JPH06132762A - Piezoelectric oscillator - Google Patents
Piezoelectric oscillatorInfo
- Publication number
- JPH06132762A JPH06132762A JP28133692A JP28133692A JPH06132762A JP H06132762 A JPH06132762 A JP H06132762A JP 28133692 A JP28133692 A JP 28133692A JP 28133692 A JP28133692 A JP 28133692A JP H06132762 A JPH06132762 A JP H06132762A
- Authority
- JP
- Japan
- Prior art keywords
- oscillator
- metal cap
- conductive
- base substrate
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、圧電素子を備えた圧電
発振子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric oscillator provided with a piezoelectric element.
【0002】[0002]
【従来の技術】圧電発振子として、例えばセラミック発
振子には足付タイプや面実装タイプがある。足付タイプ
の発振子は、その構造上、高背・大型になり、高密度実
装には適していない。面実装タイプの発振子は、一般に
パッケージとしてセラミックケースや樹脂ケースが用い
られているが、パッケージの厚みにより製品が全体的に
嵩高になり、種類にもよるが製品の高さが2mm以上の
高背型になってしまう。2. Description of the Related Art As a piezoelectric oscillator, for example, a ceramic oscillator includes a foot type and a surface mount type. The foot-type oscillator is tall and large in size due to its structure, and is not suitable for high-density mounting. A ceramic case or a resin case is generally used as the package for the surface mount type resonator, but the product becomes bulky due to the thickness of the package, and the product height is 2 mm or more depending on the type. It becomes a profile.
【0003】これらのタイプの他に、本出願人が先に出
願した圧電発振子もある。この発振子は、製品を低背型
にするためにパッケージとして金属キャップ(導電性キ
ャップ)を採用したものであり、内部の構造上、圧電素
子を端子電極に導電性樹脂ペースト等によって接続して
いる。この構造によれば、発振子を小型・低背にできる
利点が得られるが、小型化・低背化に伴い、導電性樹脂
ペーストが金属キャップに接触し易くなるため、金属キ
ャップと導電性樹脂ペーストとの間隔を大きく取る必要
がある。しかし、間隔に余裕を持たせるとパッケージが
大きくなってしまうため、より一層の小型化・低背化の
妨げになる。In addition to these types, there is a piezoelectric oscillator previously filed by the present applicant. This oscillator uses a metal cap (conductive cap) as a package in order to make the product a low profile. Due to the internal structure, the piezoelectric element is connected to the terminal electrode with a conductive resin paste or the like. There is. This structure has the advantage that the resonator can be made smaller and has a lower height. However, as the size and the height become smaller, the conductive resin paste easily comes into contact with the metal cap. It is necessary to make a large gap with the paste. However, if the space is left large, the package becomes large, which hinders further size reduction and height reduction.
【0004】図9に金属キャップを使用した圧電発振子
の構造を示す。この発振子は、ベース基板30と、ベー
ス基板30の両端部に形成された端子電極31,32
と、ベース基板30上にて端子電極31,32にそれぞ
れ導電ペースト33,34を介して接続された圧電素子
35と、ベース基板30上に取付けられ、圧電素子35
を防護する金属キャップ36とを備える。FIG. 9 shows the structure of a piezoelectric oscillator using a metal cap. This oscillator includes a base substrate 30 and terminal electrodes 31, 32 formed on both ends of the base substrate 30.
, A piezoelectric element 35 connected to the terminal electrodes 31, 32 via conductive pastes 33, 34 on the base substrate 30, and a piezoelectric element 35 mounted on the base substrate 30.
And a metal cap 36 for protecting the.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、図9に
示すような発振子では、一層小型化・低背化するために
金属キャップ36全体を小さくしてその高さを低くする
と、金属キャップ36が導電ペースト33,34に接触
し、端子電極31,32が金属キャップ36によって短
絡し、製品としての機能を果たさなくなることがある。However, in the oscillator as shown in FIG. 9, if the metal cap 36 is made smaller and its height is made lower in order to further reduce the size and height, the metal cap 36 becomes smaller. In some cases, the metal cap 36 short-circuits the terminal electrodes 31, 32 by coming into contact with the conductive pastes 33, 34, and the function as a product may not be fulfilled.
【0006】従って、本発明の目的は、金属キャップと
導電ペースト等の内部導電材との接触による短絡を防止
すると共により一層の小型化・低背化を実現する圧電発
振子を提供することにある。Therefore, an object of the present invention is to provide a piezoelectric oscillator which can prevent a short circuit due to contact between a metal cap and an internal conductive material such as a conductive paste, and can further reduce the size and height. is there.
【0007】[0007]
【課題を解決するための手段及び作用】前記目的を達成
するために、本発明の圧電発振子は、導電性キャップを
用いた圧電発振子であって、導電性キャップの内面に絶
縁層を設けたことを特徴とする。本発明の発振子では、
導電性キャップ(一般には金属キャップ)の内面に絶縁
層が設けられているため、金属キャップが導電ペースト
等の内部導電材に接触しても、両者の間に介在する絶縁
層によって金属キャップによる内部導電材の短絡を防ぐ
ことができる。従って、従来に増して金属キャップの高
さを低くすることができ、延いては金属キャップ全体を
小さくすることができ、製品の小型化・低背化が実現さ
れる。In order to achieve the above object, the piezoelectric oscillator of the present invention is a piezoelectric oscillator using a conductive cap, and an insulating layer is provided on the inner surface of the conductive cap. It is characterized by that. In the oscillator of the present invention,
Since the insulating layer is provided on the inner surface of the conductive cap (generally a metal cap), even if the metal cap comes into contact with an internal conductive material such as conductive paste, the insulating layer interposed between the two will prevent A short circuit of the conductive material can be prevented. Therefore, the height of the metal cap can be made smaller than in the past, and the entire metal cap can be made smaller as a result, and the size and height of the product can be reduced.
【0008】なお、絶縁層の材料としては、絶縁性硬化
樹脂(例えばエポキシ等の熱硬化性樹脂、紫外線硬化性
樹脂)、ガラスフィラー等を使用すればよい。As a material for the insulating layer, an insulating curable resin (for example, a thermosetting resin such as epoxy or an ultraviolet curable resin), a glass filler, or the like may be used.
【0009】[0009]
【実施例】以下、本発明の圧電発振子を実施例に基づい
て説明する。その一実施例に係る発振子の平面図を図1
に、底面図を図2に、図1の線A−Aにおける断面図を
図3に、図1の線B−Bにおける断面図を図4に示す。
この発振子1は、面実装セラミック発振子であり、金属
キャップの内面に絶縁層が設けられている以外は、図9
に示すものとほぼ同じ構成である。即ち、ベース基板1
0の両端部に端子電極11,12が周回状に形成され、
ベース基板10上にて端子電極11,12にそれぞれ導
電ペースト13,14を介して圧電セラミック素子15
が接続され、ベース基板10上にセラミック素子15を
防護する金属キャップ16が取付けられている。そし
て、金属キャップ16の内面には前例の材料からなる絶
縁層17が設けられている。EXAMPLES The piezoelectric oscillator of the present invention will be described below based on examples. FIG. 1 is a plan view of the oscillator according to the embodiment.
2 is a bottom view, FIG. 3 is a sectional view taken along line AA of FIG. 1, and FIG. 4 is a sectional view taken along line BB of FIG.
The oscillator 1 is a surface-mount ceramic oscillator, and is different from that shown in FIG. 9 except that an insulating layer is provided on the inner surface of the metal cap.
The configuration is almost the same as that shown in. That is, the base substrate 1
Terminal electrodes 11 and 12 are formed in a spiral shape on both ends of 0,
On the base substrate 10, the piezoelectric ceramic element 15 is formed on the terminal electrodes 11 and 12 via conductive pastes 13 and 14, respectively.
And a metal cap 16 for protecting the ceramic element 15 is attached on the base substrate 10. An insulating layer 17 made of the material of the previous example is provided on the inner surface of the metal cap 16.
【0010】このような発振子1では、金属キャップ1
6と導電ペースト13,14との間に絶縁層17が介在
することになるため、金属キャップ16が導電ペースト
13,14に接触しても、導電ペースト13,14の短
絡、即ち端子電極11,12の短絡を防ぐことができ
る。従って、金属キャップ16の高さをより一層低くす
ることができる。又、この例では、金属キャップ16が
端子電極11,12に重なっているが、両者の間には絶
縁層17が在るため、この箇所での端子電極11,12
の短絡も防止される。In such an oscillator 1, the metal cap 1
Since the insulating layer 17 is interposed between the conductive paste 13 and the conductive pastes 13 and 14, even if the metal cap 16 contacts the conductive pastes 13 and 14, the conductive pastes 13 and 14 are short-circuited, that is, the terminal electrodes 11 and 14. A short circuit of 12 can be prevented. Therefore, the height of the metal cap 16 can be further reduced. Further, in this example, the metal cap 16 overlaps with the terminal electrodes 11 and 12, but since the insulating layer 17 is present between the two, the terminal electrodes 11 and 12 at this location.
The short circuit of is also prevented.
【0011】次に、コンデンサ内蔵型圧電発振子の例を
図5〜図8に示す。この発振子2は、3端子を有する面
実装セラミック発振子である以外は、上記実施例のもの
と構造的にほぼ同様である。図6及び図7において、ベ
ース基板20の両端部に端子電極21,22が、中央部
に端子電極28が形成されている。この発振子2におい
ても、金属キャップ26の内面には絶縁層27が設けら
れており、金属キャップ26と導電ペースト23,24
との接触による短絡が絶縁層27によって防止される。
勿論、金属キャップ26は絶縁層27により端子電極2
1,22には接触していない。Next, examples of a piezoelectric oscillator with a built-in capacitor are shown in FIGS. This oscillator 2 is structurally almost the same as that of the above-mentioned embodiment except that it is a surface-mounted ceramic oscillator having three terminals. 6 and 7, the terminal electrodes 21 and 22 are formed at both ends of the base substrate 20, and the terminal electrode 28 is formed at the center. Also in this oscillator 2, the insulating layer 27 is provided on the inner surface of the metal cap 26, and the metal cap 26 and the conductive pastes 23 and 24 are provided.
The insulating layer 27 prevents a short circuit due to contact with.
Of course, the metal cap 26 has the insulating layer 27 so that the terminal electrode 2
No contact with 1, 22.
【0012】[0012]
【発明の効果】本発明の圧電発振子は、以上説明したよ
うに導電性キャップ(金属キャップ)の内面に絶縁層を
設けたため、下記の効果を有する。 (1)金属キャップが導電ペースト等の内部導電材に接
触しても、両者の間には絶縁層が介在しているため、金
属キャップは内部導電材には直接接触せず、金属キャッ
プと内部導電材との接触による短絡を防止することがで
きる。 (2)金属キャップと内部導電材との接触による短絡を
防止できるため、製品のより一層の小型化・低背化(厚
み1.0mm以下のもの)が可能となる。 (3)面実装セラミック発振子は勿論のこと、3端子を
持つコンデンサ内蔵型面実装セラミック発振子にも適用
可能である。The piezoelectric oscillator of the present invention has the following effects because the insulating layer is provided on the inner surface of the conductive cap (metal cap) as described above. (1) Even when the metal cap comes into contact with the internal conductive material such as the conductive paste, the insulating layer is interposed between the two, so the metal cap does not directly contact the internal conductive material and the metal cap and the internal A short circuit due to contact with a conductive material can be prevented. (2) Since a short circuit due to contact between the metal cap and the internal conductive material can be prevented, the product can be further downsized and the height can be reduced (thickness of 1.0 mm or less). (3) The present invention can be applied not only to the surface mount ceramic resonator but also to a capacitor built-in surface mount ceramic resonator having three terminals.
【図1】本発明の一実施例に係る発振子の平面図であ
る。FIG. 1 is a plan view of an oscillator according to an embodiment of the present invention.
【図2】図1に示す発振子の底面図である。FIG. 2 is a bottom view of the oscillator shown in FIG.
【図3】図1に示す発振子の線A−Aにおける断面図で
ある。3 is a cross-sectional view of the resonator shown in FIG. 1 taken along the line AA.
【図4】図1に示す発振子の線B−Bにおける断面図で
ある。4 is a cross-sectional view of the resonator shown in FIG. 1 taken along the line BB.
【図5】本発明の別実施例に係る発振子の平面図であ
る。FIG. 5 is a plan view of an oscillator according to another embodiment of the present invention.
【図6】図5に示す発振子の底面図である。6 is a bottom view of the oscillator shown in FIG.
【図7】図5に示す発振子の線C−Cにおける断面図で
ある。7 is a cross-sectional view of the oscillator taken along line C-C shown in FIG.
【図8】図5に示す発振子の線D−Dにおける断面図で
ある。8 is a cross-sectional view of the oscillator taken along line D-D shown in FIG.
【図9】従来例に係る発振子の要部断面図である。FIG. 9 is a cross-sectional view of a main part of an oscillator according to a conventional example.
1,2 圧電発振子 10,20 ベース基板 11,12 端子電極 15,25 圧電セラミック素子 16,26 金属キャップ(導電性キャップ) 17,27 絶縁層 21,22,28 端子電極 1, 2 Piezoelectric oscillator 10, 20 Base substrate 11, 12 Terminal electrode 15, 25 Piezoelectric ceramic element 16, 26 Metal cap (conductive cap) 17, 27 Insulating layer 21, 22, 28 Terminal electrode
Claims (1)
圧電素子と、圧電素子に電気的に接続され、外部に導出
された端子電極と、ベース基板上に取付けられ、圧電素
子を覆う導電性キャップとを備える圧電発振子であっ
て、 前記導電性キャップの内面に絶縁層を設けたことを特徴
とする圧電発振子。1. A base substrate, a piezoelectric element provided on the base substrate, a terminal electrode electrically connected to the piezoelectric element and led out to the outside, and a conductive member mounted on the base substrate and covering the piezoelectric element. A piezoelectric oscillator comprising a conductive cap, wherein an insulating layer is provided on an inner surface of the conductive cap.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28133692A JPH06132762A (en) | 1992-10-20 | 1992-10-20 | Piezoelectric oscillator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28133692A JPH06132762A (en) | 1992-10-20 | 1992-10-20 | Piezoelectric oscillator |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06132762A true JPH06132762A (en) | 1994-05-13 |
Family
ID=17637691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28133692A Pending JPH06132762A (en) | 1992-10-20 | 1992-10-20 | Piezoelectric oscillator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06132762A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6437412B1 (en) | 1999-06-17 | 2002-08-20 | Murata Manufacturing Co. Ltd. | Surface acoustic wave device having a package including a conductive cap that is coated with sealing material |
US6489558B1 (en) | 1999-08-18 | 2002-12-03 | Murata Manufacturing Co., Ltd. | Conductive cap, electronic component, and method of forming insulating film of conductive cap |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0260250B2 (en) * | 1984-08-22 | 1990-12-14 | Mitsubishi Heavy Ind Ltd |
-
1992
- 1992-10-20 JP JP28133692A patent/JPH06132762A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0260250B2 (en) * | 1984-08-22 | 1990-12-14 | Mitsubishi Heavy Ind Ltd |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6437412B1 (en) | 1999-06-17 | 2002-08-20 | Murata Manufacturing Co. Ltd. | Surface acoustic wave device having a package including a conductive cap that is coated with sealing material |
US6489558B1 (en) | 1999-08-18 | 2002-12-03 | Murata Manufacturing Co., Ltd. | Conductive cap, electronic component, and method of forming insulating film of conductive cap |
US6800189B2 (en) | 1999-08-18 | 2004-10-05 | Murata Manufacturing Co., Ltd. | Method of forming insulating film of conductive cap by anodizing or electrodeposition |
US6866893B2 (en) | 1999-08-18 | 2005-03-15 | Murata Manufacturing Co., Ltd. | Conductive cap, electronic component, and method of forming insulating film of conductive cap |
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