JPH06115285A - Method for removing strain of card board - Google Patents

Abstract

PURPOSE:To improve an external appearance quality of an IC card by erasing a strain generated by forming a recess for containing an IC module. CONSTITUTION:After a separate layer 9 is provided between a core sheet 1 and cover films 2, 3 corresponding to stepped recesses 6, 8 of a card board 4, recesses 6, 8 are formed by cutters 10, 11. Peripheries of strains of a striking mark 14 and a recess 15 generated in this case are locally heated by hot air 17 at softening temperature of higher of the film 3 in a noncontact state of a hot air generator 16 to erase the strain to obtain a flat surface without flex. An IC module 5 and a circuit board 7 are contained fixedly in the recesses 6, 8. An IC card 19 having a low manufacturing cost and excellent external appearance quality is manufactured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a card in which an IC module, a photo, or the like is stored, and more specifically, one core sheet and two front and back surfaces of the core sheet.
The present invention relates to a method for manufacturing a card substrate, which eliminates distortion that occurs when a recess is formed in a card substrate having a sheet of cover film laminated thereon.

In recent years, various types of cards such as cash cards and credit cards, various members' cards, and medical examination tickets for hospitals have been distributed, and are becoming indispensable to our daily lives. Currently, magnetic cards are the mainstream of these cards, but there is a limit to the expansion of functions of magnetic cards due to their small storage capacity, and a CPU, memory chip, etc. are installed as a multifunction card with a security function. It is well known that the new IC card has appeared. An IC card will be described below as an example.

There are various methods for manufacturing the IC card,
For example, West German Patent No. 30299399 discloses an IC
An IC module in which the module and its contacts are attached to a support and encapsulated to protect it from mechanical stress.
A method of manufacturing an ID card with a file is disclosed. The support, the IC module and the contacts are integrated and inserted into the recess provided in the inner layer of the card and hot laminated. In this method, it is necessary to take special measures such as providing a buffer zone in the laminated card so that the sensitive IC module is not damaged by pressure or temperature during lamination.

Therefore, as another conventional technique, there has been proposed a method of laminating a card body and then engraving a blind hole for burying an IC module in the card body by using an end mill or the like. As a result, shavings are generated, and it is extremely difficult to manufacture a high-quality card in combination with an electrostatic charge peculiar to a synthetic film, and it takes a lot of processing man-hours and it is difficult to obtain processing accuracy.

Therefore, as still another conventional technique, Japanese Patent Publication No. 63-42314 discloses a method of manufacturing an ID card with an IC module. As shown in FIG. 4, a card is formed by hot lamination by sandwiching a separation layer 45 made of, for example, silicon mixed with a solvent between the cover films 41 and 42 of the multilayer card and the intermediate layer 43 in a portion where the IC module 44 is to be housed. A punching tool having a blade 47 having the cross-sectional shape and depth of the recess 46 for forming the main body 40 and accommodating the IC module 44 is punched to reach the separation layer 45, and the punched plug-like portion 48 is punched. Are removed together with the separation layer 45 to form the recess 4
6 discloses a technique of embedding the IC module 44.

[0006]

However, the conventional technique of Japanese Patent Publication No. 63-42314 has the following problems. That is, as shown in FIG. 4, the back surface of the thin cover film 42 after being punched with a punching tool having a blade 47 that fits the cross-sectional shape and depth of the recess 46 accommodating the IC module 44, The dent 49 pressed by the blade 47 remains. If the back surface of the cover film 42 is a glossy surface, the dents 49 are more noticeably visually perceived and the appearance quality of the IC card is deteriorated. Further, the central portion of the cover film 42 after the punched plug-shaped portion 48 is removed together with the separation layer 45 is recessed at the central portion, which may hinder the adhesion of the IC module 44 in a later step. Further, the distortion such as the dent 49 and the dent described above has a problem that the printing quality is deteriorated in a later step. Needless to say, the generation of the above-mentioned dents is not limited to the punching process but is caused by applying a pressing force that deforms the thin cover film.

The present invention has been made in view of the above-mentioned conventional problems, and an object thereof is to eliminate distortion such as a dent and a dent caused by a pressing force applied to a thin cover film by a simple method, thereby reducing the manufacturing cost. The present invention provides a method of manufacturing a card substrate having excellent appearance quality.

[0008]

In order to achieve the above object, the structure of the method of manufacturing a card substrate according to the present invention is as follows.
In the method of manufacturing a card, in which a recess is formed in a card substrate in which two cover films are laminated on the front and back surfaces of a single core sheet, and an IC module, a photo or the like is embedded in the recess, a cover for the back surface is provided. The step of subjecting the card substrate to a recessing process with a knife while leaving the film, and the heat treatment above the softening temperature of the cover film at a position corresponding to the recessed part formed in the card substrate in the cover film, It is characterized by comprising the step of removing the distortion generated in the cover film.

The heat treatment of the cover film is characterized in that the cover film is locally heated without contact with the cover film.

The heating treatment of the cover film is characterized in that it is local heating with hot air.

The outer surface of the cover film on the back surface of the card substrate is subjected to a surface roughening treatment in advance, and a recess is formed in the card substrate after the surface roughening treatment step.

The present invention is characterized in that a non-adhesive treatment is applied between the core sheet and the back cover film corresponding to the concave portion of the card substrate, and the concave portion is formed in the card substrate after the non-adhesive treatment step.

The recess processing of the card substrate with a blade is a die-cutting process using a punch corresponding to the shape of the recess processing.

The concave portion formed on the card substrate is circular in shape.

The recess formed in the card substrate is subjected to a pilot hole processing step with a rotary blade having a diameter smaller than the diameter of the punch to a depth not reaching the cover film, and after the pilot hole processing step, the shape of the recess is formed. It is characterized in that a corresponding punch die cutting process is performed.

[0016]

Therefore, in the method of manufacturing a card obtained according to the present invention, since a punching process is used to form a recess for accommodating an IC module, a photo or the like in a card substrate, a thin back cover film is used. Although the film is locally stretched and dents are generated due to the pushing force applied, the physical properties of the film shrinking when heated above the softening temperature of the film are used to apply hot air, etc. to the above dent occurrence points without contact. By locally heating above the softening temperature of the cover film using, the dents shrink and the nicks are erased and become flat at room temperature, and there are no nicks and no scratches due to non-contact. Good surface quality is obtained. In addition, by forming a roughening treatment on the outer surface of the back cover film in advance before forming the concave portion on the card substrate, the dents generated by the punching process have no gloss on the film surface. It is inconspicuous due to the matte state, and therefore it is easy to remove the dents by the above heat treatment. Further, by performing a pre-drilling process prior to the punching process for forming a recess in the card substrate, the pressing force applied to the back cover film is minimized, and the dents generated are minimized. The dents can be easily removed by the above heat treatment. Further, by performing a non-adhesive treatment such as a separation layer or a non-adhesive layer between the core sheet and the back cover film corresponding to the concave portion of the card substrate, a plug-like portion unnecessary for the punch die cutting process or the like. Are easily separated and discharged. Further, the concave shape formed on the card substrate is advantageous in manufacturing the punch, life, and the like, and at the same time, when the stored item is an IC module, it has a sealing shape of the IC module. It fits.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a method of manufacturing an IC card according to an embodiment of the present invention. FIG. 1A is a perspective view of a card substrate.
3B to 3D are sectional views taken along the line AA of FIG. 1A showing the manufacturing process, FIG. 2 is another embodiment of the present invention, and a sectional view of the stepped recess showing the manufacturing process. FIG. 6 is a cross-sectional view illustrating a state where the back surface of the card substrate is subjected to a roughening process.

First, referring to FIG. 1 (a)-(d)
As shown in FIG. 1, the IC card 19 has a rectangular shape conforming to the international standard, and the IC is formed in the recess 6 of the card substrate 4 in which the cover films 2 and 3 are laminated on the front and back surfaces of the core sheet 1 made of a material such as polyvinyl chloride. It is configured by embedding the module 5. The card substrate 4 has a stepped recess, that is, a recess 6 for accommodating the IC module 5, in advance, before hot laminating the cover films 2 and 3 on the core sheet 1.
Separation layers 9 that are in contact with the cover films 2 and 3 and that are not bonded to the core sheet 1 are provided at the corresponding positions of the recesses 8 that house the circuit boards 7 that form the C module. As the separation layer 9, for example, silicon mixed with a solvent is suitable. In the structure of the card substrate 4 according to this embodiment, instead of arranging the separation layer 9 and hot laminating the core sheet 1 and the cover films 2 and 3 to each other, the stepped concave portions of the cover films 2 and 3 are laminated. An adhesive layer made of, for example, a photomelt adhesive or the like is applied to portions other than the non-adhesive areas corresponding to the positions 6 and 8 by means of rolling printing or the like, and the front and back surfaces of the core sheet 1 are covered with the cover films 2 and 3. Alternatively, a non-adhesion treatment may be performed to prevent the adhesive from being applied to the positions corresponding to the recesses 6 and 8 by bonding. When silicone or adhesive is applied, it is possible to manufacture a card with better alignment accuracy by applying it to the cover films 2 and 3 with reference to the pattern printed on the cover films 2 and 3.

Next, as shown in FIG. 1B, the stepped recess 6 is formed.
In order to form 8 and 8, a hole reaching the separation layer 9 by punching with a punching tool having blades 10 and 11 that match the cross-sectional shape and depth of each recess is formed first from the recess 8. , Punched plugs 12 and 13
Is separated and discharged together with the separation layer 9. After punching with the punching tool as described above, as shown in FIG. 1B, since the cover film 3 on the back surface is thin, a recess 15 appears in the central portion where the plug-like portion 13 is discharged. As described above, in punching the concave portion 6, the cover film 3
It is difficult to avoid the formation of dents 14 on the outer surface of the.

Therefore, as shown in FIG. 1C, at the corresponding positions of the recesses 6 and 8 formed in the card substrate 4, from the back surface of the card substrate 4 to the softening temperature of the cover film 3 or more, for example, Heat treatment is performed at about 80 to 120 ° C. Specifically, without contacting the hot air generator 16 with the cover film 3, the hot air 17 locally heats the periphery of the dents 14 and the recesses 15 to shrink the film surface, so that the outside of the cover film 3 is covered. The distortion generated on the surface, that is, the dent 14 and the dent 15 can be completely erased. As described above, the back surface of the card board 4 does not have a flaw because the hot air generator 16 is not in contact therewith, and the bottom of the recess 6 for accommodating the IC module 5 is also flat, so that a flat and beautiful surface with no dent is ensured. Is possible.

Further, as shown in FIG. 1D, the IC module 5 is fixed by the adhesive 18 applied to the stepped portion of the recess 8 of the circuit board 7 of the card board 4. As described above, the IC module 5 is housed and fixed in the card substrate 4 in an extremely stable state, and the IC card 19 is completed.

Next, the IC module 5 is mounted on the card substrate 4.
Another embodiment in which the stepped recesses 6 and 8 for housing the circuit board 7 are formed will be described with reference to FIG. Figure 2
In (a), the formation of the concave portion 8 for accommodating the circuit board 7 is the same as described above, and therefore description thereof will be omitted. However, after the concave portion 8 is formed, the concave portion 6 for accommodating the IC module 5 is formed by the punching tool. A pilot hole 21 having a depth that does not reach the back cover film 3 by a drill 20 having a diameter smaller than that of the blade 11.
Is performed, and further punching is performed by punching with a punching tool having a cutting tool 11 matching the cross-sectional shape and depth of the recess 6, whereby the bowl-shaped portion 22 is separated from the separation layer 9
At the same time, the back cover film 3 is easily separated and discharged. As described above, the prepared portion of the concave portion 6 is preliminarily drilled to reduce the machining allowance by punching and to minimize the pushing force applied to the back cover film 3 to generate dents and dents. Even if
By the above local heat treatment, the dents and dents can be easily erased and a flat and beautiful surface can be secured.

Further, as shown in FIG. 3, the card substrate 4
Before the stepped recesses 6 and 8 are formed on the outer surface of the back cover film 3, a so-called matte treatment is applied to the outer surface of the back cover film 3 in advance, for example, a satin pattern or a crepe pattern. When the plate 30 engraved on one side is heated to a predetermined temperature, for example, about 140 ° C. and pressed against the back cover film 3 side of the card substrate 4, the pattern engraved on the plate 30 is transferred. As a result, the back surface of the card substrate 4 becomes a matte pattern 31 and the like, and the outer surface becomes matte and matte. Therefore, the dents and the like generated by the punch die cutting process for punching with the punching tool for forming the concave portion 6 on the card substrate 4 after the surface roughening treatment are not conspicuous because the surface of the cover film 3 is not glossy, and are described above. By combining with the local heat treatment, the quality of the outer surface of the card substrate 4 can be secured.

Further, as shown in FIG. 1A, the fact that the shape of the storage recess 6 of the IC module 5 formed on the card substrate 4 is circular means that the blade 11 which is a punch of a punching tool is manufactured and the blade is cut. It is advantageous to the life of the IC chip, the continuity of sharpness prevents the dent from becoming large, and at the same time, it is suitable for the sealing shape of the IC module 5.

Therefore, the feature of this embodiment is that
As described above, in order to remove the distortion of the cover film at the time of processing the concave portion of the card substrate, heat treatment at a softening temperature of the cover film or higher is performed. By contact, the local area around the distortion is heated with hot air. Further, the prepared hole is preliminarily processed before the recess processing to reduce the machining allowance for the recess processing. Further, the outer surface of the back cover film is subjected to a roughening treatment in advance to be in a matte state to make the distortion inconspicuous, and by combining with the above-mentioned heat treatment, the quality of the outer surface of the card substrate is improved. To secure. Further, by performing a non-adhesive treatment including a separation layer or a non-adhesive layer between the core sheet and the cover film corresponding to the recesses, unnecessary plug-like portions at the time of forming the recesses can be easily separated and discharged. is there. In addition, the fact that the shape of the recess is circular is suitable for the shape of the punch and the sealing of the IC module. In the present embodiment, the present invention has been described by taking the IC card in which the IC module is housed in the card substrate as an example, but the present invention is not limited to the IC card, and a photograph, a printed matter, an ID collation object, etc. can be embedded. It can also be applied to the ID card etc.

[0026]

As described above, according to the present invention, when removing distortions such as dents and dents generated in the cover film at the time of processing the concave portion of the card substrate, the cover film shrinks when heated above the softening temperature of the cover film. By utilizing the physical properties of the above, local heating of the area around the strain generation point with hot air in a non-contact manner completely eliminates the strain and ensures a flat and beautiful surface. Pre-prepared hole processing also minimizes the machining allowance for recess processing to reduce the force applied to the cover film surface to minimize the occurrence of dents, and the outer surface of the cover film has a rough surface such as a satin finish. A flat surface without distortion can be obtained by combining the above local heat treatment with the above-mentioned local heat treatment in order to make the generated distortion inconspicuous and make it matte. It does not hinder the fixation of objects, it is easy to print, etc., the yield such as dent defects is improved, the manufacturing cost is low, and it is possible to manufacture cards with excellent appearance quality. is there.

[Brief description of drawings]

FIG. 1 shows a manufacturing process of an IC card according to an embodiment of the present invention, FIG. 1 (a) is a perspective view of a card substrate, and FIG.
(D) is the sectional view on the AA line of FIG.

FIG. 2 is a sectional view in the vicinity of a stepped recess showing a manufacturing process of an IC card according to another embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a state in which the back surface of the card substrate of the present invention is roughened.

FIG. 4 is a cross-sectional view illustrating a manufacturing process of a conventional IC card.

[Explanation of symbols]

 1 Core Sheet 2 Cover Film 3 Cover Film 4 Card Substrate 5 IC Module 6 Recess 9 Separation Layer 11 Cutting Tool 13 Plug-like Part 14 Ditch 15 Recess 16 Hot Air Generator 17 Hot Air 19 IC Card 20 Drill 21 Prepared Hole 30 Plate 31 Pear-skin Pattern

Claims (8)

[Claims] 1. A card substrate in which a recess is formed in a card substrate in which two cover films are laminated on the front and back surfaces of one core sheet, and an IC module, a photo, etc. is buried in the recess. In the method, the step of subjecting the card substrate to a recess processing by leaving a cover film on the back surface, and a softening temperature of the cover film or more at a position corresponding to the recess formed in the card substrate in the cover film. A method for removing distortion of a card substrate, which comprises a step of removing the distortion generated in the cover film by subjecting the card to heat treatment. 2. The method for removing distortion of a card substrate according to claim 1, wherein the heat treatment of the cover film is local heating by non-contact with the cover film. 3. The method for removing distortion of a card substrate according to claim 2, wherein the heat treatment of the cover film is local heating with hot air. 4. The card according to claim 1, wherein the outer surface of the cover film on the back surface of the card substrate is subjected to a surface roughening treatment in advance, and the concave portion is formed on the card substrate after the surface roughening treatment step. Substrate strain removal method. 5. The non-adhesive treatment is performed between the core sheet and the back cover film corresponding to the concave portion of the card substrate, and the concave portion is formed in the card substrate after the non-adhesive treatment step. The method for removing distortion of a card substrate according to 2, 3, or 4. 6. The method for removing distortion of a card substrate according to claim 5, wherein the recess processing of the card substrate with a blade is a die cutting process using a punch corresponding to the shape of the recess processing. . 7. The method for removing distortion of a card substrate according to claim 6, wherein the shape of the recess formed in the card substrate is circular. 8. The recess formed in the card substrate is subjected to a pre-drilling step of a depth that does not reach the cover film by a rotary blade having a diameter smaller than the diameter of the punch, and the recess of the recess is formed after the pre-drilling step. 8. The method for removing distortion of a card substrate according to claim 7, wherein punching processing corresponding to the shape is performed.