JPH06112536A - Light source device and its manufacture - Google Patents

Light source device and its manufacture

Info

Publication number
JPH06112536A
JPH06112536A JP4261887A JP26188792A JPH06112536A JP H06112536 A JPH06112536 A JP H06112536A JP 4261887 A JP4261887 A JP 4261887A JP 26188792 A JP26188792 A JP 26188792A JP H06112536 A JPH06112536 A JP H06112536A
Authority
JP
Japan
Prior art keywords
light source
wiring board
source device
bent
led element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4261887A
Other languages
Japanese (ja)
Inventor
Hiroyoshi Takanishi
西 宏 佳 高
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Priority to JP4261887A priority Critical patent/JPH06112536A/en
Publication of JPH06112536A publication Critical patent/JPH06112536A/en
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Measuring And Other Instruments (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To provide a light source device in which the width of a linear light source can be made as narrow as possible while the size of the wiring pattern of LED elements is secured. CONSTITUTION:The title device in which an LED element group constituted by arranging a plurality of LED elements 2 on a substrate 4 is used as a linear light source is constituted of a flexible wiring board 4 on which the elements 2 are mounted along the center line of the substrate 4 so that the LED element group can be formed and both face sections 4b and 4c of which are bent at an obtuse angle larger than 90rt. angle so that the sections 4b and 4c can be faced to each other and a synthetic resin body 6 with which the space formed by the bent face sections 4b and 4c is filled.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、各種OA機器、自動車
の計器類に組み込んでライン状に発光する光源として利
用する光源装置とその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light source device for use as a light source which emits light in a linear form by being incorporated in various office automation equipment and automobile instruments, and a method for manufacturing the same.

【0002】[0002]

【従来の技術】従来、この種の光源装置として、蛍光灯
が利用されていたが、蛍光灯には点灯回路が必要となっ
て部品点数が増える分だけコストが嵩むこと、また、蛍
光灯の特有の点灯特性によってスイッチをオンにしても
すぐには、所望の光量を得ることが出来ないなどの短所
がある。このため、最近置では、蛍光灯に代って、複数
のLED素子を直線状に配置した光源装置が普及してい
る。図5は、LED素子を用いた従来例を図示した断面
図である。符号20は、LED素子を示し、このLED
素子20は、基板21の中心線に沿って所定数一列に並
べて配線されるものである。このようにLED素子20
の直線状のLED素子群を組み込んだ基板21は、窓部
23が形成されているケース22の内部に拡散板24と
ともに収納され、このケース22によってLED素子2
0からの光が分散しないように遮蔽されている。従っ
て、ケース22の窓部23から露出するように形成され
た拡散板24の頭部24aを光が透過してライン状の光
を形成するように構成されている。
2. Description of the Related Art Conventionally, a fluorescent lamp has been used as a light source device of this kind. However, the fluorescent lamp requires a lighting circuit, which increases the cost due to the increase in the number of parts. Due to the unique lighting characteristics, there is a disadvantage in that the desired amount of light cannot be obtained immediately after the switch is turned on. For this reason, recently, instead of the fluorescent lamp, a light source device in which a plurality of LED elements are linearly arranged has become widespread. FIG. 5 is a sectional view showing a conventional example using an LED element. Reference numeral 20 indicates an LED element, and this LED
The elements 20 are arranged in a line in a predetermined number along the center line of the substrate 21 and wired. In this way, the LED element 20
The substrate 21 incorporating the linear LED element group of is housed together with the diffusion plate 24 inside the case 22 in which the window portion 23 is formed.
It is shielded so that the light from 0 does not disperse. Therefore, the light is transmitted through the head portion 24a of the diffuser plate 24 formed so as to be exposed from the window portion 23 of the case 22 to form linear light.

【0003】[0003]

【発明が解決しようとする課題】最近のOA機器、ある
いは、自動車の計器類は、ますます小型化、コンパクト
化が進んできている。このため、これらに使用されるL
ED素子の光源についても、一層の小型化が要請されて
いる。特に、自動車の指針光源として用いる場合には文
字通り針状で有ることが要求され、光源の幅が狭ければ
狭い程、指針光源として適したものになる。このような
光源装置の小型化を図る上では、構成部品の加工、特に
基板の加工との関係からくる制約を無視することが出来
ない。例えば、図5の例で全体の巾Aが数ミリのものと
もなると、基板21の外形のものをプレス金型で打ち抜
く効率が極端に悪くなり、 場合によっては、打ち抜く
こと自体が不可能となる。このため、ある程度の余裕を
もった外形寸法でプレス成形したものを、切削するなど
して所望の寸法にする必要があり、大幅に工数が増える
問題がある。また、基板21にLED素子20を1列に
配列する場合にも、巾が非常に狭いために作業性が極端
に悪化し、組み込み済みの他のLED素子20を損傷す
る欠点があった。そこで、本発明は、上記従来技術の有
する問題点を解消し、LED素子の配線パターンの大き
さを確保しながら光源の幅をできるだけ狭いものにする
ことのできる光源装置の製造方法と、光源の巾を可及的
に細くした光源装置を提供することを目的とする。
Problems to be Solved by the Invention Recent OA equipment or automobile instruments are becoming smaller and more compact. Therefore, the L used for these
The light source of the ED element is also required to be further downsized. In particular, when used as a pointer light source for automobiles, it is required to be literally needle-shaped, and the narrower the width of the light source, the more suitable it is as a pointer light source. In order to reduce the size of such a light source device, it is not possible to ignore the restrictions associated with the processing of the components, especially the processing of the substrate. For example, if the entire width A is several millimeters in the example of FIG. 5, the efficiency of punching the outer shape of the substrate 21 with the press die becomes extremely poor, and in some cases, punching itself becomes impossible. . For this reason, it is necessary to cut a press-molded product with an external dimension having a certain allowance to a desired size by cutting or the like, which causes a problem that the number of steps is significantly increased. Further, when the LED elements 20 are arranged in a row on the substrate 21, the workability is extremely deteriorated due to the extremely narrow width, and there is a drawback that the other LED elements 20 already assembled are damaged. Therefore, the present invention solves the above-mentioned problems of the conventional technology, and a method of manufacturing a light source device capable of making the width of the light source as narrow as possible while ensuring the size of the wiring pattern of the LED element, and a method of manufacturing the light source. An object is to provide a light source device whose width is as narrow as possible.

【0004】[0004]

【課題を解決するための手段】前記目的を達成するため
に、本発明は、基板上に複数のLED素子を配列してな
るLED素子群をライン状光源とした光源装置におい
て、配線基板の中心線に沿ってLED素子群を形成する
ように複数のLED素子が実装され、両側の側面部が互
いに向い合うように90度以上の鈍角に折曲した可撓性
の配線基板と、折り曲げた配線基板の内側に充填された
合成樹脂体とから構成されている。
In order to achieve the above-mentioned object, the present invention is a light source device in which a line-shaped light source is an LED element group formed by arranging a plurality of LED elements on a substrate. A plurality of LED elements are mounted so as to form an LED element group along a line, and a flexible wiring board bent at an obtuse angle of 90 degrees or more so that side surfaces on both sides face each other, and bent wiring It is composed of a synthetic resin body filled inside the substrate.

【0005】また、本発明は、前記目的を達成するため
に、可撓性の配線基板に複数のLED素子を基板中心線
に沿って配列する工程と、LED素子を実装した配線基
板の両側の側面部を90゜以上内側に折り曲げる工程
と、折り曲げた配線基板の内側に樹脂を充填する工程と
から構成されるものである。
In order to achieve the above-mentioned object, the present invention further comprises a step of arranging a plurality of LED elements on a flexible wiring board along the center line of the board, and a step of arranging the LED elements on both sides of the wiring board. It is composed of a step of bending the side surface portion inward by 90 ° or more and a step of filling the inside of the bent wiring board with resin.

【0006】[0006]

【作用】本発明によれば、配線基板の両側の側面部を9
0度以上の鈍角に折り曲げることによって、両側面部の
端縁に形成されるライン状光源の幅が可及的に狭小にな
るので、従来と同じ大きさの配線パターンを使用しても
ライン状光源を著しく狭い幅のものにすることが出来、
光源装置全体の大幅な小型化を達成することが出来る。
また、配線基板が実質的にケースとなり、樹脂体は、L
ED素子の保護材としてかつ、光拡散材として作用す
る。特に、樹脂体の露出する頭部を凸面に形成すること
により、この頭部が凸レンズの役目を果たす。
According to the present invention, the side portions on both sides of the wiring board are
Since the width of the line-shaped light source formed on the edges of both side surfaces is made as narrow as possible by bending at an obtuse angle of 0 degree or more, the line-shaped light source can be used even if a wiring pattern of the same size as the conventional one is used. Can be made extremely narrow,
A drastic downsizing of the entire light source device can be achieved.
Further, the wiring board is substantially a case, and the resin body is
It acts as a protective material for the ED element and as a light diffusing material. In particular, by forming the exposed head portion of the resin body into a convex surface, this head portion functions as a convex lens.

【0007】さらに、本発明によれば、LED素子を配
線基板に実装してから配線基板を折り曲げるようにして
いるので、光源の幅に合せて配線基板4の電気配線パタ
ーンを狭くすることなしにLED素子を実装することが
でき、LED素子実装作業の作業性が著しく向上する。
また、配線基板を折り曲げて樹脂を充填した後は、この
樹脂によって配線基板の折り曲げた形状が固定される。
Further, according to the present invention, since the LED element is mounted on the wiring board and then the wiring board is bent, the electric wiring pattern of the wiring board 4 is not narrowed in accordance with the width of the light source. The LED element can be mounted, and the workability of the LED element mounting work is significantly improved.
Further, after the wiring board is bent and filled with resin, the bent shape of the wiring board is fixed by this resin.

【0008】[0008]

【実施例】以下、本発明の一実施例について添付の図面
を参照して説明する。図1は、自動車用測定器の指針に
本発明を適用した実施例を図示した断面図である。符号
2は、LED素子を示し、このLED素子2は、配線基
板4の中心線に沿って所定数一列に並べてLED素子群
を形成するように配線されるものである。このようにL
ED素子2を実装する配線基板4は、底面部4aと左右
の両側面部4b,4cからなり一枚の平板な可撓性の配
線基板であって、後述するように、プレス金型を使用し
て両側面部4b,4cを90度以上の鈍角に折り曲げる
ことによって、両側面部4a,4bの端縁に開口部5が
形成されている。また、配線基板4の内側には、従来の
拡散板に替えて透明な合成樹脂が充填されて、合成樹脂
体6を形成している。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a sectional view showing an embodiment in which the present invention is applied to a pointer of a measuring instrument for automobiles. Reference numeral 2 indicates an LED element, and the LED elements 2 are arranged along the center line of the wiring board 4 in a predetermined number in a line to form an LED element group. Like this
The wiring board 4 on which the ED element 2 is mounted is a single flat flexible wiring board composed of a bottom surface portion 4a and left and right side surface portions 4b and 4c, and a press die is used as described later. By bending both side surface portions 4b, 4c at an obtuse angle of 90 degrees or more, an opening 5 is formed at the edge of each side surface portion 4a, 4b. Further, the inside of the wiring board 4 is filled with transparent synthetic resin instead of the conventional diffusion plate to form the synthetic resin body 6.

【0009】この実施例では、前記合成樹脂体6の頭部
6aは、配線基板4の開口部5から外部に突出するよう
になっている。この頭部6aは、配線基板4の底面に実
装されているLED素子2,2,…の配列に対向するよ
うに図に対して垂直な方向に延びているものであり、こ
れによって、LED素子2からの光が合成樹脂体6を透
過してライン状の光を形成するようになっている。な
お、配線基板4の外側の表面には、黒色のカバーコーテ
ィングが施されているので、配線基板4を透過してLE
D素子20の光が漏れないように遮蔽されている。
In this embodiment, the head portion 6a of the synthetic resin body 6 is adapted to project from the opening 5 of the wiring board 4 to the outside. The head portion 6a extends in a direction perpendicular to the drawing so as to face the array of the LED elements 2, 2, ... Mounted on the bottom surface of the wiring board 4, whereby the LED elements are formed. The light from 2 is transmitted through the synthetic resin body 6 to form linear light. The outer surface of the wiring board 4 is coated with a black cover, so that the LE penetrates through the wiring board 4.
The light of the D element 20 is shielded so as not to leak.

【0010】しかして、以上のように構成される実施例
によれば、配線基板4の両側面部4b,4cを90度以
上の鈍角に折り曲げることによって、両側面部4a,4
bの端縁に形成される開口部5の幅Bを可及的に狭小に
なるので、従来と同じ大きさの配線パターンを使用して
もライン光源を著しく狭い幅のものにすることが出来、
しかも、光源装置全体の大幅な小型化を達成することが
出来る。
However, according to the embodiment configured as described above, both side surface portions 4a, 4c of the wiring board 4 are bent at an obtuse angle of 90 degrees or more to form both side surface portions 4a, 4c.
Since the width B of the opening 5 formed at the edge of b is as narrow as possible, the line light source can be made extremely narrow even if the wiring pattern of the same size as the conventional one is used. ,
Moreover, it is possible to achieve a drastic downsizing of the entire light source device.

【0011】また、折り曲げた配線基板4が実質的にケ
ースとなり、他方、樹脂体6は、LED素子2の保護す
るとともに、光拡散材として作用するので、従来の光源
装置のようにケース、レンズなどの部品を不要となり、
部品点数を少なくすることができる。
Further, the bent wiring board 4 substantially serves as a case, while the resin body 6 protects the LED element 2 and acts as a light diffusing material. No need for parts such as
The number of parts can be reduced.

【0012】次に、本実施例による光源装置の製造工程
について、図2を参照して説明する。
Next, the manufacturing process of the light source device according to this embodiment will be described with reference to FIG.

【0013】まず、図2(a)に示すように、配線基板
4にLEDアレーの数分のLED素子2を基板中心線に
沿って一列にボンディングする。次いで、図2(b)に
示すように、治具8を使用して、配線基板4を断面コ字
状、すなわち両側面部4a,4bを90゜内側に折り曲
げておく。その後、図2(c)に示すように、治具8か
ら取り出した配線基板4を、今度は、樹脂注入型にセッ
トする。この実施例では、樹脂注入型は、左右の可動型
10a,10bと、予め固定されている下型12とから
構成されている。前記可動型10a,10bには、配線
基板4の折り曲げ角度に対応して傾斜している傾斜面1
1a,11bが形成されているので、下型12にコ字状
に曲げておいた配線基板4をこの可動型10a,10b
で挟むようにして型締めすることによって配線基板4の
折り曲げ加工を簡単に行うことができる。最後に、図2
(d)に示すように、可動型10a,10bとの間の注
入部13から樹脂を注入する。その後、樹脂の硬化をま
って型を開いて、製品を取り出すことができる。
First, as shown in FIG. 2A, the LED elements 2 corresponding to the number of LED arrays are bonded to the wiring board 4 in a line along the center line of the board. Next, as shown in FIG. 2B, the wiring board 4 is U-shaped in cross section, that is, both side surface portions 4a and 4b are bent inward by 90 ° by using a jig 8. After that, as shown in FIG. 2C, the wiring board 4 taken out from the jig 8 is set in a resin injection mold this time. In this embodiment, the resin injection mold is composed of left and right movable molds 10a and 10b and a lower mold 12 which is fixed in advance. The movable molds 10a and 10b have inclined surfaces 1 that are inclined in accordance with the bending angle of the wiring board 4.
1a and 11b are formed, the wiring board 4 bent in the U-shape in the lower mold 12 is formed into the movable molds 10a and 10b.
The wiring board 4 can be easily bent by clamping the mold by sandwiching it. Finally, Figure 2
As shown in (d), resin is injected from the injection part 13 between the movable molds 10a and 10b. After that, the resin can be cured and the mold can be opened to take out the product.

【0014】以上のような製造工程では、LED素子2
を配線基板4にボンディングしてから、配線基板4を折
り曲げるようにしているので、光源の幅に対応させて予
め配線基板4の電気配線パターンを狭くすることなしに
LED素子2を実装することができるから、LED素子
実装作業の作業性が著しく向上する。^_^また、配線
基板4を折り曲げて樹脂を充填した後は、この樹脂によ
って配線基板の折り曲げた形状が固定されるので、付帯
する工程として折り曲げ部の固定といった作業もなく、
少ない工数で効率的に光源装置を大量生産することがで
きるので、製造コストを低減することができる。
In the manufacturing process as described above, the LED element 2
Since the wiring board 4 is bent after being bonded to the wiring board 4, the LED element 2 can be mounted without narrowing the electric wiring pattern of the wiring board 4 in advance in accordance with the width of the light source. Therefore, the workability of the LED element mounting work is significantly improved. In addition, after the wiring board 4 is bent and filled with the resin, the bent shape of the wiring board is fixed by the resin, so that there is no work such as fixing the bent portion as an additional step.
Since the light source devices can be efficiently mass-produced with a small number of steps, the manufacturing cost can be reduced.

【0015】次に、他の実施例について、図3および図
4を参照して説明する。^_^図3の実施例は、配線基
板13の折り曲げ角度を略直角にし、樹脂体14の頭部
15の形状を凸面にした実施例である。この実施例のよ
うに樹脂体14の頭部15の形状を特に凸面とすること
により、 この頭部15が凸レンズとして作用するの
で、従来のように凸レンズを設けるまでもなく、レンズ
効果を付加することができる。
Next, another embodiment will be described with reference to FIGS. The embodiment of FIG. 3 is an embodiment in which the wiring board 13 is bent at a substantially right angle and the head portion 15 of the resin body 14 is formed into a convex surface. By making the shape of the head portion 15 of the resin body 14 particularly convex as in this embodiment, since the head portion 15 acts as a convex lens, a lens effect is added without providing a convex lens as in the conventional case. be able to.

【0016】これに対して、図5の実施例は、表面実装
用のLED光源として構成した実施例である。この実施
例では、LED素子2がボンディングされる配線基板1
6は、このLED素子2の取り付け側とは反対側に向け
て略90゜折り曲げられるようになっている。この結果
として、樹脂体15は、LED素子2とは反対側にあた
る配線基板の内側に充填されるようになっている。な
お、符号17は、樹脂製のカバーを示している。この実
施例によっても、従来と同じ大きさの配線パターンを使
用ながらも、ライン光源を著しく狭い幅のものにするこ
とが出来るのは図1の実施例と同様である。
On the other hand, the embodiment of FIG. 5 is an embodiment configured as an LED light source for surface mounting. In this embodiment, the wiring board 1 to which the LED element 2 is bonded
6 is bent by approximately 90 ° toward the side opposite to the mounting side of the LED element 2. As a result, the resin body 15 is filled inside the wiring board on the side opposite to the LED element 2. Reference numeral 17 indicates a resin cover. Also in this embodiment, the line light source can be made to have a remarkably narrow width while using the wiring pattern of the same size as the conventional one, as in the embodiment of FIG.

【0017】[0017]

【発明の効果】以上のように、本発明によれば、配線基
板の両側の側面部を90度以上の鈍角に折り曲げること
によって、両側面部の端縁に形成されるライン状光源の
幅が可及的に狭小になるので、従来と同じ大きさの配線
パターンを使用してもライン状光源を著しく狭い幅のも
のにすることが出来、光源装置全体の大幅な小型化を達
成することが出来る。また、配線基板が実質的にケース
となり、樹脂体は、LED素子の保護材としてかつ、光
拡散材として作用するので、これらの部品が必要なくな
り、部品点数を削減して安価な光源装置を提供すること
ができる。
As described above, according to the present invention, the width of the line-shaped light source formed at the edges of both side surface portions can be changed by bending the side surface portions on both sides of the wiring board at an obtuse angle of 90 degrees or more. Since it becomes as narrow as possible, the line-shaped light source can be made extremely narrow even if a wiring pattern of the same size as the conventional one is used, and the size of the entire light source device can be significantly reduced. . In addition, since the wiring board substantially serves as a case and the resin body acts as a protective material for the LED element and as a light diffusing material, these parts are not required, and the number of parts is reduced to provide an inexpensive light source device. can do.

【0018】また、LED素子を配線基板に実装してか
ら配線基板を折り曲げるようにしているので、光源の幅
に合せて配線基板4の電気配線パターンを狭くすること
なしにLED素子を実装することができ、LED素子実
装作業の作業性が著しく向上する。また、配線基板を折
り曲げて樹脂を充填した後は、この樹脂によって配線基
板の折り曲げた形状が固定される。従って、付帯する工
程として折り曲げ部の固定といった作業もなく、少ない
工数で効率的に光源装置を大量生産することができるの
で、製造コストを低減することができる。
Since the LED element is mounted on the wiring board and then the wiring board is bent, the LED element can be mounted without narrowing the electric wiring pattern of the wiring board 4 according to the width of the light source. Therefore, the workability of the LED element mounting work is significantly improved. Further, after the wiring board is bent and filled with resin, the bent shape of the wiring board is fixed by this resin. Therefore, the light source device can be efficiently mass-produced with a small number of steps without the work of fixing the bent portion as an additional step, and the manufacturing cost can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明による光源装置の一実施例を示す断面
図。
FIG. 1 is a sectional view showing an embodiment of a light source device according to the present invention.

【図2】本発明による光源装置の製造方法の各工程の説
明図。
FIG. 2 is an explanatory view of each step of the method for manufacturing a light source device according to the present invention.

【図3】本発明による光源装置の他の実施例の断面図。FIG. 3 is a sectional view of another embodiment of the light source device according to the present invention.

【図4】本発明による光源装置の他の実施例の断面図。FIG. 4 is a sectional view of another embodiment of the light source device according to the present invention.

【図5】従来の光源装置の断面図。FIG. 5 is a cross-sectional view of a conventional light source device.

【符号の説明】[Explanation of symbols]

2 LED素子 4 配線基板 4b,4c 側面部 6 樹脂体 6a 頭部 8 治具 10a,10b 可動型 12 固定型 15 凸面 2 LED element 4 Wiring board 4b, 4c Side part 6 Resin body 6a Head 8 Jig 10a, 10b Movable type 12 Fixed type 15 Convex surface

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】基板上に複数のLED素子を配列してなる
LED素子群をライン状光源とした光源装置において、
配線基板の中心線に沿ってLED素子群を形成するよう
に複数のLED素子が実装され、両側の側面部が互いに
向い合うように90度以上の鈍角に折曲した可撓性の配
線基板と、折り曲げた配線基板の内側に充填された合成
樹脂体を有することを特徴とする光源装置。
1. A light source device using an LED element group formed by arranging a plurality of LED elements on a substrate as a linear light source,
A flexible wiring board in which a plurality of LED elements are mounted so as to form an LED element group along the center line of the wiring board, and the side surfaces on both sides are bent at an obtuse angle of 90 degrees or more so as to face each other. A light source device having a synthetic resin body filled inside a bent wiring board.
【請求項2】請求項1に記載の光源装置において、前記
配線基板から外部に露出する前記合成樹脂体の頭部が凸
面に形成されていることを特徴とする光源装置。
2. The light source device according to claim 1, wherein a head portion of the synthetic resin body exposed from the wiring board to the outside is formed into a convex surface.
【請求項3】可撓性の配線基板に複数のLED素子を基
板中心線に沿って配列する工程と、LED素子を実装し
た配線基板の両側の側面部を90゜以上内側に折り曲げ
る工程と、折り曲げた配線基板の内側に樹脂を充填する
工程とからなることを特徴とする光源装置の製造方法。
3. A step of arranging a plurality of LED elements on a flexible wiring board along a board center line, and a step of bending side surfaces on both sides of the wiring board on which the LED elements are mounted by 90 ° or more inward. A method of manufacturing a light source device, comprising the step of filling a resin into the inside of a bent wiring board.
JP4261887A 1992-09-30 1992-09-30 Light source device and its manufacture Pending JPH06112536A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4261887A JPH06112536A (en) 1992-09-30 1992-09-30 Light source device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4261887A JPH06112536A (en) 1992-09-30 1992-09-30 Light source device and its manufacture

Publications (1)

Publication Number Publication Date
JPH06112536A true JPH06112536A (en) 1994-04-22

Family

ID=17368149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4261887A Pending JPH06112536A (en) 1992-09-30 1992-09-30 Light source device and its manufacture

Country Status (1)

Country Link
JP (1) JPH06112536A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002017405A1 (en) * 2000-08-23 2002-02-28 Osram Opto Semiconductors Gmbh Optoelectronic component and method for the production thereof, module and device comprising a module of this type
JP2007235182A (en) * 2003-07-25 2007-09-13 Seoul Semiconductor Co Ltd Chip light emitting diode
JP2011191653A (en) * 2010-03-16 2011-09-29 Silver Making Kk Signboard character
KR20190091310A (en) * 2016-11-30 2019-08-05 택토텍 오와이 Light emitting structure and method of manufacturing the same
KR102448345B1 (en) * 2021-05-17 2022-09-27 택토텍 오와이 Optoelectronically functional multilayer structure and related manufacturing method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002017405A1 (en) * 2000-08-23 2002-02-28 Osram Opto Semiconductors Gmbh Optoelectronic component and method for the production thereof, module and device comprising a module of this type
US7446347B2 (en) 2000-08-23 2008-11-04 Osram Opto Semiconductors Gmbh Optoelectronic component and method for the production thereof, module and device comprising a module of this type
JP2007235182A (en) * 2003-07-25 2007-09-13 Seoul Semiconductor Co Ltd Chip light emitting diode
USRE42112E1 (en) 2003-07-25 2011-02-08 Seoul Semiconductor Co., Ltd. Chip light emitting diode and fabrication method thereof
JP2011191653A (en) * 2010-03-16 2011-09-29 Silver Making Kk Signboard character
KR20190091310A (en) * 2016-11-30 2019-08-05 택토텍 오와이 Light emitting structure and method of manufacturing the same
JP2020507178A (en) * 2016-11-30 2020-03-05 タクトテク オーユー Lighting structure and related manufacturing method
KR102448345B1 (en) * 2021-05-17 2022-09-27 택토텍 오와이 Optoelectronically functional multilayer structure and related manufacturing method

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