JPH06105798B2 - Optical communication semiconductor device - Google Patents
Optical communication semiconductor deviceInfo
- Publication number
- JPH06105798B2 JPH06105798B2 JP27900185A JP27900185A JPH06105798B2 JP H06105798 B2 JPH06105798 B2 JP H06105798B2 JP 27900185 A JP27900185 A JP 27900185A JP 27900185 A JP27900185 A JP 27900185A JP H06105798 B2 JPH06105798 B2 JP H06105798B2
- Authority
- JP
- Japan
- Prior art keywords
- optical
- semiconductor device
- cap
- stem
- optical communication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明は、発受光半導体装置と光合分波装置を基板上に
一括搭載する波長多重光通信装置に係り、特に発受光半
導体装置の入出射平行光の光軸を無調整にて搭載組立て
に好適な光通信用半導体装置に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wavelength division multiplexing optical communication device in which a light emitting / receiving semiconductor device and an optical multiplexing / demultiplexing device are collectively mounted on a substrate. The present invention relates to a semiconductor device for optical communication, which is suitable for mounting and assembling without adjusting the optical axis of light.
従来の光通信用半導体装置においては、光素子の保護の
ため窓ガラスあるいは入出射光をコリメートするための
光学レンズまたは光学繊維を支承したキャップと、光素
子を搭載したステムとを電気抵抗溶接あるいはロウ付で
気密封止を行なっている。この製造方法ではステムフラ
ンジの外形寸法に対し小さい外形寸法で前記キャップの
外形寸法を成形する。このため基板の部品搭載面に平行
な方向で光の合波あるいは分波を行なう波長多重光通信
装置において、発受光素子を有する前記半導体装置を直
接基板に搭載することは不可能であり、光軸調整用の機
構部品を介し、半導体装置相互の光軸調整を行ないなが
ら搭載組立てる必要があり、組立て作業性が非常に悪い
という点について配慮がなされていなかった。なおこの
種の光通信用半導体装置として関連するものには例えば
特開昭59−69986号等が挙げられる。In a conventional semiconductor device for optical communication, a window glass for protecting an optical element or a cap supporting an optical lens or an optical fiber for collimating incident and outgoing light and a stem on which the optical element is mounted are electrically resistance welded or brazed. It is airtightly sealed. In this manufacturing method, the outer dimension of the cap is formed to be smaller than the outer dimension of the stem flange. Therefore, it is impossible to directly mount the semiconductor device having the light emitting / receiving element directly on the substrate in the wavelength division multiplexing optical communication device that multiplexes or splits light in the direction parallel to the component mounting surface of the substrate. It was necessary to mount and assemble the semiconductor devices while adjusting the optical axes of the semiconductor devices via the mechanical parts for axis adjustment, and no consideration was given to the fact that the assembly workability was extremely poor. Examples of related semiconductor devices for this kind of optical communication include, for example, JP-A-59-69986.
本発明の目的は、従来技術における組立作業性に関する
問題点を解決し、直接基板に搭載可能で入出射平行光の
光軸調整を必要としない光通信用半導体装置を提供する
ことにある。SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device for optical communication, which solves the problems relating to the assembling workability in the prior art, and which can be directly mounted on a substrate and does not require adjustment of the optical axis of incident / emitted parallel light.
本発明においては、光素子を有しフランジ（flange）部
を円形に成形したステム（stem）、ステムのフランジよ
り大なる外形寸法をもつキャップであって、その外周を
基板搭載時の基準面とするためにその断面形状を円形も
しくは正多角形に精密加工し、発光素子の出射光が平行
光にコリメートされかつ前記断面の軸心と同軸となる位
置に光学レンズを気密封止固定するとともに、出射平行
光の光軸調整時に発生するズレおよびレーザ溶接または
ロー付けにより発生するビードを逃がすためにステムフ
ランジとの接触部に該ステムフランジと同一外径を有す
る円形段差をもつキャップとで構成し、キャップの外周
を基板搭載時の基準面となしたことを特徴とする。In the present invention, a stem having an optical element and a flange portion formed into a circular shape, and a cap having an outer dimension larger than the flange of the stem, the outer periphery of which serves as a reference surface for mounting on a substrate. In order to precisely process the cross-sectional shape into a circular or regular polygonal shape, the light emitted from the light-emitting element is collimated into parallel light and the optical lens is hermetically sealed and fixed at a position coaxial with the axis of the cross-section, In order to escape the deviation generated when adjusting the optical axis of the emitted parallel light and the bead generated by laser welding or brazing, it is composed of a cap with a circular step with the same outer diameter as the stem flange at the contact portion with the stem flange. The outer circumference of the cap serves as a reference surface when the substrate is mounted.
以下、図面に示す実施例に基づいて本発明の光通信用半
導体装置を詳細に説明する。第１図及び第２図は本発明
を実現する光通信用半導体装置の一実施例を断面図で示
すものである。図において、１は光半導体素子２を実装
するための円形フランジステム、２は光半導体素子、３
はその断面を円形もしくは正多角形に精密加工されたキ
ャップで、外周の軸心と同軸で発光素子からの出射光が
平行光にコリメートされる位置または前記軸心と同軸な
入射平行光が受光素子の受光面を焦点位置となる様に光
学レンズ4,4′を気密固定している。５はステム１の円
形フランジと同一外径に加工されたキャップの円形段差
で、出射平行光のキャップ外周の軸心との光軸調整また
は入射平行光の焦点位置に受光素子の受光面位置を調整
する際にステムの円形フランジを支承するとともに光素
子の信頼性を確保するための気密封止としてレーザ溶接
を行なう際のレーザ光の照射部あるいはロー付け部で光
軸または焦点調整にともなうキャップ段差とステムフラ
ンジのズレおよびレーザ溶接時またはロー付け時に発生
するビードの隆着が発生してもキャップ外形寸法より大
きくならない寸法関係となっている。Hereinafter, the semiconductor device for optical communication of the present invention will be described in detail based on the embodiments shown in the drawings. 1 and 2 are sectional views showing an embodiment of a semiconductor device for optical communication which realizes the present invention. In the figure, 1 is a circular flange stem for mounting the optical semiconductor element 2, 2 is an optical semiconductor element, 3
Is a cap whose cross section is precisely processed into a circular or regular polygonal shape, and is a position where the light emitted from the light emitting element is collimated into parallel light coaxially with the axis of the outer circumference or the incident parallel light coaxial with the axis is received. The optical lenses 4 and 4'are hermetically fixed so that the light receiving surface of the element is at the focal position. Reference numeral 5 denotes a circular step of a cap processed to have the same outer diameter as the circular flange of the stem 1, and adjusts the optical axis of the emitted parallel light with the axis of the outer circumference of the cap or sets the light receiving surface position of the light receiving element at the focal position of the incident parallel light. A cap for supporting the circular flange of the stem during adjustment and for adjusting the optical axis or focus at the laser beam irradiation part or brazing part when performing laser welding as a hermetic seal for ensuring the reliability of the optical element. The dimensional relationship is such that the difference between the step and the stem flange and the bead ridge generated during laser welding or brazing are not larger than the outer dimensions of the cap.
本発明の光通信用半導体装置は、前記のように構成され
ているので、基板への搭載位置を精密に位置決め可能な
治具に支承することにより基板への光合分波装置と基板
への一括搭載時に各光半導体装置間の光軸調整が不要と
なり、無調整にて基板への搭載が可能となる。Since the semiconductor device for optical communication according to the present invention is configured as described above, the optical multiplexing / demultiplexing device for the substrate and the package for the substrate are collectively supported by supporting the mounting position on the substrate by a jig capable of accurately positioning. It is not necessary to adjust the optical axis between the optical semiconductor devices during mounting, and mounting on the substrate is possible without adjustment.
第３図は本発明による光通信用半導体装置９を基板12に
実装した斜視図である。なお、第３図において、10は光
合分波器、11は共通ポートである。FIG. 3 is a perspective view of a semiconductor device 9 for optical communication according to the present invention mounted on a substrate 12. In FIG. 3, 10 is an optical multiplexer / demultiplexer, and 11 is a common port.
以上説明したように、本発明によれば、基板への光通信
用半導体装置の搭載に際し、各装置間の光軸調整が不要
となり組立性が非常に改善されるという効果がある。As described above, according to the present invention, when mounting the semiconductor device for optical communication on the substrate, it is not necessary to adjust the optical axis between the devices, and the assembling property is greatly improved.
第１図は球レンズを使用した本発明の一実施例を示す光
軸方向の断面図、第２図は屈折率２乗分布形ロッドレン
ズを使用した本発明の一実施例の断面図、第３図は本発
明の一実施例を基板に搭載した状態を示す斜視図であ
る。 １…円形フランジステム、２…光半導体素子、３…キャ
ップ、４…球レンズ、４′…屈折率２乗分布形ロッドレ
ンズ、６…ビード、５…段差、７…リード、8a,8b…光
線軌跡。FIG. 1 is a sectional view in the optical axis direction showing an embodiment of the present invention using a spherical lens, and FIG. 2 is a sectional view of an embodiment of the present invention using a refractive index square distribution rod lens. FIG. 3 is a perspective view showing a state where one embodiment of the present invention is mounted on a substrate. 1 ... Circular flange stem, 2 ... Optical semiconductor device, 3 ... Cap, 4 ... Spherical lens, 4 '... Refractive index square distribution type rod lens, 6 ... Bead, 5 ... Step, 7 ... Lead, 8a, 8b ... Ray Trajectory.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 渡辺 敏夫 神奈川県横浜市戸塚区戸塚町216番地 株 式会社日立製作所戸塚工場内 (72)発明者 青木 聰 神奈川県横浜市戸塚区戸塚町216番地 株 式会社日立製作所戸塚工場内 (72)発明者 後藤 丸朋 神奈川県横浜市戸塚区戸塚町216番地 株 式会社日立製作所戸塚工場内 (72)発明者 立川 吉明 東京都武蔵野市緑町３丁目９番11号 日本 電信電話株式会社電子機構技術研究所内 (72)発明者 石川 重太 東京都港区芝５丁目33番１号 日本電気株 式会社内 (72)発明者 岡本 明 神奈川県川崎市中原区上小田中1015番地 富士通株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Toshio Watanabe Inventor Toshio 216 Totsuka-cho, Totsuka-ku, Yokohama-shi Kanagawa Stock company Hitachi Totsuka factory (72) Inventor Satoshi Aoki 216 Totsuka-cho, Totsuka-ku Yokohama-shi, Kanagawa Ceremony Company Hitachi Totsuka Plant (72) Inventor Maruho Goto 216 Totsuka-cho, Totsuka-ku, Yokohama, Kanagawa Stock Company Hitachi Ltd. Totsuka Plant (72) Inventor Yoshiaki Tachikawa 3-9-11 Midoricho, Musashino-shi, Tokyo No. Nippon Telegraph and Telephone Corporation, Institute of Electronics and Technology Research (72) Inventor, Shigeta Ishikawa 5-33-1 Shiba, Minato-ku, Tokyo Inside NEC Corporation (72) Akira Okamoto, Nakahara-ku, Kawasaki-shi, Kanagawa 1015 Odanaka, Fujitsu Limited
Claims (1)
ステムと、該ステムのフランジより大なる外形寸法をも
つキャップであって、その外周を基板搭載時の基準面と
なすために断面形状を円形もしくは正多角形に加工を施
こし、発光素子からの出射光が平行光にコリメートされ
かつ前記外周の中心軸と同軸となる位置に光学レンズを
気密固定したキャップとを気密封止固定した光通信用半
導体装置であって、上記キャップの気密封止固定部近傍
に上記ステムフランジ部と同一外径を有する円形段差部
を設け、上記気密封止固定時に発生するビードを逃がす
ように構成したことを特徴とする光通信用半導体装置。1. A stem having an optical element and a flange portion formed into a circular shape, and a cap having an outer dimension larger than the flange of the stem, the cross section of which serves as a reference surface for mounting a substrate. By processing the shape into a circle or regular polygon, the light emitted from the light emitting element is collimated into parallel light and the cap that fixes the optical lens to the position coaxial with the central axis of the outer periphery is hermetically sealed. In the semiconductor device for optical communication, a circular step portion having the same outer diameter as the stem flange portion is provided in the vicinity of the hermetically sealed fixing portion of the cap, and a bead generated during the hermetically sealed fixing is released. A semiconductor device for optical communication characterized by the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27900185A JPH06105798B2 (en) | 1985-12-13 | 1985-12-13 | Optical communication semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27900185A JPH06105798B2 (en) | 1985-12-13 | 1985-12-13 | Optical communication semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62139366A JPS62139366A (en) | 1987-06-23 |
| JPH06105798B2 true JPH06105798B2 (en) | 1994-12-21 |
Family
ID=17605019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27900185A Expired - Lifetime JPH06105798B2 (en) | 1985-12-13 | 1985-12-13 | Optical communication semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06105798B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE44639E1 (en) | 1997-02-07 | 2013-12-10 | Hemosphere, Inc. | Hemodialysis and vascular access system |
| US8690815B2 (en) | 2003-10-08 | 2014-04-08 | Hemosphere, Inc. | Device and method for vascular access |
| US11590010B2 (en) | 2017-01-25 | 2023-02-28 | Merit Medical Systems, Inc. | Methods and systems for facilitating laminar flow between conduits |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5123066A (en) * | 1991-04-25 | 1992-06-16 | At&T Bell Laboratories | Molded optical package utilizing leadframe technology |
-
1985
- 1985-12-13 JP JP27900185A patent/JPH06105798B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE44639E1 (en) | 1997-02-07 | 2013-12-10 | Hemosphere, Inc. | Hemodialysis and vascular access system |
| US8690815B2 (en) | 2003-10-08 | 2014-04-08 | Hemosphere, Inc. | Device and method for vascular access |
| US11590010B2 (en) | 2017-01-25 | 2023-02-28 | Merit Medical Systems, Inc. | Methods and systems for facilitating laminar flow between conduits |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62139366A (en) | 1987-06-23 |
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