JPH0594931A - Processing system of semiconductor manufacturing equipment - Google Patents

Abstract

PURPOSE:To decrease the frequency of mounting/dismounting step of reticle by providing a function for selecting a lot from processible lot groups according to the reticle status. CONSTITUTION:Current positions of respective reticles, allowable processible lot numbers after cleaning the reticles, and allowable leaving time after cleaning the reticles are registered in a large capacity memory (data base) 2. A position data processor fitted to a semiconductor manufacturing equipment 4 inputs the reticle numbers to an annexed microcomputer 5 and transmits the data to a host computer 1 through a communication controller 3 for modifying the reticle status position data in the large capacity memory 2. Besides, when the reticle 2 is taken out of the semiconductor manufacturing equipment 4 to be carried to a reticle cleaning device, the reticle status position data are modified using a terminal device 6. Furthermore, when the lots are selected, the reticle number is detected from the position data in order to decide availability thus selecting the optimum lot. Through these procedures, the manufacturing cost of the title processing system can be cut down.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to processing of a semiconductor manufacturing apparatus used for an exposure step in a wafer process of a semiconductor device, and more particularly to a processing system for selecting an optimum lot from a lot group before processing depending on the use condition of a reticle. It is a thing.

[0002]

2. Description of the Related Art At present, in the exposure process of a semiconductor wafer process, as a means for selecting a lot from a lot group before processing, a reticle to be used is determined from a reticle provided for each lot model and process. Then, a table that manages lots before processing is provided for each semiconductor manufacturing device,
The lot was selected from the table by the first-in first-out method.

In a system for processing a semiconductor wafer process by a computer, for example, a host computer that controls the system and a semiconductor manufacturing apparatus are provided with a function of communicating with each other, and a semiconductor wafer can be stored in units of 25 wafers. A multiple of a container unit called a cassette is called a lot, and the process progress status of each lot and various data regarding the lot are collectively managed.

Further, in the automatic transfer system including the automatic transfer of the lot to each semiconductor manufacturing apparatus, the automatic lot selection is realized by the first-in first-out system of the lot.

[0005]

However, when a lot is selected from the processable lot group by the first-in first-out method, the reticle mounted on the semiconductor manufacturing apparatus is taken out, and the setup necessary for the reticle attachment / detachment processing for mounting another reticle is carried out. It takes time to change, and when a reticle is newly mounted on the semiconductor manufacturing equipment, a trial process is performed on a semiconductor wafer called a dummy wafer to measure whether or not it is possible to process a lot. And conduct a visual inspection.

For this reason, if the reticle is frequently attached to and detached from the semiconductor manufacturing apparatus, there has been a problem that the manufacturing cost increases due to the time required for the setup change and the increase in the amount of the chemical solution used for the trial process.

Further, when the semiconductor manufacturing apparatus is mounted on a semiconductor manufacturing apparatus for a long time and processed for a long time after cleaning the reticle, dust is generated from a robot that transfers the semiconductor wafer and foreign matter adheres to the surface of the reticle. there were.

[0008]

According to the present invention, in the processing system of the semiconductor manufacturing apparatus described above, the host computer is provided with a table for managing the position data of the reticle, the allowable number of processes, and the allowable leaving time after cleaning the reticle. It is provided with a function of selecting an optimum lot from various lot groups.

[0009]

As described above, according to the present invention, in the processing system of the semiconductor manufacturing apparatus of the wafer process, the function of selecting a lot from the group of processable lots according to the state of the reticle is provided. It is possible to greatly reduce the attachment / detachment process of the reticle, and it is possible to reduce the time required for the setup change and the amount of the chemical liquid used for the trial process accompanying the attachment / detachment process of the reticle.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram of a system according to an embodiment of the present invention. In FIG. 1, a host computer 1 has a mass storage device 2 for storing progress data of each lot, processing conditions for each process, reticle state data, which will be described later, and a lot group that can be processed by each device. It has a function of mutually communicating the semiconductor manufacturing apparatus 4 and the microcomputer 5 attached to the apparatus 4 via the controller 3. Further, it has a terminal device 6 for referencing and updating various data stored in the mass storage device 2.

FIG. 2 is a processing condition setting / reference screen for each model and process stored in the mass storage device 2.

Since the processing conditions of the lot are determined by the model and process in which the lot is currently located, the processing conditions for the exposure process and the reticle NO to be mounted on the semiconductor manufacturing apparatus 4 are registered.

FIG. 3 is a reticle status reference / update screen stored in the mass storage device 2.

Here, the position at which each reticle physically exists at present, the allowable number of processing lots after reticle cleaning, and the allowable leaving time after cleaning are registered.

As for the position data, when the semiconductor manufacturing apparatus 4 is mounted, the reticle NO is input to the attached microcomputer 5, the data is sent to the host computer 1 via the communication controller 3, and the mass storage device 2 is used. The reticle status position data of is updated.

Further, when the reticle is taken out from the semiconductor manufacturing apparatus 4 and carried into a reticle cleaning device (not shown), the reticle state position data is updated using the terminal device 6 near the reticle cleaning device.

As the number of remaining treatments, the number of permissible treatment lots after reticle cleaning is entered using the terminal device 6.

When a lot is processed by the semiconductor manufacturing apparatus 4, the lot I.D. Enter D,
Data is sent to the host computer 1 via the communication controller 3, the reticle used in this lot is determined, and the value of the reticle state remaining processing number is reduced.

For the remaining time, the value of the allowable leaving time after reticle cleaning is entered by using the terminal device 6.

This remaining time is successively reduced.

FIG. 4 is a lot priority table according to the embodiment of the present invention, in which lot groups that can be processed in an exposure process of a semiconductor manufacturing apparatus are ranked from attribute values of lots based on a certain order determination method. Is.

FIG. 5 shows a lot selecting means according to an embodiment of the present invention.

When the host computer 1 receives a lot processability request from the semiconductor manufacturing apparatus 4 via the communication controller 3, it refers to the lot priority table of FIG. To find the highest lot. (EOB) If there is no lot in the priority table, the host computer 1 notifies the microcomputer 5 via the communication controller 3 that there is no selectable lot, and the reticle currently mounted is taken out. Submit your request.

If there is a lot in the priority table, the processing condition table of FIG. 2 is searched from the model and process in which the lot is currently located.

Next, the reticle NO currently mounted on the semiconductor manufacturing apparatus 4 is searched from the position data of the reticle state table of FIG. 3 to determine whether it can be processed. If it cannot be processed, the process returns to the first lot search process, and the lot with the next highest priority is searched. If it is possible to process, the remaining reticle number is retrieved from the reticle NO in the reticle state table of FIG. 3, and if it is not a natural number, the above-mentioned lotless process is performed.

If the number of remaining processes is a natural number, the process shifts to the next process and the remaining time is retrieved from the reticle state table of FIG.

If the remaining time is 0 hour, the process goes to the lot-less processing described above, and if not, the corresponding lot is selected.

[0029]

As described above in detail, according to the present invention, in the processing system of the semiconductor manufacturing apparatus of the wafer process, the function of selecting a lot from the processable lot group according to the state of the reticle is provided. , It is possible to drastically reduce the reticle attachment / detachment processing that has been frequently performed up to now, and reduce the time required for cutting / changing and the amount of chemical liquid used for trial processing associated with the reticle attachment / detachment processing. Therefore, the manufacturing cost can be reduced.

Further, by controlling the condition of the reticle and selecting the lot, it becomes possible to manufacture an IC of excellent quality.

[Brief description of drawings]

FIG. 1 is a system configuration diagram of an embodiment of the present invention.

FIG. 2 is a processing condition setting / reference screen.

FIG. 3 is a reticle state reference / update screen.

FIG. 4 is a lot priority table.

FIG. 5 is a lot selection means flowchart.

[Explanation of symbols]

 1 Host Computer 2 Storage Device 3 Communication Controller 4 Semiconductor Manufacturing Device 5 Microcomputer 6 Terminal Device

Claims (1)

[Claims] 1. As a processing means of a semiconductor manufacturing apparatus used in an exposure step in manufacturing a semiconductor device, (a) means for storing and updating position data of a reticle, an allowable number of processes, and an allowable leaving time after cleaning the reticle, (B) means for updating the respective sequential data are provided, and (c) and means for selecting the optimum lot by referring to each data of the reticle when selecting the lot and judging whether or not the use is possible. A processing system for a semiconductor manufacturing apparatus, which comprises: