JPH058070A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPH058070A
JPH058070A JP3158020A JP15802091A JPH058070A JP H058070 A JPH058070 A JP H058070A JP 3158020 A JP3158020 A JP 3158020A JP 15802091 A JP15802091 A JP 15802091A JP H058070 A JPH058070 A JP H058070A
Authority
JP
Japan
Prior art keywords
laser beam
laser
condensing
transmission distance
transmission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3158020A
Other languages
Japanese (ja)
Inventor
Kazuo Tsuyuki
和雄 露木
Hideyuki Shinonaga
秀之 篠永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP3158020A priority Critical patent/JPH058070A/en
Publication of JPH058070A publication Critical patent/JPH058070A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To allow optimum laser beam processing at all times regardless of a change in the transmission distance of a laser beam even if this distance changes by constituting the above-mentioned machine in such a manner that a condensing means having an optimum focal distance is selected according to the transmission distance of the laser beam. CONSTITUTION:This laser beam machine has a laser oscillating means which oscillates the laser beam by exciting a laser medium, a laser beam condensing and casting means which has the plural condensing means varying in the focal length to condense the laser beam from this laser oscillating means and irradiates a work piece, such as steel sheet, with the above-mentioned laser beam, a transmission means which transmits the laser beam from the above- mentioned laser oscillating means to the condensing means of these laser beam condensing and casting means, a transmission distance setting and detecting means which sets or detects the laser beam transmission distance of this transmission means, and a selecting means which selects the condensing means of the above-mentioned laser beam condensing and casting means according to the output of this transmission distance setting and detecting means.

Description

【発明の詳細な説明】Detailed Description of the Invention

[発明の目的] [Object of the Invention]

【0001】[0001]

【産業上の利用分野】本発明は、レーザ光により鉄板等
を加工するレーザ加工装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for processing an iron plate or the like with laser light.

【0002】[0002]

【従来の技術】従来のレーザ加工装置は、図4に示すよ
うに、レーザ光を発振するレーザ発振器1と、このレー
ザ発振器1からのレーザ光を集光する集光レンズ2を有
し、被加工物Wに集光されたレーザ光を照射する加工ヘ
ッド3と、レーザ発振器1からのレーザ光を折曲げるベ
ンダーミラー4を有し、レーザ発振器1からのレーザ光
を加工ヘッド3まで伝送する伝送手段5と、被加工物W
を搭載するテーブル6とから構成されている。
2. Description of the Related Art A conventional laser processing apparatus has a laser oscillator 1 for oscillating a laser beam and a condenser lens 2 for condensing the laser beam from the laser oscillator 1, as shown in FIG. The processing head 3 for irradiating the laser beam focused on the workpiece W and the bender mirror 4 for bending the laser beam from the laser oscillator 1 are provided, and the laser beam from the laser oscillator 1 is transmitted to the processing head 3. Means 5 and workpiece W
And a table 6 on which is mounted.

【0003】このように構成されたレーザ加工装置によ
れば、予め設定された加工形状や加工寸法に応じて、加
工ヘッド3が移動することにより、レーザ光を任意の位
置移動させ、加工を行なう。
According to the laser processing apparatus having such a configuration, the processing head 3 moves in accordance with a preset processing shape and processing size, thereby moving the laser beam to an arbitrary position to perform processing. ..

【0004】[0004]

【発明が解決しようとする課題】しかし、上記従来のレ
ーザ加工装置においては、レーザ光の伝送距離が一定で
ないため、ビームモード、スポット径、集光角度が変化
し、常時一定の加工品質、加工精度を得ることが困難で
あった。
However, in the above-mentioned conventional laser processing apparatus, since the transmission distance of the laser light is not constant, the beam mode, the spot diameter, and the converging angle are changed, and the processing quality and processing are always constant. It was difficult to obtain accuracy.

【0005】そこで、本発明は、レーザ光の伝送距離が
変化しても、所定のビームモード、スポット径、集光角
度を維持し、常時一定の加工品質、加工精度が得られる
レーザ加工装置を提供することを目的とする。 [発明の構成]
Therefore, the present invention provides a laser processing apparatus that maintains a predetermined beam mode, spot diameter, and converging angle even when the laser light transmission distance changes, and always obtains constant processing quality and processing accuracy. The purpose is to provide. [Constitution of Invention]

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に、本発明は、レーザ媒質を励起して、レーザ光を発振
するレーザ発振手段と、このレーザ発振手段からのレー
ザ光を集光する焦点距離の異なる複数の集光手段を有
し、前記レーザ光を鉄板等の被加工物に照射するレーザ
光集光照射手段と、前記レーザ発振手段からのレーザ光
を前記レーザ光集光照射手段の集光手段まで伝送する伝
送手段と、前記伝送手段のレーザ光伝送距離を設定或い
は検出する伝送距離設定検出手段と、この伝送距離設定
検出手段の出力に応じて、前記レーザ光集光照射手段の
集光手段を選択する選択手段とを備えたレーザ加工装置
を提供する。
In order to achieve the above object, the present invention provides a laser oscillating means for exciting a laser medium to oscillate a laser beam, and a laser beam from the laser oscillating means. A laser beam condensing irradiation unit that has a plurality of condensing units having different focal lengths and irradiates a workpiece such as an iron plate with the laser beam, and a laser beam condensing irradiation unit that emits the laser beam from the laser oscillation unit. Transmitting means for transmitting to the light collecting means, transmission distance setting detecting means for setting or detecting the laser light transmission distance of the transmitting means, and the laser light collecting and irradiating means according to the output of the transmission distance setting detecting means. And a selecting means for selecting the light collecting means.

【0007】[0007]

【作用】このように構成された本発明のレーザ加工装置
においては、レーザ光の伝送距離に応じて、それに適し
た焦点距離を有する集光手段を選択し、レーザ加工を行
なうので、レーザ光の伝送距離が変化しても所定のビー
ムモード、スポット径、集光角度を維持でき、常時一定
の加工品質,加工精度が得られる。
In the laser processing apparatus of the present invention configured as described above, the laser processing is performed by selecting the condensing means having a focal length suitable for the transmission distance of the laser light and performing the laser processing. Even if the transmission distance changes, a predetermined beam mode, spot diameter, and converging angle can be maintained, and constant processing quality and processing accuracy can always be obtained.

【0008】[0008]

【実施例】以下、本発明の一実施例を図面を用いて説明
する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

【0009】図1に示すように、本実施例のレーザ加工
装置は、レーザ光を発振するレーザ発振器1と、このレ
ーザ発振器1からのレーザ光を集光する焦点距離の異な
る複数の集光レンズ7a,7b,7cを有し、被加工物
Wにレーザ光を照射する加工ヘッド8と、レーザ発振器
1からのレーザ光を折曲げるベンダーミラー4を有し、
レーザ発振器1からのレーザ光を加工ヘッド8まで伝送
する伝送手段5と、レーザ発振器1からのレーザ光の伝
送距離を検出する検出器9と、この検出器9からの検出
値に応じて、加工ヘッド8の集光レンズ7a,7b,7
cのいずれかを選択する選択回路10と、被加工物Wを
搭載するテーブル6とから構成されている。このように
構成された本実施例によれば、下表の如く、予め選択回
路10にレーザ光の伝送距離Lと集光レンズの焦点距離
fとの関係を入力しておく。
As shown in FIG. 1, the laser processing apparatus of this embodiment comprises a laser oscillator 1 for oscillating a laser beam and a plurality of condenser lenses for converging the laser beam from the laser oscillator 1 and having different focal lengths. 7a, 7b, 7c, a processing head 8 for irradiating the workpiece W with laser light, and a bender mirror 4 for bending the laser light from the laser oscillator 1,
The transmission means 5 for transmitting the laser light from the laser oscillator 1 to the processing head 8, the detector 9 for detecting the transmission distance of the laser light from the laser oscillator 1, and the processing according to the detection value from the detector 9 Condensing lenses 7a, 7b, 7 of the head 8
It comprises a selection circuit 10 for selecting any one of c and a table 6 on which the workpiece W is mounted. According to the present embodiment configured as described above, as shown in the following table, the relationship between the transmission distance L of the laser light and the focal length f of the condenser lens is input to the selection circuit 10 in advance.

【0010】[0010]

【表1】 [Table 1]

【0011】そして、検出器9により検出された伝送距
離Lに応じて、選択回路10を介して、集光レンズ7
a,7b,7cのいずれかを選択する。また、上表で
は、同じ伝送距離で複数の集光レンズが重複するが、被
加工物W材質等を考慮して予め選択優先度を決めてお
き、被加工物Wの材質等により最適な加工が行なえるよ
うにしている。また、加工ヘッド8は、図2に示すよう
に、集光レンズ7a,7b,7cをロータリー式に形成
し、回動手段8aにより、回動自在としている。
Then, according to the transmission distance L detected by the detector 9, the condenser lens 7 is passed through the selection circuit 10.
Select either a, 7b, or 7c. Further, in the table above, a plurality of condensing lenses overlap at the same transmission distance, but the selection priority is determined in advance in consideration of the material of the workpiece W, and the optimum processing is performed depending on the material of the workpiece W. I can do it. Further, as shown in FIG. 2, the processing head 8 is configured such that the condenser lenses 7a, 7b and 7c are formed in a rotary type, and can be freely rotated by a rotating means 8a.

【0012】尚、本実施例においては、集光レンズ7
a,7b,7cをロータリー式に形成し、回動手段8a
により、回動自在に構成しているが、これに限らず、ス
ライド式に形成し、しゅう動手段によりしゅう動自在に
構成してもよい。
In this embodiment, the condenser lens 7
a, 7b, 7c are formed in a rotary type, and a rotating means 8a
However, the present invention is not limited to this, and it may be formed in a sliding manner and slidable by a sliding means.

【0013】[0013]

【発明の効果】以上述べたように、本発明によれば、レ
ーザ光の伝送距離に応じて、最適な焦点距離を有する集
光手段を選択するように構成したので、レーザ光の伝送
距離が変化しても、その変化に関係なく常に、最適なレ
ーザ加工が実現できる。
As described above, according to the present invention, the condensing means having the optimum focal length is selected according to the transmission distance of the laser light, so that the transmission distance of the laser light is reduced. Even if it changes, the optimum laser processing can always be realized regardless of the change.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す概要構成図。FIG. 1 is a schematic configuration diagram showing an embodiment of the present invention.

【図2】本発明の一実施例の加工ヘッドを示す概要構成
図。
FIG. 2 is a schematic configuration diagram showing a processing head according to an embodiment of the present invention.

【図3】従来のレーザ加工装置を示す概要構成図。FIG. 3 is a schematic configuration diagram showing a conventional laser processing apparatus.

【符号の説明】[Explanation of symbols]

1…レーザ発振器 5…伝送手段 7a,7b,7
c…集光レンズ 8…加工ヘッド 9…検出器 10…選択回路
W…被加工物
DESCRIPTION OF SYMBOLS 1 ... Laser oscillator 5 ... Transmission means 7a, 7b, 7
c ... Condensing lens 8 ... Processing head 9 ... Detector 10 ... Selection circuit
W ... Workpiece

Claims (1)

【特許請求の範囲】 【請求項1】 レーザ媒質を励起して、レーザ光を発振
するレーザ発振手段と、このレーザ発振手段からのレー
ザ光を集光する焦点距離の異なる複数の集光手段を有
し、前記レーザ光を鉄板等の被加工物に照射するレーザ
光集光照射手段と、前記レーザ発振手段からのレーザ光
を前記レーザ光集光照射手段の集光手段まで伝送する伝
送手段と、前記伝送手段のレーザ光伝送距離を設定或い
は検出する伝送距離設定検出手段と、この伝送距離設定
検出手段の出力に応じて、前記レーザ光集光照射手段の
集光手段を選択する選択手段とを具備したことを特徴と
するレーザ加工装置。
Claim: What is claimed is: 1. A laser oscillating means for exciting a laser medium to oscillate a laser beam, and a plurality of focusing means having different focal lengths for focusing the laser beam from the laser oscillating means. A laser beam focusing and irradiating means for irradiating a workpiece such as an iron plate with the laser beam, and a transmitting means for transmitting the laser beam from the laser oscillating means to the focusing means of the laser beam focusing and irradiating means. Transmission distance setting detection means for setting or detecting the laser light transmission distance of the transmission means, and selection means for selecting the focusing means of the laser light focusing and irradiating means according to the output of the transmission distance setting detection means. A laser processing apparatus comprising:
JP3158020A 1991-06-28 1991-06-28 Laser beam machine Pending JPH058070A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3158020A JPH058070A (en) 1991-06-28 1991-06-28 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3158020A JPH058070A (en) 1991-06-28 1991-06-28 Laser beam machine

Publications (1)

Publication Number Publication Date
JPH058070A true JPH058070A (en) 1993-01-19

Family

ID=15662520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3158020A Pending JPH058070A (en) 1991-06-28 1991-06-28 Laser beam machine

Country Status (1)

Country Link
JP (1) JPH058070A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997004917A1 (en) * 1995-08-02 1997-02-13 Komatsu Ltd. Laser marker
US5624587A (en) * 1993-03-08 1997-04-29 Mitsubishi Denki Kabushiki Kaisha Laser machining apparatus and method of setting focus thereof
US5702622A (en) * 1995-04-28 1997-12-30 Precitex Gmbh Terminal head for processing a workpiece by means of a laser beam
US20130064706A1 (en) * 2009-12-04 2013-03-14 Slm Solutions Gmbh Optical irradiation unit for a plant for producing workpieces by irradiation of powder layers with laser radiation

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5624587A (en) * 1993-03-08 1997-04-29 Mitsubishi Denki Kabushiki Kaisha Laser machining apparatus and method of setting focus thereof
US5702622A (en) * 1995-04-28 1997-12-30 Precitex Gmbh Terminal head for processing a workpiece by means of a laser beam
WO1997004917A1 (en) * 1995-08-02 1997-02-13 Komatsu Ltd. Laser marker
US20130064706A1 (en) * 2009-12-04 2013-03-14 Slm Solutions Gmbh Optical irradiation unit for a plant for producing workpieces by irradiation of powder layers with laser radiation
US9221100B2 (en) * 2009-12-04 2015-12-29 Slm Solutions Gmbh Optical irradiation unit for a plant for producing workpieces by irradiation of powder layers with laser radiation

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