JPH0570986A - Electrolytic copper plating method and electrolytic copper plating device - Google Patents

Abstract

PURPOSE:To execute plating only in the parts required to be plated even without masking the parts not to be plated and to consequently easily execute the partial plating to the fine patterns of a multilayer ceramic substrate and to prevent the other parts from being plated and corroded. CONSTITUTION:An anode member constituted by providing a gripping part formed of an insulating material around a solid electrolyte formed to a circular cylindrical shape, sharpening the front end thereof to form a nozzle part and finishing the foremost end of the nozzle part to a plane of the same size as the size of the parts required to be plated of the multilayer substrate is used. A DC electric power is connected between the anode provided at the top end of an anode member and the multilayer substrate and the foremost end of the nozzle part at the front end of the anode member is brought into contact with the parts required to be plated of the multilayer substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrolytic copper plating method and an electrolytic copper plating apparatus using a solid electrolyte, and more particularly to a solid electrolyte for partially plating a fine pattern of a multilayer ceramic substrate. The present invention relates to an electrolytic copper plating method and an electrolytic copper plating apparatus.

[0002]

2. Description of the Related Art FIG. 2 is a sectional view showing an example of a conventional electrolytic copper plating apparatus using a solid electrolyte, and FIG. 3 is a sectional view showing another example of a conventional electrolytic copper plating apparatus using a solid electrolyte. .

As shown in FIG. 2, a conventional electrolytic copper plating apparatus using a solid electrolyte for partially plating a fine pattern of a multilayer ceramic substrate has hairs, gauze, absorbent cotton, etc. at its tip. The impregnating material 17 formed in
A grip portion 12 made of an insulating material is provided on the upper portion of the grip portion, an anode 16 is held at the center of the grip portion 12, a DC power source 18 is connected between the anode 16 and the multilayer ceramic substrate (multilayer substrate) 4, and a plating solution The impregnated material 17 included is rubbed on the plating-required portion of the multilayer substrate 4 to perform plating.

Further, as shown in FIG. 3, a cover 29 is provided so as to completely surround the plating-required portion 5 of the multilayer substrate 4, and a plating solution 21 is circulated in the cover 29 by a pump 20 (arrow A). , The anode 26 provided in the cover 29
And the DC power source 28 are connected to each other so that the plating-required portion 5 of the multilayer substrate 4 is plated.

[0005]

The conventional electrolytic copper plating apparatus as described above all use a plating solution of copper sulfate or copper pyrophosphate as a copper ion source, so that plating is not necessary on a portion. It has the drawback that masking must be performed to prevent scratches and corrosion of the part. Further, in the case of the example of FIG. 3, there is also a problem that the plating solution permeates under the masking, which causes a substitution reaction to cause stains and mist. Especially when partially plating a fine pattern on a multilayer ceramic substrate, if masking is performed on a pattern that does not require plating,
Since the adhesive of the masking tape adheres to it, it has a drawback that it is difficult to partially plate a fine portion.

[0006]

According to the electrolytic copper plating method of the present invention, a grip portion formed of an insulating material is provided on the outer peripheral portion, a solid electrolyte is built in the central portion, and the tip portion is sharpened to form a nozzle shape. Then, using the anode member provided with an anode for exposing the solid electrolyte and connecting the solid electrolyte to the upper end, the DC power source is connected between the object to be plated and the anode to connect the tip of the anode member. The method includes contacting the portion to be plated of the object to be plated.

The electrolytic copper plating apparatus of the present invention has a grip portion formed of an insulating material on the outer periphery, a solid electrolyte is built in the central portion, and the tip is sharpened to form a nozzle shape to form the solid electrolyte. It is provided with an anode member which is exposed and has an anode connected to the solid electrolyte at its upper end, and a DC power source connected between the object to be plated and the anode.

[0008]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of the electrolytic copper plating apparatus of the present invention.

In FIG. 1, the anode member 9 is a solid electrolyte (7CuBrC ₆ H ₁₂ N ₄ CH ₂ Br or
RbCu ₄ Cl ₃ I ₄ ) 1 around the grip 2 made of insulating material
Are provided, the tip portions thereof are sharpened to form the nozzle portion 3, and the size of the most distal end portion is made the same as the size of the plating-required portion 5 of the multilayer substrate 4 to finish the surface flat. An anode 6 connected to the solid electrolyte 1 is provided on the upper end of the anode member 9, and a DC power supply 8 is connected between the anode 6 and the multilayer substrate 4.

When plating the plating-required portion 5 of the multilayer substrate 4 with the electrolytic copper plating apparatus thus configured, the tip portion of the nozzle portion 3 of the anode member 9 is brought into contact with the plating-required portion 5 of the multilayer substrate 4. Then, a direct current power source 8 is used to pass an electric current between the anode 6 and the multilayer substrate 4. Although the solid electrolyte 1 is a solid, it is a substance exhibiting electrical conductivity by ions like the electrolyte solution, and therefore when an electric field is applied by the DC power source 8, positive copper ions move in the solid electrolyte 1. , Is reduced on the plating-required portion 5 corresponding to the cathode to become metallic copper, and plating is performed. In this way, the nozzle 3
Only the place where the tip of the
It does not plate or corrode other parts without masking. By changing the size of the tip portion of the nozzle portion 3, it is possible to perform plating on a portion having a desired size.

In the solid electrolyte 1, since only one type of ion is involved in electric conduction and the amount of movement thereof is small, uneven distribution of electric charges is likely to occur, and therefore the thickness of plating can be easily controlled.

[0013]

As described above, according to the present invention, a grip portion formed of an insulating material is provided around a solid electrolyte formed into a cylindrical shape, and the tip portion thereof is sharpened to form a nozzle portion,
The size of the tip of the nozzle is set to be the same as the size of the plated part of the multilayer substrate, and an anode member is used that has been finished to a flat surface.A direct current is placed between the anode provided on the upper end of the anode member and the multilayer substrate. By connecting the power supply and bringing the tip of the nozzle at the tip of the anode member into contact with the plating-required portion of the multilayer substrate, only the plating-required portion is plated without masking the non-plated portion. Therefore, there is an effect that it is possible to easily perform partial plating on a fine pattern of the multilayer ceramic substrate, and also to prevent plating or corrosion of other parts. is there.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of an electrolytic copper plating apparatus using a solid electrolyte of the present invention.

FIG. 2 is a sectional view showing an example of a conventional electrolytic copper plating apparatus using a solid electrolyte.

FIG. 3 is a cross-sectional view showing another example of a conventional electrolytic copper plating apparatus using a solid electrolyte.

[Explanation of symbols]

 1 Solid Electrolyte 2 Gripping Part 3 Nozzle Part 4 Multilayer Substrate 5 Required Plating Part 6 Anode 8 DC Power Supply 9 Anode Member 12 Gripping Part 16 Anode 17 Impregnating Material 18 DC Power Supply 20 Pump 21 Plating Solution 26 Anode 28 DC Power Supply 29 Cover

Claims (2)

[Claims] 1. A solid electrolyte is built in the central part with a grip part made of an insulating material on the outer periphery, and the tip is sharpened to form a nozzle shape to expose the solid electrolyte and the solid is formed at the upper end. Using an anode member provided with an anode to be connected to an electrolyte, connecting a DC power supply between the object to be plated and the anode to bring the tip end portion of the anode member into contact with a plated portion of the object to be plated. An electrolytic copper plating method comprising: 2. A grip portion formed of an insulating material is provided on the outer periphery, a solid electrolyte is built in the central portion, the tip is sharpened to form a nozzle, and the solid electrolyte is exposed to expose the solid electrolyte at the upper end. An electrolytic copper plating apparatus comprising: an anode member provided with an anode connected to an electrolyte; and a DC power supply connected between an object to be plated and the anode.