JPH0555319A - Socket for ic - Google Patents

Abstract

PURPOSE:To cut off the effect of the crosstalk of the signal between each of wire ropes and the noise of a power source by a method wherein the liquid metal, poured into the hollow part inside the main body block, is electrically insulated from the wire ropes by having the outer circumference of the center part of the wire ropes coated by an insulating coating, and the liquid metal is grounded. CONSTITUTION:The soldering part 7 of the lower end part of wire probes 3 is soldered to a printed substrate 5. Also, liquid metal 2 is earthed together with an earthing wiring pattern provided on the printed substrate 5 through the intermediary of the main body blocks 1, formed by conductive material, and mounting screws 10. In the IC socket constituted as above, pin parts 3a can be brought into contact with bumps 4a by the prescribed pressure. Besides, the effect of the crosstalk of signal between each of the wire probes can be shut off.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket for use in an apparatus, a burn-in test, etc., during an electrical test carried out in the IC manufacturing process.

[0002]

2. Description of the Related Art Various types of integrated circuits (ICs) have been manufactured, and correspondingly, IC sockets suitable for the respective types of ICs have been put into practical use. As one example, there is an IC socket having a wire probe pin as an IC socket in which a large number of bumps are densely provided on one surface.

A conventional IC socket of this type is an IC
A plurality of wire probes are provided on the main body part on which each of the wire probes is mounted, and each wire probe is arranged so that the pin part (wire probe pin) comes into contact with each of the plurality of bumps provided on the IC. There is.

As described above, the wire probe is held in the main body of the IC socket, and the IC of the pin portion is held.
Since the contact pressure to the bump is obtained by the spring force due to the bending of the wire probe itself, the inside of the main body is hollow so that the wire probe can bend.

[0005]

The conventional IC socket having the wire probe pin as described above has a problem with respect to electrical noise and crosstalk.

That is, as described above, since the inside of the main body for holding the wire probe is hollow, it is easily affected by electrical noise. In particular, the longer the wire probe is, the higher the noise of high frequency becomes. And becomes susceptible to signal crosstalk and power supply noise between wire probes. Therefore, high-speed IC
Difficult to make electrical tests.

[0007]

SUMMARY OF THE INVENTION An IC socket according to the present invention has a plurality of wire probes formed of an electric conductor and having a central portion insulated and coated, and a hollow interior for holding the plurality of wire probes. And a liquid metal that is injected into the hollow interior of the body and grounded.

[0008]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is an enlarged sectional view showing a main part of the embodiment shown in FIG.

In FIGS. 1 and 2, a main body (main body block) 1 of an IC socket has a hollow inside, and a liquid metal 2 is injected into this hollow portion. The liquid metal 2 is electrically grounded. The body block 1 also holds a plurality of wire probes 3. The wire probe 3 is covered at its outer periphery at the center with an insulating coating 3b, and is electrically insulated from the liquid metal 2 by this.

On the upper surface of the main body block 1, the I
A guide block 6 for mounting the C4 is provided, and the IC 4 mounted on the guide block 6 with the side surface of the guide block 6 as a guide is held by the pressing member 9 via the cover plate 8. The lower surface of the IC 4 is provided with a plurality of bumps 4a for connecting an input / output signal and a power source. These bumps 4a extend through a guide hole provided at a predetermined position of the guide block 6. Contacting the top pin portion 3a of the wire probe 3
The main body block 1 is connected to the wiring pattern of the printed circuit board 5, which is fixed by the mounting screw 10, via the lead portion 3d at the lower end of the.

In the wire probe 3, the soldering portion 7 at the lower end portion is soldered to the printed circuit board 5, and when the pin portion 3a comes into contact with the bump 4a of the IC 4, the bending portion 3c at the central portion bends, which causes The elastic force generates a contact pressure on the bump 4a.

The liquid metal 2 is connected to a ground wiring pattern provided on the printed circuit board 5 through a body block 1 made of a conductive material and a mounting screw 10.

The IC socket thus constructed is
When C4 is mounted and fixed, the wire probe 3 can freely bend in the main body block 1, so that the pin portion 3a can be brought into contact with the bump 4a of the IC 4 with a predetermined pressure, and the wire 4 Since the central portion of the probe 3 is covered with the insulating coating 3b and electrically insulated from the liquid metal 2, it is possible to block the influence of signal crosstalk and power supply noise between the wire probes. Therefore, it becomes possible to perform a high-speed electrical test of the IC.

[0015]

As described above, the IC socket of the present invention is electrically insulated from the liquid metal injected into the hollow portion inside the body block by covering the outer periphery of the central portion of the wire probe with an insulating coating. However, by grounding the liquid metal, there is an effect that the crosstalk of signals between the wire probes and the influence of power source noise can be blocked, and therefore, it is possible to perform a high-speed electrical test of the IC. effective.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing an enlarged main part of the embodiment of FIG.

[Explanation of symbols]

 1 Main body block 2 Liquid metal 3 Wire probe 3a Pin part 3b Insulation coating 3c Deflection part 3d Lead part 4 IC 4a Bump 5 Printed circuit board 6 Guide block 7 Soldering part 8 Cover plate 9 Holding member 10 Mounting screw

Claims (1)

[Claims] 1. A plurality of wire probes formed of an electric conductor and having a central portion insulated and coated, a main body portion that holds the plurality of wire probes and has a hollow interior, and a hollow body portion of the main body portion. An IC socket, comprising: a liquid metal injected into the interior and grounded.