JPH0549602A - Endoscope - Google Patents

Abstract

PURPOSE:To miniaturize an image pickup part of the endoscope by housing a connecting pad of a circuit board and a signal cable, within dimensions of a solid state image pickup element, in the prescribed direction. CONSTITUTION:A circuit load 14 covers the peripheral surface of a CCD 11 by the upper substrate 14a and the lower substrate 14b for inserting and holding the CCD 11 from the upper and the lower directions, and a side part substrate formed by bending integrally and vertically the lower substrate 14b, and also, the rear of the upper substrate 4a and the lower substrate 14b is bent stepwise to the inside and a recessed part 18 to the peripheral. surface of the CCD 11 is formed. Also, signal cables 19 are connected to the facing surfaces of the upper substrate 14a and the lower substrate 14b of this recessed part, 18, respectively, thickness of an image pickup part 12 containing the signal cable 19 to the diameter direction of a tip hard part 6 is set roughly to height of the CCD 11, and in accordance with miniaturization of the CCD 11, the image pickup part, 12 can be miniaturized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an endoscope in which an image pickup section at the tip of an insertion section is downsized.

[0002]

2. Description of the Related Art In recent years, in the medical field, an endoscope capable of observing organs in a body cavity by inserting an elongated insertion portion into the body cavity is widely used. , Not only for medical use but also for industrial use,
It is used for observing and inspecting objects and the like inside pipes of chemical plants and the like, or inside machines.

The endoscope includes an optical endoscope (so-called fiberscope) and an electronic endoscope in which a solid-state image pickup device such as a charge-coupled device (CCD) is arranged in the image pickup section at the tip of the insertion section. In the image pickup section of the electronic endoscope, the CCD
Is connected to a circuit board on which an IC or the like is mounted, and a signal cable for transmitting input / output signals is connected to the circuit board.

A TAB (Tape Automated Bonding) tape or an F tape is usually provided on the circuit board.
A circuit board called CP (Film Carrier Package) is used. This circuit board is bent so as to enclose the CCD, and a signal cable is connected to a pair of upper and lower exterior surfaces.

By the way, recently, there is an increasing demand for endoscopes, such as endoscopes for bronchial observation, which require a smaller diameter of the insertion portion, and the exterior of the circuit board is accompanied by the miniaturization of the CCD. Since the surface becomes narrow compared to the thickness of the signal cable,
As shown in FIG. 8, a circuit board 51 enclosing the CCD 50
It has become necessary to wire the signal cable 52 on each exterior surface of the.

[0006]

However, since the outer diameter of the distal end portion of the endoscope insertion portion is substantially defined by the thickness of the image pickup portion and the inner diameter of the forceps channel, which depends on the size of the CCD, as described above. When the CCD is miniaturized and the signal cable is wired on each of the exterior surfaces of the circuit board, the size of the signal cable connecting portion protruding from the peripheral surface of the CCD cannot be ignored.

As a result, it is difficult to reduce the size of the image pickup section, and it is not possible to make full use of the miniaturization of the CCD. In addition, it is not possible to reduce the thickness of the image pickup section in the outer diameter direction of the distal end portion. There is a problem that it is not possible to reduce the diameter of the part.

The present invention has been made in view of the above circumstances, and it is possible to reduce the size of the image pickup unit by accommodating the connection portion between the circuit board and the signal cable within the size of the solid-state image pickup element in a predetermined direction. The purpose is to provide an endoscope.

[0009]

SUMMARY OF THE INVENTION The present invention is an endoscope in which a solid-state image pickup device is arranged in an image pickup portion at the tip of an insertion portion to be inserted into a subject, and the solid-state image pickup device is covered with a peripheral surface of the solid-state image pickup device. A recess is formed in the peripheral surface of the solid-state imaging device in a part of a circuit board connected to the device, and a signal cable is connected to the recess.

[0010]

According to the present invention, a circuit board which covers the peripheral surface of the solid-state image sensor and has a concave portion partially formed on the peripheral surface is connected to the solid-state image sensor provided in the image pickup section at the tip of the endoscope. To do. Then, since the signal cable is connected to the recess of the circuit board, the connecting portion between the circuit board and the signal cable is accommodated within the size of the solid-state image pickup element in a predetermined direction to downsize the image pickup section. be able to.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 relate to a first embodiment of the present invention.
2 is a cross-sectional view showing the tip rigid portion of the endoscope, FIG. 2 is an overall view of the endoscope, FIG. 3 is an explanatory view showing the arrangement of the imaging unit and the forceps channel in the AA line cross-section of FIG. 2, and FIG. It is a perspective view of an imaging part.

In FIG. 2, an endoscope 1 includes an insertion portion 2 formed in a slender shape so as to be inserted into a subject, a large-diameter operation portion 3 connected to a rear end of the insertion portion 2, and an operation portion 3 having a large diameter. The universal cord 4 extends from the side portion of the operation portion 3, and a connector 5 connected to a light source device (not shown) or the like is provided at an end portion of the universal cord 4.

The insertion part 2 includes a hard tip hard part 6 and
A bending portion 7 that is continuously provided to the tip rigid portion 6 and that can be bent vertically and horizontally, and the operation portion 3 from the rear end of the bending portion 7.
The flexible flexible pipe 8 is provided continuously at the front end.

As shown in FIG. 1, a forceps channel 9 through which a treatment tool or the like is inserted and an objective optical system 10 is provided in the distal end rigid portion 6, and an objective optical system 10 is provided behind the objective optical system 10. An imaging unit 12 provided with a CCD 11 as a solid-state imaging device for converting an optical image of a subject into an electric signal.
Is provided.

As shown in FIG. 3, the radial cross section of the distal end rigid portion 6 is mainly occupied by the forceps channel 9 and the image pickup portion 12, and a light guide or the like (not shown) is arranged in the remaining space. There is. Therefore, the outer diameter of the tip rigid portion 6 is substantially defined by the height H of the CCD 11 of the image pickup portion 12 and the inner diameter of the forceps channel 9.

The CCD 11 is arranged such that the photoelectric conversion surface is at the image forming position of the objective optical system 10, and a cover glass 13 is adhered to the front surface of the photoelectric conversion surface. The cover glass 13 is narrower than the flat surface portion of the CCD 11 on the photoelectric conversion surface side, and an electrode pad is provided on the flat surface portion of the CCD 11 which is not covered with the cover glass 13.

Then, on the electrode pad of the CCD 11,
Bumps (inner lead bumps) 15 of the circuit board 14 are bonded, and the CCD 11 and the circuit board 14 are bonded.
And are electrically connected.

The circuit board 14 is a so-called TAB tape or FCP, which is bent at a substantially right angle in the vicinity of the electrical connection portion to which the CCD 11 is bonded.
The CCD 11 is mounted on the upper substrate 14a from above and below the height H.
And the side substrate 14c formed by bending the lower substrate 14b integrally at a right angle as shown in FIG.
The peripheral surface of 1 is covered.

A resistor 16 is mounted on the inner surface of the lower substrate 14b on the rear side of the CCD 11, and the upper substrate 14a and the lower substrate 14b are stepped inwardly behind the portion where the resistor 16 is mounted. The inner surface of the lower substrate 14b is bent and the IC
17 has been implemented.

The upper substrate 14a and the lower substrate 14
The stepwise bent portion of b forms a concave portion 18 with respect to the peripheral surface of the CCD 11, and the signal cables 19 are connected to the outer surfaces of the upper substrate 14a and the lower substrate 14b of the concave portion 18, respectively. .. Also, the side substrate 14c and the lower substrate 14b are electrically connected,
A signal cable 19 is connected to the exterior surface of the side substrate 14c.

That is, the signal cable 1 is formed in the concave portion 18.
Since 9 is connected, the thickness of the image pickup unit 12 including the signal cable 19 in the radial direction of the distal end rigid portion 6 can be made approximately the height H of the CCD 11, and the CCD 11 can be miniaturized. Accordingly, the image pickup unit 12 can be downsized. As a result, the channel of the insertion portion 2 can be increased and the diameter thereof can be reduced, and the miniaturization of the CCD 11 can be fully utilized.

FIG. 5 is an explanatory view showing an image pickup section according to the second embodiment of the present invention. This second embodiment is the same as the first embodiment described above.
In the circuit board 14 of the embodiment, both the upper board 14a and the lower board 14b are bent to form the recesses 18 on the upper and lower sides, whereas the upper board 14a is bent only.

That is, as shown in FIG. 5, in the present embodiment, a circuit board 20 composed of the upper board 14a of the first embodiment and the lower board 20a having a flat portion is provided.
The CCD 11 is connected.

The lower substrate 20a is bent at a substantially right angle in the vicinity of the electrical connection portion to which the CCD 11 is bonded via the bump 15, and the rear portion thereof is a flat portion. A resistor 16 and an IC 17 are sequentially mounted on the inner surface side of the flat surface portion behind the CCD 11.

Further, the lower substrate 20a is bent at a right angle along the side of the CCD 11 to form a side substrate (not shown), and the side substrate and the lower substrate 20a are electrically connected. ..

A signal cable 19 is connected to the outer surface of the recess 18 of the upper substrate 14a.
The thickness of the rear portion of the imaging unit 12 including
The thickness of the front portion of the image pickup unit 12 including the above is not exceeded.

Needless to say, the same effects as those of the above-described first embodiment can be obtained in this embodiment, but this embodiment is used when the number of wirings is smaller than that of the above-mentioned first embodiment or when mounting is performed. It is particularly effective when the IC 17 to be processed is thick.

Further, in this embodiment, the lower substrate 2
Since the bending for connecting the signal cable 19 to 0a is not provided, the side substrate can be easily formed, and the workability and workability are good.

FIG. 6 is an explanatory diagram showing an image pickup section according to the third embodiment of the present invention. In this third embodiment, the CCD 11
One circuit board 30 connected to only one end of the photoelectric conversion surface side flat portion of a is adopted.

In this embodiment, the CCD 11a arranged in the image pickup section 12 of the endoscope 1 is bonded to the cover glass 13a with one end aligned and is a flat portion of the CCD 11a not covered with the cover glass 13a. The CCD 11a and the circuit board 30 are electrically connected via the bumps 15a.

The circuit board 30 is bent at a substantially right angle in the vicinity of an electrical connection portion with the CCD 11a, and a resistor 16 and an IC 17 are sequentially mounted on the inner surface side behind the circuit board 30. Further, in the circuit board 30, a rear portion of a mounting portion of the resistor 16 and the IC 17 is bent upward, a recess 31 is formed to cover the resistor 16 and the IC 17, and a peripheral surface of the CCD 11 is formed.
A side substrate (not shown) is formed so as to be bent at a right angle along the side of 11a so as to be electrically connected.

The recess 31 is provided with two steps of different heights, and the signal cable 19 is connected to each of the two steps of different heights. The thickness of the rear portion of the image pickup unit 12 including the signal cable 19 is the same as that of the CCD.
The thickness of the front part of the imaging unit 12 including 11a is not exceeded.

In this embodiment, the CCD 11a and the circuit board 30 are used.
Since the connection with the connection is made only at one end of the flat surface portion on the photoelectric conversion surface side, the diameter of the insertion portion 2 can be further reduced as compared with the first and second embodiments described above, and the circuit board 30 and the signal cable 19 can be further reduced. Since the connection part with and is on the same direction side, workability is excellent as compared with the case of connecting to both surfaces of the circuit board.

FIG. 7 is an explanatory view showing an image pickup section according to the fourth embodiment of the present invention. The fourth embodiment is the same as the third embodiment described above.
The circuit board 4 is changed by changing the bending method of the circuit board 30 of the embodiment.
0, and the connection portion of the signal cable 19 is provided on the surfaces on different sides.

That is, the circuit board 40 has the bumps 15a.
After being bent at a substantially right angle in the vicinity of an electrical connection with the CCD 11a via the CCD 11, and further along the back surface of the CCD 11a, it is bent in a stepwise manner from the middle of the back surface of the CCD 11a to the upper and lower periphery of the CCD 11a. A recess 41 is formed on the surface. Further, the circuit board 40 is bent at a right angle along the side portion of the CCD 11a to form a side substrate (not shown) that is electrically connected.

The resistor 16 and the IC 17 are mounted from the CCD 11a side on the circuit board 40 which is bent stepwise on the back side of the CCD 11a. The mounting surface of the resistor 16 and the mounting surface of the IC 17 are opposite to each other. Is becoming A signal cable 19 is connected to each of the back surface of the mounting surface of the resistor 16 and the back surface of the mounting surface of the IC 17.

In this case, the thickness of the image pickup portion 12 including the signal cable 19 does not exceed the thickness of the front portion of the image pickup portion 12 including the CCD 11a, and the same effect as that of the first embodiment can be obtained. Not only the circuit board 40 has the resistor 16,
Since the IC 17 is not covered, heat dissipation is improved.

[0038]

As described above, according to the present invention, a recess is formed in a part of the circuit board connected to the solid-state image sensor with respect to the peripheral surface of the solid-state image sensor, and the signal cable is provided in the recess. Therefore, the connecting portion between the circuit board and the signal cable can be accommodated within the size of the solid-state imaging element in a predetermined direction. As a result, the image pickup unit can be downsized in response to the downsizing of the solid-state image pickup device, and the excellent effects such as the diameter of the insertion portion of the endoscope can be reduced can be obtained.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a distal end rigid portion of an endoscope according to a first embodiment of the present invention.

FIG. 2 is a general view of an endoscope according to the first embodiment of the present invention.

FIG. 3 is an explanatory diagram related to the first embodiment of the present invention and showing the arrangement of the imaging unit in the cross section along the line AA in FIG.

FIG. 4 is a perspective view of an image pickup unit according to the first embodiment of the present invention.

FIG. 5 is an explanatory diagram showing an image pickup unit according to the second embodiment of the present invention.

FIG. 6 is an explanatory view showing an image pickup section according to the third embodiment of the present invention.

FIG. 7 is an explanatory view showing an image pickup section according to the fourth embodiment of the present invention.

FIG. 8 is a perspective view of an imaging unit according to a conventional example.

[Explanation of symbols]

 1 endoscope 2 insertion part 11 CCD 12 imaging part 14 circuit board 18 recess 19 signal cable

Claims (1)

[Claims] 1. An endoscope in which a solid-state image sensor is provided in an image-capturing section at the tip of an insertion section to be inserted into a subject, the circuit board covering a peripheral surface of the solid-state image sensor and connected to the solid-state image sensor. An endoscope characterized in that a recess is formed in a part of the peripheral surface of the solid-state imaging device, and a signal cable is connected to the recess.