JPH054581U - Packetgeshelf - Google Patents

Abstract

(57) [Summary] [Objective] To obtain a package shelf in which the cooling air flow rate can be easily adjusted according to the heat generation amount of the printed circuit board, the cooling efficiency is high, and the weight does not become heavy. [Structure] A guide plate having an opening matching the ventilation hole of the box-shaped chassis is attached. A groove is provided on the surface of the guide plate that contacts the chassis, and a plurality of recesses are provided at both ends of the opening. An air volume adjusting plate having a convex cross-section plate shape, which has a protrusion that matches the groove of the guide plate and engages with the recess of the guide plate, is attached. [Effect] By inserting the air volume adjusting plate into the guide plate, the cooling air opening area can be changed, and the cooling air volume can be easily adjusted according to the heat generation amount of the printed circuit board.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 This invention relates to an improvement of a package shelf.

[0002]

[Prior Art]

 Conventionally, as a cooling method for a package shelf on which a large number of printed circuit boards are mounted, conventionally, a cooling air intake and a cooling air outlet are provided on both sides of an electronic device housing having the above-mentioned package shelf, and a cooling fan is used to suck the cooling air. The forced air cooling method that exhausts air is widely adopted. On the other hand, recently, there is an increasing demand for weight reduction and cost reduction of electronic device housings. FIG. 6 is a sectional view showing an electronic device housing provided with a conventional package shelf, and FIG. 5 is a view seen from the direction A in FIG. In the figure, 1 is a case, and the cover 2 is fixed to the case 1 by screws 3. Punching metal 4 is adhered to both sides of the case 1. A chassis 5 is fixed to the case 1 by screws 6. A cooling fan 7 is fixed to the chassis 5 with a screw 8. At the bottom of the chassis 5, a motherboard 10 having a connector seat 9 assembled therein is fixed by screws 11. Further, guide plates 12 are fixed by screws 13 on both left and right sides of the chassis 5. Reference numeral 14 denotes a printed circuit board on which a heat generating component 15 (for example, a resistor), another circuit component 16 (for example, a capacitor) and a printed circuit board connector 17 are assembled, and is mounted along the guide portion 18 of the guide plate 12. Here, the connector seat 9 on the mother board 10 and the printed circuit board connector 17 are engaged with each other. Further, the case 1 is provided with a cooling inlet 19, and the cooling air taken in from the cooling air inlet 19 by the cooling fan 7 passes through the cooling air ventilation hole 20 provided in the chassis 5. After the heat-generating component 15 is cooled through it, the heat-generating component 15 is discharged from the discharge port 22 provided in the case 1.

[0003]

[Problems to be solved by the device]

 In the conventional package shelf as described above, since the guide portion 18 of the guide plate 12 is engaged with the connector seat 9 and the printed board connector 17 when the printed circuit board 14 is inserted, the height of the groove is increased. Since it is necessary to increase the thickness to a certain degree, the plate thickness of the guide plate 12 becomes thicker, which inevitably causes a heavy mass.

Further, in order to cool the heat-generating component 15, a ventilation hole 21 is provided in a portion of the guide plate 12 which serves as a flow path for cooling air. There was a problem that the cooling efficiency was poor because it was difficult to control the flow rate of.

The present invention has been made in order to solve such a problem, and an object thereof is to obtain a package shelf in which the cooling air flow can be easily adjusted according to the heat generation amount of the printed board and the weight can be reduced. .

[0006]

[Means for Solving the Problems]

 The package shelf according to the present invention has an opening matching the ventilation hole of the box-shaped chassis, a plurality of recesses at both ends of the opening, and a guide plate having a groove formed on the surface in contact with the chassis. Attach the air volume adjusting plate to the guide plate, which has a convex cross-section plate shape that matches the cross-sectional shape of the guide plate and has projections that engage with the recesses of the guide plate at the centers of the shorter sides. It is designed to close the hole.

[0007]

[Action]

 In this invention, the air volume adjusting plate can be fixed by inserting the air volume adjusting plate into the guide plate and engaging the protrusion of the air volume adjusting plate with the concave portion of the guide plate at an appropriate position. Adjust the cooling air opening area by changing.

[0008]

【Example】

 Example 1. 1 is a cross-sectional view showing an embodiment of the present invention, FIG. 2 is a view seen from the direction B in FIG. 1, FIG. 3 is a view showing a cross-section CC of FIG. 2, and FIG. 4 is a detail of an air volume adjusting plate. 1 to 11 and 14 to 22 are completely the same as an electronic device housing provided with a conventional package shelf. Reference numeral 23 denotes a guide plate having an opening 24 provided so as to match the ventilation hole 20 provided in the chassis 5. The guide plate 23 has a plurality of recesses 25 at the same position at both ends of the opening 24, and The end surface of the guide plate 23 serves as the guide portion 18 of the printed circuit board 14. Further, a groove 26 is formed on the surface of the guide plate 23 on the side in contact with the chassis 5, and an air volume adjusting plate 27 is inserted therein. The air volume adjusting plate 27 has a plate shape with a convex cross section, and has a protrusion 28 provided at the center of both sides of the shorter side so as to be engaged with the recess 25 of the guide plate 23. It can be held.

In the package shelf configured as described above, by inserting the air volume adjusting plate 27 into the groove 26 of the guide plate 23, the opening area of the opening 24 of the guide plate 23 becomes small, and The cooling air volume can be easily adjusted by changing the number.

Further, the opening position can be adjusted by changing the mounting position of the air volume adjusting plate according to the heat generating component of the printed circuit board.

[0011]

[Effect of the device]

 As explained above, this invention inserts an air volume adjusting plate when adjusting the air volume of the cooling air required for each printed circuit board, and adjusts the opening area formed by the air volume adjusting plate and the opening of the guide plate. The adjustment has the effect that it can be easily dealt with.

Further, only one type of air volume adjusting plate needs to be prepared, and since the air volume can be adjusted in a short time and the opening position can be freely set, cooling air is evenly distributed to the heat generating components of the printed circuit board. There is an effect that it can be sent and cooling efficiency is improved.

[Brief description of drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention.

FIG. 2 is a view seen from B in FIG.

3 is a sectional view showing a section CC of FIG. 2. FIG.

FIG. 4 is a detailed view of the air volume adjusting plate of the present invention.

FIG. 5 is a cross-sectional view showing an electronic device housing provided with a conventional package shelf.

6 is a view seen from A in FIG. 5. FIG.

[Explanation of symbols]

 1 Case 5 Chassis 7 Cooling Fan 9 Connector Seat 10 Motherboard 12 Guide Plate 14 Printed Circuit Board 18 Guide Part 20 Ventilation Hole 23 Guide Plate 24 Opening 25 Recess 26 Groove 27 Air Volume Adjustment Plate 28 Projection

Claims (1)

[Claims for utility model registration] 1. A first surface is provided with a mother board having a connector seat for mating a printed circuit board, and
A box-like shape having a rectangular ventilation hole whose longitudinal direction is in a direction perpendicular to the first surface, on a second surface perpendicular to the surface and a third surface facing the second surface. A groove is formed on a surface of the chassis that contacts the inside of the chassis, and has an opening that matches the ventilation hole of the chassis, and has a plurality of recesses at the same positions at both ends of the opening. A rectangular plate-shaped guide plate, a convex cross-section plate shape that matches the groove portion of the guide plate, and an air volume adjusting plate having a protrusion that engages with the recess of the guide plate at the center of both sides of the shorter one, A package shelf comprising a cooling air supply fan provided on either side of the second surface or the third surface.