JPH053480Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a suction chuck plate used to suction-fix or suction-transfer silicon wafers, thin films, and other articles.

[Conventional technology]

Conventionally, suction and holding of silicon wafers, thin films, and other articles (hereinafter referred to as objects to be attracted) has been used as a means of fixing the article when performing appropriate processing on the article, or as a means of transporting the article. A suction chuck plate is used, and this suction chuck plate is made of a metal sintered body, a ceramic sintered body, or the like. These sintered bodies are obtained by sintering irregularly shaped powder 1, as shown in the cross section in FIG. 5 and the surface in FIG. Processed flat,
It serves as an adsorption surface for objects to be adsorbed.

[Problem that the invention attempts to solve]

However, since the conventional suction chuck plate is made of a sintered body of irregularly shaped powder, it has the following problems. That is, (1) As shown in FIG. 6, the openings (indicated by hatching) on the surface (suction surface) are irregular, so suction cannot be performed with uniform force.

(2) The aperture ratio on the surface (adsorption surface) has a large effect on the suction force, but this aperture ratio is small. Further, the aperture ratio varies irregularly depending on the position where the flat surface is processed, making it difficult to adjust the aperture ratio.

(3) The irregularly shaped powder provides a large airflow resistance, resulting in poor ventilation. Therefore, when the chuck plate is installed in a holder connected to a suction source, suction is generated from a large area on the bottom surface of the chuck plate. It is necessary to form a special ventilation path in the holder part facing the bottom surface of the chuck plate.

(4) The complex structure of the pores makes them susceptible to clogging with dirt, dust, etc., and makes them difficult to clean.

The present invention was developed to solve these problems, and is a suction chuck that has uniform openings, allows easy adjustment of the opening ratio, has good ventilation, and is resistant to clogging and easy to clean. The purpose is to provide plates.

[Means for solving problems]

The present invention, which has been made to achieve the above object, is based on a suction chuck plate made by sintering spherical powder and flattening its surface. Here, spherical powder refers to powder having a spherical shape or a shape close to a spherical shape, and is not necessarily limited to an accurate spherical powder.

〔Example〕

Hereinafter, the present invention will be described in more detail with reference to embodiments of the present invention shown in the drawings.

FIG. 1 is a sectional view showing a suction holder equipped with a suction chuck plate according to an embodiment of the present invention;
3 is a suction chuck plate, 3A is a suction surface, 4 is a holder to which this suction chuck plate 3 is attached, 5 is a suction hole connected to a suction source (not shown), and 6 is the bottom of the holder 4 and the suction chuck. This is a wire mesh placed to form a ventilation path between the base plate 3 and the base plate 3. The suction chuck plate 3 is made by sintering spherical powder 8 of approximately the same size into a plate shape, as shown in FIG. 2 in cross section and in FIG. 3 as a top surface. The suction surface is created by flattening the surface while restoring the pores through processing.

Here, since the spherical powder 8 of almost the same size is used for the suction chuck plate 3, the spherical powder 8 is regularly arranged, and therefore the suction surface 3A formed by flat processing the spherical powder 8 is , 4th
As shown in the figure, the flat processed surface 8A of the spherical powder 8
are arranged uniformly, and the opening 8B is indicated by hatching.
is uniform. Thus, when suction is applied to the suction hole 5 in FIG. 1 using a vacuum pump or the like and a vacuum is applied to the suction chuck plate 3, uniform suction is performed on the suction surface 3A. In addition, this suction surface 3
The aperture ratio at A varies greatly depending on the flat processing position of the spherical powder. That is, in Figure 2,
When the spherical powder 8 is flat-processed near its apex, the flat-processed surface 8A is small and the aperture ratio is large, but when the spherical powder 8 is flat-processed at the center, the flat-processed surface 8A is large, The aperture ratio becomes smaller. Therefore, by adjusting the flat processing position of the spherical powder 8, the aperture ratio of the suction surface can be arbitrarily adjusted within the range of approximately 9 to 70%, and a desired suction force can be obtained. Furthermore, since the suction chuck plate 3 of the present invention uses spherical powder, it has low ventilation resistance and can exert a large suction force, and also allows air to pass through easily in the lateral direction. The wire mesh 6 in is omitted,
Suction and holding can also be achieved by eliminating the ventilation path between the suction chuck plate 3 and the bottom surface of the holder 4 and applying a vacuum directly to the suction chuck plate 3 through the suction holes 5. Furthermore, since the holes have a simple shape, they are less likely to become clogged with dirt, dust, etc., and even if they become clogged, they are easy to clean.

The spherical powder 8 used in this invention is shown in FIG.
It is preferable to use a true spherical shape as shown in Fig. 3, since it can be arranged perfectly regularly.
It is not necessarily limited to such a perfect spherical shape,
It may have a somewhat distorted spherical shape. Even slightly distorted spherical powder can be sintered in a more regular arrangement than irregularly shaped powder, and by flattening its surface, relatively uniform openings can be obtained. Moreover, the aperture ratio can be adjusted. The material of the spherical powder 8 is not particularly limited, and any material that can be sintered, such as metal or ceramic, can be used. The suitable size of the spherical powder 8 is about 50 to 500 μm.
If it is smaller than 50 μm, the gap will be too small, resulting in high resistance and may cause clogging during flat processing. Moreover, if it is larger than 500 μm, the manufacturing cost will be high and the pitch and roughness may become too large.

[Effect of idea]

As is clear from the above explanation, the suction chuck plate of the present invention is made by sintering spherical powder and flat-processing the surface to create a suction surface, so that uniform suction can be achieved on the suction surface. Moreover, the suction force can be controlled by easily adjusting the opening ratio, and it also has good ventilation in the lateral direction, so good suction can be achieved without the need to form a special ventilation path on the back side. Furthermore, it has the advantage of being less likely to be clogged with dirt, dust, etc., and being easy to clean.

[Brief explanation of the drawing]

Fig. 1 is a sectional view of a suction holder equipped with a suction chuck plate according to an embodiment of the present invention, Fig. 2 is an enlarged sectional view of the suction chuck plate, Fig. 3 is a top view thereof, and Fig. 4 5 is a plan view showing only the suction surface, FIG. 5 is an enlarged sectional view of a conventional suction chuck plate, and FIG. 6 is a plan view of the suction surface. 1... Unusual powder, 3... Suction chuck plate, 3A... Adsorption surface, 4... Holder, 5... Suction hole, 6... Wire mesh, 8... Spherical powder, 8A... Flat processed surface, 8B...Opening.

Claims (1)

[Scope of utility model registration request] A suction chuck plate made by sintering spherical powder and flattening its surface.