JPH05327211A - Multilayer flexible printed board and manufacture thereof - Google Patents
Multilayer flexible printed board and manufacture thereofInfo
- Publication number
- JPH05327211A JPH05327211A JP12206592A JP12206592A JPH05327211A JP H05327211 A JPH05327211 A JP H05327211A JP 12206592 A JP12206592 A JP 12206592A JP 12206592 A JP12206592 A JP 12206592A JP H05327211 A JPH05327211 A JP H05327211A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- metal
- flexible printed
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、多層フレキシブルプリ
ント基板およびその製法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer flexible printed board and a method for manufacturing the same.
【0002】[0002]
【従来の技術】フレキシブルプリント基板は、ワープロ
等のオフィス機器をはじめ、広い分野にわたって使用さ
れている。この種のフレキシブルプリント基板は、通
常、図7に示すように、ポリエステル樹脂,ポリイミド
樹脂等のプラスチック製絶縁フィルムからなるベースフ
ィルム20に、アクリル系樹脂等の接着剤21を介して
帯状の圧延銅箔または電解銅箔を貼着し、その後、フォ
トレジストによるパターン形成,エッチング処理を行っ
て所定の導体回路22を形成する。そして、この導体回
路22上に接着剤23付きのポリイミドフィルムからな
るカバーコートフィルムを貼着したり、またはカバーコ
ートインクを塗工したりして絶縁層24を形成すること
により作製される。そして、上記絶縁層24の形成に際
しては、コネクター等と接続する導体回路22の端部
(接続端子)22aは、絶縁層24でカバーせず、ベー
スフィルム20の端部に露呈している。2. Description of the Related Art Flexible printed circuit boards are used in a wide range of fields including office equipment such as word processors. As shown in FIG. 7, a flexible printed circuit board of this type is usually made of a strip-shaped rolled copper film on a base film 20 made of a plastic insulating film such as polyester resin or polyimide resin via an adhesive 21 such as acrylic resin. A foil or an electrolytic copper foil is attached, and thereafter, pattern formation with a photoresist and etching are performed to form a predetermined conductor circuit 22. Then, a cover coat film made of a polyimide film with an adhesive 23 is attached to the conductor circuit 22, or a cover coat ink is applied to form the insulating layer 24. When forming the insulating layer 24, the end portion (connection terminal) 22a of the conductor circuit 22 connected to the connector or the like is not covered with the insulating layer 24 and is exposed to the end portion of the base film 20.
【0003】[0003]
【発明が解決しようとする課題】ところが、電気,電子
工業の分野において、機器の小形化等の観点から、上記
機器に用いられるフレキシブルプリント基板では微細パ
ターン化が進められ、また部品の実装方法では表面実装
が多用されている。しかしながら、図7に示すように、
従来のフレキシブルプリント基板では、部品実装用の接
続端子22aを同一平面上に配置し、半田付けやボンデ
ィングまたはコネクター等により電子部品の端子(図示
せず)に接続している。このため、上記のように機器の
小形化等により、電子部品の端子ピッチが狭まり、それ
に伴ってフレキシブルプリント基板の接続端子22aの
導体幅や接続端子22a間の間隔が微細化すると、フレ
キシブルプリント基板の電気特性や機械特性が低下する
という問題が生じる。However, in the fields of the electric and electronic industries, from the viewpoint of downsizing of equipments, etc., the flexible printed circuit boards used in the above equipments are becoming finer patterns, and in the method of mounting components. Surface mounting is often used. However, as shown in FIG.
In a conventional flexible printed circuit board, connection terminals 22a for mounting components are arranged on the same plane and connected to terminals (not shown) of electronic components by soldering, bonding, connectors or the like. Therefore, when the terminal pitch of the electronic component is narrowed due to the miniaturization of the device as described above and the conductor width of the connection terminals 22a of the flexible printed circuit board and the spacing between the connection terminals 22a are accordingly reduced, the flexible printed circuit board is reduced. There is a problem that the electrical characteristics and mechanical characteristics of the are deteriorated.
【0004】本発明は、このような事情に鑑みなされた
もので、高密度配線が可能で、電気特性および機械特性
に優れた多層フレキシブルプリント基板およびその製法
の提供をその目的とする。The present invention has been made in view of the above circumstances, and an object thereof is to provide a multilayer flexible printed circuit board which enables high-density wiring and is excellent in electrical characteristics and mechanical characteristics, and a manufacturing method thereof.
【0005】[0005]
【課題を解決するための手段】上記の目的を達成するた
め、本発明は、複数の金属製回路部が絶縁層を介して多
段状に積層されてなる多層フレキシブルプリント基板で
あって、少なくとも相互に隣接する上,中,下の3層に
おいて、中層の金属製回路部の端部に対応する上層の絶
縁層の部分が除去されて中層の金属製回路部の端部が露
呈しているとともに、下層の金属製回路部の端部に対応
する中層の絶縁層の部分が除去されて下層の金属製回路
部の端部が露呈しており、上記露呈した中層および下層
の金属製回路部の端部がそれぞれ同方向に揃えられ上下
2段の階段状に配列されている多層フレキシブルプリン
ト基板を第1の要旨とし、中心層となる絶縁層の上下面
にそれぞれ上側および下側金属製回路部が形成されかつ
下側金属製回路部の端部に対応する絶縁層の部分と上側
金属製回路部の部分とが除去され窓部に形成されている
第1の基板を準備する工程と、中心層となる絶縁層の上
面に金属導体層が形成され上記第1の基板の第1の穴明
き部に対応する絶縁層の部分と金属導体層の部分が上記
第1の穴明き部よりも大きく除去されて第2の穴明き部
に形成されている第2の基板を準備する工程と、中心層
となる絶縁層の下面に金属導体層が形成された第3の基
板を準備する工程と、上記第1の基板の上面に上記第2
の基板を積層接着し上記第2の基板の第2の穴明き部か
ら上記第1の基板の上側および下側の金属製回路部の端
部を露呈させる工程と、上記第1の基板の下面に上記第
3の基板を積層接着する工程と、上記第2および第3の
基板の金属導体層にそれぞれ金属製回路部を形成する工
程と、上記第1ないし第3の基板の積層接着で得られた
積層板の上記第2の穴明き部の周囲の不要部を除去する
工程とを備えた多層フレキシブルプリント基板の製法を
第2の要旨とする。In order to achieve the above object, the present invention provides a multilayer flexible printed circuit board in which a plurality of metal circuit parts are laminated in multiple stages with an insulating layer interposed therebetween, and at least one of them is provided. In the upper, middle, and lower three layers adjacent to, the upper insulating layer corresponding to the end of the middle metal circuit part is removed to expose the end of the middle metal circuit part. , The end of the insulating layer of the middle layer corresponding to the end of the lower metal circuit part is removed to expose the end of the lower metal circuit part, and the exposed middle and lower metal circuit parts The first gist is a multi-layer flexible printed circuit board whose ends are aligned in the same direction and arranged in a staircase pattern of two steps above and below, and upper and lower metal circuit parts are provided on the upper and lower surfaces of an insulating layer serving as a central layer, respectively. And the lower metal circuit part A step of preparing a first substrate in which a portion of an insulating layer corresponding to an end portion and a portion of an upper metal circuit portion are removed and a window portion is formed, and a metal conductor layer is formed on an upper surface of the insulating layer to be a central layer. And a portion of the insulating layer and a portion of the metal conductor layer corresponding to the first perforated portion of the first substrate are removed more largely than the first perforated portion and the second perforated portion is formed. On the upper surface of the first substrate, a step of preparing a second substrate formed on the upper part of the first substrate, a step of preparing a third substrate on which a metal conductor layer is formed on the lower surface of an insulating layer which is a center layer, Second above
Laminating and adhering the substrates to each other to expose the end portions of the upper and lower metal circuit portions of the first substrate from the second perforated portion of the second substrate, and the first substrate The steps of laminating and adhering the third substrate to the lower surface, the steps of forming metallic circuit portions on the metal conductor layers of the second and third substrates, and the laminating and adhering the first to third substrates, respectively. A second gist is a method for producing a multilayer flexible printed circuit board including a step of removing an unnecessary portion around the second perforated portion of the obtained laminated plate.
【0006】[0006]
【作用】すなわち、本発明の多層フレキシブルプリント
基板は、複数の金属製回路部が絶縁層を介して多段状に
積層されており、少なくとも相互に隣接する上,中,下
の3層において、中層の金属製回路部の端部に対応する
上層の絶縁層の部分が除去されて中層の金属製回路部の
端部が露呈し、かつ下層の金属製回路部の端部に対応す
る中層の絶縁層の部分が除去されて下層の金属製回路部
の端部が露呈している。そして、上記露呈した中層およ
び下層の金属製回路部の端部がそれぞれ同方向に揃えら
れ上下2段の階段状に配列されている。このように、本
発明の多層フレキシブルプリント基板では、少なくとも
相互に隣接する上,中,下の3層において、中層と下層
との2つの層に金属製回路部の端部(接続端子)を分割
して設けるようにしている。このため、1つのフレキシ
ブルプリント基板の端部に従来と同数の接続端子を設け
る場合にも、各層において、その接続端子の数を半分に
減少させることができる。したがって、各層において、
同一平面上での接続端子幅や接続端子間の間隔を広く設
けることができ、電気特性や機械特性を低下させること
がない。また、本発明の製法によれば、上記の多層フレ
キシブルプリント基板を容易に製造することができる。That is, in the multilayer flexible printed circuit board of the present invention, a plurality of metal circuit parts are laminated in a multi-step manner with an insulating layer interposed, and at least the upper, middle, and lower three layers adjacent to each other have the middle layer. Of the upper insulating layer corresponding to the end of the metal circuit part of is exposed to expose the end of the middle metal circuit part, and the insulation of the middle layer corresponding to the end of the lower metal circuit part. The layer portion is removed to expose the end portion of the lower metal circuit portion. The exposed end portions of the metal circuit portions of the middle layer and the lower layer are arranged in the same direction, and are arranged in a two-step staircase shape. As described above, in the multilayer flexible printed circuit board of the present invention, at least in the upper, middle, and lower three layers adjacent to each other, the end portion (connection terminal) of the metal circuit portion is divided into two layers of the middle layer and the lower layer. I am trying to provide it. Therefore, even when the same number of connection terminals as the conventional one is provided at the end of one flexible printed circuit board, the number of the connection terminals can be reduced to half in each layer. Therefore, in each layer,
The connection terminal width and the interval between the connection terminals can be widened on the same plane, and the electrical characteristics and mechanical characteristics are not deteriorated. Further, according to the manufacturing method of the present invention, the above-mentioned multilayer flexible printed board can be easily manufactured.
【0007】つぎに、本発明を実施例にもとづいて詳し
く説明する。Next, the present invention will be described in detail based on examples.
【0008】[0008]
【実施例】図1は本発明の一実施例を示す多層フレキシ
ブルプリント基板の端部の斜視図であり、図2はそのX
−X′断面図である。これらの図において、1,2,3
はポリイミドフィルム(アピカル,鐘淵化学社製)から
なる絶縁性フィルムであり、そのうちポリイミドフィル
ム1,2は基板(ベースフィルム)としての作用と同時
に下側の導体回路6a,7aを被覆する絶縁層としての
作用、すなわちカバーコートフィルムの役割をし、ポリ
イミドフィルム3は基板(ベースフィルム)としての作
用を備えている。4,5はエポキシ系接着剤(日東電工
社製)からなる接着剤層である。6a,7aは圧延銅箔
(BHY,日本鉱業社製)をフォトレジストおよびエッ
チング処理等により形成された帯状の導体回路であり、
6b,7bは上記導体回路6a,7aの端部(接続端
子)である。8a,9aは圧延銅箔(BHY,日本鉱業
社製)をフォトレジストおよびエッチング処理等により
形成された導体部である。10aはスルーホール10の
内周壁面および導体部8a,9aにわたって施されたス
ルーホール銅めっきである。1 is a perspective view of an end portion of a multilayer flexible printed circuit board showing an embodiment of the present invention, and FIG.
It is a -X 'sectional view. In these figures, 1, 2, 3
Is an insulating film made of a polyimide film (Apical, manufactured by Kanebuchi Chemical Co., Ltd.), and among them, the polyimide films 1 and 2 act as substrates (base films) and at the same time an insulating layer covering the lower conductor circuits 6a and 7a. That is, the polyimide film 3 functions as a substrate (base film). Numerals 4 and 5 are adhesive layers made of an epoxy adhesive (manufactured by Nitto Denko Corporation). Reference numerals 6a and 7a denote strip-shaped conductor circuits formed by rolling copper foil (BHY, manufactured by Nippon Mining Co., Ltd.) by photoresist and etching.
6b and 7b are end portions (connection terminals) of the conductor circuits 6a and 7a. Reference numerals 8a and 9a are conductors formed by rolling copper foil (BHY, manufactured by Nippon Mining Co., Ltd.) by photoresist and etching. Reference numeral 10a is through-hole copper plating applied to the inner peripheral wall surface of the through-hole 10 and the conductor portions 8a and 9a.
【0009】上記多層フレキシブルプリント基板は、例
えばつぎのようにして製造することができる。すなわ
ち、まず、ポリイミドフイルムからなるフィルム1,
2,3の表面上に圧延銅箔を接着剤層1a,2a,3a
を介して貼着して3枚の片面銅張り基板、すなわち、下
層用の片面銅張り基板,中層用の片面銅張り基板および
上層用の片面銅張り基板をそれぞれ作製した。一方、電
子部品の端子に対応した導体回路6a,7aの端部(接
続端子)6b,7bを形成するためのフォトマスクを作
製した。このフォトマスクは、上記接続端子6b,7b
が千鳥状に配列されるように作製した。ついで、図3に
示すように、上記中層用の片面銅張り基材11のA部領
域(下側導体回路7の端部7aに対応する領域であり、
圧延銅箔6,フィルム2および接着シート2aからな
る)を金型で内抜き開孔16を設けた。つぎに、図4に
示すように、上記中層用の片面銅張り基材11のフィル
ム2の下面に圧延銅箔7を接着シート17を介してラミ
ネートし両面銅張り基材12を作製した。その後、図5
に示すように、上記両面銅張り基材12の双方の圧延銅
箔6,7上に感光性レジスト18を塗布し、上記フォト
マスクを用いて露光,現像,エッチング処理を行うこと
により上記圧延銅箔6,7に上側導体回路6a,下側導
体回路7aをそれぞれ形成した。この後、感光性レジス
トを除去した。The multilayer flexible printed board can be manufactured, for example, as follows. That is, first, a film 1 made of a polyimide film 1,
Rolled copper foil on the surface of a few adhesive layers 1a, 2a, 3a
Three single-sided copper-clad substrates, namely, a single-sided copper-clad substrate for the lower layer, a single-sided copper-clad substrate for the middle layer, and a single-sided copper-clad substrate for the upper layer, were respectively prepared by adhering through. On the other hand, a photomask for forming the end portions (connection terminals) 6b, 7b of the conductor circuits 6a, 7a corresponding to the terminals of the electronic component was produced. This photomask has the connection terminals 6b and 7b.
Were produced in a staggered arrangement. Next, as shown in FIG. 3, the area A of the single-sided copper-clad base material 11 for the middle layer (the area corresponding to the end 7a of the lower conductor circuit 7,
The rolled copper foil 6, the film 2 and the adhesive sheet 2a) were used to form an internal hole 16 with a die. Next, as shown in FIG. 4, a rolled copper foil 7 was laminated on the lower surface of the film 2 of the single-sided copper-clad substrate 11 for the intermediate layer via an adhesive sheet 17 to prepare a double-sided copper-clad substrate 12. After that, FIG.
As shown in FIG. 3, the rolled copper foil 6 and 7 of the double-sided copper-clad substrate 12 is coated with a photosensitive resist 18, and the rolled copper foil is exposed, developed, and etched using the photomask. An upper conductor circuit 6a and a lower conductor circuit 7a were formed on the foils 6 and 7, respectively. Then, the photosensitive resist was removed.
【0010】つぎに、上層用の片面銅張り基材13のB
部領域(上側導体回路6の端部6aに対応する領域であ
り、圧延銅箔8,フィルム1および接着シート1aから
なる)を金型で内抜き開孔19を設けた。そして、上記
回路形成した両面銅張り基材12の上面に上層用の片面
銅張り基材13の裏面を接着シート4を介して接着する
とともに下面に下層用の片面銅張り基材14の裏面を接
着シート5を介して接着し、その状態で熱プレス法によ
り積層一体化した。このようにして積層した基材に、図
6に示すように、上下の導体回路6a,7a間を電気的
に導通させるためスルーホール10を穿設し、このスル
ーホール10にスルーホール銅めっき10aを施した。
その後、圧延銅箔8,9に導体回路8a,9aを形成し
た。このとき、必要に応じて、接続端子6a,7aにニ
ッケル,金,錫,半田等のめっきを施す。つぎに、トム
ソン加工または金型加工により所定の外形に加工する。
このとき、上記開孔16,19の周囲の不要部を除去す
る。これにより、所望の多層フレキシブルプリント基板
を得ることができる。Next, B of the single-sided copper-clad base material 13 for the upper layer
A partial region (a region corresponding to the end 6a of the upper conductor circuit 6 and comprising the rolled copper foil 8, the film 1 and the adhesive sheet 1a) was provided with an internal drawing opening 19 with a mold. Then, the back surface of the single-sided copper-clad base material 13 for the upper layer is adhered to the upper surface of the double-sided copper-clad base material 12 on which the circuit is formed via the adhesive sheet 4, and the back surface of the single-sided copper-clad base material 14 for the lower layer is adhered to the lower surface. It adhered through the adhesive sheet 5, and in that state, they were laminated and integrated by a hot pressing method. As shown in FIG. 6, a through hole 10 is bored in the base material laminated in this way to electrically connect the upper and lower conductor circuits 6a and 7a, and the through hole copper plating 10a is formed in the through hole 10. Was applied.
After that, the conductor circuits 8a and 9a were formed on the rolled copper foils 8 and 9. At this time, the connection terminals 6a and 7a are plated with nickel, gold, tin, solder or the like, if necessary. Next, it is processed into a predetermined outer shape by Thomson processing or metal mold processing.
At this time, unnecessary portions around the openings 16 and 19 are removed. Thereby, a desired multilayer flexible printed board can be obtained.
【0011】なお、上記実施例では、圧延銅箔6,7に
のみ接続端子6b,7bを形成しているが、これに限定
するものではなく、圧延銅箔8に上記接続端子6b,7
bと同様の接続端子を形成してもよい。In the above embodiment, the connection terminals 6b and 7b are formed only on the rolled copper foils 6 and 7, but the invention is not limited to this, and the connection terminals 6b and 7 are formed on the rolled copper foil 8.
You may form the connection terminal similar to b.
【0012】また、上記実施例では、上層用および中層
用の片面銅張り基材11,13に金型で内抜いて開孔1
6,19をあけているが、レーザー法または溶解法によ
り開孔をあけるようにしてもよい。また、上記各開孔1
6,19は、上記実施例のように接続端子6b,7bに
対応する部分の全面にあけているが、部分的にあけるよ
うにしてもよい。Further, in the above-described embodiment, the holes 1 are formed in the single-sided copper-clad base materials 11 and 13 for the upper layer and the middle layer by using a die.
Although the holes 6 and 19 are formed, the holes may be formed by a laser method or a melting method. In addition, each of the openings 1
Although 6 and 19 are formed on the entire surface of the portion corresponding to the connection terminals 6b and 7b as in the above embodiment, they may be formed partially.
【0013】また、上記実施例では、中層用の片面銅張
り基材11のA部領域に開孔16を設けてから、その下
面に圧延銅箔7をラミネートして両面銅張り基材12を
作製し、その後、この両面銅張り基材12の両面に回路
形成しているが、これに代えて、開孔のない両面銅張り
基材を準備し、これに回路形成を行った後、上記A部領
域にレーザー法または溶解法により開孔を設けるように
してもよい。Further, in the above embodiment, the opening 16 is provided in the area A of the single-sided copper-clad base material 11 for the intermediate layer, and the rolled copper foil 7 is laminated on the lower surface thereof to form the double-sided copper-clad base material 12. Circuits are formed on both surfaces of the double-sided copper-clad base material 12 after that, but instead of this, a double-sided copper-clad base material without openings is prepared, and the circuit is formed on the double-sided copper-clad base material. Openings may be provided in the area A by a laser method or a melting method.
【0014】なお、上記実施例の上層用および下層用の
片面銅張り基材13,14に代えて2枚絶縁板を用い、
上記両面銅張り基材12の上下の両面に上記絶縁板をそ
れぞれ貼着して積層一体化するようにしてもよい。Two insulating plates are used in place of the single-sided copper-clad base materials 13 and 14 for the upper layer and the lower layer in the above embodiment,
The insulating plates may be attached to the upper and lower surfaces of the double-sided copper-clad base material 12 to be laminated and integrated.
【0015】このような方法により製造された多層フレ
キシブル回路基板は、その端部に接続端子6b,7bを
2層に、すなわち、2つの平面に分割して配置している
ため、1つの平面に配置される接続端子6b,7bの数
を半減させることができる。したがって、上記多層フレ
キシブル回路基板の端部に設ける接続端子6b,7bの
幅や接続端子6b,7b間の間隔を広く設計することが
でき、近年ますます小形化する電子部品の微細端子ピッ
チに対応することができ、かつ、電気特性や機械特性に
優れた多層フレキシブルプリント基板を製造することが
できるようになる。In the multilayer flexible circuit board manufactured by such a method, the connection terminals 6b and 7b are arranged in two layers at the end portions thereof, that is, divided into two planes, so that one plane is formed. The number of the connection terminals 6b and 7b arranged can be halved. Therefore, the width of the connection terminals 6b, 7b provided at the end of the multilayer flexible circuit board and the space between the connection terminals 6b, 7b can be designed to be wide, and it is possible to cope with the finer terminal pitch of electronic components which is becoming smaller and smaller in recent years. In addition, it becomes possible to manufacture a multilayer flexible printed circuit board which is excellent in electrical characteristics and mechanical characteristics.
【0016】[0016]
【発明の効果】以上のように、本発明の多層フレキシブ
ル回路基板によれば、少なくとも相互に隣接する上,
中,下の3層において、中層と下層との2つの層に金属
製回路部の端部(接続端子)を分割して設けるようにし
ている。このため、1つのフレキシブルプリント基板の
端部に従来と同数の接続端子を設ける場合にも、各層に
おいて、その接続端子の数を半分に減少させることがで
きる。したがって、各層において、同一平面上での接続
端子幅や接続端子間の間隔を広く設けることができ、電
気特性や機械特性を低下させることがない。また、本発
明の製法によれば、上記の多層フレキシブルプリント基
板を容易に製造することができる。As described above, according to the multilayer flexible circuit board of the present invention, at least adjacent to each other,
In the middle and lower three layers, the end portion (connection terminal) of the metal circuit portion is divided and provided in two layers of the middle layer and the lower layer. Therefore, even when the same number of connection terminals as the conventional one is provided at the end of one flexible printed circuit board, the number of the connection terminals can be reduced to half in each layer. Therefore, in each layer, the connection terminal width and the space between the connection terminals can be widened on the same plane, and the electrical characteristics and mechanical characteristics are not deteriorated. Further, according to the manufacturing method of the present invention, the above-mentioned multilayer flexible printed board can be easily manufactured.
【図1】本発明の一実施例の多層フレキシブルプリント
基板の端部を示す斜視図である。FIG. 1 is a perspective view showing an end portion of a multilayer flexible printed circuit board according to an embodiment of the present invention.
【図2】図1のX−X′断面図である。FIG. 2 is a sectional view taken along line XX ′ in FIG.
【図3】上記多層フレキシブルプリント基板の製造方法
の説明図である。FIG. 3 is an explanatory diagram of a method for manufacturing the multilayer flexible printed circuit board.
【図4】上記多層フレキシブルプリント基板の製造方法
の説明図である。FIG. 4 is an explanatory diagram of a method for manufacturing the multilayer flexible printed circuit board.
【図5】上記多層フレキシブルプリント基板の製造方法
の説明図である。FIG. 5 is an explanatory diagram of a method for manufacturing the multilayer flexible printed circuit board.
【図6】上記多層フレキシブルプリント基板の製造方法
の説明図である。FIG. 6 is an explanatory diagram of a method for manufacturing the multilayer flexible printed circuit board.
【図7】従来のフレキシブルプリント基板の端部を示す
斜視図である。FIG. 7 is a perspective view showing an end portion of a conventional flexible printed circuit board.
1,2,3 フィルム 6a,7a 導体回路 1,2,3 film 6a, 7a Conductor circuit
Claims (2)
段状に積層されてなる多層フレキシブルプリント基板で
あって、少なくとも相互に隣接する上,中,下の3層に
おいて、中層の金属製回路部の端部に対応する上層の絶
縁層の部分が除去されて中層の金属製回路部の端部が露
呈しているとともに、下層の金属製回路部の端部に対応
する中層の絶縁層の部分が除去されて下層の金属製回路
部の端部が露呈しており、上記露呈した中層および下層
の金属製回路部の端部がそれぞれ同方向に揃えられ上下
2段の階段状に配列されていることを特徴とする多層フ
レキシブルプリント基板。1. A multi-layered flexible printed circuit board in which a plurality of metal circuit parts are laminated in multiple stages with an insulating layer interposed therebetween, wherein at least the upper, middle and lower three layers which are adjacent to each other, the middle metal layer. The part of the upper insulating layer corresponding to the end of the circuit part made of metal is removed to expose the end of the metal circuit part of the middle layer, and the insulation of the middle layer corresponding to the end of the metal circuit part of the lower layer is exposed. The layer portions are removed to expose the end portions of the lower metal circuit portion, and the exposed end portions of the middle and lower metal circuit portions are aligned in the same direction to form a two-step upper and lower step. A multilayer flexible printed circuit board characterized by being arranged.
上側および下側金属製回路部が形成されかつ下側金属製
回路部の端部に対応する絶縁層の部分と上側金属製回路
部の部分とが除去され窓部に形成されている第1の基板
を準備する工程と、中心層となる絶縁層の上面に金属導
体層が形成され上記第1の基板の第1の穴明き部に対応
する絶縁層の部分と金属導体層の部分が上記第1の穴明
き部よりも大きく除去されて第2の穴明き部に形成され
ている第2の基板を準備する工程と、中心層となる絶縁
層の下面に金属導体層が形成された第3の基板を準備す
る工程と、上記第1の基板の上面に上記第2の基板を積
層接着し上記第2の基板の第2の穴明き部から上記第1
の基板の上側および下側の金属製回路部の端部を露呈さ
せる工程と、上記第1の基板の下面に上記第3の基板を
積層接着する工程と、上記第2および第3の基板の金属
導体層にそれぞれ金属製回路部を形成する工程と、上記
第1ないし第3の基板の積層接着で得られた積層板の上
記第2の穴明き部の周囲の不要部を除去する工程とを備
えたことを特徴とする多層フレキシブルプリント基板の
製法。2. The upper and lower metal circuit parts are formed on the upper and lower surfaces of the insulating layer serving as the central layer, respectively, and the insulating layer part and the upper metal circuit part corresponding to the ends of the lower metal circuit part. And the step of preparing a first substrate having a window portion removed therefrom and a metal conductor layer is formed on an upper surface of an insulating layer serving as a central layer, and a first hole is formed on the first substrate. A portion of the insulating layer and a portion of the metal conductor layer corresponding to the portion are removed to a greater extent than the first perforated portion to prepare a second substrate formed in the second perforated portion; A step of preparing a third substrate having a metal conductor layer formed on the lower surface of an insulating layer serving as a central layer, and a step of stacking and adhering the second substrate on the upper surface of the first substrate to form the second substrate. From the second perforated portion to the first
Exposing the ends of the upper and lower metal circuit parts of the substrate, laminating and adhering the third substrate to the lower surface of the first substrate, and adhering the second and third substrates to each other. A step of forming a metal circuit part on each of the metal conductor layers, and a step of removing unnecessary parts around the second perforated part of the laminated plate obtained by laminating and bonding the first to third substrates. A method of manufacturing a multilayer flexible printed circuit board, comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12206592A JP3226959B2 (en) | 1992-05-14 | 1992-05-14 | Manufacturing method of multilayer flexible printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12206592A JP3226959B2 (en) | 1992-05-14 | 1992-05-14 | Manufacturing method of multilayer flexible printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05327211A true JPH05327211A (en) | 1993-12-10 |
JP3226959B2 JP3226959B2 (en) | 2001-11-12 |
Family
ID=14826764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12206592A Expired - Fee Related JP3226959B2 (en) | 1992-05-14 | 1992-05-14 | Manufacturing method of multilayer flexible printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3226959B2 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002001928A1 (en) * | 2000-06-26 | 2002-01-03 | 3M Innovative Properties Company | Vialess printed circuit board |
EP1909544A2 (en) * | 2006-10-02 | 2008-04-09 | Nitto Denko Corporation | Wired circuit board |
JP2012104210A (en) * | 2010-10-12 | 2012-05-31 | Nitto Denko Corp | Suspension substrate with circuit and method for manufacturing the same |
JP2013073642A (en) * | 2011-09-27 | 2013-04-22 | Dainippon Printing Co Ltd | Flexure substrate for suspension, suspension, suspension with head, and hard disk drive |
JP2015133165A (en) * | 2015-02-23 | 2015-07-23 | 大日本印刷株式会社 | Substrate for suspension, suspension, suspension with head, and hard disk drive |
JP2015225941A (en) * | 2014-05-28 | 2015-12-14 | 株式会社村田製作所 | Multilayer board |
WO2016072338A1 (en) * | 2014-11-04 | 2016-05-12 | 株式会社村田製作所 | Transmission line cable |
CN108029192A (en) * | 2015-09-24 | 2018-05-11 | 吉佳蓝科技股份有限公司 | The flexible PCB and its manufacture method that bending durability is enhanced |
CN108141952A (en) * | 2015-09-24 | 2018-06-08 | 吉佳蓝科技股份有限公司 | The flexible PCB that bending durability is enhanced |
CN111556671A (en) * | 2020-06-29 | 2020-08-18 | 四川海英电子科技有限公司 | Manufacturing method of 5G high-frequency mixed-voltage stepped circuit board |
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Publication number | Priority date | Publication date | Assignee | Title |
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KR100722554B1 (en) * | 2005-04-15 | 2007-05-28 | 엘지전자 주식회사 | Printed circuit board and surface treatment method the same |
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1992
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Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002001928A1 (en) * | 2000-06-26 | 2002-01-03 | 3M Innovative Properties Company | Vialess printed circuit board |
EP1909544A2 (en) * | 2006-10-02 | 2008-04-09 | Nitto Denko Corporation | Wired circuit board |
EP1909544A3 (en) * | 2006-10-02 | 2009-12-23 | Nitto Denko Corporation | Wired circuit board |
JP2012104210A (en) * | 2010-10-12 | 2012-05-31 | Nitto Denko Corp | Suspension substrate with circuit and method for manufacturing the same |
JP2013073642A (en) * | 2011-09-27 | 2013-04-22 | Dainippon Printing Co Ltd | Flexure substrate for suspension, suspension, suspension with head, and hard disk drive |
JP2015225941A (en) * | 2014-05-28 | 2015-12-14 | 株式会社村田製作所 | Multilayer board |
WO2016072338A1 (en) * | 2014-11-04 | 2016-05-12 | 株式会社村田製作所 | Transmission line cable |
US10153534B2 (en) | 2014-11-04 | 2018-12-11 | Murata Manufacturing Co., Ltd. | Transmission line cable |
JP2015133165A (en) * | 2015-02-23 | 2015-07-23 | 大日本印刷株式会社 | Substrate for suspension, suspension, suspension with head, and hard disk drive |
CN108029192A (en) * | 2015-09-24 | 2018-05-11 | 吉佳蓝科技股份有限公司 | The flexible PCB and its manufacture method that bending durability is enhanced |
CN108141952A (en) * | 2015-09-24 | 2018-06-08 | 吉佳蓝科技股份有限公司 | The flexible PCB that bending durability is enhanced |
CN108029192B (en) * | 2015-09-24 | 2020-05-08 | 吉佳蓝科技股份有限公司 | Flexible circuit board with improved bending durability and method of manufacturing the same |
CN108141952B (en) * | 2015-09-24 | 2020-10-09 | 吉佳蓝科技股份有限公司 | Flexible circuit board with improved bending durability |
CN111556671A (en) * | 2020-06-29 | 2020-08-18 | 四川海英电子科技有限公司 | Manufacturing method of 5G high-frequency mixed-voltage stepped circuit board |
Also Published As
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---|---|
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