JPH05326761A - Mounting structure of thermal conduction spacer - Google Patents
Mounting structure of thermal conduction spacerInfo
- Publication number
- JPH05326761A JPH05326761A JP4123040A JP12304092A JPH05326761A JP H05326761 A JPH05326761 A JP H05326761A JP 4123040 A JP4123040 A JP 4123040A JP 12304092 A JP12304092 A JP 12304092A JP H05326761 A JPH05326761 A JP H05326761A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- mounting
- thermal conduction
- spacer
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、各種プリント配線基板
に実装される電子部品の放熱用熱伝導スペーサーの実装
構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a heat conductive spacer for heat dissipation of electronic parts mounted on various printed wiring boards.
【０００２】最近、各種電子機器に搭載されるプリント
板ユニットには高集積化して発熱量の大きな半導体デバ
イスが高密度に実装されるに伴い、これら電子部品を実
装するプリント配線基板（以下配線基板と略称する）の
内層には前記半導体デバイスの熱を伝播して放熱効果を
有する電源パターンが形成され、実装される半導体デバ
イスと配線基板表面とで形成される隙間を熱伝導性の良
い接着剤を充填している。Recently, as printed circuit boards mounted in various electronic devices are highly integrated with high density semiconductor devices having a large amount of heat generation, a printed wiring board on which these electronic components are mounted (hereinafter referred to as a wiring board). (Abbreviated) is formed with a power source pattern having a heat dissipation effect by propagating heat of the semiconductor device, and an adhesive having good thermal conductivity is provided in a gap formed between the mounted semiconductor device and the surface of the wiring board. Is being filled.
【０００３】しかるに、ＤＩＰ(Dual-Inlin-Package)型
の半導体デバイス（以下ＤＩＰ部品と略称する）におい
てはこのＤＩＰ部品の下面と配線基板表面とで形成され
る隙間が大きくなり、熱伝導性接着剤の厚みによる伝熱
量が低下して配線基板の電源パターンに対しての放熱効
果が薄れるので、実装されたＤＩＰ部品から配線基板の
電源パターンに伝熱効果の大きな熱伝導スペーサーの実
装構造が必要とされている。However, in a DIP (Dual-Inlin-Package) type semiconductor device (hereinafter abbreviated as DIP component), the gap formed between the lower surface of the DIP component and the surface of the wiring board becomes large, and the heat conductive adhesive is applied. Since the amount of heat transfer due to the thickness of the agent decreases and the heat dissipation effect on the power supply pattern of the wiring board diminishes, a mounting structure of a heat conductive spacer with a large heat transfer effect from the mounted DIP component to the power supply pattern of the wiring board is required. It is said that.
【０００４】[0004]
【従来の技術】従来広く使用されているＤＩＰ部品の実
装構造は、図４に示すように電源パターン3-1 を内層に
設けるとともにＤＩＰ部品１の実装用スルーホール3-2
として複数個の微細孔を一定の間隔で互いに平行に配列
した配線基板３に対し、当該配線基板３の実装面側に熱
伝導性の良い接着剤４をこの互いに対向する前記実装用
スルーホール3-2 の中間部に一定量塗布します。2. Description of the Related Art A mounting structure of a DIP component which has been widely used in the past has a power supply pattern 3-1 provided on an inner layer as shown in FIG.
As a wiring board 3 in which a plurality of fine holes are arranged in parallel with each other at regular intervals, an adhesive 4 having good thermal conductivity is provided on the mounting surface side of the wiring board 3 to face the mounting through holes 3 Apply a fixed amount to the middle part of -2.
【０００５】この実装用スルーホール3-2 にＤＩＰ部品
１の両側面より突出して一方向に曲折された各リード1-
2 を上記実装用スルーホール3-2 に挿入することによ
り、当該リード1-2 の先端を上記配線基板３の反対面か
ら突出させるとともに前記ＤＩＰ部品１のパッケージ1-
1 下面を接着剤４に密着させた状態で硬化・固着し、そ
の後に図示していない半田槽に浸漬して半田付けを行う
とＤＩＰ部品１の各リード1-2 と配線基板３の各実装用
スルーホール3-2 が電気的に接続されている。Leads 1-that are bent in one direction so as to project from the both side surfaces of the DIP component 1 into the through-holes 3-2 for mounting 1-
2 is inserted into the mounting through hole 3-2 so that the tip of the lead 1-2 projects from the opposite surface of the wiring board 3 and the package 1- of the DIP component 1
1 When the lower surface is hardened and fixed in close contact with the adhesive 4, and then immersed in a solder bath (not shown) for soldering, each lead 1-2 of the DIP component 1 and each mounting of the wiring board 3 are mounted. Through hole 3-2 is electrically connected.
【０００６】また他の従来例としては、図５に示すよう
に上記配線基板３の実装用スルーホール3-2 の中間部に
熱伝導性の良い前記接着剤４によりアルミニウム又は銅
よりなる熱伝導板２を固着し、その上部に同じく熱伝導
性の良い接着剤４を塗布して当該実装用スルーホール3-
2 にＤＩＰ部品１の各リード1-2 を挿入して前記接着剤
４にパッケージ1-1 の下面を密着させ状態で硬化し、前
記と同様の半田付けにより前記リード1-2 と該実装用ス
ルーホール3-2 が電気的に接続されている。As another conventional example, as shown in FIG. 5, a heat conductive material made of aluminum or copper is applied to the middle portion of the mounting through hole 3-2 of the wiring board 3 by the adhesive 4 having good heat conductivity. The plate 2 is fixed, and the adhesive 4 having the same high thermal conductivity is applied to the upper part of the plate 2 to mount the through hole 3-.
Insert each lead 1-2 of the DIP component 1 into 2 and cure it with the lower surface of the package 1-1 in close contact with the adhesive 4, and solder the same as above to the lead 1-2 and the mounting Through hole 3-2 is electrically connected.
【０００７】[0007]
【発明が解決しようとする課題】以上説明した従来の図
４に示す実装構造で問題となるのは、実装されたＤＩＰ
部品１のパッケージ1-1 下面と配線基板３の実装面との
間に形成される接着剤４の層が厚いため、ＤＩＰ部品１
で発生した熱量は接着剤４の層と配線基板３の表面絶縁
層によって電源パターン3-1 への熱伝播量が少なくなっ
て、ＤＩＰ部品１の放熱効果が低減するという問題が生
じている。A problem with the conventional mounting structure shown in FIG. 4 described above is that the mounted DIP is mounted.
Since the layer of the adhesive 4 formed between the lower surface of the package 1-1 of the component 1 and the mounting surface of the wiring board 3 is thick, the DIP component 1
There is a problem in that the amount of heat generated in 1 is reduced by the amount of heat transferred to the power supply pattern 3-1 due to the layer of the adhesive 4 and the surface insulating layer of the wiring board 3, and the heat dissipation effect of the DIP component 1 is reduced.
【０００８】また、図５に示す如き実装構造において
は、ＤＩＰ部品１のパッケージ1-1 下面と配線基板３の
実装面との間に熱伝導板２を介して接着剤４の層が２ヵ
所存在するためにＤＩＰ部品１の放熱効果が低減すると
ともに、熱伝導板２の位置決めが困難であるという問題
も生じている。Further, in the mounting structure shown in FIG. 5, two layers of adhesive 4 are provided between the lower surface of the package 1-1 of the DIP component 1 and the mounting surface of the wiring board 3 with the heat conductive plate 2 interposed therebetween. Due to the existence, the heat dissipation effect of the DIP component 1 is reduced, and the positioning of the heat conducting plate 2 is difficult.
【０００９】本発明は上記のような問題点に鑑み、実装
されたＤＩＰ部品から配線基板の電源パターンへ大きな
熱量を伝導することができる新しい熱伝導スペーサーの
実装構造の提供を目的とする。In view of the above problems, it is an object of the present invention to provide a new thermal conductive spacer mounting structure capable of conducting a large amount of heat from the mounted DIP component to the power supply pattern of the wiring board.
【００１０】[0010]
【課題を解決するための手段】本発明は、図１に示すよ
うに熱伝導性の優れた材料よりＤＩＰ部品１のパッケー
ジ1-1 と配線基板13の間に介在できる大きさに形成した
熱伝導板12-1の一面に少なくとも一本のピン12-2を突出
させたスペーサー12を、図３に示すように内層に電源パ
ターン3-1 を有する前記配線基板13の実装用スルーホー
ル3-2 間に穿設した伝熱用スルーホール13-3に前記ピン
12-2を挿入して半田付けを行い、熱伝導性の良い接着剤
４により該熱伝導板12-1に前記パッケージ1-1 を固着す
るとともにＤＩＰ部品１のリード1-2 と配線基板13の実
装用スルーホール3-2 を半田付けにて接続する。According to the present invention, as shown in FIG. 1, a heat-generating material made of a material having excellent thermal conductivity is formed between the package 1-1 of the DIP component 1 and the wiring board 13. A spacer 12 having at least one pin 12-2 protruding on one surface of the conductive plate 12-1 and a through hole 3-for mounting the wiring board 13 having a power source pattern 3-1 in an inner layer as shown in FIG. The above-mentioned pin is placed in the heat transfer through hole 13-3
12-2 is inserted and soldered, and the package 1-1 is fixed to the heat conductive plate 12-1 by the adhesive 4 having good heat conductivity, and the leads 1-2 of the DIP component 1 and the wiring board 13 are fixed. Connect the mounting through hole 3-2 of by soldering.
【００１１】[0011]
【作用】本発明では、熱伝導性の優れた熱伝導板12-1の
一面より突出したスペーサー12のピン12-2を配線基板13
に穿設した伝熱用スルーホール13-3に挿入して半田付け
を行うと、この熱伝導板12-1と配線基板13の内層に形成
した電源パターン3-1 がピン12-2を介して熱伝導的に結
合されるとともに、この熱伝導板12-1とＤＩＰ部品１の
パッケージ1-1 下面を熱伝導性の良い接着剤４で固着し
ているから、前記パッケージ1-1 と電源パターン3-1 の
間の殆どが熱伝導性の優れたスペーサー12により結合さ
れてＤＩＰ部品１の放熱効果を向上させることが可能と
なる。In the present invention, the pins 12-2 of the spacer 12 protruding from one surface of the heat conductive plate 12-1 having excellent heat conductivity are connected to the wiring board 13 by the wiring board 13.
When inserted into the heat transfer through hole 13-3 drilled in and soldered, the heat conductive plate 12-1 and the power supply pattern 3-1 formed on the inner layer of the wiring board 13 are connected via the pin 12-2. The heat conductive plate 12-1 and the lower surface of the package 1-1 of the DIP component 1 are fixed to each other by the adhesive 4 having good thermal conductivity. Most of the spaces between the patterns 3-1 are connected by the spacer 12 having excellent thermal conductivity, and the heat dissipation effect of the DIP component 1 can be improved.
【００１２】[0012]
【実施例】以下図１〜図３について本発明の実施例を詳
細に説明する。図１は本実施例による熱伝導スペーサー
を示す斜視図、図２は本実施例の熱伝導スペーサーを介
して電子部品を実装する配線基板の斜視図、図３は本実
施例の実装構造の側断面図を示し、図中において、図４
および図５と同一部材には同一記号が付してあるが、そ
の他の12はＤＩＰ部品から配線基板の電源パターンに対
して熱伝導的に結合されるスペーサー，13は前記熱伝導
スペーサーを介してＤＩＰ部品を実装する配線基板であ
る。Embodiments of the present invention will be described in detail below with reference to FIGS. 1 is a perspective view showing a heat conducting spacer according to this embodiment, FIG. 2 is a perspective view of a wiring board on which electronic components are mounted via the heat conducting spacer of this embodiment, and FIG. 3 is a side of a mounting structure of this embodiment. FIG. 4 shows a cross-sectional view, and in FIG.
The same members as those in FIG. 5 are denoted by the same symbols, but the other 12 are spacers that are thermally conductively coupled to the power supply pattern of the wiring board from the DIP parts, and 13 is the above-mentioned thermal conductive spacers. It is a wiring board on which a DIP component is mounted.
【００１３】スペーサー12は、図１に示すように実装さ
れるＤＩＰ部品１のパッケージ1-1下面と略等しい大き
さにアルミニウム或いは銅板から成形された熱伝導板12
-1の一面より、同じくアルミニウム或いは銅よりなる細
いピン12-2を当該熱伝導板12-1の中心線上に一定の間隔
で後述する配線基板13の伝熱用スルーホール13-3を貫通
する長さに複数本，例えば２本突出させたものである。The spacer 12 is a heat conducting plate 12 molded from aluminum or a copper plate to a size substantially equal to the lower surface of the package 1-1 of the DIP component 1 mounted as shown in FIG.
-1 From one side, thin pins 12-2 also made of aluminum or copper penetrate through the heat transfer through holes 13-3 of the wiring board 13 described later at regular intervals on the center line of the heat conducting plate 12-1. A plurality of pieces, for example, two pieces are projected in the length.
【００１４】配線基板13は、図２に示すように電源パタ
ーンを内層に設けた基板に複数個の微細孔を一定の間隔
で互いに平行に配列したＤＩＰ部品１の実装用スルーホ
ール3-2 を従来と同様に配設するとともに、この互いに
対向する実装用スルーホール3-2 の中心線上に上記スペ
ーサー12のピン12-2が挿入される２個の伝熱用スルーホ
ール13-3を穿設している。As shown in FIG. 2, the wiring board 13 has through holes 3-2 for mounting the DIP component 1 in which a plurality of fine holes are arranged in parallel with each other at a constant interval on a substrate having a power source pattern provided in an inner layer. The heat transfer through holes 13-3 are arranged in the same manner as the conventional one, and two heat transfer through holes 13-3 into which the pins 12-2 of the spacer 12 are inserted are formed on the center lines of the mounting through holes 3-2 facing each other. is doing.
【００１５】上記部材を使用した熱伝導スペーサーによ
るＤＩＰ部品の実装構造は、図３に示すように上記配線
基板13に配列した実装用スルーホール3-2 の中心線上に
穿設した伝熱用スルーホール13-3に上記スペーサー12の
ピン12-2を挿入して熱伝導板12-1を配線基板13の実装面
に密着させ、当該伝熱用スルーホール13-3と挿入された
前記ピン12-2を半田付けすることにより熱伝導板12-1と
配線基板13の内層に形成した電源パターン3-1 を熱伝導
的に結合する。As shown in FIG. 3, the mounting structure of the DIP component by the heat conductive spacer using the above-mentioned members is such that the heat transfer through holes formed on the center line of the mounting through holes 3-2 arranged on the wiring board 13 are formed. The pin 12-2 of the spacer 12 is inserted into the hole 13-3 to bring the heat conducting plate 12-1 into close contact with the mounting surface of the wiring board 13, and the pin 12 inserted into the through hole 13-3 for heat transfer. By soldering -2, the heat conduction plate 12-1 and the power supply pattern 3-1 formed on the inner layer of the wiring board 13 are thermally conductively coupled.
【００１６】そして、この熱伝導板12-1の上部と側面に
熱伝導性の優れた接着剤４を塗布して、従来と同様にＤ
ＩＰ部品１の両側面より突出した各リード1-2 を前記配
線基板13の実装用スルーホール3-2 に挿入して反対面か
ら先端を突出させるとともに、前記ＤＩＰ部品１のパッ
ケージ1-1 下面を接着剤４に密着させた状態にて硬化・
固着した後に、図示していない半田槽に浸漬して半田付
けを行うことにより上記配線基板13の実装用スルーホー
ル3-2 にＤＩＰ部品１のリード1-2 を電気的に接続して
いる。Then, an adhesive 4 having excellent thermal conductivity is applied to the upper and side surfaces of the heat conducting plate 12-1 and D is applied as in the conventional case.
The leads 1-2 projecting from both side surfaces of the IP component 1 are inserted into the mounting through holes 3-2 of the wiring board 13 to project the tips from the opposite surface, and the lower surface of the package 1-1 of the DIP component 1 Cure with the adhesive 4 in close contact.
After being fixed, the leads 1-2 of the DIP component 1 are electrically connected to the mounting through holes 3-2 of the wiring board 13 by immersing in a solder bath (not shown) for soldering.
【００１７】その結果、固着されるパッケージ1-1 と電
源パターン3-1 との間は一層の接着剤４を介し殆どが熱
伝導性の優れたスペーサー12により結合されるから、配
線基板13に実装されたＤＩＰ部品１の放熱効果を向上さ
せることができる。As a result, most of the package 1-1 and the power supply pattern 3-1 which are fixed to each other are bonded to each other by the spacer 12 having excellent thermal conductivity through the adhesive layer 4 of one layer. The heat dissipation effect of the mounted DIP component 1 can be improved.
【００１８】[0018]
【発明の効果】以上の説明から明らかなように本発明に
よれば極めて簡単な構造で、配線基板に実装されたＤＩ
Ｐ部品の放熱効果を向上させることができる等の利点が
あり、著しい経済的及び、信頼性向上の効果が期待でき
る熱伝導スペーサーの実装構造を提供することができ
る。As is apparent from the above description, according to the present invention, the DI mounted on the wiring board has an extremely simple structure.
There is an advantage that the heat dissipation effect of the P component can be improved, and it is possible to provide a mounting structure of the heat conductive spacer which can be expected to be significantly economical and to improve reliability.
【図１】 本実施例による熱伝導スペーサーを示す斜視
図である。FIG. 1 is a perspective view showing a heat conductive spacer according to an embodiment.
【図２】 本実施例の熱伝導スペーサーを介して電子部
品を実装する配線基板の斜視図である。FIG. 2 is a perspective view of a wiring board on which an electronic component is mounted via a heat conductive spacer of this embodiment.
【図３】 本実施例の実装構造を示す側断面図である。FIG. 3 is a side sectional view showing a mounting structure of the present embodiment.
【図４】 従来の実装構造を示す側端面図である。FIG. 4 is a side end view showing a conventional mounting structure.
【図５】 他の従来例を示す側端面図である。FIG. 5 is a side end view showing another conventional example.
１はＤＩＰ部品、1-1 はパッケージ、
1-2 はリード、3-1 は電源パターン、
3-2 は実装用スルーホール、４は接着剤、12はスペー
サー、12-1は熱伝導板、 12-2はピ
ン、13は配線基板、13-3は伝熱用スルーホール、1 is DIP part, 1-1 is package,
1-2 is a lead, 3-1 is a power pattern,
3-2 is a mounting through hole, 4 is an adhesive, 12 is a spacer, 12-1 is a heat conductive plate, 12-2 is a pin, 13 is a wiring board, 13-3 is a heat transfer through hole,
Claims (1)
線基板(13)の実装用スルーホール(3-2) 間に伝熱用スル
ーホール(13-3)を穿設して、当該伝熱用スルーホール(1
3-3)に伝導用のスペーサー(12)に設けたピン(12-2)を挿
入して半田付けを行い、当該スペーサー(12)の熱伝導板
(12-1)に熱伝導性の優れた接着剤(4)を介して半導体デ
バイス(1) のパッケージ(1-1) を固着するとともに、当
該半導体デバイス(1) のリード(1-2) を前記実装用スル
ーホール(3-2) に接続したことを特徴とする熱伝導スペ
ーサーの実装構造。1. A heat transfer through hole (13-3) is provided between mounting through holes (3-2) of a wiring board (13) having a power supply pattern (3-1) in an inner layer, Through hole for heat transfer (1
Insert the pin (12-2) provided on the spacer (12) for conduction into 3-3) and solder it, and then the heat conductive plate of the spacer (12).
While fixing the package (1-1) of the semiconductor device (1) to the (12-1) via the adhesive (4) having excellent thermal conductivity, the leads (1-2) of the semiconductor device (1) are also fixed. Is connected to the mounting through hole (3-2), and the mounting structure of the heat conductive spacer is characterized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04123040A JP3079773B2 (en) | 1992-05-15 | 1992-05-15 | Mounting structure of thermal conductive spacer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04123040A JP3079773B2 (en) | 1992-05-15 | 1992-05-15 | Mounting structure of thermal conductive spacer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05326761A true JPH05326761A (en) | 1993-12-10 |
| JP3079773B2 JP3079773B2 (en) | 2000-08-21 |
Family
ID=14850724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04123040A Expired - Fee Related JP3079773B2 (en) | 1992-05-15 | 1992-05-15 | Mounting structure of thermal conductive spacer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3079773B2 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6335862B1 (en) | 1999-11-17 | 2002-01-01 | Nec Corporation | Multilayer printed wiring board provided with injection hole for thermally conductive filler |
| KR20020074073A (en) * | 2001-03-16 | 2002-09-28 | 엘지전자 주식회사 | Heat dissipation structure of ic |
| US6459585B1 (en) | 1999-03-09 | 2002-10-01 | Telefonaktiebolaget Lm Ericsson | Method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method |
| US7294530B2 (en) * | 2002-11-08 | 2007-11-13 | Stmicroelectronics, Inc. | Method for encapsulating multiple integrated circuits |
| EP1855517A1 (en) * | 2006-05-08 | 2007-11-14 | Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho | Soldering structure of through hole |
| JP2009055116A (en) * | 2007-08-23 | 2009-03-12 | Sanyo Electric Co Ltd | Low-pass filter and audio amplifier |
| CN102548244A (en) * | 2010-12-22 | 2012-07-04 | 联合汽车电子有限公司 | Assistant welding structure |
| CN102554394A (en) * | 2010-12-22 | 2012-07-11 | 联合汽车电子有限公司 | Common temperature auxiliary welding structure applicable to selective wave soldering |
| JP2014027121A (en) * | 2012-07-27 | 2014-02-06 | Mitsubishi Electric Corp | Power semiconductor device |
| WO2019117107A1 (en) * | 2017-12-14 | 2019-06-20 | 三菱電機株式会社 | Semiconductor device |
| CN114173540A (en) * | 2021-12-13 | 2022-03-11 | 中国科学院空间应用工程与技术中心 | Thermal control structure and device for satellite-borne on-orbit information processing and service load |
-
1992
- 1992-05-15 JP JP04123040A patent/JP3079773B2/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6459585B1 (en) | 1999-03-09 | 2002-10-01 | Telefonaktiebolaget Lm Ericsson | Method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method |
| US6335862B1 (en) | 1999-11-17 | 2002-01-01 | Nec Corporation | Multilayer printed wiring board provided with injection hole for thermally conductive filler |
| KR20020074073A (en) * | 2001-03-16 | 2002-09-28 | 엘지전자 주식회사 | Heat dissipation structure of ic |
| DE10211926B4 (en) * | 2001-03-16 | 2008-06-26 | Lg Electronics Inc. | Heat Dissipation Arrangement of an Integrated Circuit (IC) |
| US7294530B2 (en) * | 2002-11-08 | 2007-11-13 | Stmicroelectronics, Inc. | Method for encapsulating multiple integrated circuits |
| EP1855517A1 (en) * | 2006-05-08 | 2007-11-14 | Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho | Soldering structure of through hole |
| JP2009055116A (en) * | 2007-08-23 | 2009-03-12 | Sanyo Electric Co Ltd | Low-pass filter and audio amplifier |
| CN102548244A (en) * | 2010-12-22 | 2012-07-04 | 联合汽车电子有限公司 | Assistant welding structure |
| CN102554394A (en) * | 2010-12-22 | 2012-07-11 | 联合汽车电子有限公司 | Common temperature auxiliary welding structure applicable to selective wave soldering |
| JP2014027121A (en) * | 2012-07-27 | 2014-02-06 | Mitsubishi Electric Corp | Power semiconductor device |
| WO2019117107A1 (en) * | 2017-12-14 | 2019-06-20 | 三菱電機株式会社 | Semiconductor device |
| JPWO2019117107A1 (en) * | 2017-12-14 | 2020-04-02 | 三菱電機株式会社 | Semiconductor device |
| US11658089B2 (en) | 2017-12-14 | 2023-05-23 | Mitsubishi Electric Corporation | Semiconductor device |
| CN114173540A (en) * | 2021-12-13 | 2022-03-11 | 中国科学院空间应用工程与技术中心 | Thermal control structure and device for satellite-borne on-orbit information processing and service load |
| CN114173540B (en) * | 2021-12-13 | 2022-07-19 | 中国科学院空间应用工程与技术中心 | Thermal control structure and device for satellite-borne on-orbit information processing and service load |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3079773B2 (en) | 2000-08-21 |
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