JPH05315779A - Electronic apparatus - Google Patents

Abstract

PURPOSE:To protect the heat generated at sections other than an information processing section from leaking into a cabinet so as to allow the use of a small cooler by installing the cooler for sending out cooling wind into the cabinet, a conductive body for electrically connecting an electric power supply section to the information processing section, and heat radiating material so as to be peripherally in contact with the conductive body installed outside the cabinet. CONSTITUTION:A CPU 2 in a cabinet 1 is supplied with power from an electric power supply 1 installed outside the cabinet 1 via a bus bar 6 to drive the CPU 2. Then, cooling wind is sent out from a cooler 3 into the cabinet so installed as to surround the CPU 2 to cool down the inside of the cabinet 1 together with the CPU 2. On the other hand, although the power supply 5 generates heat as it supplies power, and this heat leaks from the power supply to the bus bar 6. Since this heat is radiated from the heat radiating material 7 so installed as to be peripherally in contact with the bus bar 6, leaking of the heat into the cabinet 1 is suppressed. With this, the surplus cooling capability required for cooling the heat that leaks from the power supply section 5 can be saved, thereby allowing the use of a small cooler for an electronic apparatus.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to, for example, C which requires cooling.
The present invention relates to a system computer class electronic device having a PU or the like.

[0002]

2. Description of the Related Art Conventionally, a system computer class electronic device is provided with a cooler capable of operating while suppressing an increase in temperature of its information processing unit such as a CPU. As the CPU is highly integrated, it often plays a role of cooling heat generated in a portion other than the CPU, such as a power supply unit, and tends to increase in size.

As shown in FIG. 3, the conventional electronic equipment device has a CP as an information processing unit which requires cooling in the housing 31.
U32 and the like are stored. A cooler 33 that sends cooling air to the inside of the housing 31 is provided outside the housing 31. In addition, the housing 3 is provided outside the housing 31.
A power supply unit 34 that supplies electric power to the CPU 32 inside the CPU 1 is provided. The power supply unit 34 and the CPU 32 in the housing are electrically connected by a bus bar 35 as a conductor. The bus bar 35 includes a housing 31 and a power supply unit 34.
The part between and is often exposed.

In this case, power is supplied to the CPU 32 from the power supply section 34 provided outside the housing 31 through the bus bar 35, and the CPU 32 operates. At this time, the cooler 33
The cooling air is blown into the housing 31 so that the housing 31 becomes a CPU.
Cooled with 32. As a result, the temperature rise of the CPU 32 is suppressed.

By the way, in recent years, the CPU 32 is being highly integrated, and the amount of power supplied to the CPU 32 is also rapidly increasing, and the heat leaked from the power source section 34 through the bus bar 35 cannot be ignored.

Therefore, in order to additionally cool the heat of the power source section 34, a large-sized cooler tends to be used for such electronic equipment.

However, increasing the size of the cooling machine is not good because it leads to increasing the size of the entire electronic device.

[0008]

As described above, in the conventional electronic equipment described above, the heat leaked through the bus bar is becoming non-negligible as the CPU is highly integrated, and a large cooling is used for this purpose. There was a problem that it was necessary to use a machine.

The present invention has been made in order to solve such a problem, and prevents heat generated by other than the information processing unit from leaking into the housing, thereby reducing heat generation in the information processing unit inside the housing. It is an object of the present invention to provide an electronic device device that can use a small-sized cooler that cools only against it.

[0010]

In order to achieve the above-mentioned object, an electronic equipment device of the present invention has an information processing unit that requires cooling, a housing that encloses the information processing unit, and an inside of the housing. A cooler that sends out cooling air, a power supply unit that is provided outside the housing and supplies power to the information processing unit inside the housing, and an electric power supply unit and the information processing unit inside the housing. And a heat dissipating member provided around the conductor outside the housing.

Further, this electronic device is provided with an information processing section that requires cooling, a housing that encloses the information processing section, a cooler that sends cooling air into the housing, and an outside of the housing. A power supply unit for supplying electric power to the information processing unit in the housing, and an electrical connection between the power supply unit and the information processing unit in the housing and to increase the thermal resistance of the housing. And conductors redundantly arranged in the member.

[0012]

In the electronic equipment device of the present invention, the information processing unit operates by supplying power to the information processing unit inside the housing from the power supply unit provided outside the housing through the conductor. At this time, cooling air is sent from the cooler into the housing, and the inside of the housing is cooled together with the information processing unit.

On the other hand, heat is also generated in the power supply unit along with the power supply. Although this heat leaks from the power source to the conductor, it is released from the heat dissipating material provided around the conductor, so that the heat leak into the housing can be suppressed. In addition, the conductors may be redundantly arranged in the member of the housing to increase the thermal resistance of the conductors so that the heat is less likely to be transferred to the housing.

As a result, the extra cooling capacity required for cooling the leaked heat from the power source section can be omitted, and a small cooling machine can be used.

[0015]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 1 is a sectional view showing the arrangement of an electronic apparatus according to an embodiment of the present invention.

In FIG. 1, reference numeral 1 denotes a housing which encloses a CPU 2 or the like as an information processing unit which requires cooling so as to surround it, and its own wall is made of a heat insulating member. This housing 1
A cooler 3 for generating cooling air is arranged outside of, and is connected to the inside of the housing 1 by a pipe 4 for sending the cooling air. A power supply unit 5 that supplies electric power to the CPU 2 inside the housing 1 is provided outside the housing 1. The power supply unit 5 and the CPU 2 inside the housing 1 are electrically connected by a bus bar 6 as a conductor. The bus bar 6 is made of a copper rod having a high conductivity, for example, a low electric resistance, and a current of several hundred amperes may be applied. The bus bar 6 is provided with a heat radiating material 7 in circumferential contact with a portion between the housing 1 and the power supply section 5.

In this electronic device, the CPU 2 operates by supplying power from the power supply unit 5 provided outside the housing 1 to the CPU 2 in the housing 1 through the bus bar 6. At this time, cooling air is sent from the cooler 3 into the housing 1 provided so as to surround the CPU 2, and the inside of the housing 1 is cooled together with the CPU 2.

On the other hand, the power supply section 5 generates heat with power supply. This heat leaks from the power supply unit 5 to the bus bar 6. The amount of heat leak at this time can be obtained from the following equation.

Q = λ (T1−T2) · A / l However, q: heat leak amount (W), λ: thermal conductivity of the bus bar (W / m · ° C), T1: outside (ambient) temperature of the housing (℃),
T2: Internal temperature of the housing (° C), A: Cross-sectional area of the bus bar (m
² ), l: length of heat dissipation material (m). From this equation, it is understood that the amount of heat leakage is inversely proportional to the length of heat dissipation material 7. The present invention focuses on this relationship, and the heat dissipation member 7 is provided on the bus bar 6 and the length thereof is lengthened to make the housing 1
The amount of heat leaked to is reduced.

That is, since the heat of the power source section 5 leaking to the bus bar 6 is released from the heat radiating material 7 provided in circumferential contact with the bus bar 6, the leak of heat into the housing 1 is suppressed.

According to this embodiment, the extra cooling capacity required for cooling the heat leaked from the power source section 5 can be omitted, and a small cooling machine can be used.

Next, another embodiment of the present invention will be described with reference to FIG.

As shown in FIG.
PU2 is stored. Further, a cooler 3 that generates cooling air is arranged outside the housing 1, and is connected to the housing 1 by a pipe 4 that sends the cooling air. Further, a power supply unit 5 that supplies electric power to the internal CPU 2 is provided outside the housing 1. The power supply unit 5 and the CPU 2 in the housing 1 are electrically connected via a bus bar 6. This bus bar 6 is redundantly arranged in the heat insulating member of the housing 1 so as to increase the thermal resistance between the power supply unit 5 and the CPU 2, for example, is piped in a crank shape, and the total length L of the bus bar 6 is long. The housing 1 also has a thick wall portion T.

In this case, since the bus bar 6 is piped in the shape of a crank in the heat insulating member of the housing 1 to increase the total length L thereof, the thermal resistance of the bus bar 6 is increased and the thermal conductivity of the bus bar 6 itself is lowered. is doing.

Therefore, the heat generated in the power supply unit 5 is cooled by the length L of the bus bar 6 while leaking to the bus bar 6 and passing through the inside of the heat insulating member of the housing 1, so that the heat into the housing is reduced. Leaks are suppressed.

In this way, also in this embodiment, as in the above-mentioned embodiment, the leakage of heat from the power supply unit 5 into the housing can be suppressed, so that an extra cooling capacity for this can be omitted, and a small cooling can be achieved. Machine can be used.

In this embodiment, the busbars are piped in a crank shape and arranged redundantly, but the busbars may be finely meandered and the shape thereof is not limited.

[0029]

As described above, according to the electronic device apparatus of the present invention, the heat generated in the power supply portion is less likely to leak into the housing through the conductor, so that the extra cooling capacity required for this heat can be provided. It becomes possible to omit it, and it becomes possible to use a small chiller.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a configuration of an electronic device apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a configuration of an electronic device apparatus according to another embodiment of the present invention.

FIG. 3 is a sectional view showing a configuration of a conventional electronic device.

[Explanation of symbols]

1 ... Housing, 2 ... CPU, 3 ... Cooler, 4 ... Pipe, 5 ...
Power supply section, 6 ... bus bar, 7 ... heat dissipation material.

Claims (2)

[Claims] 1. An information processing unit that requires cooling, a housing that encloses the information processing unit, a cooler that sends cooling air into the housing, and a housing that is provided outside the housing and that is provided inside the housing. A power supply unit for supplying electric power to the information processing unit, a conductor electrically connecting the power supply unit to the information processing unit inside the housing, and a conductor provided around the conductor outside the housing. And a heat dissipation material provided therein. 2. An information processing unit that requires cooling, a housing that encloses the information processing unit, a cooler that sends cooling air into the housing, and a housing that is provided outside the housing and that is provided inside the housing. A power supply unit for supplying electric power to the information processing unit, and a redundant arrangement in a member of the housing for electrically connecting the power supply unit and the information processing unit in the housing and increasing thermal resistance. And an electrically conductive material.