JPH05315534A - Ic package - Google Patents

Abstract

PURPOSE:To reduce the clearance between contact regions and outer leads down to exceeding 100mum compared with the conventional clearance by covering the periphery of the contact regions wherein measuring pins come into contact with the outer leads. CONSTITUTION:An insulating film 9 of polyimide, etc., 25mum-100mum thick with aperture parts previously zigzag formed on the positions corresponding to set up pins 10 is applied to one main surface of outer leads 7. This insulating film 9 is to be apllied before a semiconductor pellet is assembled into or after an outer vessel 6 is formed. The size of the aperture parts 8 is specified not to come into contact with adjacent outer leads 7. In such a structure of the outer leads 7, the periphery of the contact regions in contact with the measuring pins 10 is covered with the insulating film 9 so that the possibility of electrical shortcircuit between the measuring pins 10 and the outer leads 7 may be precluded thereby enabling the clearance between the contact regions and the adjacent outer leads 7 to be reduced down to several scores of mum.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an external lead structure for an external container (IC package) for a semiconductor device, and more particularly to an external lead structure for a surface mount type IC package.

[0002]

2. Description of the Related Art First, a conventional IC package will be described with reference to FIGS. The IC package has a mount area 3 on which the semiconductor pellet 1 is mounted.
And an external lead electrode 2 for the semiconductor pellet and a fine metal wire (bonding wire) 4 such as Au or Al.
A bonding area 5 of a metal conductor connected to each other, an external container 6 extending in the longitudinal direction of the bonding area 5 and sealing the semiconductor pellet 1, the bonding wire 4 and the bonding area 5, and a straight line from the external container 6. And an external lead 7 of a metal conductor protruding upward.

When performing an operation test (electrical test) of a semiconductor device in which a semiconductor pellet is incorporated using the above IC package, as shown in FIG. An operation test is performed by contacting the measuring pin 10 of a jig (not shown). At this time, the measuring pin is brought into contact with the external lead in the contact area (contact area).

By the way, the size of the contact area (contact area) between the measuring pin and the external lead is (1) the positional accuracy of the measuring pin of the measuring jig, and (2) the positioning accuracy of the external lead and the measuring pin. Determined from the points. Conventionally, it is desirable that the contact region has a width of 0.25 mm to 0.30 mm, and a space (clearance) between the contact region and an adjacent external lead is 0.15 mm to.
It is 0.20 mm.

[0005]

However, in the conventional external lead structure, since the metal conductor is exposed,
When conducting an electrical test of a semiconductor device, there is a risk that the measuring pin may contact an adjacent external lead and cause an electrical short circuit. Therefore, it is difficult to reduce the clearance between the contact area and the adjacent external lead, and as a result external This hinders the fine patterning of leads.

Further, when the measuring pin comes into contact with the external lead, the measuring pin is displaced not only in the vertical direction (perpendicular to the external lead) but also in the lateral direction (surface direction of the external lead). Causes the surface of the external lead to be slightly scraped off. For this reason, when a large number of electrical tests are repeated, the scraped metal of the external lead easily adheres to the tip of the measuring pin as metal scrap. In this way, when the electrical test is performed on the measuring pin to which the metal scrap is attached, the metal scrap often causes an electrical short circuit between the adjacent external lead and the measuring pin. Further, the metal scraps may be re-attached from the measurement pin to the external leads, and the re-attached metal scraps may cause an electrical short circuit between the adjacent external leads during use of the semiconductor device. As a result, there is a problem that the semiconductor device malfunctions or the semiconductor device is destroyed. The problem caused by the metal scrap is more likely to occur when the metal of the outer lead is softer.

An object of the present invention is to provide an external lead structure which does not cause an electrical short circuit in the operation test of a semiconductor device.

[0008]

The external lead of the present invention comprises:
The main surface of the external lead has an insulator with staggered openings at positions facing the measurement pins of the measuring jig, and the size of this opening is large enough not to contact adjacent external leads. It is characterized by the fact that it does.

The external lead having such a structure has a structure in which the measuring pin is brought into contact with the external lead through the opening portion in the electrical test of the semiconductor device.

[0010]

EXAMPLES The present invention will be described below with reference to examples.

With reference to FIGS. 1A and 1B, in the present embodiment, the same components as those of the IC package shown in FIG. 2 are designated by the same reference numerals and the description thereof will be omitted. In this embodiment, the measuring pin 10 is previously formed on one main surface of the external lead 7.
An insulating film 9 of polyimide or the like having a thickness of 25 μm to 100 μm, in which the openings 8 are formed in a zigzag shape, is attached to a position corresponding to (a position where the measuring pin is contacted). The attachment of the insulating film 9 is performed before the semiconductor pellet 1 is incorporated or after the outer container 6 is formed. In addition, the opening 8
The size of is such that it does not contact the adjacent external lead.

In the external lead having the above-mentioned structure, since the periphery of the contact area where the measuring pin contacts is covered with the insulating film, there is no fear that the measuring pin electrically short-circuits with the adjacent external lead, resulting in contact. It is possible to reduce the clearance between the region and the adjacent external lead to several tens of μm.

Further, since the contact areas are arranged in a staggered pattern, the pitch of the external leads can be reduced without reducing the width of the contact areas.

FIG. 4 shows the correlation between the size of the contact area and the external lead pitch.

Here, the contact regions are arranged in a staggered pattern, and assuming that the width of the external leads is 40% of the external lead pitch, the correlation between the external lead pitch, the width of the contact regions, and the clearance of the contact regions is shown. .. As is apparent from FIG. 4, even if the contact regions are arranged in a staggered manner in the conventional external lead structure, the distance between the contact regions and the adjacent external leads cannot be reduced, and the possible external lead pitch is 0. The first of the present invention is limited to 4 mm.
It is understood that in the embodiment of the above, it is possible to reach 0.3 mm.

In such an external lead structure, even if an electrical test is performed with a measuring pin having metal scrap attached, a thickness of 25 μ is provided between the contact region where the metal is exposed (external lead in the opening) and the contact region. Since ~ 100μ of insulating film is present, in order to cause an electrical short circuit due to metal scraps, metal scraps are formed across recesses (openings) -projections (insulating films) -concave (openings) and three regions. No electrical short circuit will occur unless is attached, so there is little risk of an electrical short circuit occurring.

Next, referring to FIGS. 3A and 3B,
A second embodiment according to the present invention will be described. In the second embodiment, a support film 11 made of polyimide or the like for applying an insulator is attached to one main surface of the external lead 7, and solder resist is applied to the other surface of the external lead at a position corresponding to the support film 11. An insulating material 9 such as the above is applied, and then the opening portion 8 is formed at a position corresponding to the measuring pin 10. The size of the opening 8 is set so that it does not come into contact with the adjacent outside. Then, the apertures 8 are arranged in a staggered manner as in the first embodiment.

In the external lead having the structure shown in the second embodiment, since the insulating material is applied to one main surface of the external lead and then the opening portion is formed by using a photo-etching method or the like, the first lead is formed. As compared with the structure of the external lead in the above embodiment, the positional accuracy of the external lead and the opening portion is high, and as a result, the distance between the contact region and the adjacent external lead can be reduced.

On the other hand, in the second embodiment, since both surfaces of the external lead are covered with the insulating material, when mounting the semiconductor device on the mounting substrate, it is necessary to remove the mounting portion and provide a contact region on the external lead. is there.

[0020]

As described above, according to the present invention, the contact area around the contact between the measuring pin and the external lead is covered with the insulator, so that the distance between the contact area and the adjacent external lead is larger than that in the conventional case. Can be reduced by 100 μm or more. Further, in the electrical test of the semiconductor device, there is an effect that an electrical short circuit due to metal scrap can be prevented, and that the metal scrap can be prevented from reattaching to the external lead.

[Brief description of drawings]

1A and 1B are views showing an embodiment of an IC package according to the present invention, FIG. 1A is a plan view, and FIG. 1B is a sectional view taken along line XX ′ of FIG.

2A and 2B are views showing a conventional IC package, FIG. 2A being a plan view and FIG. 2B being a cross-sectional view taken along line XX ′ in FIG.

3A and 3B are views showing a second embodiment of an IC package according to the present invention, FIG. 3A is a plan view, and FIG.
It is sectional drawing in a line.

FIG. 4 is a diagram showing a correlation between an external lead pitch and a size of a contact region.

[Explanation of symbols]

 1 Semiconductor Pellet 2 External Extraction Electrode 3 Mounting Area 4 Bonding Line 5 Bonding Area 6 External Container 7 External Lead 8 Open Hole 9 Insulator 10 Measuring Pin 11 Support Film

Claims (2)

[Claims] 1. A mount area on which a semiconductor element is mounted, a bonding area electrically connected to an external lead electrode of the semiconductor element, an external container for sealing the mount area and the bonding area, and the bonding area. A plurality of external leads extending upward and projecting outward from the bonding region; and an insulator formed on one main surface of the external lead, the external lead being provided at a predetermined position of the insulator. The IC package is characterized in that an opening reaching up to is formed. 2. The IC package according to claim 1, wherein the openings are formed corresponding to each of the external leads, and the openings are arranged in a staggered pattern. IC package characterized by.