JPH0529537A - Semiconductor module structure - Google Patents

Abstract

PURPOSE:To reduce mounting area and realize high density mounting, by unnecessitating module substrates for mounting chip substrates, and vertically stacking the chip substrates, concerning semiconductor module structure constituted by stacking a plurality of chip substrates on which semiconductor circuits are formed. CONSTITUTION:Wiring patterns 3 and connection pads 4 are formed on the surface 11 and the rear 12 of a chip substrates 1 on which semiconductor circuits are formed. The wiring pattern on the surface and the wiring pattern 3 on the rear are electrically connected through via holes 5. A plurality of chip substrates 1 are vertically stacked by using the connection pads 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor module structure in which a plurality of semiconductor chips having semiconductor circuits are modularized and mounted at high density.

In recent years, in order to reduce the size and increase the functionality of electronic devices, a plurality of semiconductor chips are mounted on one wiring board to form a module, so that the electronic devices can be mounted on a motherboard at a high density. However, because a plurality of semiconductor chips are connected via a wiring board to form a module, the wiring board that lays out the semiconductor chips in a plane cannot be made very small, and the semiconductor chips are mounted at a higher density. There is a need for a semiconductor module structure that can do this.

[0003]

2. Description of the Related Art Conventionally, as a semiconductor module structure,
As shown in FIG. 5, a semiconductor chip 2 formed by forming a semiconductor circuit on a silicon substrate on a module substrate 10 formed by printing a wiring pattern on a resin or ceramic base material.
A plurality of 0s are connected by a solder pump or a bonding wire, a plurality of them are mounted, and the semiconductor chip 20 is protected by a seal cap 30 or a resin coat to form a semiconductor module. The external connection leads 110 formed on the module substrate 10 are connected to the mother board 40.

[0004]

However, in the conventional semiconductor module structure, the semiconductor chips 20 are two-dimensionally arranged on the module substrate 10, and the wiring patterns printed on the module substrate 10 between the respective semiconductor chips 20. The semiconductor chip 2 is connected by
There is a drawback that the mounting portions of 0, 20, ... And the wiring pattern forming portion are required on the module substrate 10, and the area of the module substrate 10 cannot be sufficiently reduced.

The present invention has been made in order to solve the above-mentioned drawbacks, and it is possible to reduce the mounting area, reduce the size, and increase the density without arranging a plurality of semiconductor chips in a plane on the module substrate. An object of the present invention is to provide a semiconductor module structure.

[0006]

The present invention will be described with reference to FIGS. 1 to 3 corresponding to an embodiment. A semiconductor circuit 2 will be described.
Wiring patterns 3 and connection pads 4 are formed on the front surface 11 and the back surface 12 of the chip substrate 1 on which the wiring patterns 3 are formed. Further, the chip substrate 1 has front and back surfaces 11, 12
Via holes 5 are formed penetrating through the space and connecting the wiring patterns 3 and 3 on the front and back surfaces. Then, the upper chip substrate 1 is formed on the connection pads 4 on the front surface side of the plurality of chip substrates 1.
The connection pads 42 on the back side of the above are overlapped and connected in multiple stages.

[0007]

According to the present invention, the wiring patterns 3 and 3 on the front and back surfaces and the connection pads 4 are formed by the via holes 5 penetrating between the front and back surfaces 11 and 12 of the chip substrate 1 in the present invention.
4 are connected to each other, the plurality of chip substrates 1 are vertically stacked, and the lower surface side connection pads 4 and the upper surface side back surface connection pads 4 to be stacked are connected by soldering or the like. Since the wiring boards for connecting the semiconductor chips into modules are not required, and by stacking them on top of each other, the mounting area on the motherboard can be reduced to the size of a single chip board, thus reducing the size of the device. It is possible to achieve higher density and higher density.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings. 1 and 2 show a chip substrate 1 of a semiconductor element that constitutes a semiconductor module of the present invention, and FIG. 3 is formed by stacking a plurality of chip substrates 1, 1, ... 1 shows a semiconductor module A.

As shown in FIG. 1, a chip substrate 1 is a silicon substrate for forming a semiconductor circuit 2, and a surface 11 has a
The semiconductor circuit 2 is formed. And the chip substrate 1
A via hole 5 that penetrates the front surface 11 and the rear surface 12 to establish electrical conduction is formed therein.

Connection pads 4 and 4 are formed on the front and back surfaces 11 and 12 of the chip substrate 1 at corresponding positions, and a wiring pattern 3 is formed to connect the semiconductor circuit 2 and the connection pad 4. There is. And the front and back surfaces 11,
The wiring patterns 3 and 3 respectively formed in 12 are electrically connected by the via holes 5 as shown in FIG.

As shown in FIG. 3, a plurality of chip substrates 1 are stacked and mounted on the mother board 6, and the connection pads 4 formed on the back surface 12 of the lowest chip substrate 1 are connected to the mother board 6. It is fixed to the connection pad 61 with solder 7 or a conductive adhesive. And the chip substrate 1
Similarly, the back surface side connection pads 42 of the upper chip substrate 1 are fixed to the front surface side connection pads 4 and stacked in multiple stages, and the whole is mounted so as to be protected by the resin coating 8.

Next, the manufacturing process of the chip substrate 1 will be described. First, as shown in FIG. 4A, a hole is formed in the silicon substrate 13 by laser or etching to form a silicon oxide film 14 on the surface. Then, a semiconductor is formed by a semiconductor manufacturing process, aluminum vapor deposition,
The semiconductor circuit 2 is formed by lithography.

Next, as shown in FIG. 4B, an insulating layer 15 is formed on the front and back surfaces 11 and 12 of the chip substrate 1 by imide spin coating or the like, and the via hole 5 is exposed by baking and developing. Then, the wiring pattern 3 for connecting the via hole 5 and the connection pad 4 by metal deposition and etching.
Is formed on the insulating layer 15 to form the chip substrate 1.

[0014]

As described above, in the present invention, the wiring patterns are provided on the front and back surfaces of the chip substrate on which the semiconductor circuit is formed by connecting via holes, and the chip substrates are stacked in multiple stages by the connection pads on the front and back surfaces. Since a semiconductor module is formed, a wiring board for modularizing a chip substrate is not required, and a mounting area on a mother board can be reduced to enable high-density mounting.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an embodiment of the present invention.

FIG. 2 is an explanatory view showing a cross section of the present invention.

FIG. 3 is an explanatory diagram showing a mounting state of the present invention.

FIG. 4 is an explanatory diagram showing a manufacturing process according to the embodiment of the present invention.

FIG. 5 is an explanatory diagram showing a conventional example.

[Explanation of symbols]

 1 chip substrate 11 front surface 12 back surface 2 semiconductor circuit 3 wiring pattern 4 connection pad 5 via hole

Claims (1)

Claims: 1. A chip substrate (1) on which a semiconductor circuit (2) is formed.
The wiring pattern (3) and the connection pad (4) are formed on the front surface (11) and the back surface (12) of the
12) The wiring patterns (3, 3) are connected by via holes (5), and the connection pads (11, 12) on the front and back surfaces (11, 12) facing the chip substrates (1, 1, ...) respectively. 4, 4) A semiconductor module structure characterized by being connected and stacked through.