JPH05291724A - Hybrid ic - Google Patents

Hybrid ic

Info

Publication number
JPH05291724A
JPH05291724A JP32427391A JP32427391A JPH05291724A JP H05291724 A JPH05291724 A JP H05291724A JP 32427391 A JP32427391 A JP 32427391A JP 32427391 A JP32427391 A JP 32427391A JP H05291724 A JPH05291724 A JP H05291724A
Authority
JP
Japan
Prior art keywords
hybrid
component mounting
mounting portions
portions
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32427391A
Other languages
Japanese (ja)
Inventor
Tetsuo Washida
哲郎 鷲田
Taiji Kasatani
泰司 笠谷
Yasuhiro Murasawa
靖博 村沢
Toshio Sogo
敏雄 十河
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP32427391A priority Critical patent/JPH05291724A/en
Publication of JPH05291724A publication Critical patent/JPH05291724A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To obtain a hybrid IC wherein a high-density mounting operation can be performed without a need for chip leads or the like. CONSTITUTION:A plurality of lands 12 are arranged and installed on a flexible mounting board in such a way that their surfaces and their rears and arranged alternately with each other. Wiring parts 13 which electrically connect the lands 12 side by side are formed across the individual lands 12. The wiring parts 13 are bent; they are made zigzag in such a way that the individual lands 12 become perpendicular to the mounting board 14.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】この発明は、実装基板上に搭載さ
れるハイブリッドＩＣ（混成集積回路）の構造に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a hybrid IC (hybrid integrated circuit) mounted on a mounting board.

【０００２】[0002]

【従来の技術】図５はこの種従来の二段構造ハイブリッ
ドＩＣを示し、（ａ）は平面図、（ｂ）は正面図、
（ｃ）は側面図である。図において、１は部品搭載部、
２はこの部品搭載部１に搭載された例えばＩＣ等の実装
部品、３はクリップリードで、クリップ４によって部品
搭載部１の両側に固定されている。そして上段側のクリ
ップリード３の先端が下段側の部品搭載部１に固定され
ることにより二段構造ハイブリッドＩＣが形成され、下
段側のクリップリード３の先端を実装基板（図示せず）
上に固定し実装される。2. Description of the Related Art FIGS. 5A and 5B show a conventional two-stage structure hybrid IC of this kind. FIG. 5A is a plan view, FIG.
(C) is a side view. In the figure, 1 is a component mounting portion,
Reference numeral 2 is a mounted component such as an IC mounted on the component mounting portion 1, 3 is a clip lead, and is fixed to both sides of the component mounting portion 1 by clips 4. Then, the tip of the upper clip lead 3 is fixed to the lower component mounting portion 1 to form a two-stage structure hybrid IC, and the tip of the lower clip lead 3 is mounted on a mounting board (not shown).
It is fixed and mounted on top.

【０００３】[0003]

【発明が解決しようとする課題】従来の多段構造ハイブ
リッドＩＣは以上のように構成されているので、段数が
多くなればなる程、部品搭載部間を連結するクリップリ
ード３の数も多くなり、又、実装基板上高さ方向のスペ
ースを非常に多く要する等という問題点があった。この
発明は上記のような問題点を解消するためになされたも
ので、クリップリード等を必要とせず高密度実装が可能
なハイブリッドＩＣを提供することを目的とするもので
ある。Since the conventional multi-stage hybrid IC is constructed as described above, the larger the number of stages, the larger the number of clip leads 3 connecting the component mounting portions, Further, there is a problem that a very large space in the height direction is required on the mounting board. The present invention has been made to solve the above problems, and an object of the present invention is to provide a hybrid IC capable of high-density mounting without the need for clip leads or the like.

【０００４】[0004]

【課題を解決するための手段】この発明に係るハイブリ
ッドＩＣは、フレキシブル基板上に交互に表裏となるよ
うに部品搭載部を複数配設するとともに、上記各部品搭
載部間に上記部品搭載部の相隣なるもの同士を電気的に
接続する配線部を形成し、上記配線部を折曲して上記各
部品搭載部が実装基板面に対して垂直となるように蛇行
させたものである。In a hybrid IC according to the present invention, a plurality of component mounting portions are arranged on a flexible substrate so that the component mounting portions are alternately arranged on the front and back sides, and the component mounting portions are arranged between the component mounting portions. Wiring portions for electrically connecting adjacent ones are formed, and the wiring portions are bent and meandered such that the component mounting portions are perpendicular to the mounting substrate surface.

【０００５】[0005]

【作用】この発明におけるハイブリッドＩＣのフレキシ
ブル基板は、配線部が形成される部分で折曲し、各部品
搭載部が実装基板面に対して垂直となるように蛇行する
ことにより、クリップリード等を必要としなくてすみ、
又、高密度実装を可能とする。The flexible substrate of the hybrid IC according to the present invention is bent at the portion where the wiring portion is formed, and meanders so that each component mounting portion is perpendicular to the mounting substrate surface, thereby eliminating the clip lead and the like. You don't need it,
It also enables high-density mounting.

【０００６】[0006]

【実施例】実施例１．以下、この発明の実施例を図につ
いて説明する。図１はこの発明の実施例１におけるハイ
ブリッドＩＣのモジュールの展開図、図２は図１におけ
るモジュールを組み立てて構成したこの発明の実施例１
におけるハイブリッドＩＣを示す正面図である。１１は
ベルト状のフレキシブル基板、１２はこのフレキシブル
基板１１上長手方向に交互に表裏となるように所定の間
隔を介して配設される多層構造の部品搭載部、１３はこ
れら各部品搭載部１２間に形成され相隣なる部品搭載部
１２同士を電気的に接続する１層構造の配線部である。EXAMPLES Example 1. Embodiments of the present invention will be described below with reference to the drawings. 1 is a development view of a hybrid IC module according to Embodiment 1 of the present invention, and FIG. 2 is an embodiment 1 of the present invention in which the modules shown in FIG. 1 are assembled.
2 is a front view showing the hybrid IC in FIG. Reference numeral 11 is a belt-shaped flexible substrate, 12 is a multi-layered component mounting portion disposed on the flexible substrate 11 so as to be alternately arranged on the front and back sides in a longitudinal direction with a predetermined interval, and 13 is each component mounting portion 12 It is a wiring part having a one-layer structure that electrically connects adjacent component mounting parts 12 formed between them.

【０００７】上記の様に構成されたモジュールを、ま
ず、配線部１３が形成された部分で折曲し、図２に示す
ように、相隣なる部品搭載部１２同士の表裏が相対向し
且つ実装基板１４に対して垂直となるように蛇行させ、
実装基板１４上に実装することによりハイブリッドＩＣ
は組立を完了する。なお、部品搭載部１２の数は、実装
基板１４上に接地する最初のリードと最後のリードにお
いて、全リードを接地させる必要があるので、奇数とす
れば構造上組立が容易となる。First, the module configured as described above is bent at the portion where the wiring portion 13 is formed, and as shown in FIG. 2, the front and back surfaces of the component mounting portions 12 adjacent to each other face each other and Make it meander so as to be perpendicular to the mounting substrate 14,
By mounting on the mounting board 14, a hybrid IC
Completes the assembly. It should be noted that the number of component mounting portions 12 needs to be grounded on all the leads on the first lead and the last lead that are grounded on the mounting substrate 14, so if the number is an odd number, structural assembly becomes easy.

【０００８】実施例２．上記実施例１では複数の部品搭
載部１２を直列に配設しているが、部品搭載部１２間の
リード対応をとるため、対応している配線部１３同士を
接続して並列に配設しても良い。すなわち、図３に示す
ように、実装基板１４から遠い側の部品搭載部１２群は
接続線１５によって電気的に一括接続し、実装基板１４
から近い側の部品搭載部１２群は、実装基板１４上に形
成された同一のランド１６上に実装することによって電
気的に一括接続する。このような接続により部品搭載部
１２を並列に配設すれば、実装基板１４から部品搭載部
１２への信号伝達の選択性の融通が利き、信号伝達のス
ピードアップが望める。Example 2. Although the plurality of component mounting portions 12 are arranged in series in the first embodiment, the corresponding wiring portions 13 are connected and arranged in parallel in order to take lead correspondence between the component mounting portions 12. May be. That is, as shown in FIG. 3, the component mounting portions 12 on the side far from the mounting board 14 are electrically connected together by the connecting line 15,
The group of component mounting portions 12 on the side closer to is mounted on the same land 16 formed on the mounting substrate 14 to electrically connect them collectively. By arranging the component mounting portions 12 in parallel by such connection, the selectivity of signal transmission from the mounting board 14 to the component mounting portion 12 is flexible, and the speed of signal transmission can be increased.

【０００９】実施例３．上記各実施例では、部品搭載部
１２上の部品を組み立ててハイブリッドＩＣを構成して
いるが、単品のＩＣにも適用可能である。すなわち、図
４は実施例３におけるハイブリッドＩＣの構成を示し、
（ａ）は正面図、（ｂ）は平面図である。図において、
１７はフィルム上に形成されたフレームリード、１８は
ＩＣ、１９はＩＣチップであり、相隣なるＩＣ１８のリ
ード対応をとるため、ＩＣチップ１９を交互に上下に配
置したものである。なお、実装基板１４への実装は上記
各実施例と同様に、フレームリード１７を折曲し、ＩＣ
１８が実装基板１４面に対して垂直となるように蛇行さ
せて行う。Embodiment 3. In each of the above embodiments, the components on the component mounting portion 12 are assembled to form the hybrid IC, but the hybrid IC is also applicable. That is, FIG. 4 shows the configuration of the hybrid IC in the third embodiment,
(A) is a front view and (b) is a plan view. In the figure,
Reference numeral 17 is a frame lead formed on the film, 18 is an IC, and 19 is an IC chip. In order to correspond to the leads of adjacent ICs 18, the IC chips 19 are alternately arranged above and below. The mounting on the mounting board 14 is performed by bending the frame leads 17 and mounting the ICs in the same manner as in each of the above embodiments.
The process is performed by making meandering so that 18 is perpendicular to the surface of the mounting substrate 14.

【００１０】[0010]

【発明の効果】以上のように、この発明によればフレキ
シブル基板上に交互に表裏となるように部品搭載部を複
数配設するとともに、各部品搭載部間に部品搭載部の相
隣なるもの同士を電気的に接続する配線部を形成し、こ
の配線部を折曲して各部品搭載部が実装基板面に対して
垂直となるように蛇行させたので、クリップリード等を
必要とせず高密度実装が可能なハイブリッドＩＣを提供
することができる。As described above, according to the present invention, a plurality of component mounting portions are arranged on the flexible substrate so as to be alternately on the front and back sides, and the component mounting portions are adjacent to each other. Since the wiring part that electrically connects the parts to each other is formed and the wiring part is bent and meandered so that each component mounting part is perpendicular to the surface of the mounting board, it is not necessary to use a clip lead or the like. A hybrid IC capable of high density mounting can be provided.

【図面の簡単な説明】[Brief description of drawings]

【図１】この発明の実施例１におけるハイブリッドＩＣ
のモジュールの展開図である。FIG. 1 is a hybrid IC according to a first embodiment of the present invention.
FIG.

【図２】図１におけるモジュールを組み立てて構成した
ハイブリッドＩＣを示す正面図である。FIG. 2 is a front view showing a hybrid IC formed by assembling the modules in FIG.

【図３】この発明の実施例２におけるハイブリッドＩＣ
の構成を示す正面図である。FIG. 3 is a hybrid IC according to a second embodiment of the present invention.
It is a front view which shows the structure of.

【図４】この発明の実施例３におけるハイブリッドＩＣ
の構成を示し、（ａ）は正面図、（ｂ）は平面図であ
る。FIG. 4 is a hybrid IC according to a third embodiment of the present invention.
2A is a front view, and FIG. 1B is a plan view.

【図５】従来の二段構造ハイブリッドＩＣの構成を示
し、（ａ）は平面図、（ｂ）は正面図、（ｃ）は側面図
である。5A and 5B show a configuration of a conventional two-stage structure hybrid IC, in which FIG. 5A is a plan view, FIG. 5B is a front view, and FIG.

【符号の説明】[Explanation of symbols]

１１ フレキシブル基板 １２ 部品搭載部 １３ 配線部 １４ 実装基板 １５ 接続線 １６ ランド １７ フレームリード １８ ＩＣ １９ ＩＣチップ 11 flexible substrate 12 component mounting portion 13 wiring portion 14 mounting substrate 15 connection line 16 land 17 frame lead 18 IC 19 IC chip

───────────────────────────────────────────────────── フロントページの続き (72)発明者 十河 敏雄 伊丹市瑞原４丁目１番地 三菱電機株式会 社北伊丹製作所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshio Togawa 4-chome, Mizuhara, Itami City Mitsubishi Electric Corp. Kita Itami Works

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 フレキシブル基板上に交互に表裏となる
ように部品搭載部を複数配設するとともに、上記各部品
搭載部間に上記部品搭載部の相隣なるもの同士を電気的
に接続する配線部を形成し、上記配線部を折曲して上記
各部品搭載部が実装基板面に対して垂直となるように蛇
行させたことを特徴とするハイブリッドＩＣ。1. A wiring for arranging a plurality of component mounting portions on a flexible substrate so as to alternately face each other, and electrically connecting adjacent ones of the component mounting portions between the component mounting portions. A hybrid IC, characterized in that a portion is formed, the wiring portion is bent, and each of the component mounting portions meanders so as to be perpendicular to a mounting substrate surface. 【請求項２】 配線部の実装基板に近い側の一群同士
を、又、実装基板から遠い側の一群同士をそれぞれ一括
して電気的に接続したことを特徴とする請求項１記載の
ハイブリッドＩＣ。2. The hybrid IC according to claim 1, wherein the groups of the wiring portion on the side closer to the mounting board and the groups on the side farther from the mounting board are electrically connected together. ..
JP32427391A 1991-12-09 1991-12-09 Hybrid ic Pending JPH05291724A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32427391A JPH05291724A (en) 1991-12-09 1991-12-09 Hybrid ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32427391A JPH05291724A (en) 1991-12-09 1991-12-09 Hybrid ic

Publications (1)

Publication Number Publication Date
JPH05291724A true JPH05291724A (en) 1993-11-05

Family

ID=18163971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32427391A Pending JPH05291724A (en) 1991-12-09 1991-12-09 Hybrid ic

Country Status (1)

Country Link
JP (1) JPH05291724A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258431A (en) * 2006-03-23 2007-10-04 Furukawa Electric Co Ltd:The Electronic-part mounting solid wiring body
US9343863B2 (en) 2009-03-19 2016-05-17 Olympus Corporation Method for manufacturing mount assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258431A (en) * 2006-03-23 2007-10-04 Furukawa Electric Co Ltd:The Electronic-part mounting solid wiring body
US9343863B2 (en) 2009-03-19 2016-05-17 Olympus Corporation Method for manufacturing mount assembly

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