JPH052859Y2 - - Google Patents
Info
- Publication number
- JPH052859Y2 JPH052859Y2 JP6581586U JP6581586U JPH052859Y2 JP H052859 Y2 JPH052859 Y2 JP H052859Y2 JP 6581586 U JP6581586 U JP 6581586U JP 6581586 U JP6581586 U JP 6581586U JP H052859 Y2 JPH052859 Y2 JP H052859Y2
- Authority
- JP
- Japan
- Prior art keywords
- hybrid circuit
- piezoelectric
- sensor element
- positive
- backing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 34
- 230000007935 neutral effect Effects 0.000 claims description 8
- 239000013013 elastic material Substances 0.000 claims description 7
- 230000003321 amplification Effects 0.000 claims description 5
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 description 6
- 230000001133 acceleration Effects 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000005616 pyroelectricity Effects 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000012858 resilient material Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は圧電体を用いて衝撃波、圧力、加速度
等を測定する圧電型センサに係り、組立が容易で
小型化が容易であると共に、水平振動（圧電素子
の厚さ方向と直角方向の振動をいう）によるノイ
ズを軽減して広い周波域に亘り、かつ広い温度範
囲に亘つて一定の出力で測定を可能とした圧電型
センサに関する。[Detailed description of the invention] [Field of industrial application] The present invention relates to a piezoelectric sensor that uses a piezoelectric body to measure shock waves, pressure, acceleration, etc. The present invention relates to a piezoelectric sensor that reduces noise caused by vibration (vibration in a direction perpendicular to the thickness direction of a piezoelectric element) and enables measurement with a constant output over a wide frequency range and a wide temperature range.
従来の圧電型センサ、特に高分子系膜状圧電体
を用いたセンサは、その周囲をケーシングで挟持
して支持していた。
Conventional piezoelectric sensors, particularly sensors using a polymer-based piezoelectric film, are supported by being sandwiched between a casing.
しかし、膜状圧電体はタルミが生じ易く、タル
ミのために水平振動によるノイズが大きくなる。 However, film-like piezoelectric materials are prone to sagging, and the sagging increases noise due to horizontal vibration.
膜状圧電体に剛性を有する裏打材を添着すると
水平振動に基づくノイズは軽減されるが使用温度
の変化に伴い裏打材が伸縮するため、温度によつ
て圧電型センサの感度が変化する欠点があつた。 If a rigid backing material is attached to the membrane piezoelectric material, noise caused by horizontal vibrations can be reduced, but the backing material expands and contracts as the operating temperature changes, so the sensitivity of the piezoelectric sensor changes depending on the temperature. It was hot.
また、膜状圧電体は、高インピーダンスのた
め、リード線で測定器に連結すると外部誘導を受
け易く、これを避けるためには、圧電型センサ内
にインピーダンス変換回路を内蔵させる方法が有
力であるが、この場合、圧電型センサの組立が複
雑となり、また、小型化が難しい問題があつた。 In addition, because the membrane piezoelectric material has high impedance, it is easily subject to external induction when connected to a measuring device with a lead wire.In order to avoid this, an effective method is to incorporate an impedance conversion circuit into the piezoelectric sensor. However, in this case, the assembly of the piezoelectric sensor was complicated, and furthermore, there were problems in that miniaturization was difficult.
本考案圧電センサはこのような問題点も解決し
ようとするもので、第１図及び第２図示のように
圧電体１の一面に一対の正、負電極２，３を設
け、圧電体１の他面に中立電極４を設け、この中
立電極４の表面に裏打材５を設けてセンサ素子７
を構成し、この裏打材５の表面に支持リング８を
接着せしめ、絶縁板９にインピーダンス変換部、
低域信号除去部及び増幅部よりなるハイブリツト
回路１０を形成し、このハイブリツト回路１０の
入力端１１，１２と正、負電極２，３間にそれぞ
れ導電性弾性体製接続材１３，１４を圧着すると
共にハイブリツト回路１０の出力端１５、電源端
１６及びアース端１７にケーブル１８を接続せし
めてセンサ本体１９を構成し、このセンサ本体１
９をハウジング２０内に収設してなる構成とした
ものである。
The piezoelectric sensor of the present invention attempts to solve these problems, and as shown in FIGS. 1 and 2, a pair of positive and negative electrodes 2 and 3 are provided on one surface of the piezoelectric body 1, and A neutral electrode 4 is provided on the other surface, a backing material 5 is provided on the surface of this neutral electrode 4, and the sensor element 7 is
A support ring 8 is adhered to the surface of this backing material 5, and an impedance converting section is attached to an insulating plate 9.
A hybrid circuit 10 consisting of a low-frequency signal removal section and an amplification section is formed, and connecting materials 13 and 14 made of conductive elastic material are crimped between the input ends 11 and 12 of this hybrid circuit 10 and the positive and negative electrodes 2 and 3, respectively. At the same time, a cable 18 is connected to the output end 15, power supply end 16, and ground end 17 of the hybrid circuit 10 to constitute a sensor body 19.
9 is housed in a housing 20.
このようなセンサ素子７を支持リング８に接着
せしめることによりセンサ素子７の外周部が支持
リング８に支持され固定されているから、ハウジ
ング２０の中央部よりセンサ素子７の中央部に加
えられた垂直振動を妨げることがなく、振動の広
い周波域に亘つて出力低下をきたすおそれがない
（一定の出力を得ることができる）ばかりでなく、
裏打材５と支持リング８の熱膨張係数をほぼ等し
くしてあるので、温度変化に対して両者の熱膨
張、収縮に差が生じて湾曲することがなくなり、
湾曲によるノイズの影響をなくして垂直振動を一
層高精度に測定でき、かつ広い温度範囲に亘つて
一定の出力を得ることができる。 By bonding such a sensor element 7 to the support ring 8, the outer circumferential portion of the sensor element 7 is supported and fixed by the support ring 8. Not only does it not interfere with vertical vibration and there is no risk of output reduction over a wide frequency range of vibration (a constant output can be obtained),
Since the coefficients of thermal expansion of the backing material 5 and the support ring 8 are approximately equal, there will be no difference in thermal expansion and contraction between the two due to temperature changes, which will prevent them from bending.
Vertical vibration can be measured with higher accuracy by eliminating the influence of noise due to curvature, and a constant output can be obtained over a wide temperature range.
また、センサ素子７の正、負電極２，３間より
得られる出力電圧は、センサ素子７の出力インピ
ーダンスをハイブリツト回路１０のインピーダン
ス変換部により変換して次段の入力インピーダン
スにマツチングさせて取り出すことができるの
で、コネクタや特殊ケーブルを使用せずに済み、
かつケーブル１８の長さを長くしても信号感度が
影響を受けず、出力は低下しない。 Further, the output voltage obtained between the positive and negative electrodes 2 and 3 of the sensor element 7 is obtained by converting the output impedance of the sensor element 7 by an impedance conversion section of the hybrid circuit 10 and matching it with the input impedance of the next stage. This eliminates the need for connectors or special cables.
Furthermore, even if the length of the cable 18 is increased, the signal sensitivity is not affected and the output does not decrease.
出力電圧の中にハウジング２０の熱的歪や焦電
性によるノイズが混入しても、これらのノイズを
ハイブリツト回路１０の低域信号除去部により除
去することができる。 Even if noise due to thermal distortion or pyroelectricity of the housing 20 gets mixed into the output voltage, this noise can be removed by the low-frequency signal removal section of the hybrid circuit 10.
第１図は本考案圧電型センサの一実施例を示す
部分分解斜視図、第２図はその縦断面図である。
FIG. 1 is a partially exploded perspective view showing an embodiment of the piezoelectric sensor of the present invention, and FIG. 2 is a longitudinal sectional view thereof.
まず、その構成を説明する。 First, its configuration will be explained.
この実施例は圧電体１の一面中央部に正電極２
を、その周部に正電極２と同一面積の負電極３を
設け、圧電体１の他面に中立電極４を設け、この
中立電極４の表面に裏打材５を設けてセンサ素子
７を構成すると共に、この裏打材５の表面に当該
裏打材５とほぼ等しい熱膨張係数の支持リング８
を接着せしめる。 In this embodiment, a positive electrode 2 is provided at the center of one surface of the piezoelectric body 1.
A negative electrode 3 having the same area as the positive electrode 2 is provided around the periphery, a neutral electrode 4 is provided on the other surface of the piezoelectric body 1, and a backing material 5 is provided on the surface of the neutral electrode 4 to form a sensor element 7. At the same time, a support ring 8 having a coefficient of thermal expansion approximately equal to that of the backing material 5 is provided on the surface of the backing material 5.
Glue.
圧電体１としてセラミツク系やPVDF、圧電セ
ラミツク、合成樹脂複合体等の有機高分子系のも
のを用いることができる。 As the piezoelectric material 1, a ceramic material, an organic polymer material such as PVDF, piezoelectric ceramic, or a synthetic resin composite can be used.
裏打材５としては、ガラスフアイバー、カーボ
ンフアイバーまたは窒化ケイ素（Si3N4）、炭化
ケイ素（SiC）、アルミナ（Al2O3）等のウイスカ
ー、ポリアセタール等の高分子ウイスカーなどと
エポキシ、不飽和ポリエステル等の高弾性率の樹
脂などから成る複合材を用いることができる。 As the backing material 5, glass fiber, carbon fiber, whiskers such as silicon nitride (Si 3 N 4 ), silicon carbide (SiC), alumina (Al 2 O 3 ), polymer whiskers such as polyacetal, etc., and epoxy, unsaturated A composite material made of a resin with a high elastic modulus such as polyester can be used.
また、支持リング８としては、上記裏打材５と
熱膨張係数が近似した剛性材料が用いられ、ガラ
ス−エポキシ、ガラス−不飽和ポリエステルより
なる熱硬化性樹脂複合体、フエノール、ユリアな
どの熱硬化性樹脂、ガラス−ナイロン、ガラス−
ポリエチレンテレフタレートなどの熱可塑性樹脂
複合体、銅、黄銅、アルミなどの金属を用いるこ
とができる。 Further, as the support ring 8, a rigid material having a thermal expansion coefficient similar to that of the backing material 5 is used, such as a thermosetting resin composite made of glass-epoxy, glass-unsaturated polyester, thermosetting resin such as phenol, urea, etc. Polymer resin, glass - nylon, glass -
Thermoplastic resin composites such as polyethylene terephthalate, metals such as copper, brass, and aluminum can be used.
そしてプラスチツク等の絶縁板９にインピーダ
ンス変換部、低域信号除去部及び増幅部よりなる
ハイブリツト回路１０を形成し、このハイブリツ
ト回路１０の入力端１１，１２と正、負電極２，
３間にそれぞれ導電性弾性体製接続材１３，１４
を圧着すると共に、ハイブリツト回路１０の出力
端１５、電源端１６及びアース端１７にケーブル
１８を接続せしめてセンサ本体１９を構成し、こ
のセンサ本体１９を上部、下部ハウジング２０
ａ，２０ｂを接着してなるハウジング２０内に収
設してなる。 Then, a hybrid circuit 10 consisting of an impedance conversion section, a low-frequency signal removal section, and an amplification section is formed on an insulating plate 9 made of plastic or the like.
Connecting materials 13 and 14 made of conductive elastic material between 3 and 3, respectively.
At the same time, a cable 18 is connected to the output end 15, power supply end 16, and ground end 17 of the hybrid circuit 10 to form a sensor body 19, and this sensor body 19 is connected to the upper and lower housings 20.
A and 20b are housed in a housing 20 formed by bonding them together.
ハウジング２０は導電性の弾性材料で形成する
のが望ましい。 Housing 20 is preferably formed from an electrically conductive, resilient material.
導電性弾性体製の接続材１３，１４としては、
プラスチツクまたはゴムの基材にカーボン粉末、
カーボン繊維、金属粉末、金属小片などを混入し
てなるものを用いることができる。 As the connecting members 13 and 14 made of conductive elastic material,
Carbon powder on plastic or rubber substrate,
A material mixed with carbon fiber, metal powder, small metal pieces, etc. can be used.
導電性弾性体製接続材１３，１４は圧着するだ
けでもよいが、導電性接着剤を用いて接着しても
よい。 The connecting members 13 and 14 made of conductive elastic bodies may be simply crimped, but they may also be bonded together using a conductive adhesive.
支持リング８は第２図示のようにハウジング２
０と一体であつてもよい。 The support ring 8 is attached to the housing 2 as shown in the second figure.
It may be integral with 0.
次にその作用を説明する。 Next, its effect will be explained.
圧電体１には焦電常数Ｐ〔COUL／degcm2〕と
いうものがあり、周囲温度に比例した電荷が正、
負電極２，３の表面に発生するが、両電極とも同
一分極面にあるため、両電極２，３に焦電現象に
より発生する出力電圧はその極性が等しく互いに
相殺するので、焦電現象によるノイズを検知する
ことなく、焦電補償効果を奏し、低周波域から高
周波域まで周波域に亘つて垂直振動を測定するこ
とができる。 The piezoelectric material 1 has a pyroelectric constant P [COUL/degcm 2 ], and the charge proportional to the ambient temperature is positive,
It is generated on the surfaces of the negative electrodes 2 and 3, but since both electrodes are on the same polarization plane, the output voltages generated on both electrodes 2 and 3 due to the pyroelectric phenomenon have the same polarity and cancel each other out, so it is not due to the pyroelectric phenomenon. It exhibits a pyroelectric compensation effect and can measure vertical vibrations across a frequency range from low to high frequencies without detecting noise.
なお、正、負電極２，３を同一面積とすること
により焦電電圧を極めて小さくすることができ
る。 Note that by making the positive and negative electrodes 2 and 3 have the same area, the pyroelectric voltage can be made extremely small.
また裏打材５は他部品との接着が容易で接着に
よる本考案センサの製造が容易になると共に、裏
打材５として弾性率が高く、かつクリープの少な
い材料を用いることによつて水平振動による曲
げ、ねじれを受けにくくなるので、水平振動によ
るノイズを大幅に軽減できる。 In addition, the backing material 5 is easy to adhere to other parts, making it easy to manufacture the sensor of the present invention by adhesion, and by using a material with a high elastic modulus and less creep as the backing material 5, bending due to horizontal vibration is possible. Since it is less susceptible to torsion, noise caused by horizontal vibration can be significantly reduced.
また、当該裏打材５の弾性率を変えることによ
り圧電体１の歪量を調整できるので、所望感度の
ものを容易に得ることができる。 Further, since the amount of strain in the piezoelectric body 1 can be adjusted by changing the elastic modulus of the backing material 5, a desired sensitivity can be easily obtained.
衝撃波、圧力、加速度等を受けると、圧電体１
は正電極２の部分を大きく変形させ、負電極３の
部分は殆ど変形しないか、または正電極２の部分
と負電極３の部分の変形が逆になるので、正、負
電極２，３に発生する電荷量に差を生じ、あるい
は正、負電極２，３に逆極性の電荷が発生し、電
荷量の差または逆極性の電荷によつて正、負電極
２，３間より出力電圧V0が得られ、加速度の測
定ができる。 When subjected to shock waves, pressure, acceleration, etc., piezoelectric material 1
The positive electrode 2 part is greatly deformed, and the negative electrode 3 part is hardly deformed, or the deformation of the positive electrode 2 part and the negative electrode 3 part is reversed, so that the positive and negative electrodes 2 and 3 are deformed. There is a difference in the amount of charge generated, or charges of opposite polarity are generated between the positive and negative electrodes 2 and 3, and the output voltage V is increased between the positive and negative electrodes 2 and 3 due to the difference in the amount of charge or the charge of opposite polarity. 0 is obtained and acceleration can be measured.
この場合、センサ素子７は支持リング８により
接着されており、センサ素子７の外周部は支持リ
ング８により支持され固定されているから、セン
サ素子７の中立部に加えられた加速度等の垂直振
動を妨げることなく、振動の広い周波域に亘つて
出力低下をきたすおそれはない。 In this case, the sensor element 7 is bonded by the support ring 8, and the outer periphery of the sensor element 7 is supported and fixed by the support ring 8, so vertical vibrations such as acceleration applied to the neutral part of the sensor element 7 There is no risk of output reduction over a wide frequency range of vibration.
また、裏打材５と支持リング８の熱膨張係数を
ほぼ等しくしてあるので、温度変化に対して両者
の熱膨張、収縮に差が生じて湾曲することがなく
なり、湾曲によるノイズが検出されることがない
から、垂直振動を一層高精度に測定でき、かつ広
い温度範囲に亘つて一定の出力を得ることができ
る。 Furthermore, since the coefficients of thermal expansion of the backing material 5 and the support ring 8 are made almost equal, there is no difference in thermal expansion and contraction between the two due to temperature changes, which prevents them from curving, and noise due to curving can be detected. Therefore, vertical vibration can be measured with higher precision, and a constant output can be obtained over a wide temperature range.
また、センサ素子７の正、負電極２，３間より
得られる出力電圧は、センサ素子７の出力インピ
ーダンスをハイブリツト回路１０のインピーダン
ス変換部により変換して次段の入力インピーダン
スにマツチングさせて取り出すことができるの
で、コネクタや特殊ケーブルを使用せずに済み、
かつケーブル１８の長さを長くしても信号感度が
影響を受けず、出力は低下しない。 Further, the output voltage obtained between the positive and negative electrodes 2 and 3 of the sensor element 7 is obtained by converting the output impedance of the sensor element 7 by an impedance conversion section of the hybrid circuit 10 and matching it with the input impedance of the next stage. This eliminates the need for connectors or special cables.
Furthermore, even if the length of the cable 18 is increased, the signal sensitivity is not affected and the output does not decrease.
出力電圧の中にハウジング２０の熱的歪や焦電
性によるノイズが混入しても、これらのノイズを
ハイブリツト回路１０の低域信号除去部により除
去することができる。 Even if noise due to thermal distortion or pyroelectricity of the housing 20 is mixed into the output voltage, these noises can be removed by the low frequency signal removal section of the hybrid circuit 10.
センサ素子７には導電性弾性体製のハウジング
２０を用いることにより、高衝撃波に対してもハ
ウジング２０の弾性により吸収できるから耐久性
を向上することができるばかりでなく、センサ素
子７やハイブリツト回路１０は導電性のハウジン
グ２０内に収められているため、外部ノイズを遮
蔽することができる。 By using the housing 20 made of conductive elastic material for the sensor element 7, the elasticity of the housing 20 can absorb high shock waves, which not only improves durability but also protects the sensor element 7 and the hybrid circuit. 10 is housed in a conductive housing 20, so external noise can be shielded.
出力電圧はハイブリツト回路１０の増幅部によ
り増幅されるので、ケーブル１８に各種機器を直
接、接続することができると共にノイズの影響を
回避することができる。 Since the output voltage is amplified by the amplifier section of the hybrid circuit 10, various devices can be directly connected to the cable 18, and the influence of noise can be avoided.
上述のような本考案によれば、先行技術の利点
を有することは勿論、センサ素子７を支持リング
８に接着したので、センサ素子７の外周部が支持
リング８に支持され固定されているからハウジン
グ２０の中央部よりセンサ素子７の中央部に加え
られた垂直振動を妨げることがなく、振動の広い
周波域に亘つて出力低下をきたすおそれがない
（一定の出力を得ることができる）ばかりでなく、
裏打材５と支持リング８の熱膨張係数をほぼ等し
くしてあるので、温度変化に対して両者の熱膨
張、収縮に差が生じて湾曲することがなくなり、
湾曲によるノイズの影響をなくして垂直振動を一
層高精度に測定でき、かつ広い温度範囲に亘つて
一定の出力を得ることができる。 According to the present invention as described above, not only does it have the advantages of the prior art, but also because the sensor element 7 is bonded to the support ring 8, the outer circumference of the sensor element 7 is supported and fixed by the support ring 8. The vertical vibration applied from the center of the housing 20 to the center of the sensor element 7 is not hindered, and there is no risk of output reduction over a wide vibration frequency range (a constant output can be obtained). Not, but
Since the coefficients of thermal expansion of the backing material 5 and the support ring 8 are approximately equal, there will be no difference in thermal expansion and contraction between the two due to temperature changes, which will prevent them from bending.
Vertical vibration can be measured with higher accuracy by eliminating the influence of noise due to curvature, and a constant output can be obtained over a wide temperature range.
また、ハウジング２０内にセンサ素子７と共に
インピーダンス変換部、低域信号除去部及び増幅
部よりなるハイブリツト回路１０を収めてあるの
で、インピーダンス変換部によりセンサ素子７と
のインピーダンスマツチングを図ることができ、
コネクタや特殊ケーブルを使用せずに済むので、
小型・軽量化を図ることができる。 Further, since the hybrid circuit 10 consisting of an impedance conversion section, a low-frequency signal removal section, and an amplification section is housed together with the sensor element 7 in the housing 20, impedance matching with the sensor element 7 can be achieved by the impedance conversion section. ,
There is no need to use connectors or special cables, so
It can be made smaller and lighter.
更に出力電圧中にハウジング２０の熱的歪や焦
電性により混入したノイズを低域信号除去部によ
り除去でき、また増幅部により出力電圧を増幅す
ることができること等によりノイズによる影響を
回避できるばかりでなく、センサ素子７にはハウ
ジング２０を介して垂直振動が加えられるので、
高衝撃波に対してもハウジング２０の弾性により
吸収できるから、耐久性を向上することができる
等の優れた効果を奏する。 Furthermore, noise mixed into the output voltage due to thermal distortion or pyroelectricity of the housing 20 can be removed by the low-frequency signal removal section, and the output voltage can be amplified by the amplification section, so that the influence of noise can be avoided. Instead, vertical vibration is applied to the sensor element 7 via the housing 20, so
Since high shock waves can be absorbed by the elasticity of the housing 20, excellent effects such as improved durability can be achieved.
第１図は本考案圧電型センサの一実施例を示す
部分分解斜視図、第２図はその縦断面図である。
１……圧電体、２，３……正、負電極、４……
中立電極、５……裏打材、７……センサ素子、８
……支持リング、９……絶縁板、１０……ハイブ
リツト回路、１１，１２……入力端、１３，１４
……導電性弾性体製接続材、１５……出力端、１
６……電源端、１７……アース端、１８……ケー
ブル、１９……センサ本体、２０……導電性弾性
体製ハウジング。
FIG. 1 is a partially exploded perspective view showing an embodiment of the piezoelectric sensor of the present invention, and FIG. 2 is a longitudinal sectional view thereof. 1... Piezoelectric material, 2, 3... Positive and negative electrodes, 4...
Neutral electrode, 5...Backing material, 7...Sensor element, 8
... Support ring, 9 ... Insulating plate, 10 ... Hybrid circuit, 11, 12 ... Input end, 13, 14
... Connecting material made of conductive elastic material, 15 ... Output end, 1
6... Power supply end, 17... Earth end, 18... Cable, 19... Sensor main body, 20... Housing made of conductive elastic material.
Claims (1)
け、圧電体１の他面に中立電極４を設け、この中
立電極４の表面に裏打材５を設けてセンサ素子７
を構成し、この裏打材５の表面に支持リング８を
接着せしめ、絶縁板９にインピーダンス変換部、
低域信号除去部及び増幅部よりなるハイブリツト
回路１０を形成し、このハイブリツト回路１０の
入力端１１，１２と正、負電極２，３間にそれぞ
れ導電性弾性体製接続材１３，１４を圧着すると
共にハイブリツト回路１０の出力端１５、電源端
１６及びアース端１７にケーブル１８を接続せし
めてセンサ本体１９を構成し、このセンサ本体１
９をハウジング２０内に収設してなる圧電型セン
サ。 A pair of positive and negative electrodes 2 and 3 are provided on one surface of the piezoelectric material 1, a neutral electrode 4 is provided on the other surface of the piezoelectric material 1, and a backing material 5 is provided on the surface of the neutral electrode 4 to form a sensor element 7.
A support ring 8 is adhered to the surface of this backing material 5, and an impedance converting section is attached to an insulating plate 9.
A hybrid circuit 10 consisting of a low-frequency signal removal section and an amplification section is formed, and connecting materials 13 and 14 made of conductive elastic material are crimped between the input ends 11 and 12 of this hybrid circuit 10 and the positive and negative electrodes 2 and 3, respectively. At the same time, a cable 18 is connected to the output end 15, power supply end 16, and ground end 17 of the hybrid circuit 10 to constitute a sensor body 19.
9 is housed in a housing 20.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6581586U JPH052859Y2 (en) | 1986-04-28 | 1986-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6581586U JPH052859Y2 (en) | 1986-04-28 | 1986-04-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62176720U JPS62176720U (en) | 1987-11-10 |
| JPH052859Y2 true JPH052859Y2 (en) | 1993-01-25 |
Family
ID=30903238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6581586U Expired - Lifetime JPH052859Y2 (en) | 1986-04-28 | 1986-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH052859Y2 (en) |
-
1986
- 1986-04-28 JP JP6581586U patent/JPH052859Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62176720U (en) | 1987-11-10 |
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