JPH05259217A - Interlayer substrate for mounting circuit part and manufacture thereof - Google Patents

Abstract

PURPOSE:To make it possible to perform a flip chip mounting with a high reliability and effect a shield effect and an impedance matching to an electrical noise by installing an electrode layer which can be electrically grounded in the circumference of a connecting terminal. CONSTITUTION:An insular electrode 3 having a second insulating base material 2 is provided on its surface of the corresponding place in which a terminal 5 for mounting circuit parts is formed on one side of a first insulating base material 1. The connecting terminal 5 for circuit parts whose one end is electrically connected to the insular electrode 3 and whose other end extends through the first insulating base material 1 and protrudes to the outside is installed. Further, another connecting terminal for circuit parts whose one end is electrically connected to the insular electrode 3 and whose other end extends through the second insulating base material 2 and protrudes to the outside is disposed. An electrode layer 11 capable of an electrically independent ground to the insular electrode 3 is provided in the circumference of the insular electrode 3. In the connecting terminal, a ring projecting part can be formed in its circumference or a spherical bump structure can be formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of flip-chip mounting a circuit component such as an IC on a circuit wiring board using solder bumps or the like, in order to improve the bonding reliability of the bump and the circuit component and the circuit. The present invention relates to an intermediate substrate for mounting circuit components mounted between the substrate and the substrate and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, the area of IC has been increased and the number of electrodes has been increased.
Along with the increase in density, a difference in thermal expansion coefficient between a circuit component such as an IC chip and a circuit board causes strain in the bump portion, which causes wire breakage or the like in an extreme case, which adversely affects connection reliability.
For such a problem, a method of increasing the height of the bump by means of disposing the circuit component mounting intermediate substrate of this type between the circuit component and the circuit substrate is effective.

Various conventional structures for such an intermediate substrate with terminals for connecting circuit parts have been proposed. For example, an insulating material as disclosed in Japanese Patent Laid-Open No. 60-123093 has a diameter of 0.1 mm. A conductive pin of about 0.2 mm is embedded so as to project from the insulating material, and a hole is provided at a predetermined position of the insulating film as in JP-A-1-72537, and the hole is formed in this hole. A certain amount of
There is one in which the solder paste is held by the printing means. Furthermore,
As shown in JP-A-62-18049, a through hole is formed in a ceramic green sheet and fired, and a copper paste having wettability to solder is inserted into the through hole. Then, a non-wettable tungsten paste or the like is inserted on the copper layer and baked, and then a wettable copper paste or the like is inserted on the tungsten layer and baked. In addition, there is a method of melting and joining a solder ball to the copper portion on the upper surface.

[0004]

In such an intermediate substrate for mounting circuit components, when the wiring density of the IC chip is further increased and the diameter of the solder bump is also reduced accordingly, a high-definition connection terminal is provided. It becomes difficult to manufacture the circuit component mounting intermediate substrate. In addition, it is difficult to align the electrodes of the IC chip with the connection terminals of the circuit component mounting intermediate substrate.

On the other hand, in mounting an IC chip, which will be further speeded up in the future, the distance between the element electrode and the circuit board should be as short as possible, but on the other hand, the viewpoint of improving the bump strength as described above. Therefore, since it is necessary to increase the bump height, there is a demand for a method of mounting a circuit component such as an IC chip that can be applied to a high speed IC while suitably increasing the bump strength. However, the preceding examples do not provide any solution to these problems.

[0006]

SUMMARY OF THE INVENTION According to the present invention, when a circuit component such as an IC chip is mounted on a circuit board, a connection terminal on a circuit component mounting intermediate substrate of this type disposed between them is improved. The density of the connection terminals can be increased, and the height of the connection terminals can be suitably increased, and the strength of the connection terminals can be ensured by providing a reinforcing member to these connection terminals, and high-density and highly reliable flip chip mounting can be achieved. An intermediate substrate for mounting circuit components, which enables the shield effect and impedance matching against electrical noise by providing an electrode layer that can be electrically grounded around the connection terminal, and a suitable manufacturing method thereof. Is provided.

Therefore, in the circuit component mounting intermediate substrate of the present invention, the second insulating base is formed on the surface of the corresponding portion of the first insulating base material where the circuit component mounting terminal is formed. For connecting to an island electrode having a base material, one end of which is electrically connected to the base electrode and the other end of which penetrates the first insulating base material and projects to the outside. And a terminal for electrically connecting one end to the island electrode and the other end for penetrating the second insulating base material and projecting to the outside. In the periphery of the island-shaped electrode, a groundable electrode layer electrically independent of the island-shaped electrode is provided.

Here, the connection terminal may be configured to have a ring-shaped ridge on its peripheral portion or a spherical bump structure.

As a method for manufacturing such an intermediate substrate for mounting circuit components, a first insulating base material is formed on one surface of the electrode layer and the other surface of the electrode layer is formed. A second insulating base material is formed on each of the first and second insulating base materials, and a metal mask is formed on the surface of each of the first and second insulating base materials at the corresponding locations. Irradiation of an excimer laser from the surface of the metal mask is performed to form conductive holes reaching the electrode layers from the respective holes, in the first and second insulating base materials, respectively, and then, the metal of both the metal layers is formed. The mask is removed, and one end of each of the conductive holes is electrically joined to the electrode layer and the other end of the circuit component is projected outside the first and second insulating base materials. Connection terminals for each of them are formed, and the surface of each connection terminal is corrosion resistant. A layer is formed, and an excimer laser is partially irradiated from the one insulating base material side to expose the electrode layer in a groove shape in the peripheral portion of the connecting terminal, and then an etching treatment is performed. Each step of forming an island-shaped electrode and an electrode layer electrically independent of the island-shaped electrode by removing the groove-shaped exposed portion of the electrode layer to form a groove for electrode separation can be adopted.

On the other hand, as another method, the first insulating base material is formed on one surface of the electrode layer and the second insulating base material is formed on the other surface of the electrode layer. The surface of the first insulating base material is formed with an island-shaped metal mask in which holes are formed at corresponding positions, and the surface of the second insulating base material corresponds to the holes. Another metal mask having holes formed at the positions is formed, and an excimer laser is irradiated from the surfaces of both of these metal masks to form the conduction holes reaching the electrode layer from the respective hole portions. Of the insulating base material, and then the other metal masks are removed while leaving the island-shaped metal mask, and one end of each of the conduction holes is electrically bonded to the electrode layer. And the other end of which protrudes outside the first and second insulating base materials. To form a corrosion-resistant metal layer on the surface of each connection terminal, and partially irradiate the excimer laser from the one insulating base material side. After exposing the electrode layer in the shape of a groove in the peripheral portion of the connection terminal, etching is performed to remove the portion of the electrode layer exposed in the shape of a groove to form an electrode separation groove, thereby forming an island electrode. It is also preferable to adopt each step of forming an electrode layer electrically independent of this island-shaped electrode.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be further described below with reference to the illustrated embodiments. In FIGS. 1 and 2, reference numeral 1 denotes a first insulating base material such as polyimide and the like. Similarly, an island-shaped electrode 3 made of copper foil or the like having a second insulating base material 2 made of polyimide or the like is formed. These two insulating base materials 1 and 2 have holes 4 for conduction at corresponding positions.
And 4A are formed, and the conduction holes 4, 4A are further formed.
One end is electrically connected to the island-shaped electrode 3 and the other end is made of copper plating or the like for a circuit component penetrating the insulating base materials 1 and 2 and protruding to the outside. The terminals 5 and 5A are formed so as to have plating layers 6 and 6A made of corrosion-resistant metal such as gold on their surfaces. These connecting terminals 5 and 5A are configured to have a ring-shaped raised portion in the peripheral portion thereof as shown in the drawing. In addition, an electrode layer 11 electrically independent of the island electrode 3 is provided around the island electrode 3 through an electrode separation groove 12 formed in an annular shape, and the electrode layer 11 is appropriately grounded. It is grounded as shown in FIG.

FIG. 3 shows another embodiment of the present invention. In the case of this embodiment, the connecting terminals projecting to the outside of the insulating base material 1 are constituted by spherical solder bumps 7. In this embodiment, an island-shaped metal mask 8 is provided at the upper end of the conduction hole 4, and the connection terminal 5 is provided with the metal mask 8.

In the above structure, the island-shaped electrode 3 acts to prevent the corrosion of these terminals when forming the connecting terminals 5 and 5A and when mounting the circuit parts, and
The second insulating base material 2 increases the height of the connecting terminal 5. The island-shaped metal mask 8 acts to stabilize the diameter of each connection terminal 5 formed by plating.

4 (1) to 4 (6) show manufacturing process diagrams of the circuit component mounting intermediate substrate shown in FIG. First, as shown in FIG. 1 (1), a first insulating base material 1 made of polyimide or the like is formed on one surface of an electrode layer 3 such as a copper foil, and the same polyimide layer is formed on the other surface of the electrode layer 3. A second insulating base material 2 made of, for example, is formed. Then, on the surfaces of these two insulating base materials 1 and 2, holes 1 are formed at corresponding positions.
Metal masks 9 and 9A provided with 0 and 10A are formed. As a means for that, for example, a polyimide single-sided non-adhesive copper-clad board is adhesively formed on one surface of the polyimide double-sided non-adhesive copper-clad board, and the ordinary photo-etching treatment is applied to the copper foils on both surfaces. The above hole 1 at the corresponding location
0A and 10A can be formed separately.

Next, as shown in FIG. 2B, the excimer lasers A1 and A2 are irradiated from the surfaces of the metal masks 9 and 9A so that the insulating bases located at the holes 10 and 10A, respectively. Conductive holes 4 and 4A for forming connection terminals of circuit components described later are ablated in the portions of the metal members 1 and 2 to partially expose both surfaces of the electrode layer 3.

Therefore, as shown in FIG. 3C, at the stage where the upper and lower metal masks 9 and 9A are removed by etching, as shown in FIG. The connecting terminals 5 and 5A for the circuit parts, which are electrically joined to the electrode layer 3 and have the other ends protruding toward the outside of the insulating base materials 1 and 2, are formed by plating means. By the process of forming the connecting terminals 5 and 5A by the plating means, the peripheral portions of the connecting terminals 5 and 5A are formed into a ring-shaped protruding shape. And these connection terminals 5,
The surface of 5A is then separately coated with plating layers 6 and 6A made of a corrosion-resistant metal such as gold. Next, as shown in FIG. 5 (5), the excimer laser A3 is placed with the separate metal mask 13 having a hole formed larger than the diameter of the connecting terminal 5 on the upper side of the insulating base material 2. When irradiated, the insulating base material 2 is formed in a ring shape or in an island shape in a portion located on the outer peripheral portion of the connecting terminal 5 which is raised in a ring shape, leaving an unnecessary portion of the insulating base material. Since 2 is ablated and removed in the shape of an annular groove, the electrode layer 3 is annularly exposed in the region where the insulating base material 2 is removed. Therefore, the unnecessary exposed region of the electrode layer 3 is removed by etching means to form the electrode separation groove 12,
As shown in FIG. 6 (6), a desired island-shaped electrode 3 and an electrode layer 11 electrically independent of the island-shaped electrode 3 and the electrode separating groove 12 can be formed. An intermediate substrate for mounting circuit components as shown in FIG. 2 can be obtained.

In the above, in the step of forming the connecting terminals 5 and 5A by the plating means, the connecting terminals 5 protruding outside the insulating base material 1 are changed by changing the plating conditions.
It is also possible to form the shape of A into a spherical solder bump 7 as shown in FIG.

5 (1) to 5 (6) are manufacturing process drawings for manufacturing a product having a structure similar to that of FIG. 3, and in these drawings, the same reference numerals as those in the above manufacturing process drawings are the same. 4 shows a member, which is formed with a ring-shaped or island-shaped metal mask 8 at the periphery of the upper end in the conduction hole 4 of the second insulating base material 2 in the step (3) of FIG. There is a feature in doing it. That is, as shown in FIG. 5A, first, a ring-shaped or island-shaped metal mask 8 having a hole 10 at a position corresponding to the hole 10A of the metal mask 9A is formed on the upper surface of the second insulating base material 2. Then, as shown in FIG. 2B, a separate metal mask 14 is placed on top of the island-shaped metal mask 8 in such a manner that the holes 10 formed in the island-shaped metal mask 8 are not blocked. Then, the excimer lasers A1 and A2 are irradiated from both sides of the metal masks 14 and 9A to form the holes 4 and 4A for conduction in the insulating base materials 1 and 2 as described above. Then, the separate metal mask 14 is removed to remove the insulating base material 1.
By etching away only the metal mask 9A on the side, the island-shaped metal mask 8 can be left around the upper end of the conduction hole 4 of the insulating base material 2 as shown in FIG. Therefore, hereinafter, by performing the same processing as the steps shown in (4) to (6) of FIG. 4 as shown in (4) to (6) of FIG.
A product having the island-shaped metal mask 8 on the connection terminal 5 side can be obtained.

[0019]

According to the circuit component mounting intermediate substrate and the method of manufacturing the same according to the present invention, since it is possible to partially provide an insulating base material on a part of the connecting terminal, the partial insulation can be achieved. The base material can effectively increase the height of the connection terminal.

Further, according to the structure in which the connecting terminal is provided with the island-shaped metal mask, the peripheral portion of the connecting terminal can be effectively reinforced.

Since the island-shaped electrode can be interposed between the connection terminals protruding in the vertical direction, the connection terminals as bumps having extremely high connection reliability can be constructed. Further, since the groundable electrode layer electrically independent of the island-shaped electrode can be provided in the peripheral portion of the island-shaped electrode, a shield effect against electrical noise and impedance matching can be achieved.

Further, according to the manufacturing method using the photoablation process of the present invention, it has a large area and high-density electrode arrangement, and has high connection reliability when mounting circuit components such as high-speed IC chips on a circuit board. It is possible to stably manufacture an intermediate substrate for mounting circuit components with extremely high precision and good operation reliability.

[Brief description of drawings]

FIG. 1 is a conceptual cross-sectional configuration diagram of essential parts of an intermediate substrate for mounting circuit components, which is configured according to an embodiment of the present invention.

2 is an enlarged perspective cross-sectional configuration diagram of a conceptual main part of the circuit component mounting intermediate substrate of FIG.

FIG. 3 is a conceptual diagram of an intermediate substrate for mounting circuit components, which has an island-shaped metal mask on one connecting terminal and is formed with solder bumps on the other connecting terminal according to another embodiment of the present invention. Enlarged cross-sectional configuration diagram of essential parts

4 (1) to 4 (6) are manufacturing process diagrams of an intermediate substrate for mounting circuit components according to an example of the present invention.

5 (1) to (6) are similar manufacturing process diagrams of an intermediate substrate for mounting circuit components according to another example of the present invention.

[Explanation of symbols]

 1 First Insulating Base Material 2 Second Insulating Base Material 3 Island Electrode 4 Conduction Hole 5 Connection Terminal 6 Plating Layer 7 Solder Bump 8 Island Metal Mask 9 Metal Mask 10 Hole 11 Electrode Layer 12 Electrode Separation Groove 13 Separate Metal Mask 14 Separate Metal Mask

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[Procedure amendment]

[Submission date] March 1, 1993

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Correction target item name] All drawings

[Correction method] Change

[Correction content]

[Figure 1]

[Fig. 2]

[Figure 3]

[Figure 4]

[Figure 5]

Claims (7)

[Claims] 1. An island-shaped electrode having a second insulating base material on the surface thereof is provided at a corresponding portion on one surface of the first insulating base material where a terminal for mounting a circuit component is formed. One end is electrically connected to the electrode and the other end is the first insulating base.
A connecting terminal for a circuit component that penetrates through the base material and projects to the outside, and has one end electrically connected to the island electrode and the other end penetrating the second insulating base material. And other connecting terminals for a circuit component projecting to the outside, and an electrode layer electrically independent of the island electrode in the periphery of the island electrode. Intermediate board. 2. The circuit component mounting intermediate substrate according to claim 1, wherein the electrode layer electrically independent of the island-shaped electrodes is configured to be electrically groundable. 3. The connection terminal for a circuit component, which is formed by penetrating at least one of the insulating base materials, is configured to have a ring-shaped ridge on its peripheral edge. Intermediate board for mounting circuit components of 2. 4. The connection terminal for a circuit component formed by penetrating at least one of the insulating base materials has an island-shaped or ring-shaped metal mask at its upper end portion. An intermediate board for mounting circuit components according to any one of 3 above. 5. The connection terminal for a circuit component formed by penetrating at least the one insulating base material is configured to have a spherical bump structure. An intermediate board for mounting circuit components. 6. A first insulating base material is formed on one surface of the electrode layer, and a second insulating base material is formed on the other surface of the electrode layer. And the second insulating base
On the surface of the metal material, metal masks having holes are formed at corresponding positions, and excimer lasers are radiated from the surfaces of both metal masks so as to reach the electrode layer through the holes. Is formed on each of the first and second insulating base materials, then both metal masks are removed, and one end of each of the conductive holes is electrically joined to the electrode layer. Form the connection terminals for the circuit parts, the other end of which protrudes outside the first and second insulating base materials, and form a corrosion-resistant metal layer on the surface of each connection terminal. Then, the excimer laser is partially irradiated from the one insulating base material side to expose the electrode layer in the groove shape in the peripheral portion of the connecting terminal, and then the groove is formed by etching treatment. By removing the exposed portion of the electrode layer, a groove for electrode separation is formed. Island electrode and preparation of the intermediate substrate circuit component mounting including the island-shaped electrode and electrically independent each step of forming an electrode layer by. 7. The first insulating base material is formed on one surface of the electrode layer, and the second insulating base material is formed on the other surface of the electrode layer. On the surface of the insulating base material, an island-shaped metal mask having holes formed at corresponding positions was formed, and on the surface of the second insulating base material, holes were formed at positions corresponding to the holes. Forming another metal mask,
Irradiation of an excimer laser from both of these metal mask surfaces to form conduction holes reaching the electrode layer from the respective hole portions in the first and second insulating base materials, respectively, and then in the above The other metal mask is removed while leaving the island-shaped metal mask, and one end of each of the conduction holes is electrically joined to the electrode layer and the other end is insulated from the first and second insulating layers. Connecting terminals for circuit parts protruding to the outside of the base material are formed respectively, and a corrosion-resistant metal layer is formed on the surface of each connecting terminal.
After partially irradiating the excimer laser from the side of the metal material to expose the electrode layer in a groove shape in the peripheral portion of the connection terminal,
The method includes an island-shaped electrode and each step of forming an electrode layer electrically isolated from the island-shaped electrode by forming a groove for electrode separation by removing a portion of the electrode layer exposed in the groove shape by etching. Manufacturing method of intermediate board for mounting circuit parts.