JPH05201164A - Screen printing plate for printing wiring board - Google Patents

Abstract

PURPOSE:To obtain a screen printing plate for a printed wiring board capable of printing and forming a wiring pattern, which is far more minute than in a case when a base material mesh sheet is used. CONSTITUTION:A material to be plated is plated in two layers and peeled in a plate, dot-shaped openings 3 as positions, where plating is not attached in conformity with a wiring pattern to be acquired, are formed to a precedingly form plated layer 1 while a continuous slit 4 as a position, where plating is not attached in conformity with the wiring pattern to be obtained, is shaped to a subsequently formed plated layer 2, and the subsequently formed plated layer 2 is fast stuck to a printed wiring board P and screen printing is conducted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a screen printing plate for a printed wiring board formed by a plating method.

[0002]

2. Description of the Related Art A conventional screen printing plate for a printed wiring board is a circuit portion formed by coating a photosensitive film on a base material mesh sheet (flat mesh) made of resin or nickel and exposing and developing original films. Was formed by forming a resist image.

[0003]

In the conventional screen printing plate for a printed wiring board, there is a limit in reducing the pattern width due to the relationship with the aperture ratio of the base material mesh sheet (in the case of one pin between the pins). , Conductor width 0.35mm, if there are 2 pins, conductor width 0.20mm, conductor spacing 0.20m
m). However, the recent technical trend is that it is possible to form a fine pattern with a high density of about 3 or more between the pins by a printing method.

The present invention has been devised in view of the above-mentioned points, and provides a screen printing plate for a printed wiring board, which can form a much finer wiring pattern by printing as compared with the case where a base material mesh sheet is used. The purpose is to

[0005]

As a means for solving the above-mentioned problems, the present invention is a plate which is a two-layer plated and peeled plate of a material Z to be plated, and which is a plated layer 1 previously formed. Alternatively, a dot-shaped opening 3 which is a portion to which plating does not adhere is formed in the plating layer formed later in conformity with the wiring pattern to be obtained, and the plating layer 2 formed later or previously formed. The plated layer is
A continuous slit 4 which is a place where plating does not adhere is formed in conformity with the wiring pattern to be obtained, and the plating layer 2 having the continuous slit 4 is closely attached to the printed wiring board P to perform screen printing. It is characterized by being adapted to do.

[0006]

In the screen printing plate for a printed wiring board, only the plating layer 1 having the dot-shaped openings 3 corresponding to the wiring pattern to be obtained and where the plating does not adhere does not cause the plate to be printed at the wiring pattern. It is connected and can be peeled off from the material Z to be plated, but the printed wiring pattern is intermittent, and the continuous slit 4 which is a place where plating does not adhere in conformity with the wiring pattern to be obtained. With the formed plating layer 2 alone, it is possible to prevent the plate from being divided when peeled from the material Z to be plated.
The two layers are complementary to each other. When the plating layer 2 formed later is brought into close contact with the printed wiring board P, the continuous slits 4 where the plating does not adhere become a passage-like space in contact with the printed wiring board P, and the plating layer 1 formed earlier is the passage. The dot-shaped opening 3 which is the ceiling of the hollow space and is a portion where the plating is not attached to the plated layer 1 is separated from the printed wiring board P and serves as a supply port of the conductive paste D. The conductive paste D is dropped onto one end of the upper surface of the plating layer 1 serving as an upper layer, and the conductive paste D is squeezed with a squeegee S.
Is scratched and moved to the other end of the upper surface of the plating layer. Then, the conductive paste D flows in from the dot-shaped openings 3 where the plating does not adhere and fills the continuous slits 4 where the plating does not adhere. Then, when the screen printing plate is rolled up, the conductive paste D in the slits 4 and the dot-shaped openings 3 is printed.
And screen printed. The conductive paste D adhered to the printed wiring board P does not have a discontinuous portion corresponding to the wiring pattern to be obtained. In addition, the conductive paste D in the dot-shaped opening 3 is the printed wiring board P.
After the transition to, the surface is flattened by the surface tension.

[0007]

EXAMPLE A first example of a screen printing plate for a printed wiring board according to the present invention will be described with reference to FIG. The screen printing plate for a printed wiring board of the present embodiment is, as shown in FIG. 1 (a), a plating plate which is two-layer plated on a material Z to be plated and peeled off. Is formed with a dot-shaped opening 3 which is a portion where plating does not adhere in conformity with the wiring pattern to be obtained,
A continuous slit 4 which is a place where plating does not adhere is formed in the plating layer 2 formed later so as to correspond to the wiring pattern to be obtained, and is formed later as shown in FIG. 1 (b). The plated layer 2 is adhered to the printed wiring board P, and the conductive paste D is dropped and the conductive paste D is scratched and moved by the squeegee S to the other end of the upper surface of the plated layer as shown in FIG. 1C. , Conductive paste D
Of the conductive paste D in the slits 4 and in the dot-shaped openings 3 by rolling up the screen printing plate. ), The printed wiring board P
Screen printing. The dot-shaped openings 3 in this embodiment are squares each side of which is 25 microns, and are formed in three rows with a connecting portion having a width of 10 microns, and the continuous slits 4 have a width of 105 microns. ..

Next, a method of manufacturing the screen printing plate for a printed wiring board of the first embodiment will be described with reference to FIG. First, as shown in FIG. 2A, a material Z to be plated (stainless steel roll or plate, or a copper roll treated with an oxide film or an organic film) having a surface texture to which electroplating adheres and can be peeled off. Alternatively, a plate) is coated with a photosensitive film M, and a laser exposure device (not shown) scans and exposes the laser light L. This laser exposure exposes only a portion corresponding to the dot-shaped opening 3 shown in FIG. Therefore, when development is performed, a resist N is formed as shown in FIG. This resist N corresponds completely to the dot-shaped opening 3 shown in FIG. Then, FIG.
As shown in (c), plating with a thickness of about 15 microns 1
(Nickel plating, nickel alloy plating, copper plating or copper alloy plating). Then, as shown in FIG. 2 (d), the plating layer 1 is subjected to resist peeling so that the plating layer 1 as an upper layer in FIG. 1 (b) can be deposited in conformity with the wiring pattern to be obtained. This is a plating layer in which the dot-shaped openings 3 that are not to be formed are formed. Then, as shown in FIG. 2E, the entire surface of the photosensitive film M is coated again, and the laser light L is scanned and exposed by a laser exposure device (not shown). This laser exposure exposes only the continuous slit 4 portion shown in FIG. Therefore, when the development is performed, the resist N shown in FIG. 2F is formed. This resist N is shown in FIG.
It corresponds to the continuous slit 4 shown in FIG. Subsequently, as shown in FIG. 2G, a plating 2 having a thickness of about 20 μm (which is the same as the lower layer) is applied. The plating layer 2 formed after this is the same as that shown in FIG.
By performing the resist peeling as shown in (h), a plating layer 2 (a plating layer having continuous slits 4 corresponding to the wiring pattern to be obtained) which is the lower layer in FIG. Become. Therefore, the plating layer 2 formed later is integrated with the plating layer 1 formed earlier and is not divided at the wiring pattern. Subsequently, the plating plate formed by double-layer plating on the material Z to be plated is peeled off, and the top and bottom are turned upside down so that the plating layer 2 plated later is on the lower side.

FIG. 3 shows that a roll R is used for the material Z to be plated and a laser beam L is irradiated. Note that the original films may be overlapped and UV rays may be irradiated instead of using the laser exposure device.

Next, a manufacturing method for forming the screen printing plate for a printed wiring board of the present invention by plating the material Z to be plated with the roll R will be described with reference to FIG. First, as shown in FIG. 4 (a), a resin film J1 on which no plating adheres is formed on both edges of the roll R, and a belt-shaped resin film J2 on which no plating adheres is formed in the roll surface length direction. Metal tape T with plating on the edge of membrane J2
Is attached and double-layered by the method shown in FIG. 2 to form a cylindrical plating 6 having a screen printing plate portion 6a for a printed wiring board (corresponding to the plating layers 1 and 2 in FIG. 1B). Then, the metal tape T is rolled up to form the cylindrical plating 6
Creates an opportunity to peel off. Next, as shown in FIG. 4B, the double-sided adhesive tape E is attached to the four corners of the cylindrical plating 6. Subsequently, as shown in FIG. 4C, the metal tape T attached to the roll R is brought into contact with one frame side of the rectangular underframe device B of a required size whose frame side length is variable. Since then
The roll R and the underframe device B are brought into relative rolling contact with each other, and the cylindrical plating 6 is peeled from the roll R by the action of the double-sided adhesive tape E, and stuck to the underframe device B in a planar manner. Next, as shown in FIG. 4 (d), the plated film 6'which is developed in a plane is fixed to the underframe device B by the clamp B1 and the vertical and horizontal frame sides of the underframe are increased to be tensioned. Next, as shown in FIG. 4 (e), a plate underframe H having an adhesive K applied to the plate adhering surface is brought into close contact with the plate from the lower side, and after the adhesive is dried to dry, the plate underframe H of the plated film 6'which has been flattened The margin 6 "around the edge of the plate is cut off with a cutter C. The plate underframe H must be extremely accurately aligned and brought into close contact with the screen printing plate portion for the printed wiring board. And, as shown in FIG. Then, the plate frame H, to which the screen printing plate for a printed wiring board is attached in a tension state, is turned upside down, mounted on a screen printing machine (not shown), and the conductive paste D is used to screen print on the printed wiring board P.

FIG. 5 is a cross-sectional view of essential parts showing a screen printing plate for a printed wiring board according to a second embodiment of the present invention.
This screen printing plate for a printed wiring board is shown in FIG.
As shown in FIG. 3, the plate Z is plated with two layers, and the plated layer 1 (upper layer in the figure) formed earlier has a pattern width that is aligned with the center of the wiring pattern to be obtained. And a continuous slit 4 which is a place where plating does not adhere is formed, and a recessed strip portion which fills the slit 4 and replaces the slit 4 is formed in a plating layer 2 (lower layer in the figure) formed later. 5 is formed, and the dot-shaped opening 3 which is a portion where plating does not adhere to the concave streak portion 5 is formed. The dot-shaped opening 3 is separated from the material Z to be plated and is formed later as shown in FIG. 5B. The plated layer 2 is closely attached to the printed wiring board P for screen printing.

[0012]

As described above, according to the screen printing plate for a printed wiring board of the present invention, a dot-shaped opening which is a portion where plating does not adhere is formed in conformity with the wiring pattern to be obtained. With the plating layer alone, the plate is connected even at the wiring pattern location and can be peeled from the material to be plated, but the printed wiring pattern will be intermittent, and the plating will match the wiring pattern to be obtained. In the plating layer formed with continuous slits, which is the place where no adheres, the fact that the plate is divided when peeled from the material to be plated is complemented by two-layer plating, and the plating layer of the upper layer When the conductive paste is dropped on one end of the upper surface and the conductive paste is scratched and moved to the other end of the upper surface of the plating layer with a squeegee, the conductive paste is The conductive paste that flows in through the dot-shaped openings where the plating does not adhere and fills the continuous slits where the plating does not adhere and adheres to the printed wiring board matches the wiring pattern to be obtained. Intermittent locations do not occur, and the conductive paste in the dot-shaped opening is flattened by surface tension after being transferred to the printed wiring board. In addition, it is possible to print and form a very fine pattern.

[Brief description of drawings]

FIG. 1A is an enlarged front view of an essential part of a screen printing plate for a printed wiring board according to a first embodiment of the present invention, and FIGS. 1B to 1D are essential parts of the screen printing plate for a printed wiring board. FIG. 5 is a process diagram of forming a cross-sectional view and printing using a conductive paste.

FIG. 2 is a manufacturing process diagram of a screen printing plate for a printed wiring board according to the first embodiment of the present invention.

FIG. 3 is a schematic perspective view of a roll coated with a photosensitive film according to an exemplary embodiment of the present invention during laser exposure.

FIG. 4 is a manufacturing process diagram when a roll is used as the material to be plated according to the embodiment of the present invention.

FIG. 5 is a sectional view showing the principal part of a screen printing plate for a printed wiring board according to a second embodiment of the present invention, which is a process drawing of printing using a conductive paste.

[Explanation of symbols]

 P Printed wiring board Z Material to be plated 1 Plated layer formed first 2 Plated layer formed after 3 3 Dot-shaped opening 4 Continuous slit

Claims (1)

[Claims] 1. A plate which is two-layer plated on a material to be plated and is peeled off, and the plated layer formed earlier or the plated layer formed later is plated in conformity with the wiring pattern to be obtained. In addition to the dot-shaped openings where the plating does not adhere, the plating layer that is formed later or the plating layer that was formed earlier should be formed in a place where the plating does not adhere to the wiring pattern to be obtained. A screen printing plate for a printed wiring board, wherein certain continuous slits are formed, and a plating layer having the continuous slits formed thereon is brought into close contact with a printed wiring board for screen printing.