JPH05190310A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To accurately provide low resistance of the specific value or lower than the specific value for a thick film hybrid integrated circuit. CONSTITUTION:For a conductor resistance pattern 13 for a first conductor 11, a distance which allows the required resistance value is calculated by a board lot. Two points in the conductor resistance pattern 13 or the conductor resistance pattern 13 and a second conductor 12 are connected, for example, by bonding a conductor line 14 made of Au or Al so as to bypass the distance.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thick film hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device capable of accurately obtaining a low resistance value.

[0002]

2. Description of the Related Art In a thick film hybrid integrated circuit device, as a method of accurately obtaining a resistance value, a thick film printing resistor 5 connected between conductor patterns 1 and 2 is patterned by using a laser or the like as shown in FIG. There is known a technique in which the laser cut portion 6 is formed by removing a part of the above, and the resistance value is adjusted to a desired value. Although this is called trimming, it is easy to obtain a resistance value within 1% accuracy by this method, but it is used only for correction to a high resistance value by minimizing the resistance value of the thick film printing resistor 5 before correction. It is a technique.

However, when trying to obtain a low resistance value, the pattern area of the thick film printed resistor 5 is greatly increased and the device becomes large. Therefore, it is practically used only up to about 1Ω. On the other hand, when a lower resistance value is required, the conductor pattern is generally used as the resistance.

[0004]

As described above, when the low resistance is formed by the thick film printing resistance, it can be practically formed only up to about 1Ω. However, if you want to limit the current to several amps in a power supply circuit, etc.
Often a low resistance of mΩ is required. In this case, a conductor resistance using a conductor pattern is used. However, in the case of conductor resistance, the accuracy is about ± 40%, but when trimming like thick film resistance, there is a danger that the resistance value of the laser cut part may change due to aging, so the resistance value There is a problem that it cannot be adjusted. Therefore, there is a problem that it cannot be used in a circuit that requires precision in practical use.

An object of the present invention is to provide a hybrid integrated circuit device which can accurately obtain low resistance without increasing the area of the conductor resistance pattern.

[0006]

A hybrid integrated circuit device according to the present invention includes a first conductor portion, a second conductor portion provided apart from the first conductor portion, the first and second conductor portions. In a hybrid integrated circuit device in which the resistance between the second conductor portions is formed by using a conductor resistance pattern, a resistance value decrease adjusting means connected to a part of the conductor resistance pattern and having a lower resistance than the conductor resistance pattern. It consists of

[0007]

When the resistance value between a plurality of conductor portions separated from each other is formed by using the conductor resistance pattern, a resistance such as a conductive wire is provided between two points inside the conductor resistance pattern or between the conductor resistance pattern and another conductor portion. By connecting with the value reduction adjusting means, it is possible to accurately adjust to a low resistance value without increasing the area of the conductor resistance pattern.

[0008]

The present invention will be described below with reference to the drawings. Figure 1
FIG. 3 is a diagram showing the structure of the first embodiment, and FIG. 2 is a diagram for explaining adjusting the conductor resistance value by changing the bonding distance. In FIG. 1, the conductor resistance pattern 1 is drawn out from the first conductor portion 11 and connected to the second conductor portion 12.
3 is used as a conductor resistance. The conductor resistance value has a variation of about ± 40% due to manufacturing variations when the conductor resistance pattern is printed and fired on the substrate. However, the variation within the same substrate lot can be suppressed within several percent, and the present invention utilizes this property.

That is, the conductor resistance value for the length X0 is confirmed for each same substrate lot, and the distance (X0-X1) indicating the required resistance value is obtained. And the conductor resistance pattern 13
Inside, the conductive wire 14 made of Au or Al is connected by bonding for a distance X1. In this way, the resistance value of AgPd or AgPt used as the conductor resistance pattern in the thick film hybrid integrated circuit device is set to this distance X
It can be extremely lowered between 1 and can be regarded as almost 0Ω. In other words, the conductive wire forms a bypass path for the current, and only the remaining conductor resistance pattern portion of the distance X0-X1 contributes as the conductor resistance.

In this way, FIG. 2 (A), (B),
The conductor resistance value is adjusted by changing the inter-bonding distance so that a desired conductor resistance value can be obtained for each substrate lot as shown in (C). Here, if the length X0 of the conductor resistance pattern 13 is set to 2 mm or more, the resistance value deviation due to the position deviation of the conductive wire 14 can be suppressed to about 5%, and the resistance value variation among the substrates is taken into consideration. It is possible to realize low resistance with an accuracy of ± 10%.

Next, FIG. 3 is a diagram showing the structure of the second embodiment, and FIG. 4 is a diagram for explaining adjusting the conductor resistance value by changing the bonding position. In FIG. 3, the conductor resistance pattern 13 drawn out from the first conductor portion 11 has a structure that is patternwise separated from the second conductor portion 12.
The adjustment of the resistance value of the conductor resistance pattern 13 is performed by confirming the resistance value with respect to the length X0 for each lot of the same substrate as in the first embodiment, and displaying the necessary resistance value (X0-X).
1) is obtained, and this position and the second conductor portion 12 are connected by a conductive wire 14 of Au or Al.

That is, as shown in FIGS. 4A, 4B and 4C, the conductor resistance value is changed by changing the bonding position in the conductor resistance pattern 13 so that a desired resistance value can be obtained for each substrate lot. Adjust.

According to this embodiment, as in the first embodiment,
An accuracy of 10% can be obtained. Further, since the conductor resistance pattern 13 and the second conductor portion 12 are separated as a pattern, another pattern can be arranged between them and the degree of freedom in design can be increased. Further, FIG. 5 is a diagram showing a third embodiment, in which a thick film printed resistor 15 of about 1Ω is connected in parallel to the conductor resistance pattern 13 as compared with the second embodiment. Generally, the conductor resistance is often used as a current detection source, and the resistance value is 100 mΩ to 500 m.
Ω is often used.

In this region, the laser cut portion 16 by trimming the thick film printing resistor 15 causes + 10%.
The resistance value can be varied to some extent, the accuracy can be further improved as compared with the second embodiment, and the resistance value can be increased to about ± 5% with respect to the desired resistance value.

Although the conductive wire is used as the resistance value lowering adjusting means in each of the above embodiments, it is possible to use another member having a resistance value lower than that of the conductor resistance pattern instead of the conductive wire.

[0016]

According to the present invention, it is possible to obtain a conductor resistance pattern having a low resistance value, which has hitherto been limited to an accuracy of about ± 40%, to an accuracy of about ± 5% without increasing the area of the pattern. It has become possible. As a result, the effect that the circuit configuration is easy and the accuracy of the characteristic value is improved is obtained.

[Brief description of drawings]

FIG. 1 is an enlarged view of a main part of a first embodiment of the present invention.

2A, 2B, and 2C are views showing an example of adjusting the conductor resistance value by a bonding distance in the first embodiment according to the present invention shown in FIG. is there.

FIG. 3 is an enlarged view of a main part of the second embodiment of the present invention.

4 (A), (B), and (C) are diagrams showing an example of adjusting the conductor resistance value by a bonding distance in the second embodiment according to the present invention shown in FIG. is there.

FIG. 5 is an enlarged view of a main part of a third embodiment of the present invention.

FIG. 6 is a diagram for explaining a conventional resistance value adjustment.

[Explanation of symbols]

 11 ... 1st conductor part 12 ... 2nd conductor part 13 ... Conductor resistance pattern 14 ... Conductive wire 15 ... Thick film printing resistor 16 ... Laser cut part

Claims (5)

[Claims] 1. A first conductor portion, a second conductor portion provided apart from the first conductor portion, and a resistance between the first and second conductor portions are defined by a conductor resistance pattern. A hybrid integrated circuit device, which is formed by using the hybrid integrated circuit device, further comprising resistance value lowering adjusting means connected to a part of the conductor resistance pattern and having a resistance lower than that of the conductor resistance pattern. 2. One end of the conductor resistance pattern is the first
Of the conductor resistance pattern, the other end of the conductor resistance pattern is connected to the second conductor part, and the resistance value lowering adjusting means is a conductive wire having both ends connected to a part of the conductor resistance pattern. The hybrid integrated circuit device according to claim 1, wherein: 3. One end of the conductor resistance pattern is the first
2. The hybrid integrated circuit according to claim 1, wherein the resistance value lowering adjusting means is a conductive wire that is connected to the conductor portion and bridges between a part of the conductor resistance pattern and the second conductor portion. apparatus. 4. The hybrid integrated circuit device according to claim 3, wherein a thick film printed resistor is connected between the first conductor portion and the second conductor portion. 5. The thick film printing resistor has a resistance value adjusted by laser cutting.
A hybrid integrated circuit device as described.