JPH05183253A - Manufacturing process design device for printed wiring board - Google Patents

Abstract

PURPOSE:To provide a manufacturing process design device, which is capable of setting easily the manufacturing processes and manufacture specifications of different printed wiring boards according to a printed wiring board to be manufactured. CONSTITUTION:Design data is inputted in a design and manufacture data storage means (b) of a manufacturing process design device by a design data input means (a). A manufacturing process selecting means (c) selects manufacturing process data to conform with the design data from manufacturing process data, which is previously stored as manufacturing data and is in a state that it is branched into a plurality. A manufacture specification arithmetic means (d) selects manufacture specification data, which is used in the above selected manufacturing process data, from the design data and the manufacture data on the basis of the design data or operates the manufacture specification data from the design data and the manufacture data. These manufacturing process and manufacture specification data are outputted from a manufacture specification output means (e) in the form of a manufacturing process specification or the like.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a large number of types, and in the production of a printed wiring board which requires many changes in the manufacturing process for each type according to design requirements, the manufacturing process and manufacturing specifications of the printed wiring board. The present invention relates to a printed wiring board manufacturing process designing device for setting.

[0002]

2. Description of the Related Art Generally, a printed wiring board has a single-sided printed wiring board, a double-sided printed wiring board, a double-sided through-hole printed wiring board, depending on its structure, that is, the number of surfaces (layers) on which circuits (wiring patterns) are formed. Boards, multi-layer printed wiring boards and the like, and special ones include flexible printed wiring boards and flash printed wiring boards.

For manufacturing such a printed wiring board, for example, in the case of a multilayer printed wiring board having a wiring pattern of three layers or more, a wiring pattern made of copper foil is formed on a copper clad laminate for inner layer, and the inner layer copper clad laminate is formed. An inner layer step of manufacturing a substrate by laminating a plate and an outer layer copper clad laminate or a copper foil with a prepreg sandwiched between them, and forming a hole (through hole) through the front and back in the substrate to form a copper clad for the outer layer. A wiring pattern is formed on the laminated plate or copper foil, and the inner wall of the through hole is plated to electrically connect the wiring patterns of the respective layers,
It consists of an outer layer process that performs the necessary outer shape processing and surface treatment.

[0004]

By the way, when ordering and producing printed wiring boards for various electronic devices, the material, size, and number of layers of wiring patterns differ depending on the printed wiring board. The method of providing a wiring pattern on a laminated board, the method of plating through holes, the method of surface treatment, and the method of inspecting the continuity of wiring are also different. further,
The product specifications differ depending on the customer, and depending on the customer, the customer receives the order from the design stage of the wiring pattern. There are even those that accept only the outer layer process.

Therefore, a material arrangement document for aligning the materials of the printed wiring board, a process specification in which different manufacturing processes are assembled for each printed wiring board in order to control the manufacturing process, and a different manufacturing for each printed wiring board. Manufacturing specifications showing specifications, mask film for forming wiring patterns, screen printing plate, NC for opening through holes
It took a long time to prepare a tooling instruction sheet for preparing tooling such as a drill tape for controlling a drill. In other words, from receiving an order for the production of a printed wiring board until the actual production starts,
It took a lot of time and effort.

The present invention has been made in view of the above circumstances, and an object of the present invention is to shorten the period from the receipt of an order for the production of a printed wiring board to the start of the production of the printed wiring board and to simplify the work. It is an object of the present invention to provide a printed wiring board manufacturing process designing device.

[0007]

Therefore, according to the present invention, design data input means a for inputting design data of a printed wiring board to be manufactured, design data input by the design data input means a, and pre-stored data are stored. Design / manufacturing data storage means b for storing manufacturing data, and manufacturing process data branching into a plurality of manufacturing data stored in the design / manufacturing data storage means b based on the design data input by the design data input means a. Manufacturing process selecting means c for selecting manufacturing process data suitable for the design data from the above and outputting the manufacturing process data to the design manufacturing data storing means b.
Manufacturing specification data used in the selected manufacturing process, selected or calculated from the design data and the manufacturing data based on the design data, and output to the design manufacturing data storage means b; And a manufacturing specification output means e for reading the manufacturing process data and the manufacturing specification data of the printed wiring board to be manufactured from the design and manufacturing data storage means b and outputting the data. Based on design data for branching the manufacturing process such as the number of layers constituting the printed wiring board to be manufactured among the data, manufacturing process data including inner layer processing process data and outer layer processing process data is generated from the manufacturing data. The selection was taken as the means for solving the above problems.

Further, the manufacturing specification calculating means d is based on the size of the board and the size of the flat in the design data in a flat pattern in which a board to be a printed wiring board is multi-faced by forming a wiring pattern. And a board multi-sided arrangement setting means f for setting the multi-sided arrangement of the board in the flat, and outputting the multi-sided arrangement of the board as manufacturing specification data to the design / manufacturing data storage means b. did.

Then, the manufacturing specification calculating means d uses the minimum conductor width of the wiring pattern and the spacing between the conductors, which are determined in advance for each product specification in the manufacturing data, and the minimum conductor width corresponding to the design data. And a conductor width selecting means g for selecting conductor spacing data, and outputting the minimum conductor width and conductor spacing data to the design / manufacturing data storage means b as manufacturing specification data. ..

Further, the manufacturing specification calculating means d sets a target coordinate on a flat for determining a position when a wiring pattern or the like is formed on the board to a flat size of the design data and a board surface of the manufacturing specification data. It has a target coordinate setting means h which is set based on the arrangement, and outputs the target coordinates as manufacturing specification data to the design / manufacturing data storage means b.

The manufacturing specification calculating means d is a film for forming a wiring pattern, a drill tape for operating an NC drill for forming a through hole in a printed wiring board to be manufactured, and a board on the flat. A code corresponding to tooling prepared based on a predesigned wiring pattern such as a plating frame for making the plating thickness constant when performing plating for forming a wiring pattern on the wiring and the design data and manufacturing data. The tooling instructing means i for instructing is output and the code is output to the design / manufacturing data storage means b as manufacturing specification data.

Further, the manufacturing specification calculating means d reads the material name of each layer constituting the printed wiring board to be manufactured, which is the design data, from the design manufacturing data storage means b,
There is a layer configuration output means k for associating the material of each layer with the graphic data symbolizing the cross section of each material stored in the design / production data storage means b in advance. The material name for each layer of the printed wiring board is output to the design / manufacturing data storage means b, and
The solution is to output the graphic data of each layer to the design / manufacturing data storage means b in layers corresponding to the layer structure of the printed wiring board.

Then, the layer structure output means k obtains the material usage amount of each layer of the printed wiring board from the material of each layer of the printed wiring board and the planned production amount of the printed wiring board in the design data. Reading the inventory data of the materials constituting each layer of the printed wiring board stored in advance in the manufacturing design data storage means b, comparing the inventory data with the material usage amount, and arranging the data of the insufficient materials The output as a document to the production specification output means e was taken as a solution means.

Further, the items of the design data stored in the manufacturing design data storage means b are compared with the items of the preset design data to be input, and the items in which the data are not input or the inconsistency between the data. And design data input instruction means for displaying that the data of the searched item is not input or is inconsistent in the data input display field of the terminal which is the design data input means a and the manufacturing specification output means e. The solution was that m was provided.

[0015]

According to the above construction, at the stage of receiving an order for the production of a printed wiring board or at the stage of designing the wiring pattern of the printed wiring board, the design data is designed and manufactured by the design data inputting means a of the manufacturing process designing apparatus. Data storage means b
Entered in. Then, the manufacturing process selection means c selects manufacturing process data that matches the design data from the manufacturing process data that is stored in advance as manufacturing data and is branched into a plurality of parts. At this time, the manufacturing process selecting means c
Selects manufacturing process data based on design data such as the number of layers of a printed wiring board that branches the manufacturing process. Then, this manufacturing process data is output from the manufacturing specification output means e in the form of a manufacturing process specification or the like.

Next, the manufacturing specification calculation means d selects the manufacturing specification data used in the above-mentioned selected manufacturing process from the design data and the manufacturing data based on the design data, or the design data and the manufacturing data. Calculate from. Then, the obtained manufacturing specification data is output from the manufacturing specification output means e in the form of a manufacturing specification or the like.

In the manufacturing specification data, a board for the flat set by the board multi-sided layout setting means f of the manufacturing specification calculating means d based on the board size and the flat size in the design data. Includes data for multiple-sided layout of.

The manufacturing specification data is stored as the manufacturing data by the conductor width selecting means g of the manufacturing specification calculating means d, and is the smallest among the wiring patterns of the printed wiring board determined for each product specification. Data on the conductor width and the distance between the conductors selected based on the design data is included from the conductor width and the minimum distance between the conductors.

Further, in the manufacturing specification data, the target coordinate setting means h of the manufacturing specification calculation means d sets the flat size in the design data and the multi-sided arrangement set by the board multi-sided setting means f. Based on, the data of the target coordinates determined is included.

Further, the manufacturing specification data corresponds to a wiring pattern which is instructed by the tooling instructing means i of the manufacturing specification calculating means d and is designed in advance, and tooling prepared based on the manufacturing data and the design data. The code to do is included.

The code corresponding to the tooling includes the plating frame designating means j of the tooling designating means i.
Accordingly, a code corresponding to a plating frame selected from plating frames prepared in advance based on the flat size of the design data and the multi-sided arrangement set by the board multi-sided setting means f is included. Be done.

Further, the manufacturing specification data includes the material name of each layer constituting the printed wiring board in the design data by the layer structure output means k of the manufacturing specification calculation means d, and the layer structure is also included. The output means k selects from the graphic data symbolizing each material corresponding to the material name that can be included in the material forming the printed wiring board in the manufacturing data, corresponding to the material name of the design data. Along with
The graphic data layered corresponding to the layer structure of the printed circuit board to be manufactured is included.

Further, the layer structure output means k uses the stock data for each material in the manufacturing data, the material for each layer of the printed wiring board to be manufactured in the design data, and the planned manufacturing of the printed wiring board. The estimated amount of use of the material of each layer obtained from the amount is compared, and the data of the insufficient material is output to the manufacturing and use output means e as a material order form.

Then, the design data input instructing means m compares the design data items stored in the manufacturing design data storing means b with the design data items to be input which are designed in advance, and inputs the design data. In the data input / display fields of the terminals serving as the means a and the manufacturing / using output means e, the data of the item of the searched input data is not input or the contradiction between the data is displayed.

The above "means for solving the problem"
Although the present invention has been described with reference to the symbols shown in FIG. 1 in the section of “Operation”, it is needless to say that the present invention is not limited to the configuration shown in FIG.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 2 is a schematic diagram showing a printed wiring board manufacturing process designing apparatus which is an embodiment of the present invention. Figure 1
In the figure, reference numeral 1 is a terminal which is composed of a display, a printer, a plotter, a keyboard and the like, and serves as an input / output means. Reference numeral 2 is a central processing unit including a CPU (central processing unit) and the like, and reference numeral 3 is a storage unit including a magnetic disk device or the like.

The terminals 1 ... Are provided in the order-accepting department A, the manufacturing design department B, the production department C, etc. so that they can access the central processing means 2 and the storage means via the central processing means 2. You can access to 3. Then, from the terminals of the order receiving department A and the manufacturing design department B, design data necessary for manufacturing the printed wiring board is input.

The design data includes design data input in the ordering department A and design data input in the manufacturing design department B. As the former design data,
For example, there is a code indicating the printed wiring board to be manufactured, the name of the manufacturer of the customer, the basic specifications of the printed wiring board, and the like.

As the latter design data, for example, the number of layers, board size, terminal position, layer configuration management No. , Material grade, flat size, number of faces, outer shape classification, laminate classification, inscribed separation classification, basic product specifications, inspection specifications,
Design specifications, tooling No. , Base material (material constituting the layer), base material thickness, copper foil thickness, number of base materials, prepreg (adhesion between base materials when laminating the base materials, sandwiched between base materials for insulation) ) Brand, prepreg thickness, number of prepregs, etc.

Further, the terminals 1 ... Display the results processed by the central processing means, which will be described later, as output means, and print out as design instructions, tooling instructions, process specifications, material arrangements, etc. It is supposed to be out.

The central processing means 2 includes the terminals 1 ...
A function of selecting manufacturing process data that matches the design data from a plurality of manufacturing process data stored in the storage unit 3 based on the design data input from the manufacturing process data and outputting the selected manufacturing process data to the storage unit 3. Have

Further, the central processing means 2 has a function of selecting or calculating manufacturing specification data used in the selected manufacturing process from the design data and manufacturing data based on the design data, and outputting to the storage means 3. have.

It has a function of reading the manufacturing process data and manufacturing specification data of the printed wiring board to be manufactured, which are output to the storage means 3, from the storage means and outputting them to the terminals 1.

The manufacturing specification data selected or calculated by the central processing means 2 are as follows.

A, in a flat in which boards to be printed wiring boards are multi-sided by forming wiring patterns, the board size and the multi-sided layout of boards calculated based on the flat size in the design data ..

B, the minimum conductor width and the spacing between the conductors corresponding to the design data selected from the minimum conductor width of the wiring pattern and the spacing between the conductors which are determined in advance for each product specification among the manufacturing data. data from.

C, target coordinates on a flat for determining a position when a wiring pattern or the like is formed on the board, which is set based on the flat size of the design data and the board surface layout of the manufacturing specification data.

D, a film for forming a wiring pattern, a drill tape for operating an NC drill for forming a through hole in a printed wiring board to be manufactured, a wiring pattern for forming a wiring pattern on the flat board. A code corresponding to tooling prepared based on a previously designed wiring pattern such as a plating frame for making the plating thickness constant when plating is applied and the design data and manufacturing data.

The code is manufactured by the central processing unit 2 from a plurality of plating frames prepared in advance, based on the flat size and the multi-sided layout of the board in the design data and manufacturing specification data. The code of the plating frame selected corresponding to the printed wiring board to be included is included.

E, the material name of each layer constituting the printed wiring board to be manufactured, which is the design data read from the design / manufacturing data storage means.

F, the material name is made to correspond to the graphic data symbolizing the cross section of each material stored in the design / manufacturing data storage means, and the graphic data is expressed in layers corresponding to the layer structure of the printed wiring board. ..

G, the amount of material used for each layer of the printed wiring board is obtained from the material of each layer of the printed wiring board and the planned production amount of the printed wiring board in the design data, and the manufacturing design data is stored in advance. Insufficient material data obtained by reading the inventory data of the material forming each layer of the printed wiring board stored in the means and comparing the inventory data with the material usage amount.

The arithmetic processing means compares the design data items stored in the storage means with preset design data items to be input, and between the data-uninput items or data. It has a function of searching for a contradiction and displaying in the data input display field on the display of the terminal that the data of the searched item is not input or the contradiction.

Next, the operation of the printed wiring board manufacturing process designing apparatus of the present invention will be described. (1) Input of design data The design data is input at the terminals of the order receiving department A and the design manufacturing department B. At this time, if there is an inconsistency among the items of the necessary design data that are not entered or the data, the unentered design data or the inconsistent data item on the data input screen of the terminal 1 ... Indicates that is not entered or conflicts.

(2) Selection of Manufacturing Process Data First, as shown in the flow chart of FIG. 3, based on the number of layers of the printed wiring board and the laminating method inputted as the design data, the manufacturing data is stored in advance in the storage means. The manufacturing process data (inner layer processing process data) required for the printed wiring board to be manufactured is selected from the manufacturing process data.

Specifically, whether the inner layer treatment is necessary is selected according to the number of layers (SP1). When the number of layers is 2 or less, that is, when the printed wiring board is a single-sided printed wiring board or a double-sided printed wiring board, the inner layer processing is not required, and therefore the process proceeds to the step (SPA) of selecting outer layer processing step data. When the number of layers is two or more, that is, in the case of a multilayer printed wiring board, one of the steps branched into three is selected depending on the classification of the laminating method (SP2).

When the laminating method is the mass laminating method, the printed wiring board has already been laminated, so that the process proceeds to the step (SPA) of selecting the outer layer processing step data. When the laminating method is the pinless laminating method, the process proceeds to the step (SPB) of selecting inner layer processing step data of the pinless laminating method.

If the laminating method is the pin laminating method, the blind
Either the step of selecting inner layer processing step data of the buried via method (SPC) or the step of selecting general layer laminating method inner layer processing step data (SPD) is selected (SP3).

In the step (SPD) of selecting the inner layer processing step data of the inner layer processing step of the pin laminating method, as shown in the flow charts of FIGS.
Among the pin lamination method inner layer processing process data of the manufacturing data stored in the storage means based on the presence / absence of the inner layer signal line input as design data, the type of copper foil, the inspection specification of the inner layer wiring, the supplier, and the number of layers. The inner layer processing step data of the printed wiring board to be manufactured is selected from.

In the inner layer processing step, material delivery (SPD1) of laminated plate, copper foil, prepreg, etc., material inspection (SPD2), engraving (SPD3), baking (SPD).
4) After the step, the method of processing the reference hole is selected based on the data of the presence / absence of the inner layer signal line in the design data (SPD5). When there is an inner layer signal line, a process of forming a reference hole by punching (SPD6) and drilling (SPD7) is selected. If there is no inner layer signal line, the step of forming the reference hole by only punching (SPD8) is selected.

Next, the surface treatment step of the copper foil is selected (SPD9) depending on the type of copper foil in the design data, that is, whether it is a double-sided roughened copper foil (DT copper foil). If it is not DT copper foil, the surface conditioning process of the copper foil surface is selected (SPD
10) In the case of DT copper foil, a solvent cleaning step for the copper foil surface is selected (SPD11).

Next, a resist film is baked on the surface of the copper foil (SPD12) and the resist is inspected and corrected (SPD).
13), after the wiring pattern (inner layer wiring) is formed by etching the copper foil (SPD14), depending on the inspection specifications of the design data, that is, whether or not to inspect the inner layer wiring, the following Process is selected (SPD1
5). When performing the above inspection, a wiring inspection (SPD1
6), wiring analysis (SPD17), pattern inspection (SPD)
When the inspection step 18) is selected and the inner layer wiring inspection is not performed, only the pattern inspection (SPD18) step is selected.

Next, the surface treatment step of the copper clad laminate covered with the copper foil is selected (SPD19) (SPD21) according to the type of copper foil and the customer of the design data. If it is not DT copper foil, blackening treatment (SPD20) is selected, and if it is not DT copper foil, pickling (SPD22) may be selected or none depending on the specifications of the customer. ..

Next, after laminating (SPD23) is performed, the flat No. is determined depending on whether the number of layers in the design data is a predetermined number or more or less. It is determined whether or not the step (SPD25) for marking (FNo.) Is selected (SS25).
PD24). Next, the step of removing the surface resin of the laminate is selected, the selection of the inner layer processing step data of the pin laminating method is completed, and the outer layer processing is selected.

The selection of the inner layer processing step data in the pinless laminating method is carried out based on the inspection specification of the design data as in the presence / absence of the inner layer wiring inspection (SPD15) in the inner layer processing step of the pin laminating method. Data selection is performed.

The selection of the inner layer processing step data in the blind and buried via method is carried out by the presence or absence of the inner layer wiring inspection in the inner layer processing step of the pin laminating method (SPD15).
And FNo. The manufacturing process data is selected based on the inspection specifications and the number of layers in the design data, as in the presence / absence of the stamp (SPD24).

As described above, the manufacturing process data in the selected inner layer processing is used as the manufacturing process instruction of the inner layer process specification, from the terminal in the manufacturing process order, and the code No. corresponding to each process. It is designed to be output together with. For example, in the design data, the number of layers is greater than 2, the lamination method classification is a general pin lamination method, the inner layer signal line is provided, the type of copper foil is not DT copper foil, and the inspection specification is wiring inspection. When the number of layers is equal to or larger than the predetermined number, the manufacturing steps are output in the order of steps as follows.

“Material delivery, material inspection, marking, baking, reference hole processing punch, reference hole processing drill, surface adjustment, inner layer baking, inspection correction, etching, wiring inspection, wiring analysis, pattern inspection, blackening treatment, Laminate, FNo. Engraved ”

The selection of the manufacturing process data in the outer layer processing process is performed in the same manner as the selection of the manufacturing process data in the inner layer processing process. At this time, the design data, which is the standard for selecting the manufacturing process data in the outer layer processing process, is the laminate classification, material grade, number of layers, number of conductors between lands,
Cleaning classification in the through hole, type of plating method (panel plating method or pattern plating method), presence or absence of solder resist printing, presence or absence of component marking printing, presence or absence of terminal plating, presence or absence of fusing after solder plating, precious metal plating Presence / absence, flat size, inspection specifications, etc.

Then, the manufacturing process data of the selected outer layer processing process is, like the manufacturing data of the inner layer processing process, a code corresponding to each process in the manufacturing process order from the terminal as a manufacturing process instruction of the outer layer processing specification. No. It is designed to be output together with.

(3) Selection of Manufacturing Specification Data, Calculation a, Arrangement with Multiple Sides As shown in FIG. 6, the central processing means 2 uses the size of the board 6 input as the design data to determine the board 6 on the flat 5 Perform multi-sided layout of.

The board 6 indicates the shape and size of the printed wiring board to be manufactured, and the shape is generally rectangular. The flat 5 indicates the size of the base material that is carried into the production line when the wiring pattern is actually formed on the base material that is the material of the printed wiring board. A plurality of wiring boards to be manufactured are arranged. That is, a plurality of the boards 6 ... Are arranged on the flat 5 and a wiring pattern is formed on the plurality of boards 6 at a time. The base material is used for forming wiring patterns and the like. After completion, the boards 6 are separated into printed wiring boards.

The board size is determined at the stage of designing a product using the printed wiring board to be manufactured, and is input as design data from the terminal. The flat size is also limited to some extent according to the conditions of the production line and the like, and is determined from the limited sizes in consideration of the conditions such as the board size, and is input as design data.

Then, the central processing means 2 calculates the flat size and the board size, the minimum distance between the boards stored as the manufacturing data of the storage means, the outer peripheral edge of the flat 5 and the board closest to the outer peripheral edge of the flat 5. From the minimum distance from the outer peripheral edge of 6, the maximum number of boards 6 that can be arranged vertically and horizontally in the flat 5 is determined, and the boards 6 that can be arranged are evenly arranged on the flat 5 in multiple planes. The coordinate position of the board 6 on the coordinate is output. Then, it is displayed as a graphic on the display of the terminal as shown in FIG. 6, and as the manufacturing specification data, the flat size and the board size as well as the number of boards 6 arranged vertically and horizontally and the boards 6 arranged vertically and horizontally.
Outputs the interval between. The output data is used when creating a mask film or screen for printing a resist or the like on a printed wiring board, or creating a drill tape of an NC drill for forming through holes and the like.

B, Selection of Minimum Conductor Width and Minimum Conductor Interval The central processing means 2 uses the name of the customer as input as the design data and the thickness of the copper foil to be used, and the product of the customer as stored as manufacturing data. Search for standards and select minimum conductor width and minimum conductor spacing for printed wiring boards to be manufactured.

C, Determination of target coordinates. As shown in FIG. 6, the central processing means 2 has a plurality of target coordinates at arbitrary positions in the flat 5 on which the boards 6 are arranged in multiple planes in the outer peripheral edge portion of the flat 5 where the boards 6 are not arranged. To place. This target coordinate is used for alignment of the printing screen, mask film, etc. used when forming a wiring pattern, etc. on each layer, and mark the same coordinates on the copper foil, mask film, etc. of each layer. This is to prevent misalignment by accurately overlapping them. Therefore, the position is not particularly limited, and it is sufficient that it does not overlap the board 6 arranged on the flat 5.

D, Tooling instruction The memory means includes NC tape drill drill tapes, wiring pattern forming films, solder resist printing films, component marking printing films, which are created by the pattern of the wiring board designed in advance. Code No. corresponding to tooling such as plating frame and tooling selected by flat size and arrangement with multiple faces of board. Is remembered. Then, the central processing unit determines the product No. input as the design data. Tooling code No. corresponding to Is output to the terminal as manufacturing specification data.

E, Selection of Plating Frame: The plating frame is formed on the wiring pattern forming film at the same time as the wiring pattern, and remains as a frame-shaped conductive portion at the periphery of a flat plate to form a conductive portion for plating. It is what constitutes. The central processing means 2 selects a plating frame suitable for the printed wiring board to be manufactured from the plating frames prepared in advance based on the flat size of the design data and the layout with imposition, and corresponds to the plating frame. Code No.
Is specified as one of the instructions when manufacturing the tooling. This plating frame is selected so that its outer shape is close to a flat size,
In addition, the plating frame is selected so that it does not overlap the board 6 ...

F, Output of Layer Structure of Printed Wiring Board A multilayer printed wiring board is formed by laminating and laminating copper foil, copper clad laminate for outer layer, copper clad laminate for inner layer, prepreg and the like. .. The central processing means 2 reads the material name of the material forming each layer, which is input as design data, and outputs it to the terminal. Further, at this time, for each of the materials inputted as the manufacturing data, the graphic data showing the determined material is searched, and the graphic data is read for each material name, and at the same time, it is read as the layer of the printed wiring board. As shown in FIG. 7, the layers are output to the display and printer of the terminal according to the configuration. The layer structure shown in FIG.
The figure data 1 indicated by reference numeral 10 indicates the copper foil, and the reference numeral 11
2 indicates a double-sided copper clad laminate, and the figure A indicated by reference numeral 12 and the figure B indicated by reference numeral 13 indicate prepreg. It should be noted that, together with the display of these graphic data, the product name of the material indicated by these graphic data is output.

Output of Material Arrangement Document The central processing means 2 compares the data of the materials forming each layer of the printed wiring board to be manufactured with the stock data of the materials stored in the storage means in advance as the manufacturing data. Then, the missing material is output as a material order form. At this time, the central processing means 2 calculates the planned usage amount of the material from the data of the material and the planned production amount of the printed wiring board, and compares it with the inventory data to obtain the amount of the lacking material.

Output of h and other manufacturing specification data. Specification data other than the manufacturing specification data, for example, a drill diameter of NC data for forming a through hole, a position of a reference hole, a solder resist printing ink, a component marking printing ink, and the like are centrally calculated based on the design data. It is selected by the processing means and output. The drill diameter is selected based on the through hole diameter input as design data.

The design data, manufacturing process data, and manufacturing specification data input or set as described above are
A common specification file mainly consisting of basic specifications, product specifications, inspection specifications, and design specifications entered as design data, and tooling specifications, base material specifications, inner layer manufacturing specifications, outer layer manufacturing specifications,
The manufacturing process data mainly including the process procedure and the drilling specifications and the manufacturing specification data file obtained as the manufacturing specification data are managed as a pair of files. When the common specification data or the manufacturing specification data is changed or modified, the serial numbers of the data file before the change and the data file after the change are serialized. Are allocated and managed.

For example, when the common specification data is changed, the common specification data (01) after the change, the common specification data (00) before the change, and the manufacturing specification data (00) are stored in the storage means 3. When the manufacturing specification data is changed, the common specification data (00), the changed manufacturing specification data (01) and the unchanged manufacturing specification data (00) are stored in the storage means 3. It has become. If further changes or modifications are made, the changed or modified data file is serially numbered together with the data file. Is attached and stored.

As described above, according to the manufacturing process designing apparatus for a printed wiring board of this embodiment, the above-mentioned manufacturing process data can be obtained by inputting the above-mentioned design data in the order acceptance gate A and the manufacturing design department B. , Multi-sided board layout for flat, target coordinates, minimum conductor width and conductor spacing, and tooling code No. corresponding to the printed wiring board to be manufactured.・ Production specification data including graphic data showing the layer structure of the printed wiring board and the material arrangement document in the form of design instructions, inner layer processing process specification, outer layer process specification, material arrangement document, etc. .. can be output from each of the terminals 1 ... Including, it is possible to shorten the period from the ordering to the production of the printed wiring board and the work from the ordering to the production can be simplified.

[0075]

As described above, according to the manufacturing process designing apparatus for a printed wiring board of this embodiment, by inputting the design data from the design data input means, the manufacturing process selecting means selects the printed wiring board to be manufactured. The manufacturing process data can be output to the design / manufacturing data storage means, and the manufacturing specification calculation means can be used to arrange the board on multiple sides with flats, target coordinates, minimum conductor width and conductor spacing, and printed wiring board to be manufactured. Corresponding tooling code N
o. Manufacturing specification data including graphic data indicating the layer structure of the printed wiring board can be output to the design / manufacturing data storage unit, and further, the manufacturing process data and manufacturing specification data and layer structure output from the manufacturing specification output unit. Since it is possible to read the material order sheet by means, it is possible to shorten the period from receiving the order of the printed wiring board to the production and simplifying the work from the order receiving to the production.

[Brief description of drawings]

FIG. 1 is a block diagram showing a schematic configuration of a manufacturing process designing apparatus for the printed wiring board.

FIG. 2 is a block diagram showing a schematic configuration of a manufacturing process designing apparatus for a printed wiring board of the above embodiment.

FIG. 3 is a flowchart showing an operation of the manufacturing process designing apparatus.

FIG. 4 is a flowchart of an inner layer processing process for showing the operation of the manufacturing process designing apparatus.

FIG. 5 is a continuation of the above flowchart.

FIG. 6 is a diagram showing a flat and a board for showing the operation of the manufacturing process designing apparatus.

FIG. 7 is a schematic view showing a layer structure of a multilayer printed wiring board for showing the operation of the manufacturing process design apparatus.

[Explanation of symbols]

1 Manufacturing process design terminal (design data input means a,
Manufacturing specification output means e) 2 Central processing means (manufacturing process selecting means c, board multi-sided setting means f, conductor width selecting means g, target coordinate setting means h, tooling instructing means i, plating frame instruction of the manufacturing process design apparatus Means j, layer structure output means k, design data input means m) 3, storage means (design / manufacturing data storage means b)

Claims (8)

[Claims] 1. Design data input means for inputting design data of a printed wiring board to be manufactured, and design / manufacturing data storing means for storing design data input by the design data input means and manufacturing data accumulated in advance. Selecting manufacturing process data conforming to the design data from manufacturing process data branched into a plurality of manufacturing data stored in the design manufacturing data storage unit based on the design data input by the design data input unit, Manufacturing process selecting means for outputting the manufacturing process data to the design manufacturing data storage means, and manufacturing specification data used in the selected manufacturing process is selected or calculated from the design data and the manufacturing data based on the design data, Manufacturing specification calculation means for outputting to the design and manufacturing data storage means, and the print distribution to be manufactured. A manufacturing specification output means for reading and outputting plate manufacturing process data and manufacturing specification data from the design and manufacturing data storage means, wherein the manufacturing process selecting means is one of the input design data to be manufactured. A printing process characterized by selecting manufacturing process data consisting of inner layer processing process data and outer layer processing process data from the manufacturing data based on design data for branching the manufacturing process such as the number of layers constituting a printed wiring board. Wiring board manufacturing process design equipment. 2. The apparatus according to claim 1, wherein the manufacturing-specification calculating means includes a board of the design data on a flat surface on which boards to be printed wiring boards are formed by forming wiring patterns. Based on the size and the size of the flat, it has a board multi-sided layout setting means for setting the multi-sided layout of the board on the flat, and outputs the multi-sided layout of the board to the design / manufacturing data storage means as manufacturing specification data. A manufacturing process design apparatus for a printed wiring board, which is characterized by: 3. The apparatus according to claim 1 or 2, wherein the manufacturing specification calculation means is configured to have a minimum conductor width of a wiring pattern and a space between the conductors, which is predetermined for each product specification in the manufacturing data. And a conductor width selecting means for selecting a minimum conductor width and a conductor interval data corresponding to the design data from data, and the minimum conductor width and the conductor interval data as manufacturing specification data. A device for designing a manufacturing process of a printed wiring board, which is characterized by outputting to a means. 4. The device according to claim 2 or 3,
The manufacturing specification calculation means sets a target coordinate on a flat for determining a position when forming a wiring pattern or the like on the board based on a flat size of the design data and a board surface layout of the manufacturing specification data. A manufacturing process designing apparatus for a printed wiring board, comprising target coordinate setting means, and outputting the target coordinates as manufacturing specification data to the design / manufacturing data storage means. 5. The apparatus according to claim 2, wherein the manufacturing specification calculation means is a film for forming a wiring pattern or the like, and an NC drill for forming a through hole in a printed wiring board to be manufactured. Pre-designed wiring pattern such as a drill tape for operating a flat board, a plating frame or the like for making a plating thickness constant when performing plating for forming a wiring pattern on the board on the flat, the design data and manufacturing A manufacturing process of a printed wiring board, comprising tooling instruction means for instructing a code corresponding to tooling prepared based on the data, and outputting the code to the design / manufacturing data storage means as manufacturing specification data. Design equipment. 6. The apparatus according to claim 1, wherein the manufacturing specification calculation means is a material name of each layer constituting a printed wiring board to be manufactured which is design data from the design manufacturing data storage means. And has a layer configuration output means for associating the material of each layer with graphic data symbolizing the cross section of each material previously stored in the design / manufacturing data storage means, and the layer configuration output means, as manufacturing specification data, The material name of each layer of the printed wiring board is output to the design / manufacturing data storage means, and the graphic data of each layer is output to the design / manufacturing data storage means in layers corresponding to the layer structure of the printed wiring board. A manufacturing process design device for a printed wiring board, which is characterized in that 7. The apparatus according to claim 6, wherein the layer configuration output means determines the printed wiring board based on the material of each layer of the printed wiring board and the planned production amount of the printed wiring board in the design data. In addition to obtaining the material usage of each layer, read the inventory data of the material forming each layer of the printed wiring board stored in advance in the manufacturing design data storage means, compare the inventory data with the material usage, A process for designing a manufacturing process of a printed wiring board, wherein the data of the material to be processed is output as a material order form to the manufacturing specification output means. 8. The apparatus according to claim 1, wherein the item of design data stored in the manufacturing design data storage means is compared with a preset item of design data to be input. Data for which no data has been input, and design data that indicates that the data for the searched item has not been input in the data input display field of the terminal that is the design data input means and the manufacturing specification output means. An apparatus for designing a manufacturing process of a printed wiring board, characterized by comprising input instruction means.