JPH05167212A - Metal base substrate - Google Patents
Metal base substrateInfo
- Publication number
- JPH05167212A JPH05167212A JP35275891A JP35275891A JPH05167212A JP H05167212 A JPH05167212 A JP H05167212A JP 35275891 A JP35275891 A JP 35275891A JP 35275891 A JP35275891 A JP 35275891A JP H05167212 A JPH05167212 A JP H05167212A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive material
- adhesive layer
- material layer
- base substrate
- property
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は発熱を伴う電子部品等を
高密度に実装するのに適した金属ベース基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal base substrate suitable for mounting electronic parts and the like which generate heat at high density.
【０００２】[0002]
【従来の技術】従来からアルミニウム、鉄等の金属基板
上に厚さ数１０μ〜１００μ程度のエポキシ樹脂等の高
分子化合物からなる接着剤層を設け、その上に銅箔等の
金属箔を貼着させたもの、またはガラスエポキシプリプ
レグ等を接着剤層としたもの等が実用化されているが、
熱放散性が充分でない。さらに特公昭６３−４９９２０
号公報には接着剤（エポキシ、フエノール、ポリイミド
等）にアルミナを６０〜６５体積％含有させシランカッ
プリング剤を添加することにより接着剤としての機能を
もたせ熱放散性を向上させた混成集積回路用基板が提案
されている。2. Description of the Related Art Conventionally, an adhesive layer made of a polymer compound such as epoxy resin having a thickness of several 10 μm to 100 μm is provided on a metal substrate such as aluminum or iron, and a metal foil such as a copper foil is attached thereon. Although it is put into practical use, such as those that have been attached, or those that use glass epoxy prepreg etc. as an adhesive layer,
Not enough heat dissipation. Furthermore, Japanese Patent Publication Sho 63-49920
Japanese Patent Laid-Open Publication No. 2005-242242 discloses a hybrid integrated circuit in which 60 to 65% by volume of alumina is contained in an adhesive (epoxy, phenol, polyimide, etc.) and a silane coupling agent is added to thereby function as an adhesive to improve heat dissipation. Substrates have been proposed.
【０００３】[0003]
【発明が解決しようとする課題】しかし、前述した混成
集積回路用基板においても、配線回路の高密度化、発熱
素子の高密度実装用基板としては熱放散性が充分でな
い。However, even in the above-described hybrid integrated circuit substrate, the heat dissipation is not sufficient as a substrate for high density wiring circuits and high density mounting of heat generating elements.
【０００４】本発明はこのような点に鑑みてなされたも
のであり、配線回路の高密度化、発熱素子の高密度実装
用基板として充分な熱放散性のある金属ベース基板を提
供することを目的とする。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a metal base substrate having sufficient heat dissipation as a substrate for high density wiring circuits and high density mounting of heat generating elements. To aim.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に本発明による金属ベース基板は、金属基板の少なくと
も片面上に設けられた接着剤層と接着剤層上に設けられ
た金属薄層により構成された金属ベース基板において、
接着剤層の接着剤に絶縁性、熱伝導性に優れた球状無機
充填材を６５〜８５体積％含有させたことに特徴を有し
ている。また、本発明による他の金属ベース基板は、金
属基板の少なくとも片面上に設けられた接着剤層と接着
剤層上に設けられた金属薄層により構成された金属ベー
ス基板において、接着剤層の接着剤に絶縁性、熱伝導性
に優れた球状無機充填材の平均粒径の異なる数種類を混
合して粒度分布を広げることにより最密充填化を図った
ことに特徴を有している。In order to solve the above problems, a metal base substrate according to the present invention comprises an adhesive layer provided on at least one side of a metal substrate and a thin metal layer provided on the adhesive layer. In the configured metal base substrate,
It is characterized in that the adhesive of the adhesive layer contains 65 to 85% by volume of a spherical inorganic filler excellent in insulation and thermal conductivity. Further, another metal base substrate according to the present invention is a metal base substrate constituted by an adhesive layer provided on at least one surface of the metal substrate and a thin metal layer provided on the adhesive layer. It is characterized in that the adhesive is mixed with several kinds of spherical inorganic fillers having excellent insulating properties and thermal conductivity and having different average particle diameters to broaden the particle size distribution to achieve the closest packing.
【０００６】[0006]
【作用】金属基板の少なくとも片面上に接着剤層を設け
る。この接着剤層上に金属薄層を設ける。この接着剤層
は、接着剤に絶縁性、熱伝導性に優れた球状無機充填材
の平均粒径の異なる数種類を混合して粒度分布を広げ、
６５〜８５体積％を含有させる。従って、この接着剤層
は非常に熱放散性が良く、配線回路の高密度化、発熱素
子の高密度実装用基板として充分な熱放散性を有するこ
とになる。Function: An adhesive layer is provided on at least one side of a metal substrate. A thin metal layer is provided on this adhesive layer. This adhesive layer has a wide range of particle size distribution by mixing several kinds of spherical inorganic fillers having different average particle sizes with excellent adhesiveness and heat conductivity to the adhesive,
65 to 85% by volume is contained. Therefore, this adhesive layer has a very good heat dissipation property, and has a sufficient heat dissipation property as a substrate for high density wiring circuits and high density mounting of heat generating elements.
【０００７】[0007]
【実施例】以下、本発明の一実施例を図面に基づいて説
明する。図１には本発明による金属ベース基板の断面図
が示されいる。図において、１は金属薄層であり、２は
接着剤層であり、３は金属基板であり、接着剤層２には
球状無機充填剤材４が充填されている。球状無機充填剤
材４としてはアルミナ、シリカ、窒化アルミニウム、窒
化ボロン、酸化ベリリウム等及びこれらの組合せが使用
できる。例えば、球状アルミナは非常に熱放散性の良い
特性を示し、８×１０-3〜１．７×１０-2cal/cm.sec.
°C である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a sectional view of a metal base substrate according to the present invention. In the figure, 1 is a thin metal layer, 2 is an adhesive layer, 3 is a metal substrate, and the adhesive layer 2 is filled with a spherical inorganic filler material 4. As the spherical inorganic filler material 4, alumina, silica, aluminum nitride, boron nitride, beryllium oxide, etc., and combinations thereof can be used. For example, spherical alumina has a very good heat dissipation property, and is 8 × 10 −3 to 1.7 × 10 −2 cal / cm.sec.
° C.
【０００８】なお、接着剤層２は、接着剤（エポキシ樹
脂、フェノール樹脂、シリコン樹脂、ポリイミド樹脂
等）に絶縁性、熱伝導性に優れた球状無機充填材４を高
充填（球状のためフィラーの比表面積が小さくぬれ性が
良いため、高充填化が可能）し、６５〜８５体積％を含
有させてある。また、球状無機充填材４の平均粒径の異
なる数種類を混合することにより粒度分布を広げ、充填
密度が最も高くなる様にして６５〜８５体積％含有させ
てある。The adhesive layer 2 is highly filled with a spherical inorganic filler 4 excellent in insulation and thermal conductivity in an adhesive (epoxy resin, phenol resin, silicon resin, polyimide resin, etc.) Since it has a small specific surface area and good wettability, it can be highly filled and contains 65 to 85% by volume. Further, by mixing several kinds of spherical inorganic fillers 4 having different average particle diameters, the particle size distribution is widened so that the packing density becomes the highest, and the spherical inorganic filler 4 is contained in an amount of 65 to 85% by volume.
【０００９】実施例（１） 接着剤層２に充填されている球状無機充填材４として
は、昭和電工製アルミナビーズＡ３０Ｓ、Ａ１０、Ａ０
５、Ａ０１をそれぞれ６０〜６５％、５〜１５％、５〜
１０％、２０〜２５％秤量して振動ミル等で混合する。
なお、これらのアルミナビーズの平均粒径、粒度分布
は、表１に示す通りである。混合した後または混合と同
時にシランカップリング剤をアルミナ粉表面に付着させ
る。次にアルミナ粉９０重量部に対してエポキシ樹脂１
０重量部（アルミナ７５体積％相当）を高シェア機械分
散機、例えば、三木ロール、プラネタリー型ミキサ、ニ
ーダー等を用いて分散混練する。Example (1) As the spherical inorganic filler 4 filled in the adhesive layer 2, alumina beads A30S, A10, A0 manufactured by Showa Denko are used.
5, A01 60-65%, 5-15%, 5
10%, 20-25% are weighed and mixed with a vibration mill or the like.
The average particle size and particle size distribution of these alumina beads are as shown in Table 1. After or simultaneously with mixing, the silane coupling agent is attached to the surface of the alumina powder. Next, 1 part of epoxy resin is used for 90 parts by weight of alumina powder.
0 parts by weight (corresponding to 75% by volume of alumina) is dispersed and kneaded using a high shear mechanical disperser such as a Miki roll, a planetary mixer, a kneader or the like.
【００１０】この様にしてできた接着剤を金属基板３で
あるアルミ板にスクリーン印刷機等を用いて５０〜２０
０μ塗布する。さらに１５０℃で５分程度乾燥させてＢ
ステージ状態にした後、金属薄層である銅箔をその上に
積載して熱圧プレスにより１８０℃で３０分成形し金属
ベース基板を得る。得られた接着剤層２である絶縁層の
熱伝導率は約１．２×１０-2cal/cm.sec. ℃で前述した
混成集積回路用基板（．７×１０-3cal/cm.sec. ℃）の
約２倍と優れている。The adhesive thus produced is applied to an aluminum plate, which is the metal substrate 3, using a screen printer or the like for 50 to 20.
Apply 0 μ. After drying at 150 ° C for about 5 minutes, B
After being placed in a stage state, a copper foil, which is a thin metal layer, is placed on it and molded by hot pressing at 180 ° C. for 30 minutes to obtain a metal base substrate. The thermal conductivity of the insulating layer which is the obtained adhesive layer 2 is about 1.2 × 10 −2 cal / cm.sec. ° C. and the hybrid integrated circuit substrate (0.7 × 10 −3 cal / cm. sec. ℃) is about twice as good.
【００１１】 [0011]
【００１２】実施例（２） 接着剤層２に充填されている球状無機充填材４として、
昭和電工製球状アルミナビーズＡ６０、Ａ１０、Ａ−０
１をそれぞれ７０〜７５％、５〜１５％、１５〜２０％
秤量し、振動ミル等で混合する。次に混合したアルミナ
粉９０重量部に対しエポキシ樹脂１０重量部（アルミナ
７５体積％相当）さらにシランカップリング剤を少量加
えて実施例１と同様に分散混練し、金属基板３であるア
ルミ板に塗布、乾燥した後、金属薄層である銅箔をその
上に熱圧プレスし、金属ベース基板を得る。得られた接
着剤層２である絶縁層の熱伝導率は実施例１と同様で前
述した混成集積回路用基板の２倍と優れた値を示す。Example (2) As the spherical inorganic filler 4 filled in the adhesive layer 2,
Showa Denko spherical alumina beads A60, A10, A-0
1 to 70-75%, 5-15%, 15-20%
Weigh and mix with a vibration mill. Next, to 90 parts by weight of the mixed alumina powder, 10 parts by weight of epoxy resin (corresponding to 75% by volume of alumina) and a small amount of a silane coupling agent were added and dispersed and kneaded in the same manner as in Example 1 to form an aluminum plate as the metal substrate 3. After coating and drying, a copper foil, which is a thin metal layer, is hot-pressed thereon to obtain a metal base substrate. The thermal conductivity of the obtained insulating layer, which is the adhesive layer 2, is similar to that of Example 1 and is twice as high as that of the above-mentioned substrate for hybrid integrated circuit, which is an excellent value.
【００１３】[0013]
【発明の効果】以上のように本発明による金属ベース基
板は、金属基板の少なくとも片面上に設けられた接着剤
層と接着剤層上に設けられた金属薄層により構成された
金属ベース基板において、接着剤層の接着剤に絶縁性、
熱伝導性に優れた球状無機充填材を６５〜８５体積％含
有させたので、また、本発明による他の金属ベース基板
は、金属基板の少なくとも片面上に設けられた接着剤層
と接着剤層上に設けられた金属薄層により構成された金
属ベース基板において、接着剤層の接着剤に絶縁性、熱
伝導性に優れた球状無機充填材の平均粒径の異なる数種
類を混合して粒度分布を広げることにより最密充填化を
図ったので、この接着剤層は非常に熱放散性が良く、配
線回路の高密度化、発熱素子の高密度実装用基板として
充分な熱放散性を有する。As described above, the metal base substrate according to the present invention is a metal base substrate composed of an adhesive layer provided on at least one surface of the metal substrate and a thin metal layer provided on the adhesive layer. , Insulating to the adhesive of the adhesive layer,
Since the spherical inorganic filler having an excellent thermal conductivity is contained in an amount of 65 to 85% by volume, another metal base substrate according to the present invention has an adhesive layer and an adhesive layer provided on at least one surface of the metal substrate. In the metal base substrate composed of the thin metal layer provided above, the adhesive of the adhesive layer is mixed with several kinds of spherical inorganic fillers having different average particle diameters having excellent insulating properties and thermal conductivity, and the particle size distribution is obtained. Since the closest packing is achieved by widening, the adhesive layer has a very good heat dissipation property, and has a sufficient heat dissipation property as a substrate for high density wiring circuit and high density mounting of heat generating elements.
【図１】本発明の一実施例における金属ベース基板の断
面図である。FIG. 1 is a cross-sectional view of a metal base substrate according to an embodiment of the present invention.
１ 金属薄層 ２ 接着剤層 ３ 金属基板 ４ 球状無機充填材 1 Metal Thin Layer 2 Adhesive Layer 3 Metal Substrate 4 Spherical Inorganic Filler
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成４年２月３日[Submission date] February 3, 1992
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００７[Correction target item name] 0007
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００７】[0007]
【実施例】以下、本発明の一実施例を図面に基づいて説
明する。図１には本発明による金属ベース基板の断面図
が示されいる。図において、１は金属薄層であり、２は
接着剤層であり、３は金属基板であり、接着剤層２には
球状無機充填剤材４が充填されている。球状無機充填剤
材４としてはアルミナ、シリカ、窒化アルミニウム、窒
化ボロン、酸化ベリリウム等及びこれらの組合せが使用
できる。例えば、球状アルミナは非常に熱放散性の良い
特性を示し、２．４×１０-2〜４．８×１０-2cal/cm.s
ec. ℃である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows a sectional view of a metal base substrate according to the present invention. In the figure, 1 is a thin metal layer, 2 is an adhesive layer, 3 is a metal substrate, and the adhesive layer 2 is filled with a spherical inorganic filler material 4. As the spherical inorganic filler material 4, alumina, silica, aluminum nitride, boron nitride, beryllium oxide, etc., and combinations thereof can be used. For example, spherical alumina has a very good heat dissipation property, and is 2.4 × 10 -2 to 4.8 × 10 -2 cal / cm.s.
ec. ° C.
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００９[Correction target item name] 0009
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００９】実施例（１） 接着剤層２に充填されている球状無機充填材４として
は、昭和電工製アルミナビーズＡ３０Ｓ、Ａ１０、Ａ０
５Ｓ、Ａ０１をそれぞれ６０〜６５％、５〜１５％、５
〜１０％、２０〜２５％秤量して振動ミル等で混合す
る。なお、これらのアルミナビーズの平均粒径、粒度分
布は、表１に示す通りである。混合した後または混合と
同時にシランカップリング剤をアルミナ粉表面に付着さ
せる。次にアルミナ粉９０重量部に対してエポキシ樹脂
１０重量部（アルミナ７５体積％相当）を高シェア機械
分散機、例えば、三木ロール、プラネタリー型ミキサ、
ニーダー等を用いて分散混練する。Example (1) As the spherical inorganic filler 4 filled in the adhesive layer 2, alumina beads A30S, A10, A0 manufactured by Showa Denko are used.
5S and A01 are 60 to 65%, 5 to 15%, 5 respectively.
Weigh 10% to 20% to 25% and mix with a vibration mill or the like. The average particle size and particle size distribution of these alumina beads are as shown in Table 1. After or simultaneously with mixing, the silane coupling agent is attached to the surface of the alumina powder. Then, 10 parts by weight of epoxy resin (corresponding to 75% by volume of alumina) with respect to 90 parts by weight of alumina powder is used in a high-share mechanical disperser, for example, Miki roll, planetary mixer,
Disperse and knead using a kneader or the like.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１２[Correction target item name] 0012
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１２】実施例（２） 接着剤層２に充填されている球状無機充填材４として、
昭和電工製球状アルミナビーズＡ６０、Ａ１０、Ａ０１
をそれぞれ７０〜７５％、５〜１５％、１５〜２０％秤
量し、振動ミル等で混合する。次に混合したアルミナ粉
９０重量部に対しエポキシ樹脂１０重量部（アルミナ７
５体積％相当）さらにシランカップリング剤を少量加え
て実施例１と同様に分散混練し、金属基板３であるアル
ミ板に塗布、乾燥した後、金属薄層である銅箔をその上
に熱圧プレスし、金属ベース基板を得る。得られた接着
剤層２である絶縁層の熱伝導率は実施例１と同様で前述
した混成集積回路用基板の２倍と優れた値を示す。Example (2) As the spherical inorganic filler 4 filled in the adhesive layer 2,
Showa Denko spherical alumina beads A60, A10, A01
Are weighed 70 to 75%, 5 to 15% and 15 to 20%, respectively, and mixed by a vibration mill or the like. Next, 90 parts by weight of the mixed alumina powder was mixed with 10 parts by weight of epoxy resin (7 parts of alumina).
(Equivalent to 5% by volume) Furthermore, a small amount of a silane coupling agent was added, the mixture was kneaded in the same manner as in Example 1, coated on an aluminum plate which is the metal substrate 3 and dried, and then a copper foil, which is a thin metal layer, was heated thereon. Pressing is performed to obtain a metal base substrate. The thermal conductivity of the obtained insulating layer, which is the adhesive layer 2, is the same as that of Example 1 and is twice as excellent as that of the above-described substrate for hybrid integrated circuit.
Claims (2)
た接着剤層と接着剤層上に設けられた金属薄層により構
成された金属ベース基板において、 接着剤層の接着剤に絶縁性、熱伝導性に優れた球状無機
充填材を６５〜８５体積％含有させたことを特徴とする
金属ベース基板。1. A metal base substrate composed of an adhesive layer provided on at least one surface of a metal substrate and a thin metal layer provided on the adhesive layer, wherein the adhesive of the adhesive layer has insulation and heat. A metal base substrate comprising 65 to 85% by volume of a spherical inorganic filler having excellent conductivity.
る球状無機充填材を数種類混合して粒度分布を広げるこ
とにより最密充填化を図ったことを特徴とする請求項１
記載の金属ベース基板。2. The closest packing is achieved by mixing several kinds of spherical inorganic fillers having different average particle diameters into the adhesive of the adhesive layer to broaden the particle size distribution.
The metal base substrate described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35275891A JPH05167212A (en) | 1991-12-16 | 1991-12-16 | Metal base substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35275891A JPH05167212A (en) | 1991-12-16 | 1991-12-16 | Metal base substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05167212A true JPH05167212A (en) | 1993-07-02 |
Family
ID=18426243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35275891A Pending JPH05167212A (en) | 1991-12-16 | 1991-12-16 | Metal base substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05167212A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0738007A2 (en) * | 1995-04-12 | 1996-10-16 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal-base multilayer circuit substrate |
| JP2007096185A (en) * | 2005-09-30 | 2007-04-12 | Sanyo Electric Co Ltd | Circuit board |
| US7683482B2 (en) | 1999-01-29 | 2010-03-23 | Panasonic Corporation | Electronic component unit |
| WO2010117023A1 (en) * | 2009-04-09 | 2010-10-14 | 日本発條株式会社 | Metal-based circuit board and method for producing same |
| JP2012076421A (en) * | 2010-10-05 | 2012-04-19 | Sumitomo Bakelite Co Ltd | Bonded object |
| CN102602117A (en) * | 2012-03-21 | 2012-07-25 | 苏州东亚欣业节能照明有限公司 | Method for preparing copper-clad plate |
| JP2012154602A (en) * | 2011-01-28 | 2012-08-16 | Tdk Corp | Fluid heater and steam cleaning apparatus using the fluid heater |
| US20130288120A1 (en) * | 2011-07-08 | 2013-10-31 | Mitsui Chemicals Inc. | Polyimide resin composition and laminate including polyimide resin composition |
| US9357642B2 (en) | 2010-05-27 | 2016-05-31 | Nhk Spring Co., Ltd. | Circuit board laminate and metal-based circuit board |
| US9538648B2 (en) | 2010-03-24 | 2017-01-03 | Sumitomo Chemical Company, Limited | Liquid composition and metal-based circuit board |
| JP2018159083A (en) * | 2011-12-28 | 2018-10-11 | 日立化成株式会社 | Resin composition, resin composition sheet and method for producing resin composition sheet, resin composition sheet with metal foil, b stage sheet, semi-cured resin composition sheet with metal foil, metal base wiring board material, metal base wiring board, led light source member, and power semiconductor device |
-
1991
- 1991-12-16 JP JP35275891A patent/JPH05167212A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0738007A2 (en) * | 1995-04-12 | 1996-10-16 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal-base multilayer circuit substrate |
| EP0738007A3 (en) * | 1995-04-12 | 1998-04-29 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal-base multilayer circuit substrate |
| US8007627B2 (en) * | 1999-01-29 | 2011-08-30 | Panasonic Corporation | Electronic component mounting method and apparatus |
| US7683482B2 (en) | 1999-01-29 | 2010-03-23 | Panasonic Corporation | Electronic component unit |
| US7759583B2 (en) | 2005-09-30 | 2010-07-20 | Sanyo Electric Co., Ltd. | Circuit board |
| JP2007096185A (en) * | 2005-09-30 | 2007-04-12 | Sanyo Electric Co Ltd | Circuit board |
| WO2010117023A1 (en) * | 2009-04-09 | 2010-10-14 | 日本発條株式会社 | Metal-based circuit board and method for producing same |
| JP5427884B2 (en) * | 2009-04-09 | 2014-02-26 | 日本発條株式会社 | Metal base circuit board and manufacturing method thereof |
| US9538648B2 (en) | 2010-03-24 | 2017-01-03 | Sumitomo Chemical Company, Limited | Liquid composition and metal-based circuit board |
| US9357642B2 (en) | 2010-05-27 | 2016-05-31 | Nhk Spring Co., Ltd. | Circuit board laminate and metal-based circuit board |
| JP2012076421A (en) * | 2010-10-05 | 2012-04-19 | Sumitomo Bakelite Co Ltd | Bonded object |
| JP2012154602A (en) * | 2011-01-28 | 2012-08-16 | Tdk Corp | Fluid heater and steam cleaning apparatus using the fluid heater |
| US20130288120A1 (en) * | 2011-07-08 | 2013-10-31 | Mitsui Chemicals Inc. | Polyimide resin composition and laminate including polyimide resin composition |
| JP2018159083A (en) * | 2011-12-28 | 2018-10-11 | 日立化成株式会社 | Resin composition, resin composition sheet and method for producing resin composition sheet, resin composition sheet with metal foil, b stage sheet, semi-cured resin composition sheet with metal foil, metal base wiring board material, metal base wiring board, led light source member, and power semiconductor device |
| CN102602117A (en) * | 2012-03-21 | 2012-07-25 | 苏州东亚欣业节能照明有限公司 | Method for preparing copper-clad plate |
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