JPH05102451A - Evaluating method for solid-state image sensor - Google Patents

Evaluating method for solid-state image sensor

Info

Publication number
JPH05102451A
JPH05102451A JP3263529A JP26352991A JPH05102451A JP H05102451 A JPH05102451 A JP H05102451A JP 3263529 A JP3263529 A JP 3263529A JP 26352991 A JP26352991 A JP 26352991A JP H05102451 A JPH05102451 A JP H05102451A
Authority
JP
Japan
Prior art keywords
value
solid
state image
added
difference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3263529A
Other languages
Japanese (ja)
Inventor
Tomoya Tanaka
知哉 田中
Hiroshi Nakayama
博史 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP3263529A priority Critical patent/JPH05102451A/en
Publication of JPH05102451A publication Critical patent/JPH05102451A/en
Pending legal-status Critical Current

Links

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE:To provide a method for evaluating a solid state image sensor for automatically evaluating a line defect, in which an output value is gradually varied, by a tester. CONSTITUTION:Picture data arranged in a two-dimensional manner is added in one of longitudinal and lateral directions by adding means 2, and a line defect is evaluated according to a difference between a maximum value A and an average value B of added data 3 or between a minimum value C and the value B.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、固体撮像素子の電気的
特性を評価する固体撮像素子の評価方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image sensor evaluation method for evaluating the electrical characteristics of a solid-state image sensor.

【0002】[0002]

【従来の技術】近年、固体撮像素子の民生、産業分野へ
の進出はめざましく、それにともない小型化,高画質
化,多機能化への要求がますます高まっている。
2. Description of the Related Art In recent years, solid-state image pickup devices have made remarkable progress in the consumer and industrial fields, and accordingly, demands for miniaturization, high image quality, and multi-functionality are increasing.

【0003】固体撮像素子の電気的特性の中には画質に
対する規定が設けられており、この規定を満足するかど
うかについて製品を正確かつ迅速に評価することが必要
である。
The electric characteristics of the solid-state image pickup device include a regulation for image quality, and it is necessary to accurately and quickly evaluate a product as to whether or not the regulation is satisfied.

【0004】従来より、固体撮像素子の電気的特性を評
価する場合、まずウェハ状態でテスタを用いて自動評価
を行い、組立後にテスタまたは実装評価装置を用いて評
価するのが一般的である。
Conventionally, in the case of evaluating the electrical characteristics of a solid-state image pickup device, it is general to first perform automatic evaluation using a tester in a wafer state, and then evaluate using a tester or a mounting evaluation device after assembly.

【0005】ここでテスタを用いた固体撮像素子の画質
評価の一部である線欠陥に関して、固体撮像素子の評価
方法を図3を参照しながら説明する。
Here, with respect to the line defect which is a part of the image quality evaluation of the solid-state image pickup device using the tester, an evaluation method of the solid-state image pickup device will be described with reference to FIG.

【0006】図3は従来の固体撮像素子の評価方法のブ
ロック図である。図3に示すように、固体撮像素子から
の信号をテスタにより二次元配列にした画像データ1に
対し、加算手段2により、画素の配列に対して縦方向ま
たは横方向の一方向に、各列毎または各行毎の加算を行
い、画像データ1を一次元のデータ列である加算データ
3に変換する。次に加算データ3の個々の加算値に対
し、差分処理手段34により隣接する加算値間で差分を
とり、その差分データ35の個々の差分値と定められた
しきい値38とを比較し、しきい値38を越える加算値
を比較計数手段36により計数し、その合計値37によ
り線欠陥を評価していた。
FIG. 3 is a block diagram of a conventional solid-state image sensor evaluation method. As shown in FIG. 3, with respect to the image data 1 in which the signals from the solid-state image pickup device are arranged in a two-dimensional array by a tester, each column is added by the addition unit 2 in one direction in the vertical direction or the horizontal direction with respect to the pixel array. The image data 1 is converted into addition data 3 which is a one-dimensional data string by performing addition for each row or each row. Next, for each added value of the added data 3, the difference processing means 34 calculates a difference between adjacent added values, and compares each difference value of the difference data 35 with a predetermined threshold value 38, The added value exceeding the threshold value 38 was counted by the comparison counting means 36, and the line defect was evaluated by the total value 37.

【0007】[0007]

【発明が解決しようとする課題】しかしながら上記従来
の構成では、加算データに対し、隣接する加算値間の差
分がしきい値より小さく、徐々に加算値すなわち出力値
が変化する線欠陥は、テスタで自動評価することができ
ず、したがってこのような線欠陥を有する固体撮像素子
では、その出力をモニタテレビ受像機に写しだし、その
画像を人間の目視によって官能評価しなければならない
という課題を有していた。
However, in the above-mentioned conventional configuration, the line defect in which the difference between the adjacent addition values is smaller than the threshold value with respect to the addition data and the addition value, that is, the output value gradually changes is Therefore, a solid-state image sensor having such a line defect has a problem that the output must be projected on a monitor television receiver and the image must be visually evaluated by human eyes. Was.

【0008】本発明は上記従来の課題を解決するもの
で、徐々に出力値が変化する線欠陥をテスタで自動評価
できる固体撮像素子の評価方法を提供することを目的と
する。
The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a solid-state image sensor evaluation method capable of automatically evaluating a line defect whose output value gradually changes with a tester.

【0009】[0009]

【課題を解決するための手段】この目的を達成するため
に、本発明の固体撮像素子の評価方法における第1の手
段は、二次元配列された画像データを縦方向または横方
向の一方向に加算し、その加算データの最大値と平均値
との差または最小値と平均値との差により線欠陥を評価
するものである。
In order to achieve this object, the first means in the method for evaluating a solid-state image pickup device according to the present invention is to use two-dimensionally arranged image data in one of the vertical and horizontal directions. The line defects are evaluated by the addition and the difference between the maximum value and the average value of the added data or the difference between the minimum value and the average value.

【0010】また本発明の固体撮像素子の評価方法にお
ける第2の手段は、加算データの個々の加算値と平均値
との差を個々にしきい値と比較し、しきい値を越える加
算値を計数し、その合計値により線欠陥を評価するもの
である。
The second means in the method for evaluating a solid-state image pickup device according to the present invention compares the difference between the individual added value and the average value of the added data with a threshold value individually, and detects the added value exceeding the threshold value. The line defect is evaluated by counting and counting the total value.

【0011】[0011]

【作用】この第1の手段によって、隣接する加算値間の
差分が定められたしきい値より小さく徐々に加算値が変
化するような線欠陥をテスタで自動評価することができ
る。
With this first means, it is possible to automatically evaluate a line defect in which the difference between adjacent addition values is smaller than a predetermined threshold value and the addition value gradually changes, by a tester.

【0012】また第2の手段によって、加算データの個
々の加算値と平均値との差を個々にしきい値と比較し、
しきい値を越える加算値を計数し、その合計値により線
欠陥をテスタで自動評価することができる。
By the second means, the difference between each added value and the average value of the added data is individually compared with the threshold value,
The added value exceeding the threshold value is counted, and the line defect can be automatically evaluated by the tester based on the total value.

【0013】[0013]

【実施例】以下本発明の一実施例について、図面を参照
しながら説明する。図1は本発明の第1の実施例におけ
る固体撮像素子の評価方法のブロック図である。図1に
示すように、固体撮像素子からの信号をテスタにより二
次元配列にした画像データ1に対し、加算手段2により
画素の配列に対して縦方向または横方向の一方向に、各
列毎または各行毎の加算を行い、画像データ1を一次元
のデータ列である加算データ3に変換する。次に加算デ
ータ3について最大値A,最小値Bおよび平均値Cを算
出する。次にA,B,CによりDおよびEをD=A−
C,E=C−Bとして算出する。ここでDは(最大値−
平均値)で、Dによって画像データ1全体の出力平均値
より出力が大きい線欠陥を評価する。Eは(平均値−最
小値)で、Eにより画像データ1全体の出力平均値より
出力が小さい線欠陥を評価する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram of a method for evaluating a solid-state image sensor according to the first embodiment of the present invention. As shown in FIG. 1, with respect to image data 1 in which a signal from a solid-state image sensor is arranged in a two-dimensional array by a tester, an addition unit 2 is arranged in each of the vertical and horizontal directions of the pixel array for each column. Alternatively, addition is performed for each row, and the image data 1 is converted into addition data 3 which is a one-dimensional data string. Next, the maximum value A, the minimum value B, and the average value C of the addition data 3 are calculated. Next, D and E are D = A- by A, B, and C.
It is calculated as C, E = CB. Where D is (maximum value-
The average value) is used to evaluate a line defect whose output is larger than the average output value of the entire image data 1 by D. E is (average value-minimum value), and E is used to evaluate a line defect whose output is smaller than the average output value of the entire image data 1.

【0014】このように第1の実施例によれば、加算デ
ータ3について(最大値−平均値),(平均値−最小
値)を算出し、その算出された値により線欠陥を評価す
るため、隣接する列または行の加算値間の差が小さく、
徐々に加算値すなわち出力値が変化する線欠陥でもテス
タで自動評価することができる。
As described above, according to the first embodiment, (maximum value-average value) and (average value-minimum value) are calculated for the addition data 3 and the line defect is evaluated based on the calculated values. , The difference between the sums of adjacent columns or rows is small,
Even a line defect in which the added value, that is, the output value, gradually changes can be automatically evaluated by the tester.

【0015】次に本発明の第2の実施例について、図2
を参照しながら説明する。図2は本発明の第2の実施例
における固体撮像素子の評価方法のブロック図である。
すなわち、第1の実施例と同様にして得られた加算デー
タ3に対し、第1の実施例と同様に平均値Cを算出す
る。次に差分処理手段24により、加算データ3の個々
の加算値と平均値Cとの差分をとることにより差分デー
タ25を算出する。次に差分データ25の個々の差分値
としきい値28とを比較計数手段26により比較し、し
きい値28を越える差分値の個数を計数して合計値27
により線欠陥を評価する。このように第2の実施例によ
れば、加算データ3の個々の加算値と平均値Cとの差を
個々にしきい値28と比較し、しきい値28を越える加
算値を計数し、その合計値により線欠陥を評価するた
め、隣接する列または行の加算値間の差が小さく、徐々
に加算値すなわち出力値が変化する線欠陥でもテスタで
自動評価することができる。
Next, a second embodiment of the present invention will be described with reference to FIG.
Will be described with reference to. FIG. 2 is a block diagram of a method for evaluating a solid-state image sensor according to the second embodiment of the present invention.
That is, the average value C is calculated for the addition data 3 obtained in the same way as in the first embodiment, as in the first embodiment. Next, the difference processing means 24 calculates the difference data 25 by taking the difference between each added value of the added data 3 and the average value C. Next, each difference value of the difference data 25 and the threshold value 28 are compared by the comparison / counting means 26, and the number of difference values exceeding the threshold value 28 is counted to obtain the total value 27.
The line defect is evaluated by. As described above, according to the second embodiment, the difference between the individual addition value of the addition data 3 and the average value C is individually compared with the threshold value 28, and the addition value exceeding the threshold value 28 is counted. Since the line defect is evaluated based on the total value, it is possible to automatically evaluate even a line defect in which the difference between the added values of adjacent columns or rows is small and the added value, that is, the output value changes gradually by the tester.

【0016】[0016]

【発明の効果】以上のように本発明の固体撮像素子の評
価方法によれば、隣接する加算値間の差分が小さく徐々
に加算値、すなわち出力値が変化する線欠陥をテスタで
自動評価することが可能になる。
As described above, according to the solid-state image sensor evaluation method of the present invention, a line defect in which the difference between adjacent addition values is small and the addition value is gradually changed, that is, the output value is automatically evaluated by the tester. It will be possible.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施例における固体撮像素子の
評価方法のブロック図
FIG. 1 is a block diagram of a solid-state image sensor evaluation method according to a first embodiment of the present invention.

【図2】本発明の第2の実施例における固体撮像素子の
評価方法のブロック図
FIG. 2 is a block diagram of a solid-state image sensor evaluation method according to a second embodiment of the present invention.

【図3】従来の固体撮像素子の評価方法のブロック図FIG. 3 is a block diagram of a conventional solid-state image sensor evaluation method.

【符号の説明】[Explanation of symbols]

1 画像データ 2 加算手段 3 加算データ A 加算データの最大値 B 加算データの平均値 C 加算データの最小値 D 最大値と平均値の差 E 最小値と平均値の差 1 image data 2 addition means 3 addition data A maximum value of addition data B average value of addition data C minimum value of addition data D difference between maximum value and average value E difference between minimum value and average value

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 固体撮像素子から出力された二次元配列
の画像データを加算手段により縦方向または横方向の一
方向に加算し、その加算データの最大値と平均値との差
または最小値と平均値との差により、線欠陥を評価する
固体撮像素子の評価方法。
1. A two-dimensional array of image data output from a solid-state image pickup device is added in one direction in a vertical direction or a horizontal direction by an adding means, and a difference between a maximum value and an average value of the added data or a minimum value is obtained. A solid-state image sensor evaluation method for evaluating line defects based on a difference from an average value.
【請求項2】 固体撮像素子から出力された二次元配列
の画像データを縦方向または横方向の一方向に加算し、
その加算データの個々の加算値と平均値との差を個々に
しきい値と比較し、しきい値を越える加算値を計数し、
その合計値により線欠陥を評価する固体撮像素子の評価
方法。
2. The two-dimensional array of image data output from the solid-state image pickup device is added in one direction in the vertical direction or the horizontal direction,
The difference between each added value and the average value of the added data is individually compared with the threshold value, and the added value exceeding the threshold value is counted,
A solid-state image sensor evaluation method for evaluating line defects based on the total value.
JP3263529A 1991-10-11 1991-10-11 Evaluating method for solid-state image sensor Pending JPH05102451A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3263529A JPH05102451A (en) 1991-10-11 1991-10-11 Evaluating method for solid-state image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3263529A JPH05102451A (en) 1991-10-11 1991-10-11 Evaluating method for solid-state image sensor

Publications (1)

Publication Number Publication Date
JPH05102451A true JPH05102451A (en) 1993-04-23

Family

ID=17390805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3263529A Pending JPH05102451A (en) 1991-10-11 1991-10-11 Evaluating method for solid-state image sensor

Country Status (1)

Country Link
JP (1) JPH05102451A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006135700A (en) * 2004-11-05 2006-05-25 Sharp Corp Image inspection device, image inspection method, control program and readable storage medium

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006135700A (en) * 2004-11-05 2006-05-25 Sharp Corp Image inspection device, image inspection method, control program and readable storage medium
US7646892B2 (en) 2004-11-05 2010-01-12 Sharp Kabushiki Kaisha Image inspecting apparatus, image inspecting method, control program and computer-readable storage medium

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