JPH05101813A - Mounting structure and method of flat type power supply element onto circuit substrate - Google Patents

Abstract

PURPOSE:To mount a flat type power supply element having an excellent sealing structure onto a circuit substrate with high reliability without remarkable increase in the thickness of a power supply part. CONSTITUTION:A case 2, which serves as one terminal, made of a metal and an electrode part 7, which serves as the other terminal, adhered inside of the case 2 via an insulating layer 8 are provided, an opening 6 which exposes a part of the electrode plate 7 is formed in the case 2. A flat type power supply element 1 is mounted onto a circuit substrate 16 where a first and a second connecting parts 19 and 20 are provided. An insulative adhesive layer 21 is formed on the circuit substrate 16, a first and a second removed parts 22 and 23 are provided in the adhesive layer 21. The first conducting member 26 electrically connects the case 2 to the connecting part 19 through a removed part 22, and the second conducting member 27 electrically connects the electrode plate 7 to the connecting part 20 through the removed part 23 and the opening 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure and a mounting method for a power supply device such as an electric double layer capacitor or a battery on a circuit board, and more particularly to a flat power supply device having a flat shape as a whole. The present invention relates to a mounting structure and a mounting method on a circuit board.

[0002]

2. Description of the Related Art A lithium battery or an electric double layer capacitor is suitable as a power source for an IC card, which has been developed in recent years, and these power source elements have a thin shape, that is, a flat type.

As an electrolyte for a lithium battery, a non-aqueous electrolyte prepared by dissolving lithium perchlorate or the like as an electrolyte in an organic solvent such as propylene carbonate or γ-butyrolactone is usually used. However, since the withstand voltage can be set high, it is desirable to use the same kind of electrolytic solution.

However, when such a non-aqueous electrolyte is used, if the amount of water in the system increases, the internal resistance increases, the withstand voltage decreases, and the performance deteriorates. Need to keep. In addition, it is necessary to prevent volatilization of the electrolytic solution inside. for that purpose,
The case provided in such a flat type power supply element is required to be capable of providing a hermetically sealed structure having a high sealing property.

The applicant of the present invention previously filed Japanese Patent Application No. 62-2968.
No. 79 (Japanese Patent Laid-Open No. 1-140553) proposes a flat type power supply element having a hermetically sealed structure with high sealing performance.

FIG. 5 is a sectional view showing a flat type power supply element 1 as one example thereof. Referring to FIG. 5, case 2 of flat type power supply element 1 includes first and second case halves 3 and 4 made of, for example, stainless foil,
The peripheral portion 5 is welded and sealed. An opening 6 is formed in the first case half body 3, and an electrode plate 7 made of, for example, stainless steel foil is arranged so as to face the opening 6. The electrode plate 7 and the first case half 3 are in a state of being insulated from each other and sealed by an insulating layer 8 made of, for example, a resin. In this way, the sealed storage portion 9 is formed, and in the storage portion 9, the first and second functional substances (for example, the positive electrode active material and the negative electrode active material) 11 positioned with the separator 10 interposed therebetween, and 12 are stored.

According to the structure shown in FIG. 5 described above, the width of the insulating layer 8 can be made sufficiently large without increasing the external dimensions of the product. Volatilization can be prevented more effectively.

[0008]

However, the flat type power supply device 1 having the structure shown in FIG. 5 encounters the following problems when it is mounted on a circuit board.

That is, in the flat type power supply element 1, since the electrode plate 7 serving as one terminal is arranged inside the case 2, the electrode plate 7 and the circuit board are electrically connected to each other. Or the opening 6 without coming into contact with the case 2, particularly the first case half 3 having the same potential as the other terminal.
Need to go through. Therefore, when the flat type power supply element 1 is mounted on the circuit board, the configuration as shown in FIG. 6 is most typically adopted.

Referring to FIG. 6, contact pieces 14 and 15 are provided on circuit board 13, and contact piece 1 is provided while elastically sandwiching power supply element 1 between these contact pieces 14 and 15.
Each of 4 and 15 is made to contact different terminals of the power supply element 1, that is, the case 2 (more specifically, the second case half 4) and the electrode plate 7.

However, in the structure shown in FIG. 6, the presence of the contact pieces 14 and 15 makes it difficult to thin the power supply section including the power supply element 1, and the contact pieces 14 and 15 are added to the power supply element 1. Since the pressure may not be sufficiently strong, there is a problem that the reliability of electrical connection is low.

Therefore, an object of the present invention is, for example, FIG.
By improving the mounting structure of the flat type power supply element with the excellent sealing structure on the circuit board as shown in Fig. 3, it is possible to achieve highly reliable electrical connection without significantly increasing the thickness of the power supply section. Is to try.

Another object of the present invention is to provide a method for mounting a flat type power supply element on a circuit board in order to obtain a mounting structure capable of satisfying the above-mentioned demands.

[0014]

The present invention, like the flat type power supply element 1 shown in FIG. 5, has a case made of a metal that serves as one terminal and the other case that is adhered to the inside of the case through an insulating layer. And a flat type power supply element in which an opening for exposing a part of the electrode plate is formed in the case, and the flat type power supply element is mounted on the circuit board provided with the first and second connection portions. Directed to a structure or method.

In the mounting structure according to the present invention, in order to solve the above-mentioned technical problem, the flat type power supply element is provided on the circuit board so that the electrode plate faces the circuit board through the opening. Insulating adhesive layers are sandwiched between the adhesive layers, and a defective portion is provided at a position of the adhesive layer corresponding to a part of the case and the opening. It is characterized in that the first and second conductive members are electrically connected to the second connection portion and the second connection portion via the defective portion.

In the mounting method according to the present invention, a step of applying an insulating adhesive layer having a defect portion exposing the first and second connection portions on the circuit board, and through the opening. Placing the flat type power supply element on the adhesive layer so that the electrode plate faces the circuit board, and electrically connecting the case and the first connecting portion through the defective portion. A step of applying a first conductive member, and a step of applying a second conductive member so as to electrically connect the electrode plate and the second connecting portion through the defective portion and the opening, Adhering the flat type power supply element to the circuit board by the adhesive layer.

The adhesive layer is preferably provided by an adhesive film or a double-sided adhesive sheet. In addition, the first and second conductive members are preferably
A conductive paste is used.

[0018]

In the present invention, the insulating adhesive layer achieves attachment of the flat type power supply element to the circuit board and prevents undesired electrical contact between the flat type power supply element and the circuit board. Perform a function.

The defective portion provided in the adhesive layer is the first
And a case and an electrode plate by the second conductive member and the first
And electrical connection between each of them and the second connection portion is allowed.

[0020]

As described above, according to the present invention, since the flat type power supply element is directly fixed on the circuit board through the insulating adhesive layer, the adhesive layer can be made thin to greatly reduce the power supply section. It can be made thinner.

Further, since the electrical connection between the power supply element and the circuit board is achieved by the conductive member located inside the defective portion provided in the adhesive layer, the reliability of the electrical connection is high.

Further, since the power supply element and the circuit board are electrically isolated from each other by the adhesive layer, the power supply element is arranged at an arbitrary position on the circuit board without concern for the conductor on the circuit board. be able to.

If through holes are provided in the circuit board corresponding to the positions of the defective portions of the adhesive layer and the positions of the first and second connection portions, after fixing the power supply element to the circuit board, The first and second conductive members can be provided through the through holes provided in the circuit board.

[0024]

1 and 2 show a mounting structure of a flat type power supply element 1 on a circuit board 16 according to an embodiment of the present invention. The flat type power supply element 1 shown here is shown in FIG.
, For example, an electric double layer capacitor or a battery.

On the upper surface of the circuit board 16, the first and second
Conductors 17 and 18 are provided, and first and second connecting portions 19 and 20 are formed at the ends of the first and second conductors 17 and 18, respectively.

On the upper surface of the circuit board 16 as described above, the power supply element 1 is arranged with the insulating adhesive layer 21 sandwiched so that the electrode plate 7 faces the circuit board 16 through the opening 6. A first defective portion, here a through hole 22, is provided at a position of the adhesive layer 21 corresponding to a part of the case 2, more specifically a part of the first case half 3. Further, a second defective portion, here a through hole 23, is provided at a position of the adhesive layer 21 corresponding to the opening 6. In this embodiment, the circuit board 16 is further provided with through holes 24 and 25, which are aligned with the above-described first and second defective portions 22 and 23, respectively. .. The through holes 24 and 25 also penetrate the first and second connecting portions 19 and 20, respectively.

These first defective portion 22 and through hole 24
In addition, the second defective portion 23 and the through hole 25 are respectively loaded with the first and second conductive members 26 and 27 made of, for example, a conductive base. by this,
The first conductive member 26 electrically connects the case 2 and the first connecting portion 19, and the second conductive member 27 electrically connects the electrode plate 7 and the second connecting portion 20. .

The above-mentioned adhesive layer 21 is preferably thin, flat, and free from pinholes, and is composed of, for example, a heat-adhesive film or a double-sided adhesive sheet. More specifically, a hot-melt type heat-adhesive film made of an ethylene-vinyl acetate copolymer resin having a thickness of 0.040 mm can be advantageously used.

As the conductive members 26 and 27, from the viewpoint of workability, a conductive resin paste or a conductive resin film to which powder of silver, nickel, copper, carbon or the like is added is used.

FIG. 3 shows an embodiment of a method for obtaining the mounting structure shown in FIGS. 1 and 2, that is, a method for mounting the flat type power supply element 1 on the circuit board 16.

As shown in FIG. 3 (1), first, first and second connection parts 19 and 20 are provided.
A circuit board 16 including the conductors 17 and 18 is prepared. The circuit board 16 includes the first and second connection portions 1
Through holes 24 and 25 penetrating the respective positions 9 and 20
Is provided.

Next, as shown in FIG. 3B, the adhesive layer 2 made of, for example, a heat-adhesive film is formed on the circuit board 16.
1 is placed. The adhesive layer 21 is provided with first and second defective portions 22 and 23 so as not to block the through holes 24 and 25.

Next, as shown in FIG. 3C, the power supply element 1 is placed on the adhesive layer 21. At this time, the power supply element 1
The electrode plate 7 faces the circuit board 16 through the opening 6. Further, the opening 6 of the power supply element 1 is aligned with the second defective portion 23 of the adhesive layer 21, as shown in FIG. In this state, the power supply element 1 is pressed toward the circuit board 16 while heating the adhesive layer 21, so that the power supply element 1 is bonded to the circuit board 16.

In the above steps, a part of the adhesive layer 21 is formed in the opening 6 provided in the case 2 of the power supply element 1.
It is preferable to cover the peripheral portion of the through hole 23, and therefore, it is desirable that the diameter of the through hole 23, which is the defective portion, be smaller than the diameter of the opening 6.

Next, as shown in FIG. 3 (4), the circuit board 16 is turned upside down. Next, as shown in FIG. 3 (5), the first and second conductive members 2 made of, for example, silver paste are passed through the through holes 24 and 25 provided in the circuit board 16.
6 and 27 are loaded. As a result, the first conductive member 26 has the first defective portion 22 provided in the adhesive layer 21.
The case 2 and the first connecting portion 19 are electrically conducted through each other, while the second conductive member 27 has the second defective portion 23 provided in the adhesive layer 21 and the opening 6 provided in the case 2. The electrode plate 7 and the second connecting portion 20 are electrically connected to each other through the.

In this way, the mounting structure of the power supply element 1 on the circuit board 16 as shown in FIGS. 1 and 2 is obtained.

FIG. 4 shows another embodiment of the present invention.
The mounting structure of the power supply element 1 on the circuit board 16a is shown. Note that, in FIG. 4, elements corresponding to the elements shown in FIG. 1 are denoted by the same reference numerals, and redundant description will be omitted.

Referring to FIG. 4, the circuit board 1 used here
6a has a structure substantially similar to that of the circuit board 16 used in the above-described embodiment, but the usage is different. That is, the adhesive layer 21 is formed on the surface of the circuit board 16a where the first and second conductors 17 and 18 are not formed, and the power supply element 1 is arranged thereon. Therefore, the electrical connection between the first connecting portion 19 and the case 2 is performed by the first conductive portion through the through hole 24 provided in the circuit board 16a and the first defective portion 22 provided in the adhesive layer 21. Achieved by member 26. Also, the second connecting portion 2
0 and the electrode plate 7 are electrically connected through the through hole 25 provided in the circuit board 16, the second defective portion 23 provided in the adhesive layer 21, and the opening 6 provided in the case 2. This is achieved by the second conductive member 27.

Although the through holes 24 and 25 provided in the circuit board 16a are essential in the embodiment shown in FIG. 4, such through holes 24 and 25 are necessary in the embodiment shown in FIGS. 25 may not be provided. Certainly, when the through holes 24 and 25 are provided, the first and second conductive members 26 and 27 are provided as desired after the power supply element 1 is bonded to the circuit board 16 by the adhesive layer 21. However, if such an advantage is not desired, for example, before placing the power supply element 1 on the adhesive layer 21, the first and second defects 22 and 23 provided on the adhesive layer 21 are First and second conductive members 26
It is also possible to provide the conductive bases and 27 and then to place the power supply element 1 on the adhesive layer 21.

Further, although the adhesive layer 21 is provided with the first and second defective portions 22 and 23 independently of each other in the above-described embodiment, these defective portions 22 and 23 are
It may be replaced by one common defect.

The circuit board used in the present invention is not particularly limited, but a flexible board is particularly suitable.

[Brief description of drawings]

FIG. 1 is a sectional view taken along line I-I of FIG. 2 showing a mounting structure of a flat type power supply device 1 on a circuit board 16 according to an embodiment of the present invention.

FIG. 2 is a perspective view showing the mounting structure shown in FIG.

3 is a perspective view showing each step included in a method for obtaining the mounting structure shown in FIG. 1. FIG.

FIG. 4 is a sectional view corresponding to FIG. 1, showing a mounting structure of a power supply element 1 on a circuit board 16a according to another embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a flat type power supply element 1 to which the present invention is applied.

FIG. 6 is a cross-sectional view showing a conventional mounting structure of the flat type power supply element 1.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Flat type power supply element 2 Case 6 Opening 7 Electrode plate 8 Insulating layer 16, 16a Circuit board 19 1st connection part 20 2nd connection part 21 Adhesive layer 22,23 Defect part 26 1st conductive member 27 2nd Conductive member

Continuation of the front page (72) Inventor Masato Higuchi 2 26-10 Tenjin Tenjin, Nagaokakyo-shi, Kyoto Murata Manufacturing Co., Ltd.

Claims (2)

[Claims] 1. A case made of metal that serves as one terminal, and an electrode plate that serves as the other terminal that is adhered to the inside of the case via an insulating layer, and the case has a part of the electrode plate. Is a structure for mounting a flat type power supply element, in which an opening exposing the above is formed, on a circuit board provided with first and second connection parts, wherein the flat type power supply element is provided on the circuit board through the opening. The flat type power supply element is arranged so as to sandwich the insulating adhesive layer so that the electrode plate faces the circuit board, and the defective portion is provided at a position corresponding to a part of the case and the opening of the adhesive layer. And the case and the electrode plate are electrically connected to the first and second connection portions by the first and second conductive members via the defective portion, respectively. Mounting structure of type power supply element on circuit board. 2. A case made of metal that serves as one of the terminals, and an electrode plate that serves as the other terminal that is adhered to the inside of the case via an insulating layer, and the case includes a part of the electrode plate. Is a method of mounting a flat type power supply element having an opening for exposing the substrate on a circuit board provided with first and second connection portions, the method comprising: An insulating adhesive layer having a defective portion exposing the connecting portion is provided, and the flat type power supply element is placed on the adhesive layer so that the electrode plate faces the circuit board through the opening, and the defective portion is provided. A first conductive member is provided so as to electrically connect the case and the first connecting portion through a portion, and the electrode plate and the second connecting portion are electrically connected to each other through the defective portion and the opening. Second conductive member so as to electrically conduct electrically Imparting to, adhering the flat type power supply device to the circuit board by the adhesive layer comprises the steps, method for mounting the circuit board of the flat type power supply device.