JPH04784U - - Google Patents
Info
- Publication number
- JPH04784U JPH04784U JP3948990U JP3948990U JPH04784U JP H04784 U JPH04784 U JP H04784U JP 3948990 U JP3948990 U JP 3948990U JP 3948990 U JP3948990 U JP 3948990U JP H04784 U JPH04784 U JP H04784U
- Authority
- JP
- Japan
- Prior art keywords
- case
- control unit
- vehicle control
- circuit board
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
Description
第１図は本考案に係る一実施例を示すケースの
平面図、第２図はケースの縦断面図である。
１ａ……蓋、１……ケース、２……取付け部、
４……支持部、９……メタルコア基板。
FIG. 1 is a plan view of a case showing an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of the case. 1a...Lid, 1...Case, 2...Mounting part,
4...Supporting part, 9...Metal core board.
Claims (1)
スの車体への取付け部及び該ケース内に収納され
る回路基板の支持部に一体の金属を鋳込んで樹脂
により成形し、前記回路基板をメタルコア基板と
したことを特徴とする車載コントロールユニツト
の放熱構造。 The case of the in-vehicle control unit is molded from resin by integrally casting metal into the attachment part of the case to the car body and the supporting part of the circuit board housed in the case, and the circuit board is made into a metal core board. A heat dissipation structure for an in-vehicle control unit featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990039489U JPH0713277Y2 (en) | 1990-04-16 | 1990-04-16 | Heat dissipation structure for in-vehicle control unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990039489U JPH0713277Y2 (en) | 1990-04-16 | 1990-04-16 | Heat dissipation structure for in-vehicle control unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04784U true JPH04784U (en) | 1992-01-07 |
| JPH0713277Y2 JPH0713277Y2 (en) | 1995-03-29 |
Family
ID=31548443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990039489U Expired - Lifetime JPH0713277Y2 (en) | 1990-04-16 | 1990-04-16 | Heat dissipation structure for in-vehicle control unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713277Y2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0578127U (en) * | 1992-03-17 | 1993-10-22 | 古河電気工業株式会社 | Electrical junction box |
| US7113400B2 (en) | 2002-03-29 | 2006-09-26 | Denso Corporation | Housing structure of electronic control unit and mounting structure of the same |
| JP2007325344A (en) * | 2006-05-30 | 2007-12-13 | Yazaki Corp | Electrical connection box |
| JP2008174124A (en) * | 2007-01-19 | 2008-07-31 | Pioneer Electronic Corp | Moving body-mounting device |
| JP2008174129A (en) * | 2007-01-19 | 2008-07-31 | Pioneer Electronic Corp | Moving body mounting device |
| WO2010150510A1 (en) * | 2009-06-26 | 2010-12-29 | 日本特殊陶業株式会社 | Circuit board containing unit |
| JP2012033596A (en) * | 2010-07-29 | 2012-02-16 | Kyocera Corp | Substrate for semiconductor device and semiconductor device equipped with the same |
-
1990
- 1990-04-16 JP JP1990039489U patent/JPH0713277Y2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0578127U (en) * | 1992-03-17 | 1993-10-22 | 古河電気工業株式会社 | Electrical junction box |
| US7113400B2 (en) | 2002-03-29 | 2006-09-26 | Denso Corporation | Housing structure of electronic control unit and mounting structure of the same |
| JP2007325344A (en) * | 2006-05-30 | 2007-12-13 | Yazaki Corp | Electrical connection box |
| JP2008174124A (en) * | 2007-01-19 | 2008-07-31 | Pioneer Electronic Corp | Moving body-mounting device |
| JP2008174129A (en) * | 2007-01-19 | 2008-07-31 | Pioneer Electronic Corp | Moving body mounting device |
| WO2010150510A1 (en) * | 2009-06-26 | 2010-12-29 | 日本特殊陶業株式会社 | Circuit board containing unit |
| JP5542815B2 (en) * | 2009-06-26 | 2014-07-09 | 日本特殊陶業株式会社 | Circuit board container |
| JP2012033596A (en) * | 2010-07-29 | 2012-02-16 | Kyocera Corp | Substrate for semiconductor device and semiconductor device equipped with the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0713277Y2 (en) | 1995-03-29 |
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