JPH0469147A - Relatively equal speed polishing method - Google Patents

Relatively equal speed polishing method

Info

Publication number
JPH0469147A
JPH0469147A JP18354190A JP18354190A JPH0469147A JP H0469147 A JPH0469147 A JP H0469147A JP 18354190 A JP18354190 A JP 18354190A JP 18354190 A JP18354190 A JP 18354190A JP H0469147 A JPH0469147 A JP H0469147A
Authority
JP
Japan
Prior art keywords
polishing
workpiece
polished
plate
rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18354190A
Other languages
Japanese (ja)
Inventor
Hiromu Watanabe
渡辺 煕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mabuchi Shoten KK
Original Assignee
Mabuchi Shoten KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mabuchi Shoten KK filed Critical Mabuchi Shoten KK
Priority to JP18354190A priority Critical patent/JPH0469147A/en
Publication of JPH0469147A publication Critical patent/JPH0469147A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To uniformly polish each part of a face to be polished so as not to generate polishing unevenness by supporting a workpiece and polishing member so as not to be spun and swinging at least one of them in a specified pattern. CONSTITUTION:At least one polishing member 23 is pushed to at least one face 27a of a workpiece 27 to be polished at fixed force to fix the workpiece 27 and polishing member 23 so as not to be spun. In the next step, either the workpiece 27 or polishing member 23 is swung through a swing bar 25 so as to draw an arbitrary locus above a plane including a face 27a to be polished to polish the face 27a of the workpiece 27 to be polished.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、高精度の平面研磨および大型加工物の高精度
研磨に特に通した研磨方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a polishing method particularly suitable for high-precision surface polishing and high-precision polishing of large workpieces.

〔従来の技術〕[Conventional technology]

光学レンズなどの研磨機としては、オスカー型レンズ研
磨機などに代表される研磨機が一般的に採用されている
。第8図にはかかる研磨機の基本構成を示してあり、こ
の図に示すように、ワーク保持板である強制回転板lの
上面に加工物2が載置され、この直上位置には、垂直揺
動棒3の下端に研磨板4が回転自在に支持されている。
As a polishing machine for optical lenses, etc., a polishing machine typified by an Oscar type lens polishing machine is generally employed. FIG. 8 shows the basic configuration of such a polishing machine. As shown in this figure, the workpiece 2 is placed on the upper surface of the forced rotating plate l, which is a workpiece holding plate, and a vertical A polishing plate 4 is rotatably supported at the lower end of the swing rod 3.

研磨時には、この研磨板4が揺動棒によって加工物に押
しつけられ、この状態で、強制回転板10回転が開始す
る。これと同時に、揺動棒が左右に揺動する。この結果
、揺動棒の下端に回転自在に支持されている研磨板4は
、強制回転板1の自転によって回転運動を与えられて、
自転しながら加工物の表面上を揺動して、この加工物の
表面を研磨することになる。
During polishing, the polishing plate 4 is pressed against the workpiece by the swing rod, and in this state, the forced rotary plate starts rotating 10 times. At the same time, the swing rod swings left and right. As a result, the polishing plate 4 rotatably supported at the lower end of the rocking rod is given rotational motion by the rotation of the forced rotary plate 1.
It rotates on its own axis and swings over the surface of the workpiece, polishing the surface of the workpiece.

一方、上記とは異なる形式の研磨機としては、ホフマン
式あるいはラップマスター式と呼ばれる研磨機が知られ
ている。この形式の研磨機は、第9[g (A)、(B
)に示すように、強制回転研磨板11上に遊星歯車減速
機構が組み込まれた構成となっており、この減速機構を
構成する各遊星歯車がワーク保持板13として機能し、
ここに、複数枚の加工物14が研磨vi11の側に押し
つけられた状態で担持されている。この構成の研磨機に
おいては、研磨板11が自転運動すると、それによって
、ワーク保持板13が自転および公転運動を行い、この
ワーク保持板13に担持されている加工物14の研磨が
行われる。
On the other hand, as a polishing machine of a type different from the above, a polishing machine called a Hoffman type or Lapmaster type is known. This type of polishing machine has the 9th [g (A), (B
), a planetary gear reduction mechanism is incorporated on the forced rotation polishing plate 11, and each planetary gear making up this reduction mechanism functions as a workpiece holding plate 13.
Here, a plurality of workpieces 14 are supported while being pressed against the polishing vi11 side. In the polishing machine having this configuration, when the polishing plate 11 rotates, the workpiece holding plate 13 rotates and revolves, and the workpiece 14 supported on the workpiece holding plate 13 is polished.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

このような従来の研磨機においては、いずれの形式のも
のにおいても、研磨板が自転運動を行いながら加工物の
研磨を行うようになっている。このために、研磨板の自
転中心側と外周側とを比較すると、周速度の大きな外周
側の研磨加工運動量が、周速度の小さな中心側の研磨加
工運動量よりも格段に大きくなる。この結果、自転中心
側に当接している加工物の部分と1、外周側に当接して
いる加工物の部分とでは、研磨量が異なってきてしまい
、精度の良い研磨動作を期待できないおそれがある。
In any of these conventional polishing machines, the polishing plate polishes the workpiece while rotating on its axis. For this reason, when comparing the rotation center side and the outer peripheral side of the polishing plate, the polishing momentum on the outer peripheral side, where the peripheral speed is high, is much larger than the polishing momentum on the center side, where the peripheral speed is low. As a result, the amount of polishing differs between the part of the workpiece that is in contact with the center of rotation and the part of the workpiece that is in contact with the outer circumference, and there is a risk that highly accurate polishing operation cannot be expected. be.

特に、加工物の形状が、矩形、三角形などの場合には、
それらの中心から遠い距離にある角部分における研磨加
工運動量が大きくなり、加工物全体を均一に精度良く研
磨することが困難となる。
Especially when the shape of the workpiece is rectangular or triangular,
The polishing momentum at corner portions located far from the center becomes large, making it difficult to polish the entire workpiece uniformly and accurately.

また、加工サイクルを早めるために機械回転数を高速に
した場合においても、同様に研磨加工運動量の差が大き
くなるので、研磨精度が著しく低下することになる。さ
らには、加工物が大型化した場合にも、このような周速
度差に起因して研磨加工運動量の差が大きくなるので、
ラップマスター式などの研磨機においては、加工物に比
べて相当に大きな研磨板を用いて研磨しなければ研磨精
度を高めることができない。
Furthermore, even when the machine rotational speed is increased to speed up the machining cycle, the difference in polishing momentum similarly increases, resulting in a significant drop in polishing accuracy. Furthermore, even when the workpiece becomes larger, the difference in polishing momentum increases due to this difference in peripheral speed.
In polishing machines such as the Lapmaster type, polishing accuracy cannot be improved unless the workpiece is polished using a polishing plate considerably larger than the workpiece.

ここに、機械回転数を超低速にして、このような周速度
差を減少させて研磨精度を高めることが考えられるが、
このようにすると、加工時間が長くなり、実用的ではな
い。
Here, it is possible to increase the polishing accuracy by reducing the peripheral speed difference by reducing the machine rotation speed to an extremely low speed.
If this is done, the machining time will be long and it is not practical.

本発明の課題は、このような従来の研磨機における欠点
に鑑みて、研磨加工運動量を各部分において実質的に等
しくなるようにでき、以て、精度良く研磨動作を行うこ
との可能な研摩方法を実現することにある。
In view of the drawbacks of conventional polishing machines, an object of the present invention is to provide a polishing method in which the polishing momentum can be made substantially equal in each part, and thereby the polishing operation can be performed with high precision. The aim is to realize this.

〔課題を解決するための手段〕[Means to solve the problem]

上記の課題を解決するために、本発明においては、加工
物のどの部分に対しても研磨板が実質的に等しい相対軌
跡を描くように、これら加工物および研磨機を相対運動
させ、これによって、精度のよい研磨動作を行い得るよ
うにしている。
In order to solve the above problems, in the present invention, the workpiece and the polishing machine are moved relative to each other so that the polishing plate draws a substantially equal relative trajectory with respect to any part of the workpiece, thereby This makes it possible to perform polishing operations with high precision.

すなわち、本発明の研磨方法においては、加工物の少な
くとの一つの被研磨面に対して少なくとも一つの研磨部
材を一定の力で押しつけ、また、加工物および研磨部材
のそれぞれを自転運動しないように固定し、この状態を
保持したままで、加工物および研磨部材の少なくとも′
一方の側を、被研磨面を含む面上において任意の軌跡を
描くように揺動させるようにすることを特徴としている
That is, in the polishing method of the present invention, at least one polishing member is pressed against at least one polished surface of the workpiece with a constant force, and each of the workpiece and the polishing member is prevented from rotating. and while maintaining this state, at least
It is characterized in that one side is oscillated so as to draw an arbitrary trajectory on the surface including the surface to be polished.

また、本発明の方法においては、対向した位置にある加
工物の第1および第2の被研磨面に対して、それぞれ第
1および第2の研磨部材を、加工物を挟む状態で、一定
の力で押しつけると共に、加工物並びに第1および第2
の研磨部材のそれぞれを自転運動しないように固定して
おき、この状態で、加工物の側、あるいは第1および第
2の研磨部材の側、またはこれら双方の側を、第1の被
研磨面を含む面上および第2の被研磨面を含む面上にお
いて任意の軌跡を描くように揺動させるようにすること
を特徴としている。
In addition, in the method of the present invention, the first and second polishing members are respectively applied to the first and second polished surfaces of the workpiece located at opposing positions, with the workpiece sandwiched between them. While pressing with force, the workpiece and the first and second
Each of the polishing members is fixed so as not to rotate, and in this state, the workpiece side, the first and second polishing member sides, or both sides are connected to the first polished surface. It is characterized in that it is made to swing so as to draw an arbitrary locus on a surface including the second surface to be polished and on a surface including the second surface to be polished.

〔作用〕[Effect]

本発明の方法においては、研磨時に、加工物および研磨
部材のいずれの側においても、自転運動は発生しない。
In the method of the present invention, no rotational motion occurs on either side of the workpiece or the polishing member during polishing.

このために、加工物の被研磨面の各部においける研磨部
材との間の相対軌跡は実質的に等しくなる。この結果、
被研磨面の各部分における研磨運動量も等しくなり、各
部分が均一に研磨される。換言すると、精度のよい研磨
が行われる。
For this reason, the relative trajectories between each part of the polished surface of the workpiece and the polishing member are substantially equal. As a result,
The polishing momentum in each part of the surface to be polished is also equal, and each part is polished uniformly. In other words, highly accurate polishing is performed.

〔実施例〕〔Example〕

以下に、図面を参照して本発明の詳細な説明する。 The present invention will be described in detail below with reference to the drawings.

第1図ないし第5図には、本発明の方法に従って研磨動
作を行う研磨機の例を示しである。まず、第1図ないし
第3図に示すように、本例の研磨機21は、定位置に固
定配置した定盤22と、この上面に固定した研磨板23
と、この直上位置において研磨板に対峙した状態に吊り
下げられたワーク保持板24とを備えている。このワー
ク保持板24の上側には、機枠(図示せず)によって揺
動棒25が垂直に支持されており、この揺動棒25の下
端に形成したピボット25aによって、ここを中心に揺
動可能に、上記のワーク保持板24が吊り下げられてい
る。このワーク保持板24の下面に、加工物27が固定
支持される。
1 to 5 illustrate examples of polishing machines that perform polishing operations according to the method of the present invention. First, as shown in FIGS. 1 to 3, the polishing machine 21 of this example includes a surface plate 22 fixed at a fixed position, and a polishing plate 23 fixed on the upper surface of the surface plate 22.
and a work holding plate 24 suspended in a position directly above the polishing plate facing the polishing plate. A swinging rod 25 is vertically supported on the upper side of this work holding plate 24 by a machine frame (not shown), and is pivoted about this by a pivot 25a formed at the lower end of this swinging rod 25. Possibly, the work holding plate 24 mentioned above is suspended. A workpiece 27 is fixedly supported on the lower surface of this workpiece holding plate 24 .

ここに、ワーク保持板24の上面には、その揺動中心を
通る溝24aが形成されており、揺動中心を挟み、両側
の溝内には、揺動棒25に固着した回り止め部材26の
係合爪26r、26fが嵌入している。
Here, a groove 24a passing through the center of swing is formed on the upper surface of the workpiece holding plate 24, and a detent member 26 fixed to the swing rod 25 is placed in the groove on both sides of the center of swing. The engaging claws 26r and 26f are fitted.

上記の揺動棒25は、不図示の昇降機構によって昇降可
能となっている。このような昇降機構は、エアーシリン
ダなどの駆動機構を利用して当業者ならば極めて容易に
構成することができると共に、同様な機構は当該分野に
おける研磨機において利用されているので、その詳細な
説明は省略する。
The above-mentioned swing rod 25 can be raised and lowered by a lifting mechanism (not shown). Such a lifting mechanism can be easily constructed by a person skilled in the art by using a drive mechanism such as an air cylinder, and similar mechanisms are used in polishing machines in the field, so please refer to the detailed explanation below. Explanation will be omitted.

研磨される加工物27は、かかる昇降機構によって、研
磨板23に対して一定の力で押しつけられる。
The workpiece 27 to be polished is pressed against the polishing plate 23 with a constant force by the lifting mechanism.

これに加えて、この揺動棒25は、第3図に示すように
、水平面上(加工物27の被研磨面27aを含む面上)
を一定のピッチで円を描きながら全体として矩形を描く
ような軌跡に沿って移動されるようになっている。
In addition, as shown in FIG.
It is designed to move along a trajectory that draws a rectangular shape as a whole while drawing a circle at a constant pitch.

第4図には、かか軌跡に沿って揺動棒を駆動させるのに
好適な駆動機構の例を示しである。この駆動機構31は
、二輪スライド機構であり、矩形に組んだ四辺のうちの
一方の対向辺に、X方向に向けて延びるボールねじ32
およびガイドロッド33が支持されおり、同様に他方の
側の対向辺には、X方向に向けて延びるボールねじ34
およびガイドロッド35が支持されている。そして、ボ
ールねじ32およびロッド33の間には、X方向に延び
るX方向移動ロッド37が支持され、ボールねじ34お
よびロッド35の間には、X方向に延びるX方向移動ロ
ッド38が支持されている。
FIG. 4 shows an example of a drive mechanism suitable for driving the rocking rod along the heel trajectory. This drive mechanism 31 is a two-wheel slide mechanism, and a ball screw 32 extending in the X direction is provided on one opposite side of the four sides assembled in a rectangle.
and a guide rod 33 are supported, and similarly a ball screw 34 extending in the X direction is provided on the opposite side on the other side.
and a guide rod 35 are supported. An X-direction moving rod 37 extending in the X direction is supported between the ball screw 32 and the rod 33, and an X-direction moving rod 38 extending in the X direction is supported between the ball screw 34 and the rod 35. There is.

これらのX方向移動ロッド37およびX方向移動ロッド
38は、それぞれスライダ39を摺動可能に貫通して延
びている。このスライダ39には、前述した揺動棒25
の上端側が支持されている。
The X-direction moving rod 37 and the X-direction moving rod 38 extend slidably through the slider 39, respectively. This slider 39 includes the aforementioned swing rod 25.
The upper end side of is supported.

一方、各ボールねじ32.34は、それぞれモータ41
,42によって回転駆動される。
On the other hand, each ball screw 32, 34 is connected to a motor 41, respectively.
, 42.

このように構成した駆動機構31においては、各モータ
41.42の駆動を、シーケンサあるいはマイクロコン
ピュータによって制御することにより、平面上の任意の
位置にスライダ39を移動させることができる。換言す
ると、゛平面上において任意の軌跡に沿ってスライダ3
9を移動させることができ、従って、ここに支持されて
いる揺動棒25を第3図に示す軌跡に沿って移動させる
ことができる。
In the drive mechanism 31 configured in this manner, the slider 39 can be moved to any position on a plane by controlling the drive of each motor 41, 42 by a sequencer or a microcomputer. In other words, move the slider 3 along an arbitrary trajectory on the plane.
9 can be moved, and thus the swinging rod 25 supported thereon can be moved along the trajectory shown in FIG.

このように構成した本例の研磨機21においては、まず
、第1図および第2図に示すように、加工物27を研磨
板23上に乗せ、この上から、ワーク保持板24を一定
の力で押しつける。かかる状態で、第4図に示すような
駆動機構によって、揺動棒25を第3図に示す軌跡に沿
って揺動させる。この揺動運動中においては、揺動棒2
5の下端側に支持されているワーク保持板24は、回転
止め部材26によってその自転が禁止されているので、
自転運動することなく、揺動棒25と共に同一の軌跡を
描く。一方、研磨板23の側は、定盤22の側に固定さ
れているので、ワーク保持板24および加工物27が運
動したとしても、自転などの運動は行わない。この結果
、加工物27の被研磨面27a上における各点では、研
磨板23との間の相対運動軌跡が同一となり、第5図に
示す模様を描くことになる。従って、被研磨面27a上
の各点における研磨加工運動量は等しくなり、よって、
均一で精度のよい研磨が行われる。
In the polishing machine 21 of this example configured as described above, first, as shown in FIGS. Press with force. In this state, the swing rod 25 is swung along the trajectory shown in FIG. 3 by a drive mechanism as shown in FIG. 4. During this rocking movement, the rocking rod 2
The workpiece holding plate 24 supported on the lower end side of the frame 5 is prevented from rotating by the rotation stopper member 26.
It draws the same trajectory together with the swinging rod 25 without rotating. On the other hand, since the polishing plate 23 side is fixed to the surface plate 22 side, even if the workpiece holding plate 24 and the workpiece 27 move, they do not rotate or otherwise move. As a result, at each point on the polished surface 27a of the workpiece 27, the locus of relative movement with respect to the polishing plate 23 becomes the same, and the pattern shown in FIG. 5 is drawn. Therefore, the polishing momentum at each point on the surface to be polished 27a is equal, and therefore,
Uniform and precise polishing is performed.

血支皇隻豆鳳 上記の例においては、加工物27の側を揺動運動させる
ようにしているが、この代わりに、研磨板の側を揺動運
動させるようにしてもよい。この場合には、加工物が自
転運動しないように、固定しておく必要がある。あるい
は、双方を共に揺動させても良い。また、揺動棒の軌跡
としては、どのようなパターンであってもよ(、例えば
第6図および第7図に示す軌跡を挙げることができる。
In the above example, the side of the workpiece 27 is rocked, but instead of this, the side of the polishing plate may be rocked. In this case, it is necessary to fix the workpiece so that it does not rotate. Alternatively, both may be oscillated together. Further, the trajectory of the swinging rod may be any pattern (for example, the trajectory shown in FIGS. 6 and 7 can be cited).

さらに、上記の例では、加工物27の被研磨面が一面で
あり、従って、研磨板も一個であるが、多数の研磨面を
複数の研磨板によって同時的に研磨するようにしてもよ
いことは勿論である。
Furthermore, in the above example, the surface to be polished of the workpiece 27 is one surface, and therefore there is only one polishing plate, but a large number of polishing surfaces may be simultaneously polished by a plurality of polishing plates. Of course.

一方、上記の例は、加工物27の一方の面を研磨する研
磨機に本発明の方法を適用した例であるが、加工物の上
下双方の面を同時に研磨する構成の研磨機に対しても同
様に本発明の方法を適用することが可能である。この場
合においては、加工物を定位置に固定配置し、その上下
に押しつけた研磨板を、自転運動させない状態で一定の
軌跡を描くように揺動運動させればよい。あるいは、研
磨板の側を自転運動あるいは揺動運動しないように定ま
った位置に固定しておき、加工物の側を、自転運動させ
ない状態で、一定のパターンの軌跡に沿って揺動運動さ
せればよい。
On the other hand, the above example is an example in which the method of the present invention is applied to a polishing machine that polishes one surface of the workpiece 27. It is also possible to apply the method of the present invention to. In this case, the workpiece may be fixed at a fixed position, and the polishing plates pressed above and below the workpiece may be oscillated so as to draw a constant trajectory without rotating. Alternatively, the side of the polishing plate may be fixed at a fixed position so as not to rotate or oscillate, and the side of the workpiece may be oscillated along a fixed pattern of loci without rotating. Bye.

(発明の効果〕 以上説明したように、本発明の方法においては、加工物
および研磨部材を自転運動が生じないように支持し、少
なくとも一方の側を所定のパターンで揺動運動させるよ
うにしている。従って、本発明の方法によれば、加工物
のどの部分に対しても研磨板が実質的に等しい相対軌跡
を措くので、加工物あるいは研磨部材の側に自転運動が
起きることに起因した周速差が原因となって研磨むらが
発生する事態を回避できる。よって、被研磨面の各部分
を均一に研磨することができ、精度のよい研磨動作を行
うことが可能となる。従って、本発明の方法を採用すれ
ば、高精度研磨を高速で行うことができ、大型の加工物
の高精度研磨も容易に行うことができ、しかも、加工物
形状に係わらず精度のよい研磨を行うことができる。
(Effects of the Invention) As explained above, in the method of the present invention, the workpiece and the polishing member are supported so as not to rotate, and at least one side is caused to swing in a predetermined pattern. Therefore, according to the method of the present invention, since the polishing plate follows a substantially equal relative trajectory with respect to any part of the workpiece, the rotational motion on the side of the workpiece or the polishing member is avoided. It is possible to avoid the situation where uneven polishing occurs due to differences in circumferential speed. Therefore, each part of the surface to be polished can be uniformly polished, and it is possible to perform a highly accurate polishing operation. Therefore, By adopting the method of the present invention, high-precision polishing can be performed at high speed, high-precision polishing of large workpieces can be easily performed, and highly accurate polishing can be performed regardless of the shape of the workpiece. be able to.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の方法を適用した研磨機の概略構成を示
す正面図、第2図は第1図の研磨機の概略側面図、第3
図は第1図の研摩機の揺動棒の軌跡を示す説明図、第4
図は第1図の研磨機における揺動棒の駆動機構を示す概
略構成図、第5図は第1図の研磨機における加工物と研
磨板との相対軌跡を示す線図、第6図および第7図は加
工物と研磨板との相対軌跡の別の例をそれぞれ示す線図
、第8図は従来の研磨機の構成を示す概略構成図、第9
図(A)および(B)は従来の別の研磨機における構成
を示す概略側面図および概略平面図である。 〔符号の説明〕 21・・・研磨機 23・・・研磨板 ・・・ワーク保持板 ・・・揺動棒 ・・・回転止め部材 ・・・加工物 a・・・被研磨面 ・・・揺動棒の駆動機構。 第4図 第7図 第8図 第5図 冒 ワ 第6図 第9図
FIG. 1 is a front view showing a schematic configuration of a polishing machine to which the method of the present invention is applied, FIG. 2 is a schematic side view of the polishing machine shown in FIG. 1, and FIG.
The figure is an explanatory diagram showing the locus of the swinging rod of the polishing machine in Figure 1, and Figure 4.
The figure is a schematic configuration diagram showing the drive mechanism of the rocking rod in the polishing machine of Figure 1, Figure 5 is a line diagram showing the relative locus of the workpiece and polishing plate in the polishing machine of Figure 1, Figures 6 and FIG. 7 is a diagram showing another example of the relative trajectory between the workpiece and the polishing plate, FIG. 8 is a schematic diagram showing the configuration of a conventional polishing machine, and FIG.
Figures (A) and (B) are a schematic side view and a schematic plan view showing the configuration of another conventional polishing machine. [Explanation of symbols] 21... Polishing machine 23... Polishing plate... Work holding plate... Rocking rod... Rotation stopping member... Workpiece a... Surface to be polished... Swing rod drive mechanism. Figure 4 Figure 7 Figure 8 Figure 5 Exploration Figure 6 Figure 9

Claims (2)

【特許請求の範囲】[Claims] (1)加工物の少なくとの一つの被研磨面に対して少な
くとも一つの研磨部材を一定の力で押しつけ、 前記加工物および研磨部材のそれぞれを自転運動しない
ように固定し、 前記加工物および研磨部材のうちの少なくとも一方の側
を、前記被研磨面を含む面上において任意の軌跡を描く
ように揺動させ、 前記加工物の被研磨面の研磨を行うようになっている相
対等速度研磨方法。
(1) Pressing at least one polishing member against at least one surface to be polished of the workpiece with a constant force, fixing each of the workpiece and the polishing member so as not to rotate, the workpiece and At least one side of the polishing member is oscillated so as to draw an arbitrary trajectory on a surface including the surface to be polished, and the surface to be polished of the workpiece is polished at a relative constant velocity. Polishing method.
(2)対向した位置にある加工物の第1および第2の被
研磨面に対して、それぞれ第1および第2の研磨部材を
、前記加工物を挟む状態で、一定の力で押しつけ、 前記加工物並びに第1および第2の研磨部材のそれぞれ
を自転運動しないように固定し、前記加工物の側、およ
び、前記第1および第2の研磨部材の側の少なくとも一
方の側を、前記第1の被研磨面を含む面上および前記第
2の被研磨面を含む面上において任意の軌跡を描くよう
に揺動させ、 前記加工物の第1および第2の被研磨面の研磨を行うよ
うになっている相対等速度研磨方法。
(2) Pressing the first and second polishing members with a constant force against the first and second polished surfaces of the workpiece located at opposing positions, respectively, with the workpiece sandwiched therebetween, and The workpiece and each of the first and second polishing members are fixed so as not to rotate, and at least one side of the workpiece and the first and second polishing members is fixed to the workpiece and the first and second polishing members. polishing the first and second surfaces of the workpiece by swinging it so as to draw an arbitrary trajectory on a surface including the first surface to be polished and a surface including the second surface to be polished; This is a relative constant speed polishing method.
JP18354190A 1990-07-11 1990-07-11 Relatively equal speed polishing method Pending JPH0469147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18354190A JPH0469147A (en) 1990-07-11 1990-07-11 Relatively equal speed polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18354190A JPH0469147A (en) 1990-07-11 1990-07-11 Relatively equal speed polishing method

Publications (1)

Publication Number Publication Date
JPH0469147A true JPH0469147A (en) 1992-03-04

Family

ID=16137623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18354190A Pending JPH0469147A (en) 1990-07-11 1990-07-11 Relatively equal speed polishing method

Country Status (1)

Country Link
JP (1) JPH0469147A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5989107A (en) * 1996-05-16 1999-11-23 Ebara Corporation Method for polishing workpieces and apparatus therefor
US6343978B1 (en) 1997-05-16 2002-02-05 Ebara Corporation Method and apparatus for polishing workpiece
US6354922B1 (en) 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
US6413156B1 (en) 1996-05-16 2002-07-02 Ebara Corporation Method and apparatus for polishing workpiece
US6682408B2 (en) 1999-03-05 2004-01-27 Ebara Corporation Polishing apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5989107A (en) * 1996-05-16 1999-11-23 Ebara Corporation Method for polishing workpieces and apparatus therefor
US6413156B1 (en) 1996-05-16 2002-07-02 Ebara Corporation Method and apparatus for polishing workpiece
US7011569B2 (en) 1996-05-16 2006-03-14 Ebara Corporation Method and apparatus for polishing workpiece
US6343978B1 (en) 1997-05-16 2002-02-05 Ebara Corporation Method and apparatus for polishing workpiece
US6682408B2 (en) 1999-03-05 2004-01-27 Ebara Corporation Polishing apparatus
US6878044B2 (en) 1999-03-05 2005-04-12 Ebara Corporation Polishing apparatus
US7632378B2 (en) 1999-03-05 2009-12-15 Ebara Corporation Polishing apparatus
US6354922B1 (en) 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus

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