JPH0467379U - - Google Patents
Info
- Publication number
- JPH0467379U JPH0467379U JP11095390U JP11095390U JPH0467379U JP H0467379 U JPH0467379 U JP H0467379U JP 11095390 U JP11095390 U JP 11095390U JP 11095390 U JP11095390 U JP 11095390U JP H0467379 U JPH0467379 U JP H0467379U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- hole
- tip
- butt
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａ，ｂは本考案の一実施例を示す断面図
、第２図は従来の実装構造を示す側面図である。
１……バツトリードパツケージ、２……基板、
３……穴、４……導体めつき部、５……ハンダ、
１１……リード、１４……パツド部、２１……配
線層。
1A and 1B are cross-sectional views showing an embodiment of the present invention, and FIG. 2 is a side view showing a conventional mounting structure. 1... Butt lead package cage, 2... Board,
3...hole, 4...conductor plating part, 5...solder,
11... Lead, 14... Pad portion, 21... Wiring layer.
Claims (1)
トリードパツケージのリードの先端部が挿入され
、前記穴と前記リード先端部とがハンダで接続さ
れることを特徴とするバツトリードパツケージの
実装構造。 Mounting of a butt lead package characterized in that a concave hole is formed in the surface of a substrate, a tip of a lead of a butt lead package is inserted into the hole, and the hole and the tip of the lead are connected by solder. structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11095390U JPH0467379U (en) | 1990-10-23 | 1990-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11095390U JPH0467379U (en) | 1990-10-23 | 1990-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0467379U true JPH0467379U (en) | 1992-06-15 |
Family
ID=31858361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11095390U Pending JPH0467379U (en) | 1990-10-23 | 1990-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0467379U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07263830A (en) * | 1993-12-17 | 1995-10-13 | Hughes Aircraft Co | Interconnection structure between cavity and bump parts for electronic package |
-
1990
- 1990-10-23 JP JP11095390U patent/JPH0467379U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07263830A (en) * | 1993-12-17 | 1995-10-13 | Hughes Aircraft Co | Interconnection structure between cavity and bump parts for electronic package |