JPH0445276B2 - - Google Patents
Info
- Publication number
- JPH0445276B2 JPH0445276B2 JP2042027A JP4202790A JPH0445276B2 JP H0445276 B2 JPH0445276 B2 JP H0445276B2 JP 2042027 A JP2042027 A JP 2042027A JP 4202790 A JP4202790 A JP 4202790A JP H0445276 B2 JPH0445276 B2 JP H0445276B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- plating
- layer
- thickness
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 30
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 30
- 238000003466 welding Methods 0.000 claims description 11
- 229910000838 Al alloy Inorganic materials 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 61
- 238000007747 plating Methods 0.000 description 19
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- 229910000943 NiAl Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、アルミニウムパツケージに関し、例
えばGaAsFETなどのような半導体を利用したマ
イクロ波用アンプを密封収容するアルミニウムパ
ツケージの製法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an aluminum package, and more particularly, to a method for manufacturing an aluminum package that hermetically houses a microwave amplifier using a semiconductor such as GaAsFET.
従来のこの種マイクロ波用アンプパツケージ
は、周知の通り、鉄系材料、主としてステンレス
鋼から製作されている。 As is well known, conventional microwave amplifier packages of this type are made of iron-based materials, mainly stainless steel.
このようなパツケージは、熱放散性は乏しいば
かりでなく非常に重いため、かかるパツケージに
近年求められている２つの課題、すなわち、軽量
化（特に航空機に搭載する場合などに必要であ
る）と良熱伝導性（これが悪いと、高出力アンプ
の場合、その発熱に原因して回路素子の損傷がひ
きおこされる）を満たすことができない。 Such packages not only have poor heat dissipation properties but also are very heavy, which has led to two recent demands on such packages: weight reduction (especially necessary when mounted on aircraft) and quality. Thermal conductivity (poor thermal conductivity can cause damage to circuit elements due to heat generation in the case of high-power amplifiers) cannot be met.
近年、アンプに対する高出力化と小型軽量化へ
の要求が高まつており、熱放散性が良く、軽量な
アルミニウムパツケージが着目されているがアル
ミニウムは熱放散性が極めて良いためにパルスレ
ーザによりシーム溶接による密封封止する際、急
冷によるクラツクが生じて、要求される気密が保
てないのが現状である。 In recent years, there has been an increasing demand for higher output power, smaller size, and lighter weight for amplifiers, and attention has been focused on lightweight aluminum packages with good heat dissipation properties.Aluminum has extremely good heat dissipation properties, so it is possible to seam it using a pulsed laser. Currently, when sealing by welding, cracks occur due to rapid cooling, making it impossible to maintain the required airtightness.
本発明者はかかる問題を解決する為に、それぞ
れがアルミニウム又はアルミニウム合金からなる
ケースとカバーとの間に中間金属層を介在させレ
ーザ溶接したアルミニウムパツケージを既に特願
昭57−106150特開昭58−223350号公報に出願して
いる。
In order to solve this problem, the present inventor has already developed an aluminum package in which an intermediate metal layer is interposed between a case and a cover, each of which is made of aluminum or an aluminum alloy, and is laser welded. -The application has been filed in Publication No. 223350.
本発明は工程数を少なくし、耐食性を向上させ
たアルミニウムパツケージの製法を提供せんとす
るものである。本発明者出願の上記特願昭57−
106150（特開昭58−223350号公報）には中間金属
層としてCu＋Ni複合メツキ層を用いる実施例も
示した。即ちアルミニウムもしくはアルミニウム
合金上に直接Niメツキ層を形成することはめつ
き前のAlの表面が清浄化されていない場合剥離
しやすいという理由でアルミニウムもしくはアル
ミニウム合金とNi層との間にCuメツキ層を設け
たものであり、工程数が多いと云うことの他Cu
とAlとは大きな電位差があるので、耐食性が悪
い。
The present invention aims to provide a method for manufacturing an aluminum package that reduces the number of steps and improves corrosion resistance. The above patent application filed by the present inventor in 1983-
106150 (Japanese Unexamined Patent Publication No. 58-223350) also shows an example in which a Cu+Ni composite plating layer is used as the intermediate metal layer. In other words, forming a Ni plating layer directly on aluminum or an aluminum alloy is not a good idea because it is easy to peel off if the Al surface is not cleaned before plating. In addition to the large number of steps, Cu
Since there is a large potential difference between aluminum and aluminum, corrosion resistance is poor.
そこで、この問題を改決する方法としてAlに
直接Niとめつきを施すことが考えられるが、Al
とNiとの金属間化合物の発生などにより溶接が
困難であるという問題があつた。 Therefore, one possible way to resolve this problem is to apply Ni directly to Al.
There was a problem that welding was difficult due to the generation of intermetallic compounds between Ni and Ni.
上記問題点はそれぞれがアルミニウム又はアル
ミニウム合金からなるケースとカバーとの間に介
在させる中間金属層として、溶接部のNi量が1.5
〜10wt％となる厚さのNi層を用いてレーザ溶接
により密封結合される本発明によるアルミニウム
パツケージの製法により達成される。
The above problem is that the intermediate metal layer interposed between the case and cover, each made of aluminum or aluminum alloy, has a Ni content of 1.5 in the welded part.
This is achieved by the method of manufacturing an aluminum package according to the invention, which is hermetically bonded by laser welding using a Ni layer with a thickness of ~10 wt%.
アルミニウム、又はアルミニウム合金からなる
ケース、カバー間の溶接部のNi量が1.5〜10wt％
の範囲にあるとき溶接部におけるクラツクの生じ
る危険が殆んどない、これ以下、あるいはこれ以
上の場合は後述のように共に溶接による接合強度
が低下する。
Case made of aluminum or aluminum alloy, the amount of Ni in the welded part between the cover is 1.5 to 10wt%
When it is within this range, there is almost no risk of cracks occurring in the welded part, and when it is less than or above this range, the strength of the welded joint decreases as will be described later.
又Ni層はCuの如くAlとの間に大きい電位差は
なく耐食性も向上し信頼性の高いこの種パツケー
ジが得られる。 Also, unlike Cu, the Ni layer does not have a large potential difference with Al, and corrosion resistance is improved, making it possible to obtain this type of package with high reliability.
以下に本発明の実施例を説明する。 Examples of the present invention will be described below.
実施例 １
第１図に斜視図で示すアルミニウムからなるふ
た１とケース２の全面にそれぞれ電気めつきによ
り、封止後の溶接部のNi量が３〜10wt％となる
ようにNi層を形成した。Example 1 A Ni layer was formed on the entire surface of the lid 1 and case 2 made of aluminum shown in a perspective view in FIG. 1 by electroplating so that the amount of Ni in the welded part after sealing was 3 to 10 wt%. did.
アルミニウムのふた１とケース２の全面にNi
メツキ層を形成するのは次の如き利点を有する。 Ni on the entire surface of aluminum lid 1 and case 2
Forming a plating layer has the following advantages.
(1) Al−Siなどのろう材なしで溶接ができる。(1) Can be welded without a filler metal such as Al-Si.
(2) 耐食性を向上することができる。(2) Corrosion resistance can be improved.
(3) 直接、端子などをはんだ付けできる。(3) Terminals, etc. can be soldered directly.
その後、ふた１とケース２を第２図に側面図で
示すように配置し、窒素ガス雰囲気中にてレーザ
発振器４からレンズ系５を介して接合部にパルス
レーザビームを照射してシーム溶接する。ここ
で、パルスレーザビームは例えばパルス幅４ｍ
sec、パルスレート20pps、平均出力310W、ビー
ム速度5.4mm／secの条件で0.1mm中に集光して照射
する。 Thereafter, the lid 1 and the case 2 are arranged as shown in the side view in FIG. 2, and the joint is seam-welded by irradiating the joint with a pulsed laser beam from the laser oscillator 4 through the lens system 5 in a nitrogen gas atmosphere. . Here, the pulsed laser beam has a pulse width of 4 m, for example.
sec, pulse rate 20pps, average output 310W, and beam speed 5.4mm/sec. Focus and irradiate within 0.1mm.
このような条件で気密封止したアルミニウムパ
ツケージの気密性をヘリウムリークデイテクター
により調べたところ、１×10-10atm・c.c.／ｓ以
下の高い気密性を有することを確認した。 When the airtightness of the aluminum package hermetically sealed under these conditions was examined using a helium leak detector, it was confirmed that the aluminum package had a high airtightness of 1×10 -10 atm·cc/s or less.
なお、電解ニツケルメツキによる場合封止後の
溶接部のNi層を３〜10wt％とするのは次の理由
による。 In the case of electrolytic nickel plating, the reason why the Ni layer in the welded part after sealing is 3 to 10 wt% is as follows.
Ni量が3wt％より少い場合、アルミニウムもし
くはアルミニウム合金にNiを加えることにより
接合部での強度を高める効果が低下する。 When the amount of Ni is less than 3 wt%, the effect of increasing the strength at the joint by adding Ni to aluminum or aluminum alloy is reduced.
一方Ni量が10wt％より多い場合ニツケルアル
ミニウム金属間化合物Al3Ni等が形成されもろく
なり、接合部での強度が低下する。 On the other hand, if the amount of Ni is more than 10 wt%, nickel-aluminum intermetallic compounds such as Al 3 Ni are formed, resulting in brittleness and reduced strength at the joint.
第３図は中間金属層としての最適Ni層厚さを
規定する為の実験データを示す。 Figure 3 shows experimental data for defining the optimum Ni layer thickness as the intermediate metal layer.
第３図ａは、純アルミニウム（1100）1′、他方
がアルミニウム合金（5052）2′であるアルミパツ
ケージ材料の各々にNiメツキ層６を形成した後
に、レーザ溶接した溶接部の側断面拡大図であ
る。接合部７ではレーザビーム照射により溶融し
たアルミニウムニツケル合金となつている。1′，
2′は厚さ３mmであるのに溶融部は約１mm程度の深
さまで達している。アルミニウムパツケージの接
合部の信頼性を調べるために、電解Niメツキ層
の膜厚を変えた場合の接合部の引張強度の変化を
第３図ｂに示す。 Figure 3a is an enlarged side cross-sectional view of a welded part that was laser welded after forming a Ni plating layer 6 on each of the aluminum package materials, one made of pure aluminum (1100) 1' and the other made of aluminum alloy (5052) 2'. It is. The joint portion 7 is made of aluminum-nickel alloy melted by laser beam irradiation. 1',
2' has a thickness of 3 mm, but the melted part reaches a depth of approximately 1 mm. In order to investigate the reliability of the joints of aluminum packages, Figure 3b shows the changes in the tensile strength of the joints when the thickness of the electrolytic Ni plating layer was varied.
図は、縦軸に引張強度（Kgｆ／mm2）で、横軸に
電解Niメツキ層厚さ（μｍ）でプロツトしたも
のである。 In the figure, the vertical axis is the tensile strength (Kgf/mm 2 ), and the horizontal axis is the electrolytic Ni plating layer thickness (μm).
純アルミニウム1100の引張強度は９Kgｆ／mm2で
あり、又、アルミニウム合金5052の引張強度は
19.5Kgｆ／mm2であるが、純アルミニウム1100とア
ルミニウム合金5052をNi層を介して接合された
接合部の引張強度はNi層厚さが約15μｍ程度の時
最大強度を示し、厚さ９〜18μｍのNi層厚さでク
ラツクを生ずることなく接合することができる。 The tensile strength of pure aluminum 1100 is 9Kgf/ mm2 , and the tensile strength of aluminum alloy 5052 is
19.5Kgf/ mm2 , but the tensile strength of the joint where pure aluminum 1100 and aluminum alloy 5052 are joined through the Ni layer shows the maximum strength when the Ni layer thickness is about 15μm, and when the thickness is 9~ Bonding can be achieved with a Ni layer thickness of 18 μm without causing any cracks.
Ni層厚さが9μｍより薄い場合、純アルミニウ
ム1100の接合部近傍の熱影響部で切断が生じ、強
度が低下する。 When the Ni layer thickness is thinner than 9 μm, cutting occurs in the heat affected zone near the joint of pure aluminum 1100, resulting in a decrease in strength.
又一方Ni層厚さが18μｍよりも厚い場合、
Al3Ni等の金属間化合物が生じ、もろくなり、ク
ラツクが生じ、強度が低下する。 On the other hand, if the Ni layer thickness is thicker than 18 μm,
Intermetallic compounds such as Al 3 Ni are formed, resulting in brittleness, cracks, and reduced strength.
第４図は接合部の合金層中のNi含有量が異な
る２つの合金層ａ，ｂのＸ線回折の状態を縦軸に
Ｘ線強度を、横軸にＸ線回折角で示し、ａは合金
層中のNi含有量が7wt％のもの、ｂは合金層中の
Ni含有量が15wt％のＸ線回折を示す。ａではAl
の回折ピークが主であるが、ｂではAlのピーク
の他にAl3Niのピークが多く検出される。 Figure 4 shows the state of X-ray diffraction of two alloy layers a and b with different Ni contents in the alloy layers at the joint, with the vertical axis representing the X-ray intensity and the horizontal axis representing the X-ray diffraction angle. Ni content in the alloy layer is 7wt%, b is in the alloy layer
Shows X-ray diffraction with Ni content of 15wt%. In a, Al
The diffraction peak is the main one, but in b, many Al 3 Ni peaks are detected in addition to the Al peak.
電解Niメツキによるクラツクが生じない接合
部でのNi含有量は３〜10wt％であることが判つ
た。 It was found that the Ni content in the joint where no cracks occur due to electrolytic Ni plating is 3 to 10 wt%.
上記実施例については、電気めつきによるもの
である。 The above embodiments are based on electroplating.
実施例 ２
電気めつきでは、めつき厚さは被めつき材の周
縁部に厚く着きやすく、平坦な部分でも膜厚のバ
ラツキが大きい。Example 2 In electroplating, the plating thickness tends to be thicker at the peripheral edge of the plated material, and the film thickness varies greatly even on flat areas.
これに対し、無電解めつきでは、めつき厚さの
均一性は電気めつきに比べ優れており、めつき膜
厚のバラツキも小さい。 On the other hand, in electroless plating, the uniformity of the plating thickness is superior to that of electroplating, and the variation in the plating film thickness is also small.
これを明らかにする為第５図の如くNiめつき
５３がほぼ全面均一に行われ、めつき厚にバラツ
キが生じない無電解めつきをケース側５１及びフ
タ側５２の両方に行つた試料を用いレーザ溶接を
行つた。 In order to clarify this, a sample was prepared in which Ni plating 53 was applied almost uniformly over the entire surface and electroless plating was performed on both the case side 51 and the lid side 52, with no variation in the plating thickness, as shown in Fig. 5. Laser welding was performed using
結果を第６図、第７図、第８図に示す。 The results are shown in FIGS. 6, 7, and 8.
クラツクの生じないアルミニウムニツケル合金
中のNi含有量は第７図に示されるように、1.5〜
10wt％であつた。又この値はトータルのNiめつ
き厚が2.4〜18μｍであり、ケース側、フタ側各々
の無電解Niめつき厚は1.2〜9μｍである。 As shown in Figure 7, the Ni content in an aluminum-nickel alloy that does not cause cracks is between 1.5 and 1.5.
It was 10wt%. Further, this value indicates that the total Ni plating thickness is 2.4 to 18 μm, and the electroless Ni plating thickness on each of the case side and the lid side is 1.2 to 9 μm.
電解めつきによる場合とほぼ同じ結果をより精
度よく得ることができた。 Almost the same results as those obtained by electrolytic plating could be obtained with higher precision.
第６図はケース側、フタ側各々のNi無電解め
つき膜厚と引張強度及び引張応力の関係を示す図
である。第７図はNi無電解めつき膜厚t2とレーザ
溶融溶接部のNi含有量（wt％）の関係を示す図
である。 FIG. 6 is a diagram showing the relationship between the Ni electroless plating film thickness, tensile strength, and tensile stress on the case side and the lid side, respectively. FIG. 7 is a diagram showing the relationship between the Ni electroless plating film thickness t 2 and the Ni content (wt%) of the laser fusion welded part.
第８図はレーザ溶融溶接部のNi含有量（wt％）
と引張強度（MPa）の関係を示す図である。 Figure 8 shows the Ni content (wt%) of the laser fusion welded part.
It is a figure showing the relationship between and tensile strength (MPa).
引張試験は英国インストロン社製1195型万能引
張試験機を用いて、引張速度0.5mm／minで行な
つた。溶接部の組織観察は、２％HF溶液で10秒
エチチングした後、光学顕微鏡を用いて行なつ
た。その後、XMA分析によつて、溶接部のNi量
を求めた。硬さ試験はマイクロビツカース硬度計
を用いて荷重50ｇで行なつた。 The tensile test was conducted at a tensile speed of 0.5 mm/min using a 1195 universal tensile testing machine manufactured by Instron, UK. The structure of the weld was observed using an optical microscope after etching with a 2% HF solution for 10 seconds. Thereafter, the amount of Ni in the weld was determined by XMA analysis. The hardness test was conducted using a micro-Vickers hardness meter under a load of 50 g.
クラツク発生の有無とNiめつき厚の関係につ
いて考えると、NiとAlは、NiAl3，NiAl，
Ni3Alなどの金属間化合物を形成する。また、Al
とNiAl3は、Ni量が5.7％で共晶組織となる。ク
ラツクのない良好な溶接ができるのはNi量が６
％前後のときなので、この部分では共晶組織とな
つており、その結果、強度が上がりクラツクが発
生しなかつたものと考えられる。 Considering the relationship between the occurrence of cracks and the Ni plating thickness, Ni and Al are NiAl 3 , NiAl,
Forms intermetallic compounds such as Ni 3 Al. Also, Al
and NiAl 3 have a eutectic structure when the Ni content is 5.7%. Good welding without cracks is possible when the Ni content is 6.
%, it is thought that this part has a eutectic structure, and as a result, the strength is increased and no cracks occur.
Ni量の増加に伴い硬さが大きくなるのは、硬
くて脆いNiAl3の初晶が晶出するためである。高
Ni側でクラツクが発生するのは、この金属間化
合物の塑性変形能が極めて低いために、急冷時に
導入される内部応力が吸収できずに起こると考え
る。また、低Ni側でクラツクが発生するのは、
Ni量が少ないために、溶接部に熱間強度の低い
Alが晶出するためである。 The reason why the hardness increases as the amount of Ni increases is because primary crystals of hard and brittle NiAl 3 crystallize. high
It is thought that cracks occur on the Ni side because the intermetallic compound has extremely low plastic deformability and is unable to absorb the internal stress introduced during rapid cooling. Also, cracks occur on the low Ni side because
Due to the small amount of Ni, the hot strength of the welded part is low.
This is because Al crystallizes.
本発明はケースとふたからなるアルミニウムパ
ツケージにおいて該ケースとふたに直接、封止後
の溶接部のNi量が1.5〜10wt％になるように電気
めつきあるいは無電解めつきによりNi層を形成
し、この封止部をパルスレーザ溶接することによ
り溶接部にクラツクの生じない安定な気密封止を
可能とし、熱放散性が良く、電蝕の危険もなく、
高出力素子を搭載できる軽量なパツケージが安定
に容易な工程で得られる。
In the present invention, in an aluminum package consisting of a case and a lid, a Ni layer is formed directly on the case and the lid by electroplating or electroless plating so that the Ni content in the welded part after sealing is 1.5 to 10 wt%. By pulse laser welding this sealing part, it is possible to create a stable hermetic seal that does not cause cracks in the welded part, has good heat dissipation, and has no risk of electrolytic corrosion.
A lightweight package capable of mounting high-output elements can be obtained stably and through a simple process.
第１図は、本発明のアルミニウムパツケージ
の、気密封止溶接前の状態を示した斜視図、第２
図は、本発明のアルミニウムパツケージをレーザ
溶接により気密封止する方法を示した側面図、第
３図、第４図は本発明効果を説明する特性図、第
５図は無電解Niメツキを行つた試料のレーザ溶
接を説明する図、第６図はNiめつき膜厚と引張
強度、応力の関係を示す図、第７図はNi無電解
めつき膜厚とレーザ溶融溶接部のNi含有量の関
係を示す図、第８図はレーザ溶融溶接部のNi含
有量と、引張強度との関係を示す図である。
図中、１はカバー、２はケース、３は入出力端
子、４はレーザ発振器、５はレンズ系、６はNi
メツキ層である。
Fig. 1 is a perspective view showing the state of the aluminum package of the present invention before hermetically sealing welding;
The figure is a side view showing the method of hermetically sealing the aluminum package of the present invention by laser welding, Figures 3 and 4 are characteristic diagrams illustrating the effects of the present invention, and Figure 5 is an electroless Ni plating method. Figure 6 is a diagram explaining the laser welding of ivy samples. Figure 6 is a diagram showing the relationship between Ni plating film thickness, tensile strength, and stress. Figure 7 is Ni electroless plating film thickness and Ni content in laser fusion welding. FIG. 8 is a diagram showing the relationship between the Ni content of the laser fusion welded part and the tensile strength. In the figure, 1 is the cover, 2 is the case, 3 is the input/output terminal, 4 is the laser oscillator, 5 is the lens system, and 6 is Ni
This is the Metsuki layer.
Claims (1)
金からできているケースとカバーとの間に介在さ
せる中間金属層として、溶接部のNi量が1.5〜
10wt％になる厚さのNi層を用いることを特徴と
する特にレーザ溶接により密封結合されたアルミ
ニウムパツケージの製法。1 As an intermediate metal layer interposed between the case and the cover, each made of aluminum or aluminum alloy, the amount of Ni in the welded part is between 1.5 and 1.5.
A method for manufacturing an aluminum package hermetically bonded by laser welding, characterized by using a Ni layer with a thickness of 10 wt%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2042027A JPH02247094A (en) | 1990-02-22 | 1990-02-22 | Manufacture of aluminum package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2042027A JPH02247094A (en) | 1990-02-22 | 1990-02-22 | Manufacture of aluminum package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02247094A JPH02247094A (en) | 1990-10-02 |
| JPH0445276B2 true JPH0445276B2 (en) | 1992-07-24 |
Family
ID=12624685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2042027A Granted JPH02247094A (en) | 1990-02-22 | 1990-02-22 | Manufacture of aluminum package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02247094A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4564328B2 (en) * | 2004-10-18 | 2010-10-20 | 古河スカイ株式会社 | Housing for electronic equipment with excellent productivity and design |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111992914B (en) * | 2020-08-24 | 2022-08-02 | 珠海冠宇电池股份有限公司 | Welding equipment |
-
1990
- 1990-02-22 JP JP2042027A patent/JPH02247094A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4564328B2 (en) * | 2004-10-18 | 2010-10-20 | 古河スカイ株式会社 | Housing for electronic equipment with excellent productivity and design |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02247094A (en) | 1990-10-02 |
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