JPH04354344A - Film tape - Google Patents

Abstract

PURPOSE:To provide a film tape in which a deformation of a lead, generated in the case of resin-sealing in a resin injection mold, a resin flash between the leads can be reduced. CONSTITUTION:Protrusions 26 are formed at parts of leads 16 in contact with an inner edge of a resin injection mold (upper mold). The protrusions 26 are formed in a square shape, and protrude in a predetermined direction at respective lead groups. The length of each protrusion 26 is about half of an interval between the leads. A pressure to be applied from the mold to the leads 16 in the case of resin-sealing is alleviated, and the resin scarcely flows out between the leads.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film tape such as a TAB tape used for mounting semiconductor chips.

0002

[Prior art] TAB (Tape Automated
Bonding technology is one of the IC chip mounting technologies, and it is possible to form leads with a large number of pins and a narrow pitch compared to other mounting technologies. Another feature is that high-speed automatic bonding can be performed face-up. For this reason, TAB technology has attracted particular attention in recent years.

FIG. 11 is a schematic plan view of a typical conventional TAB tape, and FIG. 12 is a schematic cross-sectional view showing the TAB tape sandwiched between resin molding molds. Furthermore, Figure 11
is a schematic cross-sectional view of the TAB tape shown in FIG. 12 in the direction of the arrow B-B. In addition, the shaded part in FIG. 11 is
It's part of the film.

The TAB tape shown in FIG. 11 has an IC chip 112 and a film carrier on which leads 116 are formed on a film 114. IC chip 112 is connected to leads 116 via bumps 118. The film 114 has a device hole 122 in which the IC chip 112 is placed and two types of punched parts 124.
a, 124b are formed. Lead group 116a~
116b is drawn out in the vertical and horizontal directions as shown in FIG. Furthermore, the area surrounded by the dashed line L0 in FIG. 11 is the area to be resin molded.

[0005]

[Problems to be Solved by the Invention] By the way, when the leads 116 formed on a film tape such as TAB tape are held between the resin molding molds 132a and 132b, the lead 1
Since 16 is thick, there is a gap between the leads. For this reason, in the conventional film tape, the resin molding die 13
When resin is injected into 2a and 132b, there is a problem in that the resin flows between the leads and causes resin burrs between the leads.

[0006] Also, the lead 116 is molded into a resin mold 132.
There was a problem in that when the thin leads were held between a and 132b, a large amount of pressure was applied to the thin leads, causing the leads to deform. This deformation of the lead is particularly noticeable in the portion of the lead that comes into contact with the edge of the resin molding die.

The present invention has been made based on the above circumstances, and it is an object of the present invention to provide a film tape that can reduce lead deformation and resin burrs between leads that occur during resin sealing with a resin molding die. The purpose is to

[0008]

[Means for Solving the Problems] To achieve the above objects, the present invention provides a film tape comprising a film, a plurality of leads formed on the surface of the film, and a semiconductor element bonded to the leads. wherein, when the semiconductor element is resin-sealed using a resin mold, a protrusion is formed at least in a portion of the lead that comes into contact with an inner edge of the resin mold. It is.

[0009]

[Operation] According to the present invention, a protrusion is formed at least in the portion of the lead that comes into contact with the inner edge of the resin molding die, so that when resin sealing is performed, the resin molding die can be closed. The area of the lead that comes into contact with the inner edge can be increased, and therefore the pressure applied to the lead can be alleviated. Furthermore, by forming the protrusion, it is possible to suppress the amount of resin flowing out from between the leads.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1 to 5. Figure 1 shows a TAB which is an embodiment of the present invention.
A schematic plan view of the tape, FIG. 2 is a schematic partially enlarged plan view thereof,
FIG. 3 is a schematic enlarged perspective view of the protrusion, FIG. 4 is a schematic cross-sectional view of the TAB tape shown in FIG. FIG. 3 is a diagram illustrating the positional relationship between the two when sandwiched between resin molding molds.

The TAB tape shown in FIGS. 1 and 2 is
It comprises a chip 12 and a film carrier on which leads 16 are formed on a film 14. The IC chip 12 is connected to the leads 16 via bumps 18, and the IC chip 12 and leads 16 are provided only on one side of the TAB tape. A device hole (formed below the IC chip 12 in FIG. 1) 22 and two types of punched portions 24a and 24b are formed in the film 14. Further, the leads 16 are divided into four lead groups 16a, 16b, 16c, and 16d for each frame, and are pulled out in four directions (vertical, horizontal, and vertical directions in FIG. 1). Note that the film 14 is made of polyimide, which has good heat resistance and stretch resistance.

The punched portion 24a is formed within the resin-sealed region surrounded by the dashed line L, and the punched portion 24b is formed outside the resin-sealed region.

In this embodiment, the portion of the lead 16 that comes into contact with the inner edge of the resin molding die, that is, the position of the dashed line L, which is the boundary of the resin sealing area, as shown in FIGS. A protrusion 26 is formed. Projection part 2 of this embodiment
6 is formed in a rectangular shape and protrudes in a certain direction for each lead group 16a to 16b. Furthermore, the length of the protrusion 26 is approximately half the distance between the leads.

Next, a procedure for resin-sealing the IC chip 12 will be explained. The area of the TAB tape to be resin-sealed is the area surrounded by the dashed line L shown in FIG. 1, as described above. This one-dot chain line L is drawn slightly inward from the edge of the punched portion 24b. First, as shown in FIG. 4, a TAB tape is placed between an upper mold 32a and a lower mold 32b, and the TAB tape is sandwiched between the two molds. As a result, the inner edge of the upper mold 32a comes into contact with the protrusion 26 formed on the lead 16. The positional relationship between the TAB tape and the cavities 36a, 36b of both molds at this time is shown in FIG. However, in FIG. 5, the lead groups in the vertical direction are omitted for clarity.

Further, the lower mold 32b used in this embodiment has a lead group 16 among the edges along the cavity 36b.
A step portion 38 having a height slightly smaller than the thickness of the film 14 (for example, a height smaller than the thickness of the film by the thickness of the lead) is formed at the portion where a to 16b are pressed. Therefore, as shown in FIG. 4, the lower mold 32b has a stepped portion 38
engages with the film 14 at the end of the punched portion 24b. This allows the leads to bite into the film when both molds are pressed, thus reducing the gap between the leads. After the upper mold 32a and the lower mold 32b are brought into close contact with the TAB tape in this way, molten thermosetting resin is poured from the pot of the upper mold 32a, and the cavity 36 is
Press fit into a and 36b. Then, after leaving it or heating it for several hours to advance curing, the resin-molded TAB tape is taken out from the mold, and the resin sealing work is completed.

[0016] Conventionally, gaps were formed between the leads due to the thickness of the leads, and for this reason, when resin was injected, the resin sometimes flowed out from between the leads, causing burrs. However, in this example, since the protrusion is formed in the part of the lead where the upper mold and the lower mold engage, the resin that flows through between the leads during resin sealing is absorbed into the protrusion. This prevents the sealing resin from flowing out. Therefore, resin burrs generated between the leads are reduced compared to conventional ones.

Furthermore, by forming the protrusion on the part of the lead that contacts the inner edge of the upper mold, the area of the lead sandwiched between the upper mold and the lower mold becomes larger.
The pressure applied to the leads is alleviated, thus reducing deformation and breakage of the leads during resin sealing.

[0018] As described above, in this embodiment, problems with the TAB tape such as deformation of the TAB tape leads after transfer molding and resin burrs between the leads can be solved, so that the work can be carried out efficiently. It is possible to produce high quality TAB tape.

Incidentally, in the above embodiment, a case was explained in which the protruding portion was formed in a rectangular shape by protruding in a certain direction for each lead group, but the protruding portion may have a shape as shown in FIGS. 6 to 10, for example. It may be formed into

In the above embodiment, the protrusion 26 was formed to protrude in one direction, but the protrusion 26a shown in FIG.
are formed to protrude in both directions. This makes it more difficult for the resin to flow out between the leads than in the embodiments described above.

Further, as shown in FIG. 7, by forming the protrusions 26b shown in FIG. 6 in three layers, the amount of resin flowing between the leads can be further reduced. In this case, the inner edge of the resin molding die is brought into contact with, for example, the central protrusion.

Furthermore, the protrusion may be a wavy protrusion 26c as shown in FIG. 8, or an uneven protrusion 26d as shown in FIG. This makes it possible to suppress the amount of resin flowing out between the leads. In addition, when the protruding part is formed in a wavy shape or an uneven shape in this way, as shown in FIG. You may. This reduces deformation of the leads during resin sealing.

[0023]

As explained above, according to the present invention, a semiconductor element can be resin-sealed by forming a protrusion on at least the portion of the lead that comes into contact with the inner edge of the resin molding die. In this case, we use a film tape that can reduce the pressure applied to the leads from the resin molding mold and also prevent the resin from flowing out between the leads, reducing deformation of the leads and resin burrs between the leads. can be provided.

[Brief explanation of drawings]

FIG. 1 is a schematic plan view of a TAB tape that is an embodiment of the present invention.

FIG. 2 is a schematic partially enlarged plan view of the TAB tape of this example.

FIG. 3 is a schematic enlarged perspective view of a protrusion.

FIG. 4 is a schematic cross-sectional view of the TAB tape shown in FIG. 1 when viewed from the direction of arrow A-A with the TAB tape shown in FIG. 1 sandwiched between resin molding molds.

FIG. 5 is a diagram illustrating the positional relationship between the TAB tape and the resin molding die when the tape is sandwiched between the two.

FIG. 6 is a diagram showing another embodiment.

FIG. 7 is a diagram showing another embodiment.

FIG. 8 is a diagram showing another embodiment.

FIG. 9 is a diagram showing another embodiment.

FIG. 10 is a diagram showing another embodiment.

FIG. 11 is a schematic plan view of a typical conventional TAB tape.

FIG. 12 is a schematic cross-sectional view showing a state in which a conventional TAB tape is sandwiched between resin molding molds.

[Explanation of symbols]

12 IC chip 14 Film 16 Lead 16a-16d Lead group 18 Bump 22 Device hole 24a, 24b Punching part 26 Protruding part 32a Upper mold 32b Lower mold 36a, 36b Cavity 38 Step part L Boundary of area to be sealed with resin

Claims (5)

[Claims] 1. A film tape comprising a film, a plurality of leads formed on the surface of the film, and a semiconductor element bonded to the leads, wherein the semiconductor element is resin-sealed using a resin molding die. A film tape characterized in that a protruding portion is formed at least in a portion of the lead that comes into contact with an inner edge portion of the resin molding die. 2. The film tape according to claim 1, wherein the protrusion has a convex shape. 3. The film tape according to claim 1, wherein the protrusion has an uneven shape. 4. The film tape according to claim 1, wherein the protrusion has a corrugated shape. 5. The film tape according to claim 3, wherein the protruding portion is formed to have a wider width at a portion that comes into contact with an inner edge portion of the resin molding die than at other portions.