JPH04293706A - Method for bonding copper-based sintered friction material to substrate - Google Patents
Method for bonding copper-based sintered friction material to substrateInfo
- Publication number
- JPH04293706A JPH04293706A JP5897391A JP5897391A JPH04293706A JP H04293706 A JPH04293706 A JP H04293706A JP 5897391 A JP5897391 A JP 5897391A JP 5897391 A JP5897391 A JP 5897391A JP H04293706 A JPH04293706 A JP H04293706A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- substrate
- sintered
- friction material
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 46
- 239000010949 copper Substances 0.000 title claims abstract description 46
- 239000000758 substrate Substances 0.000 title claims abstract description 29
- 239000002783 friction material Substances 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims description 7
- 238000007747 plating Methods 0.000 claims abstract description 16
- 239000000956 alloy Substances 0.000 claims abstract description 13
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 13
- 239000000843 powder Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 14
- 238000005245 sintering Methods 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Powder Metallurgy (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、銅系焼結摩擦材料と基
板との間に高い接合強度を達成する接合方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding method for achieving high bonding strength between a copper-based sintered friction material and a substrate.
【０００２】0002
【従来の技術】自動車のディスクブレーキのパット等、
苛酷な摩擦条件下に使用される機械部品には、耐摩耗性
が大きいこと、摩擦係数が大きいこと、摩擦係数が安定
していること、熱伝導性がよいこと、耐熱性があること
、及び耐油性があることが必要である。そのような機械
部品の一例として、鉄系基板上に焼結用銅系合金粉末焼
結体を摩擦材料として接合して設けたものがある。この
ようなタイプの摩擦部品では、摩擦条件下での使用で基
板からの焼結体（摩擦材料）の剥離・脱離が生じないよ
うに基板と焼結体との間に十分な接合強度（密着性）が
確保される必要がある。[Prior art] Automobile disc brake pads, etc.
Mechanical parts used under severe friction conditions must have high wear resistance, high friction coefficient, stable friction coefficient, good thermal conductivity, heat resistance, and Must be oil resistant. An example of such a mechanical component is one in which a sintered body of copper-based alloy powder for sintering is bonded to an iron-based substrate as a friction material. In these types of friction parts, sufficient bonding strength ( adhesion) must be ensured.
【０００３】かかる製造工程において、焼結摩擦材料た
る銅系合金と基板、例えば鋼鈑又は鉄板との密着性を高
めるために、従来は基板の表面に予め電気めっき等によ
り銅めっきを施し、更にその上に焼結用銅系合金粉末材
料の層を設けて、このアセンブリを焼結条件に付して、
銅系合金の焼結体からなる摩擦材料を生じさせると同時
にその焼結体を銅めっきされた基板へ接合させていた。
銅めっきを施したのは、銅系焼結摩擦材料中の銅元素と
銅めっき中の銅元素との親和力によって、接合後の焼結
摩擦材料と基板との接合強度（密着性）が向上するから
である。In this manufacturing process, in order to improve the adhesion between the copper-based alloy that is the sintered friction material and the substrate, such as a steel plate or iron plate, conventionally the surface of the substrate is plated with copper by electroplating or the like, and then A layer of sintering copper-based alloy powder material is provided thereon and the assembly is subjected to sintering conditions.
A friction material made of a sintered body of a copper-based alloy was produced, and at the same time, the sintered body was bonded to a copper-plated substrate. Copper plating was applied to improve the bonding strength (adhesion) between the sintered friction material and the substrate after bonding due to the affinity between the copper element in the copper-based sintered friction material and the copper element in the copper plating. It is from.
【０００４】しかしながら、摩擦焼結材料は多孔性であ
るため、従来の方法では、図１に示すように、銅めっき
層と摩擦焼結材料層との間に空孔が存在しうる。従って
、接合面積が空孔のない場合と比べて小さくなり、望ま
しい接合強度を得ることができなかった。However, since the friction sintered material is porous, in the conventional method, pores may exist between the copper plating layer and the friction sintered material layer, as shown in FIG. Therefore, the bonding area becomes smaller than in the case without holes, making it impossible to obtain desired bonding strength.
【０００５】[0005]
【発明が解決しようとする課題】従って、本発明は、基
板と銅系焼結摩擦材料との接合強度を改善することを目
的とする。更に、本発明は、該基板の上に該焼結摩擦材
料を接合させて製造した耐高温摩耗性機械部品の耐用年
数を延ばすことを目的とする。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to improve the bonding strength between a substrate and a copper-based sintered friction material. Furthermore, the invention aims to extend the service life of high temperature wear resistant mechanical parts manufactured by bonding the sintered friction material onto the substrate.
【０００６】[0006]
【課題を解決するための手段】上記の課題を解決するた
めに、本発明は、基板の上に銅めっきを施し、その銅め
っき面上に銅粉末の薄層を設け、更にその上に摩擦材料
となるべき焼結用銅系合金粉末材料の層を設け、このア
センブリを焼結条件に付して、銅系合金の焼結体からな
る摩擦材料を生じさせると同時に上記銅層を介してその
焼結体を銅めっき基板へ接合させることからなる、銅系
焼結摩擦材料と基板との接合方法を提供する。なお、銅
粉末及び銅系合金粉末は、銅めっきを施された基板の上
に散布して加圧成形して後に焼結してもよいし、あるい
は粉末を成形して予め圧粉体とし、該圧粉体と上記基板
とを重合わせた後焼結してもよい。[Means for Solving the Problems] In order to solve the above problems, the present invention provides copper plating on a substrate, providing a thin layer of copper powder on the copper plating surface, and further applying friction on the copper plating surface. A layer of a sintering copper-based alloy powder material is provided, and this assembly is subjected to sintering conditions to produce a friction material made of a sintered body of the copper-based alloy, while at the same time A method for bonding a copper-based sintered friction material and a substrate is provided, which comprises bonding the sintered body to a copper-plated substrate. In addition, the copper powder and the copper-based alloy powder may be sprinkled on a copper-plated substrate, pressure-molded, and then sintered, or the powder may be formed into a green compact in advance. The green compact and the substrate may be superimposed and then sintered.
【０００７】[0007]
【実施例】基板の表面上に銅めっきを１５〜２０μの厚
さだけ施し、押型内にセットし、その上に銅粉末を厚さ
が０．５〜１．０ｍｍとなるように散布し、更に、その
上に摩擦材料となるべき銅系合金粉末を散布した。次に
、加圧成形して一体にし、続いて、圧縮焼結法により加
圧しながら焼結し、同時に基板と摩擦焼結材料との接合
をも行った。[Example] Copper plating is applied to the surface of the substrate to a thickness of 15 to 20 μm, set in a mold, and copper powder is sprinkled on it to a thickness of 0.5 to 1.0 mm. Furthermore, copper-based alloy powder to be used as a friction material was sprinkled thereon. Next, they were integrated by pressure molding, and then sintered under pressure using a compression sintering method, and at the same time, the substrate and the friction sintered material were joined.
【０００８】本発明の方法によれば、図２に示されるよ
うに、従来技術による方法では基板と銅めっき層との間
に存在していた空孔が消滅して、該基板と銅めっき層、
更には該摩擦焼結材料との接合面積が大きくなり、接合
強度が向上した。According to the method of the present invention, as shown in FIG. 2, the pores that existed between the substrate and the copper plating layer in the conventional method disappear, and the holes between the substrate and the copper plating layer are removed. ,
Furthermore, the bonding area with the friction sintered material was increased, and the bonding strength was improved.
【０００９】[0009]
【作用】基板、例えば鋼鈑又は鉄板の上に銅めっき層を
形成し、その上に銅の焼結材層、更にその上に銅系摩擦
焼結材料層を形成することによって、点接合から面接合
に変わり空孔が消滅することにより接合強度が向上する
。[Operation] By forming a copper plating layer on a substrate, such as a steel plate or iron plate, and forming a copper sintered material layer on top of that, and further a copper-based friction sintered material layer on top of that, it is possible to change from point joining to The bonding strength is improved by changing to surface bonding and eliminating voids.
【発明の効果】本発明によれば、基板と摩擦焼結材料と
の接合強度が向上し、該基板の上に該摩擦焼結材料を施
して製造した機械部品の耐用年数を高め、更には該部品
の取替周期の長くなることによって経済性を向上させる
ことができる。[Effects of the Invention] According to the present invention, the bonding strength between the substrate and the friction sintered material is improved, and the service life of mechanical parts manufactured by applying the friction sintered material on the substrate is increased. Economical efficiency can be improved by lengthening the replacement cycle of the parts.
【図１】従来技術によって接合された基板／銅めっき層
／銅系摩擦焼結材料層の断面図である。FIG. 1 is a cross-sectional view of a substrate/copper plating layer/copper-based friction sintering material layer bonded by a conventional technique.
【図２】本発明の方法によって接合された基板／銅めっ
き層／銅層／銅系摩擦焼結材料層の断面図である。FIG. 2 is a cross-sectional view of a substrate/copper plating layer/copper layer/copper-based friction sintering material layer bonded by the method of the present invention.
１ 銅系摩擦焼結材料層 ２ 銅層 ３ 銅めっき層 ４ 基板 ５ 空孔 1 Copper-based friction sintered material layer 2 Copper layer 3 Copper plating layer 4 Board 5 Vacancy
Claims (1)
面上に銅粉末の薄層を設け；更に、その上に摩擦材料と
なるべき焼結用銅系合金粉末材料の層を設け；このアセ
ンブリを焼結条件に付して銅系合金の焼結体からなる摩
擦材料を生じさせると同時に上記銅層を介して焼結体を
銅めっき基板へ強固に接合させる；ことからなる、銅系
合金焼結摩擦材料と基板との接合方法。Claim 1: Copper plating is performed on a substrate; a thin layer of copper powder is provided on the copper plating surface; further, a layer of a sintering copper-based alloy powder material to be a friction material is provided thereon; This assembly is subjected to sintering conditions to produce a friction material made of a sintered body of a copper-based alloy, and at the same time, the sintered body is firmly bonded to a copper-plated substrate via the copper layer; A method of joining a sintered alloy friction material and a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5897391A JPH04293706A (en) | 1991-03-22 | 1991-03-22 | Method for bonding copper-based sintered friction material to substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5897391A JPH04293706A (en) | 1991-03-22 | 1991-03-22 | Method for bonding copper-based sintered friction material to substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04293706A true JPH04293706A (en) | 1992-10-19 |
Family
ID=13099795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5897391A Pending JPH04293706A (en) | 1991-03-22 | 1991-03-22 | Method for bonding copper-based sintered friction material to substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04293706A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012202527A (en) * | 2011-03-28 | 2012-10-22 | Akechi Ceramics Co Ltd | Friction member and method for manufacturing the same |
| CN104841941A (en) * | 2015-04-21 | 2015-08-19 | 龙工（上海）精工液压有限公司 | Valve plate with high friction-reducing performance and good anti-seizure performance and manufacturing process of valve plate |
| CN105063459A (en) * | 2015-07-20 | 2015-11-18 | 广西民族大学 | Copper-based powder metallurgy friction material for high-speed train braking and preparation method thereof |
| CN105436496A (en) * | 2014-10-21 | 2016-03-30 | 长沙建明工程机械摩擦材料有限公司 | Steel-backing non-electroplating copper alloy based friction material and preparation method and application for friction piece |
-
1991
- 1991-03-22 JP JP5897391A patent/JPH04293706A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012202527A (en) * | 2011-03-28 | 2012-10-22 | Akechi Ceramics Co Ltd | Friction member and method for manufacturing the same |
| CN105436496A (en) * | 2014-10-21 | 2016-03-30 | 长沙建明工程机械摩擦材料有限公司 | Steel-backing non-electroplating copper alloy based friction material and preparation method and application for friction piece |
| CN104841941A (en) * | 2015-04-21 | 2015-08-19 | 龙工（上海）精工液压有限公司 | Valve plate with high friction-reducing performance and good anti-seizure performance and manufacturing process of valve plate |
| CN105063459A (en) * | 2015-07-20 | 2015-11-18 | 广西民族大学 | Copper-based powder metallurgy friction material for high-speed train braking and preparation method thereof |
| CN105063459B (en) * | 2015-07-20 | 2017-05-17 | 广西民族大学 | Copper-based powder metallurgy friction material for high-speed train braking and preparation method thereof |
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