JPH04267353A - Wire bonder - Google Patents

Abstract

PURPOSE:To increase wire bonding speed drastically. CONSTITUTION:A wire bonding jig 40 is provided with a plurality of capillaries 42a-42c to be individually inserted with a plurality of bonding wires 50a-50c so that wire bonding operation is carried out simultaneously at a plurality of bonding pads 11 on a pellet 10 and between the leads 21 of a lead frame 20.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to wire bonding technology, and more particularly to a technology that is effective when applied to assembly steps in the manufacturing process of semiconductor devices.

0002

[Prior Art] For example, in the assembly process in the manufacture of semiconductor devices, bonding pads of a semiconductor pellet into which an integrated circuit structure with a desired function is built, a lead frame, etc. Wire bonding is sometimes performed in which a bonding wire is installed between the terminal and the external connection terminal for electrical connection.

By the way, in order to respond to the demand for increased production in a short period of time due to the shortening of the market life of products, and the increase in the number of terminals due to the multifunctionality and high integration of semiconductor devices, there is a need to speed up the wire bonding process. sex is getting bigger and bigger.

For this reason, conventionally, for example, "Latest Semiconductor Assembly Technology and its High Integration and Full Automation" published by Oyo Gijutsu Publishing Co., Ltd., November 3, 1985, P307~
As described in documents such as P309, P313, and P330, by optimizing the path of the bonding tool, shortening the time required for positioning the positioning table and bonding tool, and shortening the control operation time of the processor, etc.
We are trying to meet the above-mentioned demand for faster wire bonding processes.

[0005]

However, in the case of the above-mentioned prior art, only one bonding wire is inserted through the bonding tool, and only one set of bonding pads can be connected in one bonding operation. Because it is a lead, no matter how much time is taken to shorten the time required for the bonding operation, it will not be possible to exceed the bonding speed specified by the time required to construct a unit wire, and it is difficult to dramatically improve the bonding speed in the wire bonding process. The problem is that you can't hope for it.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a wire bonding technique that can dramatically improve wire bonding speed.

Another object of the present invention is to provide a wire bonding apparatus capable of obtaining highly reliable bonding results.

[0008] Still another object of the present invention is to provide a wire bonding device that can extend its life and simplify maintenance management.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

0010

[Means for Solving the Problems] Among the inventions disclosed in this application, a brief overview of typical inventions will be as follows.
It is as follows.

That is, the wire bonding apparatus according to the present invention is a wire bonding apparatus that connects a bonding object by connecting a bonding wire inserted through a bonding tool between a first bonding site and a second bonding site on an object to be bonded. The bonding tool is provided with a plurality of wire insertion parts through which a plurality of bonding wires are individually inserted and which can be displaced independently of each other, and a plurality of bonding wires are inserted into the bonding tool at the first and second bonding sites. The wire installation operation is performed at the same time.

0012

[Operation] According to the above-described wire bonding apparatus of the present invention, for example, when n wire insertion portions are provided, the bonding wire installation operation for n pairs of first and second bonding sites can be performed simultaneously. So,
The time required for wire bonding can be reduced to 1/n, and the speed of wire bonding can be dramatically improved.

In addition, the number of positioning operations of the bonding tool is reduced to 1/n, the wear of movable parts such as the positioning mechanism is reduced, and the life of the wire bonding device is increased and maintenance management is simplified. Wire bonding accuracy is also maintained stably, and good wire bonding results can be obtained.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic perspective view schematically showing essential parts of a wire bonding apparatus according to an embodiment of the present invention.

Above the bonding stage (not shown) is a lead frame 20 with a pellet 10 mounted in the center.
are mounted, and intermittent feeding operations are performed, for example, at the mounting pitch of the pellets 10 concerned.

The inner ends of the plurality of leads 21 constituting the lead frame 20 are arranged so as to surround the pellet 10 located in the center, and the inner ends of the plurality of leads 21 that constitute the lead frame 20 are arranged so as to surround the pellet 10 located in the center. A plurality of bonding pads 11 are arranged.

On the other hand, above the bonding stage on which the lead frame 20 is placed, there is a bonding head 3.
A bonding tool 40 supported at 0 is provided.

In this case, the bonding tool 40 includes a base portion 41 and a plurality of capillaries 42a, 42b, and 4 displaceably attached to the base portion 41.
2c. A plurality of capillaries 42a to 4
A plurality of bonding wires 50a, bonding wires 50b, and bonding wires 50c, which are paid out from a spool (not shown) or the like, are inserted into each of the wires 2c,
It is designed to be pulled out from the tip.

Capillary 42a of bonding tool 40
- 42c are configured to be driven by a piezoelectric element (not shown) provided inside the base portion 41, and the positions of the tip portions from which each of the bonding wires 50a-50c are pulled out are mutually different from each other. It can be controlled independently in three dimensions.

The bonding head 30 that supports the bonding tool 40 is supported by an elevating mechanism mounted on an X-Y table (not shown), and performs three-dimensional positioning of the entire bonding tool 40. It is.

Although not particularly shown, the lead frame 2
Above the lead frame 20 and the pellet 10,
An industrial television camera is disposed to detect the positions of the plurality of leads 21 and bonding pads 11 in the area using well-known image recognition technology. Then, the leads 21 and bonding pads 1 by this industrial TV camera are
1, the bonding tool 40 and the plurality of capillaries 4 constituting the bonding tool 40 are detected.
2a to 42c, bonding pads 11 and leads 21
The positioning operation is controlled.

[0022] Also, near the bonding tool 40,
A torch (not shown) or the like that forms a ball by discharging or the like is arranged at the tip of the bonding wires 50a to 50c drawn out from the tips of the plurality of capillaries 42a to 42c.

An example of the operation of this embodiment will be explained below.

First, the bonding wire 50a protrudes from the tip of each of the plurality of capillaries 42a to 42c.
By heating and melting the tip portion of ~50c with a torch (not shown), the tip portion is shaped into a ball shape.

Thereafter, based on the detected images of the lead frame 20 and the pellet 10, the capillaries 42a are aligned in accordance with the positions of the plurality of target bonding pads 11.
The entire bonding tool 40 is lowered to the target position of the pellet 10 by appropriately controlling the position of the tip of the tip 42a and at the same time by moving the bonding head 30.
Each of the bonding wires 50a to 50c at the tip of each capillary 42a to 42c is simultaneously pressed to each of the plurality of corresponding bonding pads 11.

[0026] As a result, a plurality of capillaries 42a to 4
The ball-shaped tip portions of the bonding wires 50a to 50c protruding from the tip portions of the bonding wires 2c are simultaneously crimped to each of the plurality of bonding pads 11.

Next, while paying out the bonding wires 50a to 50c from the tips of the individual capillaries 42a to 42c, the bonding tool 40 is moved to the side of the plurality of leads 21 by the moving operation of the bonding head 30, and at the same time The positions of the tips of the capillaries 42a to 42c are controlled to match the bonding positions of the corresponding leads 21 to which they are moved. Then, by lowering the entire bonding tool 40,
The side surfaces of each of the bonding wires 50a to 50c drawn out from the tips of the plurality of capillaries 42a to 42c are simultaneously pressed and crimped onto each of the corresponding plurality of leads 21.

Thereafter, by raising the bonding tool 40 while stopping feeding out the bonding wires 50a to 50c from each of the capillaries 42a to 42c, each of the plurality of bonding wires 50a to 50c is connected to the plurality of leads 21. It is torn off near the crimped part.

As a result, as shown in FIG. 1, the plurality of bonding pads 11 of the pellet 10 and the corresponding plurality of leads 21 are separated from each other by the bonding wires 50a to 50c installed in a loop shape. are connected all at once.

Thereafter, by repeating the series of bonding operations described above, wire bonding between all the bonding pads 11 of the pellet 10 and all the corresponding leads 21 is completed.

[0031] In the pressing operation on the pellet 10 and lead 21 sides, application of ultrasonic vibration or the like, heating, etc. may be performed as appropriate. In this way, in the case of the wire bonding apparatus of this embodiment, wire bonding is performed simultaneously between a plurality of pairs of bonding pads 11 and leads 21 in one bonding operation, so that the bonding tool 40 is A plurality of capillaries 42a to 42c (bonding wire 50a
~50c) When the number of wires is n, the number of bonding times is reduced compared to the conventional case where a pair of bonding pads and leads are connected in one bonding operation like one bonding wire. It drastically decreases to 1/n.

[0032] Therefore, the time required for wire bonding can be significantly shortened, and the speed of wire bonding can be dramatically increased.

[0033] Furthermore, the movement range and number of times the bonding head 30 that drives the bonding tool 40 is significantly reduced.
Wear of movable parts in the positioning mechanism of the bonding head 30 is also reduced. As a result, the life of the wire bonding device is extended and the frequency of maintenance management is reduced.

Furthermore, deterioration of wire bonding accuracy due to wear of the movable parts is also prevented, and good bonding results without bonding defects can be obtained.

FIG. 2 is a schematic perspective view showing the main parts of a wire bonding apparatus according to another embodiment of the present invention.

In the case of this second embodiment, the bonding head 300 supports a plurality of bonding tools 40,
Bonding between a plurality of pellets 10 and a lead frame 20 is performed simultaneously.

[0037] As a result, the individual bonding tools 40
n capillaries are provided, and m bonding tools 4 are installed.
0 is supported by the bonding head 300, the time required for wire bonding is reduced by 1/(
n×m), and a further significant improvement in wire bonding speed can be achieved.

Although the invention made by the present inventor has been specifically explained based on examples, the present invention is not limited to the above-mentioned examples, and can be modified in various ways without departing from the gist thereof. Needless to say.

For example, in the above embodiments, the case where a bonding wire is installed between a pair of a first bonding site and a second bonding site is described, but the present invention is not limited to this, and a plurality of first bonding sites and one second
A wire bonding operation may be performed in which a plurality of bonding wires are simultaneously installed between the bonding site and the bonding site. In addition, in the above embodiments, a case where a plurality of wire insertion portions are linearly arranged and attached to the bonding tool is explained, but the wire insertion portions are not limited to this, and the wire insertion portions may be attached to the bonding tool in the form of a bundle, a polygonal columnar surface, or a cylindrical surface. They may be arranged in a shape.

[0040]

[Effects of the Invention] Among the inventions disclosed in this application, the effects obtained by the typical inventions are briefly explained as follows.
It is as follows.

That is, according to the wire bonding apparatus of the present invention described above, for example, when n wire insertion portions are provided, the bonding wire installation operation for n pairs of first and second bonding portions can be performed simultaneously. , the time required for wire bonding is reduced by 1/n.
This makes it possible to dramatically improve the wire bonding speed.

In addition, the number of positioning operations of the bonding tool is reduced to 1/n, the wear of movable parts such as the positioning mechanism is reduced, and the life of the wire bonding device is increased and maintenance management is simplified. Wire bonding accuracy is also maintained stably, and good wire bonding results can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a perspective view schematically showing main parts of a wire bonding apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view schematically showing main parts of a wire bonding apparatus according to a second embodiment of the present invention.

[Explanation of symbols]

10 Pellet 11 Bonding pad (first bonding part) 20 Lead frame 21 Lead (second bonding part) 30 Bonding head 40 Bonding tool 41 Base part 42a Capillary (wire insertion part) 42b Capillary (wire insertion part) 42c Capillary ( Wire insertion part) 50a Bonding wire 50b Bonding wire 50c Bonding wire 300 Bonding head

Claims (5)

[Claims] 1. A wire bonding apparatus that connects a bonding wire inserted through a bonding tool between a first bonding site and a second bonding site on a bonding target by constructing the bonding wire, the bonding tool comprising: A plurality of wire insertion portions are provided through which the plurality of bonding wires are individually inserted and which can be displaced independently of each other, and the plurality of bonding wires are inserted into the first and second bonding portions. A wire bonding device characterized in that wire bonding is performed simultaneously. 2. The wire bonding apparatus according to claim 1, wherein the wire insertion portion constituting the bonding tool is driven by a piezoelectric element. 3. A plurality of the bonding tools are fixed to a bonding head that performs a positioning operation for the entire bonding tool, and a bonding operation for each of the plurality of bonding objects is performed simultaneously. The wire bonding apparatus according to claim 1 or 2, characterized in that: 4. An image recognition mechanism for specifying the positions of the first and second bonding parts by image recognition, the distal end of the wire insertion part constituting the bonding tool being individually connected to the first and second bonding parts. 4. The wire bonding apparatus according to claim 1, wherein the wire bonding apparatus is positioned at the second bonding site. 5. The object to be bonded includes a semiconductor pellet and a lead frame on which the semiconductor pellet is mounted, and the first and second bonding parts are bonding pads and inner ends of the leads of the semiconductor pellet. 5. The wire bonding apparatus according to claim 1, 2, 3 or 4.