JPH04266940A - Epoxy resin composition for composite material, intermediate material and composite material - Google Patents
Epoxy resin composition for composite material, intermediate material and composite materialInfo
- Publication number
- JPH04266940A JPH04266940A JP4564091A JP4564091A JPH04266940A JP H04266940 A JPH04266940 A JP H04266940A JP 4564091 A JP4564091 A JP 4564091A JP 4564091 A JP4564091 A JP 4564091A JP H04266940 A JPH04266940 A JP H04266940A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- intermediate material
- weight
- composite material
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 50
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 50
- 239000002131 composite material Substances 0.000 title claims abstract description 28
- 239000000203 mixture Substances 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 title claims description 53
- 239000003063 flame retardant Substances 0.000 claims abstract description 18
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 14
- 150000004984 aromatic diamines Chemical class 0.000 claims abstract description 14
- 239000004088 foaming agent Substances 0.000 claims abstract description 9
- 239000004604 Blowing Agent Substances 0.000 claims description 11
- 238000005187 foaming Methods 0.000 claims description 11
- 230000003014 reinforcing effect Effects 0.000 claims description 7
- 239000012779 reinforcing material Substances 0.000 claims 1
- 239000011342 resin composition Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 29
- 229920000049 Carbon (fiber) Polymers 0.000 description 27
- 239000004917 carbon fiber Substances 0.000 description 27
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 239000011521 glass Substances 0.000 description 14
- 239000003365 glass fiber Substances 0.000 description 12
- 239000004744 fabric Substances 0.000 description 11
- 238000002156 mixing Methods 0.000 description 11
- 238000005452 bending Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 238000001723 curing Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 8
- 229920003319 Araldite® Polymers 0.000 description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 8
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 7
- 235000019399 azodicarbonamide Nutrition 0.000 description 7
- 239000011162 core material Substances 0.000 description 7
- 239000006260 foam Substances 0.000 description 7
- -1 glycidyl ester Chemical class 0.000 description 7
- 239000007983 Tris buffer Substances 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000004156 Azodicarbonamide Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 4
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 229920006231 aramid fiber Polymers 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 238000010008 shearing Methods 0.000 description 4
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 3
- MWRWFPQBGSZWNV-UHFFFAOYSA-N Dinitrosopentamethylenetetramine Chemical compound C1N2CN(N=O)CN1CN(N=O)C2 MWRWFPQBGSZWNV-UHFFFAOYSA-N 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000004760 aramid Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000013585 weight reducing agent Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- NBOCQTNZUPTTEI-UHFFFAOYSA-N 4-[4-(hydrazinesulfonyl)phenoxy]benzenesulfonohydrazide Chemical compound C1=CC(S(=O)(=O)NN)=CC=C1OC1=CC=C(S(=O)(=O)NN)C=C1 NBOCQTNZUPTTEI-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- VJRITMATACIYAF-UHFFFAOYSA-N benzenesulfonohydrazide Chemical compound NNS(=O)(=O)C1=CC=CC=C1 VJRITMATACIYAF-UHFFFAOYSA-N 0.000 description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000003562 lightweight material Substances 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 238000013035 low temperature curing Methods 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 239000004005 microsphere Substances 0.000 description 2
- ALIFPGGMJDWMJH-UHFFFAOYSA-N n-phenyldiazenylaniline Chemical compound C=1C=CC=CC=1NN=NC1=CC=CC=C1 ALIFPGGMJDWMJH-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 description 2
- CZGWDPMDAIPURF-UHFFFAOYSA-N (4,6-dihydrazinyl-1,3,5-triazin-2-yl)hydrazine Chemical compound NNC1=NC(NN)=NC(NN)=N1 CZGWDPMDAIPURF-UHFFFAOYSA-N 0.000 description 1
- QRFALSDGOMLVIR-UHFFFAOYSA-N 1,2,3,4-tetrabromobenzene Chemical compound BrC1=CC=C(Br)C(Br)=C1Br QRFALSDGOMLVIR-UHFFFAOYSA-N 0.000 description 1
- GMVJKSNPLYBFSO-UHFFFAOYSA-N 1,2,3-tribromobenzene Chemical compound BrC1=CC=CC(Br)=C1Br GMVJKSNPLYBFSO-UHFFFAOYSA-N 0.000 description 1
- CHRJZRDFSQHIFI-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;styrene Chemical compound C=CC1=CC=CC=C1.C=CC1=CC=CC=C1C=C CHRJZRDFSQHIFI-UHFFFAOYSA-N 0.000 description 1
- NZUPFZNVGSWLQC-UHFFFAOYSA-N 1,3,5-tris(2,3-dibromopropyl)-1,3,5-triazinane-2,4,6-trione Chemical compound BrCC(Br)CN1C(=O)N(CC(Br)CBr)C(=O)N(CC(Br)CBr)C1=O NZUPFZNVGSWLQC-UHFFFAOYSA-N 0.000 description 1
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 1
- YFYZPVXABJAXSL-UHFFFAOYSA-N 2,3-dinitrosobenzene-1,4-dicarboxamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C(N=O)=C1N=O YFYZPVXABJAXSL-UHFFFAOYSA-N 0.000 description 1
- ANNPLZPOELVJCW-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxymethyl)oxirane;toluene Chemical compound CC1=CC=CC=C1.C1OC1COCC1CO1 ANNPLZPOELVJCW-UHFFFAOYSA-N 0.000 description 1
- RVHUMFJSCJBNGS-UHFFFAOYSA-N 2-[2,6-dibromo-4-[2-[3,5-dibromo-4-(2-hydroxyethoxy)phenyl]propan-2-yl]phenoxy]ethanol Chemical compound C=1C(Br)=C(OCCO)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(OCCO)C(Br)=C1 RVHUMFJSCJBNGS-UHFFFAOYSA-N 0.000 description 1
- IAQNLUJLASSNLX-UHFFFAOYSA-N 2-bromoethyl dihydrogen phosphate Chemical compound OP(O)(=O)OCCBr IAQNLUJLASSNLX-UHFFFAOYSA-N 0.000 description 1
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- OMHOXRVODFQGCA-UHFFFAOYSA-N 4-[(4-amino-3,5-dimethylphenyl)methyl]-2,6-dimethylaniline Chemical group CC1=C(N)C(C)=CC(CC=2C=C(C)C(N)=C(C)C=2)=C1 OMHOXRVODFQGCA-UHFFFAOYSA-N 0.000 description 1
- XPAQFJJCWGSXGJ-UHFFFAOYSA-N 4-amino-n-(4-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1NC(=O)C1=CC=C(N)C=C1 XPAQFJJCWGSXGJ-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004254 Ammonium phosphate Substances 0.000 description 1
- 239000004135 Bone phosphate Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical class C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 1
- 235000019289 ammonium phosphates Nutrition 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- HUTDDBSSHVOYJR-UHFFFAOYSA-H bis[(2-oxo-1,3,2$l^{5},4$l^{2}-dioxaphosphaplumbetan-2-yl)oxy]lead Chemical compound [Pb+2].[Pb+2].[Pb+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O HUTDDBSSHVOYJR-UHFFFAOYSA-H 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- NMDGMYNXRRCPGM-UHFFFAOYSA-N dibromo propyl phosphate Chemical compound P(=O)(OBr)(OBr)OCCC NMDGMYNXRRCPGM-UHFFFAOYSA-N 0.000 description 1
- 125000003963 dichloro group Chemical group Cl* 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000004872 foam stabilizing agent Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- BMLIZLVNXIYGCK-UHFFFAOYSA-N monuron Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C=C1 BMLIZLVNXIYGCK-UHFFFAOYSA-N 0.000 description 1
- 125000000018 nitroso group Chemical group N(=O)* 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- MHZDONKZSXBOGL-UHFFFAOYSA-N propyl dihydrogen phosphate Chemical compound CCCOP(O)(O)=O MHZDONKZSXBOGL-UHFFFAOYSA-N 0.000 description 1
- 239000002990 reinforced plastic Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- VLCLHFYFMCKBRP-UHFFFAOYSA-N tricalcium;diborate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]B([O-])[O-].[O-]B([O-])[O-] VLCLHFYFMCKBRP-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- FFULTTXGZNPTQO-UHFFFAOYSA-N tris(2-bromoethyl) phosphate Chemical compound BrCCOP(=O)(OCCBr)OCCBr FFULTTXGZNPTQO-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- NWIKMSABBNGQRG-UHFFFAOYSA-N tris(3,3-dibromopropyl) phosphate Chemical compound BrC(Br)CCOP(=O)(OCCC(Br)Br)OCCC(Br)Br NWIKMSABBNGQRG-UHFFFAOYSA-N 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
Landscapes
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、微小中空球体、発泡剤
、難燃剤および芳香族ジアミンを含有する複合材料用エ
ポキシ樹脂組成物、これをシート状に成形した中間材な
らびに中間材を成形して得られる複合材料に関する。[Industrial Application Field] The present invention relates to an epoxy resin composition for composite materials containing micro hollow spheres, a foaming agent, a flame retardant, and an aromatic diamine, an intermediate material formed by molding the same into a sheet shape, and a method for molding the intermediate material. The present invention relates to composite materials obtained by
【0002】0002
【従来の技術】近年、高層建築物が多数建設され、その
際高層部では内装部分に軽量材料の使用が望まれている
。また、航空機の利用が年々増加していることから、輸
送効率を上げるため軽量化が望まれている。特に、最近
のようにエネルギー価格が上昇してくると、軽量化が大
幅に燃料費を低減できるためその効果は大きい。従来か
ら積層物の内部コア材として、 フェノール樹脂、 硬
質発泡ポリウレタン、各種ビニルフォーム等を反応時に
発泡させたり発泡剤を利用する方法等がある。 また、
微小中空球体を樹脂に分散させたものも各種の用途に
使用されてきた。 しかしながら、発泡を利用したもの
は強度、 剛性および耐熱性が十分ではなく、微小中空
球体を使用したものは軽量化には不十分であった。BACKGROUND OF THE INVENTION In recent years, many high-rise buildings have been constructed, and it is desired to use lightweight materials for interior parts of the high-rise buildings. In addition, as the use of aircraft increases year by year, weight reduction is desired to improve transportation efficiency. Particularly when energy prices are rising as they have been recently, reducing weight can significantly reduce fuel costs, which has a great effect. Conventionally, as the inner core material of laminates, there have been methods such as foaming phenolic resin, rigid polyurethane foam, various vinyl foams, etc. during reaction, or using a foaming agent. Also,
Microscopic hollow spheres dispersed in resin have also been used for various purposes. However, those using foam did not have sufficient strength, rigidity, and heat resistance, and those using microscopic hollow spheres were insufficient for reducing weight.
【0003】0003
【発明が解決しようとする課題】本発明は、このような
状況に鑑み、高層建築物の内装材、航空機の内装材等に
ついて、剛性および強度を保持しつつ軽量化を図るため
の検討を行い、特に内部コア材等の材料用樹脂組成物、
これを用いたシート状中間材および複合材料を提供する
ことを目的とする。[Problems to be Solved by the Invention] In view of the above circumstances, the present invention has been made to study how to reduce the weight of interior materials for high-rise buildings, interior materials for aircraft, etc. while maintaining rigidity and strength. , especially resin compositions for materials such as internal core materials,
The purpose of the present invention is to provide sheet-like intermediate materials and composite materials using the same.
【0004】0004
【課題を解決するための手段】本発明者らは上記の目的
に沿って鋭意検討した結果、エポキシ樹脂に微小中空球
体、発泡剤、難燃剤および芳香族ジアミンを併用添加す
ることにより、平板から複雑な形状のものまで容易に積
層でき、 他のプリプレグと共架橋(co−cure)
が可能であり、しかも高強度、高剛性でかつ軽量な組成
物が得られることを見出し、本発明に達した。すなわち
、 本発明は(A)エポキシ樹脂、(B)微小中空球体
、 (C)発泡剤、(D)難燃剤および(E)芳香族ジ
アミンを含有することを特徴とする複合材料用エポキシ
樹脂組成物を提供するものである。また、本発明は上記
複合材料用エポキシ樹脂組成物をシート状にした複合材
料用中間材および該中間材を成形して得られる複合材料
を提供するものである。[Means for Solving the Problems] As a result of intensive studies in accordance with the above objectives, the present inventors have found that by adding micro hollow spheres, a foaming agent, a flame retardant, and an aromatic diamine to an epoxy resin, a flat plate can be produced. It can be easily laminated even to complex shapes, and can be co-cured with other prepregs.
The present invention has been achieved based on the discovery that it is possible to obtain a composition that is high in strength, high in rigidity, and lightweight. That is, the present invention provides an epoxy resin composition for composite materials containing (A) an epoxy resin, (B) micro hollow spheres, (C) a foaming agent, (D) a flame retardant, and (E) an aromatic diamine. It is something that provides something. The present invention also provides an intermediate material for a composite material in which the above-mentioned epoxy resin composition for a composite material is formed into a sheet, and a composite material obtained by molding the intermediate material.
【0005】以下に本発明を更に詳細に説明する。本発
明に用いる(A)エポキシ樹脂としては、液状エポキシ
樹脂および/または固体エポキシ樹脂が挙げられ、例え
ば、ビスフェノールA型エポキシ樹脂、ビスフェノール
F型エポキシ樹脂、フェノールノボラック型エポキシ樹
脂、クレゾールノボラック型エポキシ樹脂、グリシジル
アミン型エポキシ樹脂、グリシジルエステル型エポキシ
樹脂、脂環式エポキシ樹脂、 トリス(グリシジルエー
テルフェニル)メタン、 末端カルボキシル化ブタジエ
ン−アクリロニトリルゴム変性エポキシ樹脂等の各種エ
ポキシ樹脂を用いることができ、またこれらの2種以上
のエポキシ樹脂の混合物を用いることができる。The present invention will be explained in more detail below. Examples of the epoxy resin (A) used in the present invention include liquid epoxy resins and/or solid epoxy resins, such as bisphenol A epoxy resin, bisphenol F epoxy resin, phenol novolac epoxy resin, and cresol novolac epoxy resin. , glycidyl amine type epoxy resin, glycidyl ester type epoxy resin, alicyclic epoxy resin, tris (glycidyl ether phenyl) methane, terminal carboxylated butadiene-acrylonitrile rubber modified epoxy resin, and various other epoxy resins can be used. A mixture of two or more epoxy resins can be used.
【0006】ビスフェノールA型エポキシ樹脂としては
、エピコート828、同834、同827、同1001
、同1002、同1004、同1007、同1009(
以上、油化シェルエポキシ(株)製)、アラルダイトC
Y205、同CY230、同CY232、同CY221
、同GY257、同GY252、同GY255、同GY
250、同GY260、同GY280、同6071、同
7071、同7072(以上、チバ・ガイギ−社製)、
ダウエポキシDER331、同DER332、同DER
662、同DER663U、同DER662U(以上、
ダウケミカル社製)、エピクロン840、同850、同
855、同860、同1050、同3050、同405
0、同7050(以上、大日本インキ化学工業(株)製
)、エポトートYD115、同YD115CA、同YD
117、同YD121、同YD127、同YD128、
同YD128CA、同YD128S、同YD134、同
YD001Z、同YD011、同YD012、同YD0
14、 同YD014ES、 同YD017、同YD0
19、同YD020、同YD002(以上、東都化成(
株)製)等が挙げられる。[0006] As bisphenol A type epoxy resins, Epikote 828, Epikote 834, Epikote 827, Epikote 1001 are used.
, 1002, 1004, 1007, 1009 (
(manufactured by Yuka Shell Epoxy Co., Ltd.), Araldite C
Y205, CY230, CY232, CY221
, GY257, GY252, GY255, GY
250, GY260, GY280, 6071, 7071, 7072 (manufactured by Ciba Geigy),
Dowepoxy DER331, DER332, DER
662, DER663U, DER662U (and above,
(manufactured by Dow Chemical Company), Epiclon 840, Epiclon 850, Epiclon 855, Epiclon 860, Epiclon 1050, Epiclon 3050, Epiclon 405
0, Epotote 7050 (manufactured by Dainippon Ink and Chemicals Co., Ltd.), Epotote YD115, Epotote YD115CA, Epotote YD
117, YD121, YD127, YD128,
Same YD128CA, Same YD128S, Same YD134, Same YD001Z, Same YD011, Same YD012, Same YD0
14, YD014ES, YD017, YD0
19, YD020, YD002 (Toto Kasei)
Co., Ltd.), etc.
【0007】ビスフェノールF型エポキシ樹脂としては
、エポトートYDF170(東都化成(株)製)が挙げ
られる。フェノールノボラック型エポキシ樹脂としては
、エピコート152、同154(以上、油化シェルエポ
キシ(株)製)、アラルダイトEPN1138、同EP
N1139(以上、チバ・ガイギー社製)、ダウエポキ
シDEN431、同DEN438、同DEN439(以
上、ダウケミカル社製)、EPPN201(日本化薬(
株)製)、エピクロンN740(大日本インキ化学工業
(株)製)、エポトートYDPN638(東都化成(株
)製)、Tactix785(ダウケミカル日本(株)
製)等が挙げられる。クレゾールノボラック型エポキシ
樹脂としては、ECN1280、ECN1299(以上
、チバ・ガイギー社製)、EOCN102(日本化薬(
株)製)等が挙げられる。脂環式エポキシ樹脂としては
、アラルダイトCY179、同CY178、同CY18
2、同CY183(以上、チバ・ガイギー社製)等があ
る。グリシジルアミン型エポキシ樹脂としては、アラル
ダイトMY720(チバ・ガイギー社製)、エポトート
YH434(東都化成(株)製)、ELM120、EL
M434(以上、住友化学工業(株)製)、TETRA
D−C、TETRAD−X(以上、三菱ガス化学(株)
製)等がある。トリス(グリシジルエーテルフェニル)
メタン型エポキシ樹脂としては、Tac−tix742
(ダウケミカル日本(株)製)が挙げられる。ナフタレ
ン型エポキシ樹脂としては、HP4032、EXA47
00(以上、大日本インキ化学工業(株)製)等がある
。[0007] As the bisphenol F type epoxy resin, Epotote YDF170 (manufactured by Toto Kasei Co., Ltd.) can be mentioned. Examples of phenol novolac type epoxy resins include Epicote 152, Epicote 154 (manufactured by Yuka Shell Epoxy Co., Ltd.), Araldite EPN1138, Epikote EP
N1139 (manufactured by Ciba-Geigy), Dowepoxy DEN431, DEN438, DEN439 (manufactured by Dow Chemical), EPPN201 (Nippon Kayaku)
Co., Ltd.), Epiclon N740 (Dainippon Ink & Chemicals Co., Ltd.), Epotote YDPN638 (Toto Kasei Co., Ltd.), Tactix785 (Dow Chemical Japan Co., Ltd.)
(manufactured by), etc. Cresol novolac type epoxy resins include ECN1280, ECN1299 (manufactured by Ciba-Geigy), and EOCN102 (Nippon Kayaku).
Co., Ltd.), etc. As the alicyclic epoxy resin, Araldite CY179, Araldite CY178, Araldite CY18
2. CY183 (manufactured by Ciba Geigy), etc. Examples of glycidylamine type epoxy resins include Araldite MY720 (manufactured by Ciba Geigy), Epotote YH434 (manufactured by Toto Kasei Co., Ltd.), ELM120, and EL.
M434 (manufactured by Sumitomo Chemical Co., Ltd.), TETRA
D-C, TETRAD-X (Mitsubishi Gas Chemical Co., Ltd.)
(manufactured by) etc. Tris (glycidyl ether phenyl)
As a methane type epoxy resin, Tac-tix742
(manufactured by Dow Chemical Japan Co., Ltd.). As naphthalene type epoxy resin, HP4032, EXA47
00 (manufactured by Dainippon Ink & Chemicals Co., Ltd.), etc.
【0008】上記の中では、グリシジルアミン型エポキ
シ樹脂であるアラルダイトMY720、エポトートYH
434、ELM120、ELM434、TETRAD−
C、およびTETRAD−X、ならびにトリス(グリシ
ジルエーテルフェニル)メタン型エポキシ樹脂であるT
actix742等が耐熱性を向上するため好ましい。Among the above, Araldite MY720, which is a glycidylamine type epoxy resin, and Epotote YH
434, ELM120, ELM434, TETRAD-
C, and TETRAD-X, and T, which is a tris(glycidyl ether phenyl)methane type epoxy resin.
Actix742 and the like are preferred because they improve heat resistance.
【0009】更に、エポキシ樹脂の靱性を向上させるた
め、各種のプラスチックおよびゴム等を、 エポキシ樹
脂100重量部に対し通常5〜30重量部、 好ましく
は8〜20重量部添加することができる。例えば、プラ
スチックとしてはポリカーボネート、ポリエーテルスル
ホン、フェノキシ樹脂、ポリビニルホルマール、ポリビ
ニルブチラール、ポリエチレンテレフタレート等がある
。ゴム類としてはブタジエン−アクリロニトリルゴム、
スチレン−ブタジエンゴム、アクリロニトリル−ブタジ
エン−スチレン樹脂、シリコーン樹脂等がある。また、
更に靱性を向上させるために高分子の超微粒子を添加す
ることもできる。高分子超微粒子としてスチレン樹脂、
ジビニルベンゼン樹脂、スチレン−ジビニルベンゼン樹
脂、ベンゾグアナミン樹脂、メラミン樹脂、ベンゾグア
ナミン−メラミン共縮合樹脂、尿素樹脂、シリコーン樹
脂、エチレン−アクリル酸共重合樹脂、メチルメタクリ
レート樹脂、 n−ブチルアクリレート樹脂、アクリル
−ウレタン樹脂、ポリアミド樹脂、芳香族ポリエステル
樹脂等がある。Furthermore, in order to improve the toughness of the epoxy resin, various plastics, rubbers, etc. can be added in an amount of usually 5 to 30 parts by weight, preferably 8 to 20 parts by weight, per 100 parts by weight of the epoxy resin. For example, plastics include polycarbonate, polyether sulfone, phenoxy resin, polyvinyl formal, polyvinyl butyral, polyethylene terephthalate, and the like. Rubbers include butadiene-acrylonitrile rubber,
Examples include styrene-butadiene rubber, acrylonitrile-butadiene-styrene resin, and silicone resin. Also,
Further, ultrafine polymer particles may be added to improve toughness. Styrene resin as ultrafine polymer particles,
Divinylbenzene resin, styrene-divinylbenzene resin, benzoguanamine resin, melamine resin, benzoguanamine-melamine cocondensation resin, urea resin, silicone resin, ethylene-acrylic acid copolymer resin, methyl methacrylate resin, n-butyl acrylate resin, acrylic-urethane There are resins, polyamide resins, aromatic polyester resins, etc.
【0010】本発明に使用する(B)微小中空球体とし
ては、例えば、ガラス、アルミナシリケート、セラミッ
ク、カーボン等の無機質系 および フェノール、エポ
キシ樹脂、ユリア樹脂、 メラミン樹脂等の有機質系の
ものが挙げられる。 この中で特に、強度および軽量化
の点でガラス微小中空球体が好ましい。微小中空球体の
サイズは特に限定されないが、通常10〜200μm、
好ましくは80〜120μmの粒径分布のものである。
更に、80〜120μmと20〜50μmの粒径分布の
ものをブレンドして用いると、強度の向上が図れるため
特に望ましい。厚さ1mm以下のエポキシ樹脂組成物フ
ィルム用には、 5〜50μmのガラス微小中空球体が
好ましい。Examples of the micro hollow spheres (B) used in the present invention include inorganic ones such as glass, alumina silicate, ceramic, and carbon, and organic ones such as phenol, epoxy resin, urea resin, and melamine resin. It will be done. Among these, glass microscopic hollow spheres are particularly preferred in terms of strength and weight reduction. The size of the micro hollow spheres is not particularly limited, but is usually 10 to 200 μm,
Preferably, it has a particle size distribution of 80 to 120 μm. Furthermore, it is particularly desirable to use a blend of particles with a particle size distribution of 80 to 120 μm and 20 to 50 μm, since this can improve the strength. For epoxy resin composition films with a thickness of 1 mm or less, glass micro hollow spheres of 5 to 50 μm are preferred.
【0011】また、ガラス微小中空球体を用いる場合、
マトリックス樹脂との界面接着強度を高め、 物性を向
上させるため、 シランカップリング剤を使用すること
もできる。 該シランカップリング剤としては、 例え
ば、β−(3,4−エポキシシクロヘキシル)−エチル
トリメトキシシラン、 γ−グリシドキシプロピルトリ
メトキシシラン、γ−クロロプロピルトリメトキシシラ
ン等が挙げられる。[0011] Furthermore, when using glass micro hollow spheres,
A silane coupling agent can also be used to increase the interfacial adhesive strength with the matrix resin and improve physical properties. Examples of the silane coupling agent include β-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, and the like.
【0012】(B)微小中空球体の使用量は、(A)エ
ポキシ樹脂100重量部につき通常5〜65重量部、好
ましくは10〜35重量部である。使用量が5重量部未
満の際には、軽量化が不十分であり、また65重量部を
超えるときは、樹脂組成物の混合性が不十分であるため
いずれも好ましくない。The amount of (B) micro hollow spheres used is usually 5 to 65 parts by weight, preferably 10 to 35 parts by weight per 100 parts by weight of (A) epoxy resin. If the amount used is less than 5 parts by weight, the weight reduction will be insufficient, and if it exceeds 65 parts by weight, the mixability of the resin composition will be insufficient, which is not preferable.
【0013】本発明で用いられる(C)発泡剤としては
、例えば、アゾビスイソブチロニトリル(AIBN)、
アゾジカルボンアミド(ADCA)、アゾビスホルムア
ミド(ABFA)、ジアゾアミノベンゼン(DAB)等
のアゾ系、 N,N’−ジニトロソペンタメチレンテト
ラミン(DPT)、 N,N’−ジメチル−N,N’−
ジニトロソテレフタルアミド等のニトロソ系、ベンゼン
スルホニルヒドラジド(BSH)、トルエンスルホニル
ヒドラジド(TSH)、p,p’−オキシビス(ベンゼ
ンスルホニルヒドラジド)(OBSH)等のヒドラジド
系が挙げられる。また、硬化の際、加熱によりガスが発
生するもの、または沸点が硬化温度付近のもの、例えば
、脂肪族炭化水素、アルコール類、ケトン類、ハロゲン
化合物等の有機溶剤も使用することができる。なかでも
アゾジカルボンアミド、ジニトロソペンタメチレンテト
ラミン、トリヒドラジノトリアジンが高温発泡性の点で
好ましい。これらを使用することにより硬化時に効果的
に発泡し、軽量の発泡体体が得られる。Examples of the blowing agent (C) used in the present invention include azobisisobutyronitrile (AIBN),
Azo series such as azodicarbonamide (ADCA), azobisformamide (ABFA), diazoaminobenzene (DAB), N,N'-dinitrosopentamethylenetetramine (DPT), N,N'-dimethyl-N,N' −
Examples include nitroso-based compounds such as dinitrosoterephthalamide, and hydrazide-based compounds such as benzenesulfonylhydrazide (BSH), toluenesulfonylhydrazide (TSH), and p,p'-oxybis(benzenesulfonylhydrazide) (OBSH). Further, during curing, it is also possible to use organic solvents that generate gas when heated or have boiling points near the curing temperature, such as aliphatic hydrocarbons, alcohols, ketones, and halogen compounds. Among them, azodicarbonamide, dinitrosopentamethylenetetramine, and trihydrazinotriazine are preferred from the viewpoint of high-temperature foamability. By using these materials, they can be effectively foamed during curing and a lightweight foamed product can be obtained.
【0014】(C)発泡剤は、(A)エポキシ樹脂10
0重量部につき通常 0.1〜25重量部、好ましくは
2〜10重量部が添加される。 添加量が0.1重量部
未満のときには、発泡の効果が少なく、また25重量部
を超えるときは、発泡量がが大き過ぎ、成形性に問題を
生ずるためいずれも好ましくない。(C) The blowing agent is (A) epoxy resin 10
Usually 0.1 to 25 parts by weight, preferably 2 to 10 parts by weight are added per 0 parts by weight. If the amount added is less than 0.1 parts by weight, the foaming effect will be small, and if it exceeds 25 parts by weight, the amount of foaming will be too large, causing problems in moldability, which are both undesirable.
【0015】また発泡剤の分解温度、発生ガス量、発泡
速度等を調整する目的で発泡助剤を添加することもでき
る。発泡助剤としては、例えば、亜鉛華、硝酸亜鉛、三
塩基性リン酸鉛、金属石鹸、ホウ砂、蓚酸、尿素等の発
泡促進剤、ハイドロキノン等の発泡抑制剤が挙げられる
。A foaming aid may also be added for the purpose of adjusting the decomposition temperature, amount of gas generated, foaming speed, etc. of the foaming agent. Examples of the foaming aid include foaming accelerators such as zinc white, zinc nitrate, tribasic lead phosphate, metal soap, borax, oxalic acid, and urea, and foaming inhibitors such as hydroquinone.
【0016】本発明で用される(D)難燃剤としては、
例えばハロゲン系、リン系および無機金属化合物系等の
ものが挙げられる。ハロゲン系難燃剤の代表的なものと
しては、例えば、ブロム化エポキシ樹脂、ブロム化フェ
ニルグリシジルエーテル、テトラブロモビスフェノール
、 2,2−ビス(4−ヒドロキシ−3,5−ジブロモ
フェニル)プロパン、トリブロモベンゼン、テトラブロ
モベンゼン、 ヘキサブロモベンゼン、トリス(2,3
−ジブロモプロピル)イソシアヌレート、2,2−ビス
(4−ヒドロキシエトキシ−3,5−ジブロモフェニル
)プロパン、デカブロモジフェニルオキサイド、塩素化
パラフィン、臭素化ポリフェニル等が挙げられる。また
リン系難燃剤の代表的なものとしては、例えば、リン酸
アンモニウム、トリクレジルホスフェート、トリエチル
ホスフェート、 トリス(β−クロロエチル)ホスフェ
ート、トリス(β−ブロモエチル)ホスフェート、 ト
リスクロロエチルホスフェート、トリスジクロロプロピ
ルホスフェート、トリスジブロモプロピルホスフェート
、クレジルジフェニルホスフェート、キシリレンジフェ
ニルホスフェート、酸性リン酸エステル、含窒素リン化
合物等が挙げられる。無機金属化合物系難燃剤の代表な
ものとしては、例えば、酸化スズ、三酸化アンチモン、
メタホウ酸バリウム、ホウ酸カルシウム、水酸化アルミ
ニウム、水酸化マグネシウム、赤リン等が挙げられる。The flame retardant (D) used in the present invention includes:
Examples include halogen-based, phosphorus-based, and inorganic metal compound-based materials. Typical halogen flame retardants include, for example, brominated epoxy resins, brominated phenylglycidyl ether, tetrabromobisphenol, 2,2-bis(4-hydroxy-3,5-dibromophenyl)propane, and tribromo Benzene, tetrabromobenzene, hexabromobenzene, tris(2,3
-dibromopropyl) isocyanurate, 2,2-bis(4-hydroxyethoxy-3,5-dibromophenyl)propane, decabromodiphenyl oxide, chlorinated paraffin, brominated polyphenyl, and the like. Typical phosphorus flame retardants include, for example, ammonium phosphate, tricresyl phosphate, triethyl phosphate, tris (β-chloroethyl) phosphate, tris (β-bromoethyl) phosphate, trischloroethyl phosphate, and tris dichloro. Examples include propyl phosphate, tris-dibromopropyl phosphate, cresyl diphenyl phosphate, xylylene diphenyl phosphate, acidic phosphoric acid ester, and nitrogen-containing phosphorus compounds. Representative examples of inorganic metal compound flame retardants include tin oxide, antimony trioxide,
Examples include barium metaborate, calcium borate, aluminum hydroxide, magnesium hydroxide, red phosphorus, and the like.
【0017】(D)難燃剤は、 (A)エポキシ樹脂1
00重量部につき通常 5〜75重量部、好ましくは1
0〜50重量部添加される。添加量が5重量部未満では
、難燃化の効果がなく、また75重量部を超えるときは
、樹脂組成物の粘度が増加し混合が困難となるためいず
れも好ましくない。(D) Flame retardant is (A) Epoxy resin 1
Usually 5 to 75 parts by weight per 00 parts by weight, preferably 1
It is added in an amount of 0 to 50 parts by weight. If the amount added is less than 5 parts by weight, there is no flame retardant effect, and if it exceeds 75 parts by weight, the viscosity of the resin composition increases and mixing becomes difficult, which is not preferable.
【0018】本発明で使用される(E)芳香族ジアミン
としては、 例えば、4,4’−ジアミノジフェニルス
ルホン、3,3’−ジアミノジフェニルスルホン、4,
4’−ジアミノジフェニルメタン、4,4’−メチレン
ジ−o−トルイジン、4,4’−メチレンジ−2,6−
キシリジン、4,4’−ジアミノベンズアニリド、4,
4’−メチレンジ−2,6−ジエチルアニリン、 4,
4’−ジアミノ−3,3’−ジメチルジシクロヘキシル
メタン等が挙げられる。特に固形の芳香族ジアミンを用
いる場合には、均一に分散させるため粒径を60μm以
下にすることが好ましい。The aromatic diamine (E) used in the present invention includes, for example, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, 4,
4'-diaminodiphenylmethane, 4,4'-methylenedi-o-toluidine, 4,4'-methylenedi-2,6-
xylidine, 4,4'-diaminobenzanilide, 4,
4'-methylenedi-2,6-diethylaniline, 4,
Examples include 4'-diamino-3,3'-dimethyldicyclohexylmethane. Particularly when using a solid aromatic diamine, it is preferable that the particle size is 60 μm or less in order to ensure uniform dispersion.
【0019】(E)芳香族ジアミンは、(A)エポキシ
樹脂100重量部につき通常15〜140重量部、好ま
しくは25〜65重量部が添加される。添加量が15重
量部未満の際には、十分な硬化物が得られず、また14
0重量部を超えるときは、発熱量が大き過ぎて成形性に
問題があるためいずれも好ましくない。(E) Aromatic diamine is usually added in an amount of 15 to 140 parts by weight, preferably 25 to 65 parts by weight, per 100 parts by weight of (A) epoxy resin. When the amount added is less than 15 parts by weight, a sufficient cured product may not be obtained;
If it exceeds 0 parts by weight, the amount of heat generated is too large and there is a problem with moldability, which is not preferable.
【0020】また、必要に応じ他の硬化剤、硬化促進剤
を配合することもできる。これらの例として、ジシアン
ジアミド、BF3モノエチルアミン、3−(3,4−ジ
クロロフェニル)−1,1−ジメチルウレア等が挙げら
れる。本発明では、その他の添加物として反応稀釈剤、
各種フィラー、可塑剤、整泡剤、増粘剤、着色剤等を混
合することもできる。[0020] Other curing agents and curing accelerators may also be added as required. Examples of these include dicyandiamide, BF3 monoethylamine, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, and the like. In the present invention, as other additives, a reactive diluent,
Various fillers, plasticizers, foam stabilizers, thickeners, colorants, etc. can also be mixed.
【0021】次に、本発明の複合材料用樹脂組成物の製
造方法について説明する。上記樹脂組成物の製造におい
て重要な点は、1)配合物の添加順序および2)混合方
法である。エポキシ樹脂、微小中空球体、発泡剤、難燃
剤および芳香族ジアミンを混合するに際し、まずエポキ
シ樹脂を通常80〜200℃で加熱溶融し、粘度が低下
してから微小中空球体を添加する。 均一に混合してか
ら混合物を通常 60〜80℃まで冷却後、あらかじめ
液状のエポキシ樹脂と混合した発泡剤、難燃剤および芳
香族ジアミンを手早く添加し、その後、配合物を抜き出
し急冷する。Next, a method for producing the resin composition for composite materials of the present invention will be explained. Important points in the production of the above resin composition are 1) the order of addition of the blends and 2) the mixing method. When mixing the epoxy resin, hollow microspheres, foaming agent, flame retardant, and aromatic diamine, the epoxy resin is first melted by heating, usually at 80 to 200°C, and after the viscosity has decreased, the hollow microspheres are added. After uniformly mixing and cooling the mixture to usually 60 to 80°C, the blowing agent, flame retardant and aromatic diamine previously mixed with the liquid epoxy resin are quickly added, and then the mixture is extracted and rapidly cooled.
【0022】混合方法については、微小中空球体のよう
に剪断力を加え過ぎると容易に破壊する固体の場合、混
合時の粘度調節および剪断速度の調節が重要である。混
合時の粘度は500〜25,000cP程度がよく、好
ましくは800〜13,000cPが用いられる。この
際粘度が500cP未満であると、シート状にしたとき
べたついたり、流動したりする。 また、粘度が25,
000cPよりも高いと均一に混合し難く、微小中空球
体が破壊するので好ましくない。Regarding the mixing method, in the case of solids such as micro hollow spheres that easily break if too much shearing force is applied, it is important to adjust the viscosity and shear rate during mixing. The viscosity during mixing is preferably about 500 to 25,000 cP, preferably 800 to 13,000 cP. At this time, if the viscosity is less than 500 cP, it becomes sticky or fluid when formed into a sheet. Also, the viscosity is 25,
If it is higher than 000 cP, it will be difficult to mix uniformly and the micro hollow spheres will be destroyed, which is not preferable.
【0023】剪断力の小さい混合機としては、プラネタ
リーミキサー、2軸型ニーダーおよびスタチックミキサ
ー等が挙げられる。プラネタリーミキサーおよびニーダ
ーは変速機付きが好ましい。特に、粘度が高い場合に剪
断力が大きいと、発熱が起こり反応が進行して、樹脂の
粘度が増加したり発泡したりする。剪断力が小さいとき
には、混合が不十分なため微小中空球体、発泡剤、難燃
剤および芳香族ジアミンが不均一となり、十分な物性が
得られない。Examples of mixers with low shearing force include planetary mixers, twin-screw kneaders, and static mixers. The planetary mixer and kneader are preferably equipped with a transmission. In particular, if the shearing force is large when the viscosity is high, heat generation occurs and the reaction progresses, causing the viscosity of the resin to increase and foaming to occur. When the shearing force is small, the micro hollow spheres, foaming agent, flame retardant and aromatic diamine become non-uniform due to insufficient mixing, and sufficient physical properties cannot be obtained.
【0024】このようにして得られた複合材料用樹脂組
成物は、複合材料用の中間材であるシートまたはフィル
ム(単体中間材)の製造に用いられる。製造方法には各
種あるが、例えば、カレンダーコーター、リバースロー
ルコーター、ナイフオーバーロールコーター等を使用し
て行う方法が代表的である。塗工厚さとしては、通常0
.1〜5mm 程度が好ましい。 被塗工材としては、
剥離紙が一般に使用されるが、プラスチック等のフィ
ルムも使用できる。また、被覆材として剥離紙およびポ
リエチレン等のフィルムが使用できる。更に、上記の単
体中間材としてのシートまたはフィルムを、ガラススク
リムクロス、ガラスマット、不織布等により補強し、補
強中間材として使用することができる。The resin composition for composite materials thus obtained is used for producing sheets or films (single intermediate materials) that are intermediate materials for composite materials. There are various manufacturing methods, but typical methods include methods using a calendar coater, reverse roll coater, knife over roll coater, etc. The coating thickness is usually 0.
.. Approximately 1 to 5 mm is preferable. As the material to be coated,
Release paper is commonly used, but films such as plastic can also be used. Furthermore, release paper and films such as polyethylene can be used as the covering material. Furthermore, the above sheet or film as a single intermediate material can be reinforced with glass scrim cloth, glass mat, nonwoven fabric, etc., and used as a reinforcing intermediate material.
【0025】なお、複合材料用樹脂組成物は、そのまま
加温した押出機、注入機等により、例えばガラス繊維強
化樹脂(FRP)製あるいは炭素繊維強化樹脂(CFR
P)製パイプや、複雑形状物の内部に注入充填して、加
熱硬化することにより、補強の目的に使用することもで
きる。[0025] The resin composition for composite materials is made of glass fiber reinforced resin (FRP) or carbon fiber reinforced resin (CFR) by using an extruder, injection machine, etc. heated as it is.
It can also be used for reinforcing purposes by injecting and filling the inside of P) pipes or complex-shaped objects and curing with heat.
【0026】前記のようにして製造した単体中間材また
は補強中間材は、そのまま加熱して発泡状の軽量材とし
て使用できるが、 更に、炭素繊維、ガラス繊維、 ア
ラミド繊維、ボロン繊維、シリコンカーバイド繊維、ポ
リエチレン繊維、アルミナ繊維等を用いたプリプレグと
一体成形させた後に加熱硬化を行って、複合材料とする
ことができる。この場合に用いられるプリプレグは、特
にエポキシ樹脂と容易に共架橋するため好ましい。上記
中間材の加熱硬化は、通常150〜250℃で10分〜
10時間、好ましくは170〜230℃で30分〜3時
間加熱することにより達成される。[0026] The single intermediate material or reinforcing intermediate material produced as described above can be heated as is and used as a foamed lightweight material. It can be made into a composite material by integrally molding it with a prepreg using polyethylene fiber, alumina fiber, etc., and then heat-curing it. The prepreg used in this case is particularly preferred because it easily co-crosslinks with the epoxy resin. The above intermediate material is usually heat-cured at 150-250°C for 10 minutes or more.
This is achieved by heating for 10 hours, preferably 30 minutes to 3 hours at 170-230°C.
【0027】中間材(単体中間材または補強中間材)を
用いて積層構造とするには、中間材をコア材とするサン
ドイッチ構造が用いられるが、コア材層の数に従って単
層および多層に分けられる。更にサンドイッチハイブリ
ッド構造、層間ハイブリッド構造として使用することも
できる。単層サンドイッチ構造には、例えば、炭素繊維
プリプレグ/中間材/炭素繊維プリプレグ、ガラス繊維
プリプレグ/中間材/ガラス繊維プリプレグ等がある。
多層サンドイッチ構造には、例えば、炭素繊維プリプレ
グ/中間材/炭素繊維プリプレグ/中間材/炭素繊維プ
リプレグ、ガラス繊維プリプレグ/中間材/ガラス繊維
プリプレグ/中間材/ガラス繊維プリプレグ等がある。
サンドイッチハイブリッドには、例えば、炭素繊維プリ
プレグ/中間材/ガラス繊維プリプレグ、アラミド繊維
プリプレグ/中間材/炭素繊維プリプレグ、炭素繊維プ
リプレグ−アラミドプリプレグ/中間材/炭素繊維プリ
プレグ−ガラス繊維プリプレグ等がある。層間ハイブリ
ッドには炭素繊維プリプレグ/中間材/ガラス繊維プリ
プレグ/中間材/炭素繊維プリプレグ等がある。[0027] To create a laminated structure using an intermediate material (single intermediate material or reinforcing intermediate material), a sandwich structure is used in which the intermediate material is the core material, but it is divided into single layer and multilayer according to the number of core material layers. It will be done. Furthermore, it can also be used as a sandwich hybrid structure or an interlayer hybrid structure. Examples of the single-layer sandwich structure include carbon fiber prepreg/intermediate material/carbon fiber prepreg, glass fiber prepreg/intermediate material/glass fiber prepreg, and the like. Examples of the multilayer sandwich structure include carbon fiber prepreg/intermediate material/carbon fiber prepreg/intermediate material/carbon fiber prepreg, glass fiber prepreg/intermediate material/glass fiber prepreg/intermediate material/glass fiber prepreg, and the like. Sandwich hybrids include, for example, carbon fiber prepreg/intermediate material/glass fiber prepreg, aramid fiber prepreg/intermediate material/carbon fiber prepreg, carbon fiber prepreg-aramid prepreg/intermediate material/carbon fiber prepreg-glass fiber prepreg, and the like. Interlayer hybrids include carbon fiber prepreg/intermediate material/glass fiber prepreg/intermediate material/carbon fiber prepreg.
【0028】積層体の成形物は平板状、曲面状、管状、
棒状等のいずれでもよい。管状および棒状成形物の場合
には、スキン層は炭素繊維、アラミド繊維、ガラス繊維
等を有するプリプレグ等を用い、コア材に単体中間材を
中空状にまたは隙間なく充填することにより軽量の成形
物が得られる。[0028] The molded product of the laminate can be flat, curved, tubular,
It may be rod-shaped or the like. In the case of tubular and rod-shaped molded products, the skin layer is made of prepreg containing carbon fiber, aramid fiber, glass fiber, etc., and the core material is filled with a single intermediate material in a hollow shape or without any gaps, thereby creating a lightweight molded product. is obtained.
【0029】そのほかの成形法として、炭素繊維、アラ
ミド繊維、ガラス繊維等を有するプリプレグをあらかじ
め硬化した成形板と単体中間材とを貼付して加熱硬化す
ることもできる。更に炭素繊維、アラミド繊維、ガラス
繊維等を有する強化プラスチック板と硬化させた単体中
間材(複合材料)とをフィルム状接着剤で加熱接着する
こともできる。[0029] As another molding method, a pre-cured molded plate made of prepreg containing carbon fibers, aramid fibers, glass fibers, etc. and a single intermediate material may be attached and cured by heating. Furthermore, a reinforced plastic plate containing carbon fibers, aramid fibers, glass fibers, etc. and a cured single intermediate material (composite material) can also be heat-bonded using a film adhesive.
【0030】このように、複合材料用エポキシ樹脂組成
物をシート状に成形した単体中間材は、平板から複雑形
状まで容易に積層でき、かつ他のプリプレグと共架橋さ
せることにより、構造接着剤と同様に使用することがで
き、しかも取扱いが容易であり、より軽量で強度の大き
い複合材料が得られる。[0030] As described above, the single intermediate material formed into a sheet form from the epoxy resin composition for composite materials can be easily laminated in shapes ranging from flat plates to complex shapes, and can be used as a structural adhesive by co-crosslinking with other prepregs. A composite material that can be used in a similar manner, is easier to handle, and is lighter and stronger is obtained.
【0031】これらの用途の一例として、航空機関係で
は構造物のコア材、複雑形状物への充填、穴、くぼみ等
の補修、 ダクトの形成等がある。 建築関係では高層
階の家具、壁等のパネルがある。自動車等の車両関係で
は構造材のコア材、電気関係では装置、機器のハウジン
グ等がある。Examples of these uses include, in the aircraft industry, core materials for structures, filling complex-shaped objects, repairing holes, depressions, etc., and forming ducts. In the architectural field, there are furniture for upper floors, panels for walls, etc. For vehicles such as automobiles, there are core materials for structural materials, and for electrical equipment, there are housings for devices and equipment.
【0032】[0032]
【実施例】以下、実施例および比較例により本発明を具
体的に説明するが、本発明はこれらに制限されるもので
はない。[Examples] The present invention will be specifically explained below with reference to Examples and Comparative Examples, but the present invention is not limited thereto.
【0033】実施例1
4官能グリシジルアミン型エポキシ樹脂(商品名:アラ
ルダイトMY720、チバ・ガイギー社製)5.5kg
およびビスフェノールA型エポキシ樹脂(商品名:エ
ピコート828、油化シェルエポキシ(株)製)1.5
kg をプラネタリーミキサーに送入し、120℃で均
一に混合した後、ガラス微小中空球体(商品名:スコッ
チライトグラスバブルズB28/750グレード、住友
スリーエム社製)1.2kg ならびに難燃剤として三
酸化アンチモン0.5kgおよびトリスジブロムプロピ
ルホスフェート0.6kgを添加して均一に混合した。
混合後、内容物を攪拌しながら100℃まで冷却し、
芳香族ジアミンとして4,4’−ジアミノジフェニルス
ルホン2.4kg、 発泡剤としてアゾジカルボンアミ
ド0.25kg を手早く添加し、15分間攪拌し、抜
き出し、冷却した。 この配合物を70℃で再溶融し、
カレンダーロールコーターを使用して厚さ1.3mm
のシート状物(単体中間材)を得た。製造したシート
状物を切り出し、180℃のオーブン中で1時間加熱硬
化したところ、厚さ4mmの複合材料が得られた。 得
られた発泡体の密度は0.35g/cm3であった。
また、JISK6911 に準拠して燃焼性を試験した
ところ、自消性が認められた。Example 1 5.5 kg of tetrafunctional glycidylamine type epoxy resin (trade name: Araldite MY720, manufactured by Ciba Geigy)
and bisphenol A type epoxy resin (trade name: Epicote 828, manufactured by Yuka Shell Epoxy Co., Ltd.) 1.5
kg were fed into a planetary mixer and mixed uniformly at 120°C, followed by 1.2 kg of glass micro hollow spheres (trade name: Scotchlite Glass Bubbles B28/750 grade, manufactured by Sumitomo 3M) and three flame retardants. 0.5 kg of antimony oxide and 0.6 kg of tris dibromopropyl phosphate were added and mixed uniformly. After mixing, the contents were cooled to 100°C while stirring,
2.4 kg of 4,4'-diaminodiphenylsulfone as an aromatic diamine and 0.25 kg of azodicarbonamide as a blowing agent were quickly added, stirred for 15 minutes, taken out, and cooled. This blend was remelted at 70°C,
1.3mm thick using calendar roll coater
A sheet-like product (single intermediate material) was obtained. The produced sheet-like material was cut out and cured by heating in an oven at 180°C for 1 hour to obtain a composite material with a thickness of 4 mm. The density of the resulting foam was 0.35 g/cm3.
Furthermore, when the flammability was tested in accordance with JISK6911, self-extinguishing properties were found.
【0034】実施例2
3官能グリシジルアミン型エポキシ樹脂(商品名:Ta
ctix742、ダウケミカル日本(株)製)3.0k
g、 ビスフェノールF型エポキシ樹脂(商品名:エポ
トートYDF170、東都化成(株)製)1.3kg
およびブロム化エポシキ樹脂(商品名:エポトートYD
B340、東都化成(株)製)1.2kg をプラネタ
リーミキサーに送入し、130℃で均一に混合した後、
ガラス微小中空球体(商品名:スコッチライトガラスバ
ブルズ B28/750グレード)1.2kg を添加
して均一に混合した。その後、内容物を攪拌しながら9
0℃まで冷却し、芳香族ジアミンとして4,4’−ジア
ミノジフェニルスルホン2.6kg、発泡剤としてジニ
トロソペンタメチレンテトラミン0.25kgを手早く
添加し、 10分間攪拌し、抜き出し、冷却した。この
配合物を80℃で再溶融し、カレンダーロールコーター
を使用して厚さ1.3mmのシート状物(単体中間材)
を得た。 製造したシート状物を切り出し、180℃の
オーブン中で1時間加熱硬化したところ、得られた発泡
体の密度は0.35g/cm3であった。また、JIS
K6911 に準拠して燃焼性を試験したところ、自
消性が認められた。Example 2 Trifunctional glycidylamine type epoxy resin (trade name: Ta
ctix742, manufactured by Dow Chemical Japan Co., Ltd.) 3.0k
g, Bisphenol F type epoxy resin (product name: Epotote YDF170, manufactured by Toto Kasei Co., Ltd.) 1.3 kg
and brominated epoxy resin (product name: Epotote YD
After feeding 1.2 kg of B340 (manufactured by Toto Kasei Co., Ltd.) into a planetary mixer and uniformly mixing it at 130°C,
1.2 kg of glass micro hollow spheres (trade name: Scotchlite Glass Bubbles B28/750 grade) were added and mixed uniformly. Then, while stirring the contents,
After cooling to 0°C, 2.6 kg of 4,4'-diaminodiphenylsulfone as an aromatic diamine and 0.25 kg of dinitrosopentamethylenetetramine as a blowing agent were quickly added, stirred for 10 minutes, taken out, and cooled. This mixture was remelted at 80°C and a sheet of 1.3 mm thick was produced using a calendar roll coater (single intermediate material).
I got it. The produced sheet-like product was cut out and cured by heating in an oven at 180°C for 1 hour, and the density of the resulting foam was 0.35 g/cm 3 . Also, JIS
When the flammability was tested in accordance with K6911, it was found to be self-extinguishing.
【0035】比較例1
発泡剤およびガラス微小中空球体を用いない点を除き、
実施例1と同様の方法で厚さ1.7mmのシートを得た
。 更に180℃で1時間硬化して得られた硬化物の密
度は1.3g/cm3であった。Comparative Example 1 Except that no blowing agent and glass micro hollow spheres were used.
A sheet with a thickness of 1.7 mm was obtained in the same manner as in Example 1. The density of the cured product obtained by further curing at 180° C. for 1 hour was 1.3 g/cm 3 .
【0036】比較例2
発泡剤を用いない点を除き、 実施例1と同様の方法で
厚さ1.7mmのシート状物を得た。更に180℃で1
時間硬化して得られた硬化物の密度は0.65g/cm
3であった。Comparative Example 2 A sheet-like product with a thickness of 1.7 mm was obtained in the same manner as in Example 1, except that no blowing agent was used. Furthermore, 1 at 180℃
The density of the cured product obtained by time curing is 0.65 g/cm
It was 3.
【0037】比較例3
ガラス微小中空球体を用いない点を除き、 実施例1と
同様の方法で厚さ1.7mm のシートを得た。 更に
180℃で 1時間硬化して得られた硬化物の密度は
0.65g/cm3であった。Comparative Example 3 A sheet with a thickness of 1.7 mm was obtained in the same manner as in Example 1, except that glass micro hollow spheres were not used. Further, the density of the cured product obtained by curing at 180° C. for 1 hour was 0.65 g/cm 3 .
【0038】実施例3
301×301mm角、 厚さ3.5mmのステンレス
金型に300×300mm角の炭素繊維クロスプリプレ
グを2枚積層し、 その上に実施例1で得られた 30
0×300mm角の未硬化の単体中間材を1枚貼付し、
更に300×300mm角の炭素繊維クロスプリプレグ
を2枚積層した。 これらの上下面に離型フィルムを当
て、更にその外側にステンレスの当て板をして、ホット
プレスに挟んだ。これを2.5℃/minの速度で室温
から180℃まで加熱後、 180℃で1時間保持して
硬化させた。 得られた積層体の成形板の厚さは3.5
mm、密度は0.5g/cm3であり、厚さにかかわら
ず非常に軽量であった。 次いで、 この成形板から長
さ20cm、幅1.5cmの短冊形の試験板を切り出し
、支点間長さ/厚さ比=30、測定温度120℃の条件
で4点曲げ試験をASTM C393 に準拠して実施
したところ、曲げ強度は14kg/mm2、曲げ剛性は
2.9ton/mm2であった。Example 3 Two 300 x 300 mm square carbon fiber cloth prepregs were laminated on a 301 x 301 mm square, 3.5 mm thick stainless steel mold, and on top of that, 30 pieces of carbon fiber cloth prepreg obtained in Example 1 were laminated.
Attach one piece of uncured intermediate material of 0 x 300 mm square,
Furthermore, two sheets of carbon fiber cloth prepreg measuring 300 x 300 mm were laminated. Release films were applied to the upper and lower surfaces of these, and a stainless steel backing plate was placed on the outside of the release film, and the pieces were sandwiched in a hot press. This was heated from room temperature to 180°C at a rate of 2.5°C/min, and then held at 180°C for 1 hour to cure. The thickness of the molded plate of the obtained laminate was 3.5
mm, the density was 0.5 g/cm3, and it was extremely lightweight regardless of the thickness. Next, a rectangular test plate with a length of 20 cm and a width of 1.5 cm was cut from this molded plate, and a 4-point bending test was conducted under the conditions of a length/thickness ratio between fulcrums of 30 and a measurement temperature of 120°C in accordance with ASTM C393. As a result, the bending strength was 14 kg/mm2, and the bending rigidity was 2.9 ton/mm2.
【0039】実施例4
301×301mm角、厚さ3mmのステンレス金型に
300×300mm角の炭素繊維クロスプリプレグを2
枚積層し、その上に実施例1において得られた300×
300mm角の未硬化の単体中間材を2枚貼付し、更に
300×300mm角の炭素繊維クロスプリプレグ を
2枚積層した。 これらの上下面に離型フィルムを当て
、更にその外側にステンレスの当て板をして、ホットプ
レスに挟んだ。 2.5℃/minの速度で室温から1
80℃まで加熱後、180℃で1時間保持して発泡硬化
させた。得られた成形板の厚さは3.0mm、密度は0
.5g/cm3であり、 厚さにかかわらず非常に軽量
であった。また、120℃における曲げ強度は14kg
/mm2、曲げ剛性は2.9ton/mm2であった。Example 4 Two carbon fiber cloth prepregs of 300 x 300 mm square were placed in a stainless steel mold of 301 x 301 mm square and 3 mm thick.
300× obtained in Example 1
Two sheets of uncured single intermediate material of 300 mm square were attached, and two sheets of carbon fiber cloth prepreg of 300 x 300 mm square were further laminated. Release films were applied to the upper and lower surfaces of these, and a stainless steel backing plate was placed on the outside of the release film, and the pieces were sandwiched in a hot press. 1 from room temperature at a rate of 2.5°C/min.
After heating to 80°C, it was held at 180°C for 1 hour to foam and harden. The thickness of the obtained molded plate was 3.0 mm, and the density was 0.
.. It was 5g/cm3 and was extremely lightweight regardless of its thickness. In addition, the bending strength at 120℃ is 14kg.
/mm2, and the bending rigidity was 2.9 ton/mm2.
【0040】実施例5
実施例2で得られた未硬化の単体中間材を200×40
mm角に裁断し、外径約10mmの棒状に丸め、 その
上から厚さ0.12mm、200×72mm角の一方向
炭素繊維プリプレグを巻き、 更にその上から厚さ0.
05mm、220×40mm角の離型フィルムを巻き、
両端を耐熱テープでシールした。これを内径12.5m
m、長さ200mmの鉄製パイプに入れた後、両端をキ
ャップで閉塞した。これをオーブンに入れ、室温から1
80℃まで3℃/minの速度で昇温し、その後、18
0℃で1時間加熱して発泡硬化させた。これにより円筒
状成形体が得られた。Example 5 The uncured single intermediate material obtained in Example 2 was
It is cut into 1 mm square pieces, rolled into a rod shape with an outer diameter of about 10 mm, and wrapped with a 0.12 mm thick, 200 x 72 mm square unidirectional carbon fiber prepreg, and then wrapped with a 0.1 mm thick unidirectional carbon fiber prepreg.
Wrap a release film of 0.05 mm, 220 x 40 mm square,
Both ends were sealed with heat-resistant tape. This has an inner diameter of 12.5m
After putting it into a 200 mm long iron pipe, both ends were closed with caps. Put this in the oven and let it rise from room temperature to 1
The temperature was raised to 80°C at a rate of 3°C/min, and then the temperature was increased to 18°C.
The foam was cured by heating at 0° C. for 1 hour. As a result, a cylindrical molded body was obtained.
【0041】比較例4
301×301mm角、厚さ3.5mmのステンレス金
型に 300×300mm角の炭素繊維クロスプリプレ
グを2枚積層し、 その上に比較例2で得られた 30
0×300mm角の未硬化のシート状物を1枚貼付し、
更に300×300mm角の炭素繊維クロスプリプレグ
を2枚積層した。 これらの上下面に離型フィルムを当
て、更にその外側にステンレスの当て板をして、ホット
プレスに挟んだ。 2.5℃/minの速度で室温から
185℃まで加熱後、185℃で1時間保持して硬化さ
せた。得られた積層体の成形板の厚さは3.5mm、
密度は0.95g/cm3であり、発泡剤を添加した実
施例3の密度の約2倍であった。120℃における曲げ
強度は14kg/mm2、曲げ剛性は3.2ton/m
m2であった。Comparative Example 4 Two 300 x 300 mm square carbon fiber cloth prepregs were laminated on a 301 x 301 mm square, 3.5 mm thick stainless steel mold, and on top of that, 30 pieces of carbon fiber cloth prepreg obtained in Comparative Example 2 were laminated.
Attach one uncured sheet of 0 x 300 mm square,
Furthermore, two sheets of carbon fiber cloth prepreg measuring 300 x 300 mm were laminated. Release films were applied to the upper and lower surfaces of these, and a stainless steel backing plate was placed on the outside of the release film, and the pieces were sandwiched in a hot press. After heating from room temperature to 185°C at a rate of 2.5°C/min, it was held at 185°C for 1 hour to cure. The thickness of the molded plate of the obtained laminate was 3.5 mm,
The density was 0.95 g/cm3, which was about twice the density of Example 3 in which a blowing agent was added. Bending strength at 120℃ is 14kg/mm2, bending rigidity is 3.2ton/m
It was m2.
【0042】比較例5
ビスフェノールA型エポキシ樹脂(商品名:エピコート
828、油化シェルエポキシ(株)製)2.8kg お
よびフェノールノボラック型エポキシ樹脂(商品名:エ
ピコート154、油化シェルエポキシ(株)製)5.2
kg をプラネタリーミキサーに送入し、120℃で均
一に混合した後、ガラス微小中空球体(商品名:スコッ
チライトグラスバブルズB28/750グレード、住友
スリーエム社製)1.2kg ならびにトリス(β−ブ
ロモエチル)ホスフェート1.2kg および三酸化ア
ンチモン0.4kgを添加して均一に混合した。 混合
後、内容物を攪拌しながら70℃まで冷却し、 更に硬
化剤としてジシアンジアミド0.24kg、硬化促進剤
として3−p−クロロフェニル−1,1−ジメチルウレ
ア0.32kg、発泡剤としてアゾジカルボンアミド0
.24kgを手早く添加し、 5分間攪拌し、抜き出し
、冷却した。この配合物を70℃で再溶融し、カレンダ
ーロールコーターを使用して厚さ1.3mmのシート状
物を得た。次に301×301mm角、厚さ3mmのス
テンレス金型に300×300mm角の炭素繊維クロス
プリプレグを2枚積層し、その上に上記の方法で得られ
た300×300mm角、 厚さ1.3mmのシート状
物を1枚貼付し、更に300×300mm角の炭素繊維
クロスプリプレグを2枚積層した。これらの上下面に離
型フィルムを当て、更にその外側にステンレスの当て板
をして、ホットプレスに挟んだ。 そして2.5℃/m
inの速度で室温から130℃まで加熱後、130℃で
1時間保持して硬化させた。得られた積層体の成形板の
厚さは3.0mm、密度は0.5g/cm3であり、
厚さにかかわらず非常に軽量であった。 また、120
℃における曲げ強度は8kg/mm2、曲げ剛性は1.
8ton/mm2であった。Comparative Example 5 2.8 kg of bisphenol A type epoxy resin (trade name: Epicote 828, manufactured by Yuka Shell Epoxy Co., Ltd.) and phenol novolak type epoxy resin (trade name: Epicote 154, manufactured by Yuka Shell Epoxy Co., Ltd.) manufactured by) 5.2
kg into a planetary mixer and mixed uniformly at 120°C, 1.2 kg of glass micro hollow spheres (trade name: Scotchlite Glass Bubbles B28/750 grade, manufactured by Sumitomo 3M) and Tris (β- 1.2 kg of (bromoethyl) phosphate and 0.4 kg of antimony trioxide were added and mixed uniformly. After mixing, the contents were cooled to 70°C while stirring, and further added 0.24 kg of dicyandiamide as a hardening agent, 0.32 kg of 3-p-chlorophenyl-1,1-dimethylurea as a hardening accelerator, and azodicarbonamide as a blowing agent. 0
.. 24 kg was quickly added, stirred for 5 minutes, removed and cooled. This blend was remelted at 70°C, and a sheet-like product with a thickness of 1.3 mm was obtained using a calendar roll coater. Next, two sheets of 300 x 300 mm square carbon fiber cloth prepreg were laminated on a 301 x 301 mm square, 3 mm thick stainless steel mold, and on top of that, the 300 x 300 mm square, 1.3 mm thick sheet obtained by the above method was laminated. One sheet-like material was attached, and two 300 x 300 mm square carbon fiber cloth prepregs were further laminated. Release films were applied to the upper and lower surfaces of these, and a stainless steel backing plate was placed on the outside of the release film, and the pieces were sandwiched in a hot press. and 2.5℃/m
After heating from room temperature to 130° C. at a speed of 100° C., the film was cured by holding at 130° C. for 1 hour. The thickness of the molded plate of the obtained laminate was 3.0 mm, the density was 0.5 g/cm3,
Despite its thickness, it was extremely lightweight. Also, 120
The bending strength at ℃ is 8 kg/mm2, and the bending rigidity is 1.
It was 8 tons/mm2.
【0043】実施例3および実施例4と比較例5との相
違点は、実施例3および実施例4では180℃で硬化を
行っているのに対し、比較例5では低温硬化型樹脂を用
い、130℃で硬化していることである。このように低
温硬化型樹脂を用いると、ガラス転移温度(Tg)が低
くなるために、 耐熱性、例えば120℃における曲げ
特性が劣ったものとなる。また、実施例3および実施例
4は、発泡剤を用いない比較例4に比べ、同等の曲げ特
性を有し、しかも密度が1/2程度に低いことがわかる
。The difference between Examples 3 and 4 and Comparative Example 5 is that in Examples 3 and 4, curing was carried out at 180°C, whereas in Comparative Example 5, a low temperature curing resin was used. , and is cured at 130°C. When a low-temperature curing resin is used in this manner, the glass transition temperature (Tg) becomes low, resulting in poor heat resistance, for example, bending properties at 120°C. Furthermore, it can be seen that Examples 3 and 4 have the same bending properties as Comparative Example 4 in which no blowing agent is used, and the density is about 1/2 lower.
【0044】[0044]
【発明の効果】本発明によれば、取扱いの容易な複合材
料用樹脂シートまたはフィルムから、難燃性および耐熱
性があり、軽量で、かつ強度、剛性のある発泡体を含む
複合材料を得ることができる。Effects of the Invention According to the present invention, a composite material containing a foam that is flame retardant, heat resistant, lightweight, strong and rigid is obtained from an easy-to-handle resin sheet or film for composite material. be able to.
Claims (6)
球体、(C)発泡剤、(D)難燃剤および(E)芳香族
ジアミンを含有することを特徴とする複合材料用エポキ
シ樹脂組成物。1. An epoxy resin composition for a composite material, comprising (A) an epoxy resin, (B) micro hollow spheres, (C) a foaming agent, (D) a flame retardant, and (E) an aromatic diamine. thing.
し、(B)微小中空球体5〜65重量部、(C)発泡剤
0.1〜25重量部、 (D)難燃剤5〜75重量部お
よび(E)芳香族ジアミン15〜140重量部であるこ
とを特徴とする請求項1に記載の複合材料用エポキシ樹
脂組成物。2. (A) 100 parts by weight of epoxy resin, (B) 5 to 65 parts by weight of micro hollow spheres, (C) 0.1 to 25 parts by weight of blowing agent, and (D) 5 to 75 parts by weight of flame retardant. 2. The epoxy resin composition for composite materials according to claim 1, wherein the amount of the aromatic diamine (E) is 15 to 140 parts by weight.
エポキシ樹脂組成物をシート状またはフィルム状に成形
したことを特徴とする単体中間材。3. A single intermediate material, characterized in that the epoxy resin composition for composite materials according to claim 1 or 2 is molded into a sheet or a film.
れる複合材料。4. A composite material obtained by foaming and curing the single intermediate material according to claim 3.
を補強する補強材とを有することを特徴とする補強中間
材。5. A reinforcing intermediate material comprising the single intermediate material according to claim 3 and a reinforcing material for reinforcing the single intermediate material.
れる複合材料。6. A composite material obtained by foaming and curing the reinforcing intermediate material according to claim 5.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4564091A JPH04266940A (en) | 1991-02-20 | 1991-02-20 | Epoxy resin composition for composite material, intermediate material and composite material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4564091A JPH04266940A (en) | 1991-02-20 | 1991-02-20 | Epoxy resin composition for composite material, intermediate material and composite material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04266940A true JPH04266940A (en) | 1992-09-22 |
Family
ID=12724970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4564091A Pending JPH04266940A (en) | 1991-02-20 | 1991-02-20 | Epoxy resin composition for composite material, intermediate material and composite material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04266940A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6346573B1 (en) * | 1995-11-18 | 2002-02-12 | Vantico Inc. | Amine-modified epoxy resin reacted in presence of latent hardener |
JP2003064209A (en) * | 2001-08-28 | 2003-03-05 | Sekisui Chem Co Ltd | Foam material of epoxy resin |
JP2003105118A (en) * | 2001-09-28 | 2003-04-09 | Nitto Denko Corp | Thermosetting foaming/filling resin composition |
CN1307258C (en) * | 2002-08-09 | 2007-03-28 | 信越化学工业株式会社 | Flame-retardant epoxy resin composition, semiconductor packaging material using said composition, and resin packaged semiconductor |
JP2007519540A (en) * | 2004-02-02 | 2007-07-19 | エル アンド エル プロダクツ, インク. | Improvements in or related to composite materials |
JP2010195852A (en) * | 2009-02-23 | 2010-09-09 | Hitachi Chem Co Ltd | Resin composition, prepreg using the same, laminated sheet, and wiring board |
JP2012527515A (en) * | 2009-05-20 | 2012-11-08 | ヘクセル コーポレイション | Epoxy resin with improved bending properties |
JP2013094988A (en) * | 2011-10-28 | 2013-05-20 | Sekisui Chem Co Ltd | Laminate |
JP2018178359A (en) * | 2017-04-03 | 2018-11-15 | 株式会社エービーシー商会 | Interior building material |
JP2022513181A (en) * | 2018-12-07 | 2022-02-07 | エルエックス・ハウシス・リミテッド | Thermosetting foam, this manufacturing method and the heat insulating material containing it |
WO2023032698A1 (en) * | 2021-09-02 | 2023-03-09 | 三菱瓦斯化学株式会社 | Epoxy resin foam, carbon dioxide absorbent, method for producing epoxy resin foam, multilayer structure and method for producing same |
-
1991
- 1991-02-20 JP JP4564091A patent/JPH04266940A/en active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6346573B1 (en) * | 1995-11-18 | 2002-02-12 | Vantico Inc. | Amine-modified epoxy resin reacted in presence of latent hardener |
US6831113B2 (en) | 1995-11-18 | 2004-12-14 | Huntsman Advanced Materials Americas Inc. | Amine-modified epoxy resin reacted in presence of latent hardener |
JP2003064209A (en) * | 2001-08-28 | 2003-03-05 | Sekisui Chem Co Ltd | Foam material of epoxy resin |
JP2003105118A (en) * | 2001-09-28 | 2003-04-09 | Nitto Denko Corp | Thermosetting foaming/filling resin composition |
CN1307258C (en) * | 2002-08-09 | 2007-03-28 | 信越化学工业株式会社 | Flame-retardant epoxy resin composition, semiconductor packaging material using said composition, and resin packaged semiconductor |
JP2007519540A (en) * | 2004-02-02 | 2007-07-19 | エル アンド エル プロダクツ, インク. | Improvements in or related to composite materials |
JP2010195852A (en) * | 2009-02-23 | 2010-09-09 | Hitachi Chem Co Ltd | Resin composition, prepreg using the same, laminated sheet, and wiring board |
JP2012527515A (en) * | 2009-05-20 | 2012-11-08 | ヘクセル コーポレイション | Epoxy resin with improved bending properties |
JP2013094988A (en) * | 2011-10-28 | 2013-05-20 | Sekisui Chem Co Ltd | Laminate |
JP2018178359A (en) * | 2017-04-03 | 2018-11-15 | 株式会社エービーシー商会 | Interior building material |
JP2022513181A (en) * | 2018-12-07 | 2022-02-07 | エルエックス・ハウシス・リミテッド | Thermosetting foam, this manufacturing method and the heat insulating material containing it |
WO2023032698A1 (en) * | 2021-09-02 | 2023-03-09 | 三菱瓦斯化学株式会社 | Epoxy resin foam, carbon dioxide absorbent, method for producing epoxy resin foam, multilayer structure and method for producing same |
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