JPH0426184A - Thick-film circuit board - Google Patents
Thick-film circuit boardInfo
- Publication number
- JPH0426184A JPH0426184A JP2130923A JP13092390A JPH0426184A JP H0426184 A JPH0426184 A JP H0426184A JP 2130923 A JP2130923 A JP 2130923A JP 13092390 A JP13092390 A JP 13092390A JP H0426184 A JPH0426184 A JP H0426184A
- Authority
- JP
- Japan
- Prior art keywords
- thick
- boards
- film printed
- thick film
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 28
- 239000011521 glass Substances 0.000 claims abstract description 12
- 239000003990 capacitor Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 21
- 239000003989 dielectric material Substances 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000919 ceramic Substances 0.000 abstract description 2
- 239000012212 insulator Substances 0.000 abstract description 2
- 239000004744 fabric Substances 0.000 abstract 2
- -1 overglasses Substances 0.000 abstract 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はハイブリッドＩＣ等に使用される厚膜回路基板
に関し、特に多数の抵抗体や誘電体等を含む高密度な厚
膜回路基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thick film circuit board used for hybrid ICs and the like, and particularly to a high-density thick film circuit board including a large number of resistors, dielectrics, etc.
従来、かかるハイブリッドＩＣに使用される厚膜回路基
板は、抵抗体や大容量のコンデンサを形成する場合、数
量を多くし且つ精度を上げるために最上層の表面もしく
は最下層の裏面に形成している。Conventionally, when forming a resistor or a large capacitor on a thick film circuit board used in such a hybrid IC, it is formed on the top surface of the top layer or the back surface of the bottom layer in order to increase the quantity and improve precision. There is.
第３図はかかる従来の一例を示す厚膜回路基板の縦断面
図である。FIG. 3 is a longitudinal sectional view of a thick film circuit board showing an example of such a conventional circuit board.
第３図に示すように、従来の厚膜回路基板は一つのみを
示し且つその両面に各種の素子を形成した場合である。As shown in FIG. 3, only one conventional thick film circuit board is shown, and various elements are formed on both sides of the board.
かかる基板は絶縁基板１上に被着される銀・パラジウム
等より成る配線導体２と、酸化ルテニウム系等の抵抗体
３と、配線導体２上に形成されるチタン酸バリウム等の
高誘電率誘電体４と、オーバガラス５と、クロスガラス
用の結晶化ガラス９とを有し、しがも絶縁基板１にはス
ルーホール部１０が形成される。This substrate includes a wiring conductor 2 made of silver, palladium, etc. deposited on an insulating substrate 1, a resistor 3 made of ruthenium oxide, etc., and a high dielectric constant dielectric such as barium titanate formed on the wiring conductor 2. It has a body 4, an over glass 5, and a crystallized glass 9 for cross glass, and a through hole portion 10 is formed in the insulating substrate 1.
特に、表面および裏面に形成される抵抗体３は抵抗回路
を形成し、誘電体４を挟んだ配線導体２はコンデンサ回
路を形成している。このコンデンサ回路の形成にあたっ
ては、大面積を必要としている。In particular, the resistors 3 formed on the front and back surfaces form a resistance circuit, and the wiring conductors 2 sandwiching the dielectric 4 form a capacitor circuit. Forming this capacitor circuit requires a large area.
上述した従来の厚膜回路基板は、抵抗回路やコンデンサ
回路を多数個含む場合に、基板面積が大きくなるという
欠点があり、しかも大容量のコンデンサの形成が困難で
あるという欠点がある。The above-described conventional thick film circuit board has the drawback that the board area becomes large when it includes a large number of resistor circuits and capacitor circuits, and furthermore, it is difficult to form a large capacitance capacitor.
本発明の目的は、かかる基板面積を小さく形成しうると
ともに、大容量コンデンサの製造を容易ならしめる厚膜
回路基板を提供することにある。An object of the present invention is to provide a thick film circuit board that can reduce the area of the board and facilitate the manufacture of large capacity capacitors.
本発明の厚膜回路基板は、絶縁基板上に抵抗体、誘電体
、導体、オーバガラスおよびクロスガラス等を厚膜形成
した複数個の厚膜印刷基板と、前記複数個の厚膜印刷基
板上に形成した接続導体部とを有し、前記複数個の厚膜
印刷基板を積層し且つ前記接続導体部を介して前記厚膜
印刷基板間を電気的に接続して構成される。The thick film circuit board of the present invention includes a plurality of thick film printed boards on which a resistor, a dielectric, a conductor, an overglass, a cross glass, etc. are thickly formed on an insulating substrate, and The thick film printed substrates are stacked and the thick film printed substrates are electrically connected via the connection conductor portion.
〔実施例〕
次に、本発明の実施例について図面を参照して説明する
。[Example] Next, an example of the present invention will be described with reference to the drawings.
第１図は本発明の第一の実施例を示す厚膜回路基板の縦
断面図である。FIG. 1 is a longitudinal sectional view of a thick film circuit board showing a first embodiment of the present invention.
第１図に示すように、本実施例は３個の厚膜印刷基板１
１から構成される高密度厚膜回路基板の例であり、それ
ぞれアルミナセラミックス等の絶縁基板１，７．８と、
絶縁基板１．７．８上に形成された導体２と、絶縁基板
１．８上に各々形成された抵抗体３と、絶縁基板１．７
上に形成された誘電体４と、絶縁基板１，７．８の導体
２上に形成されたオーバガラス５と、絶縁基板１，７の
導体２上に形成された接続用導体６と、絶縁基板８の導
体２上に形成されたクロスガラス部９とを有し、絶縁基
板７．８にはスルーホール１ｏが形成されている。As shown in FIG. 1, this embodiment uses three thick film printed substrates 1.
This is an example of a high-density thick film circuit board consisting of 1, 7 and 8 insulating substrates such as alumina ceramics, respectively.
A conductor 2 formed on an insulating substrate 1.7.8, a resistor 3 formed on an insulating substrate 1.8, and an insulating substrate 1.7.
The dielectric 4 formed above, the overglass 5 formed on the conductor 2 of the insulating substrate 1, 7.8, the connecting conductor 6 formed on the conductor 2 of the insulating substrate 1, 7, A cross glass portion 9 is formed on the conductor 2 of the substrate 8, and a through hole 1o is formed in the insulating substrate 7.8.
特に、厚膜印刷基板１１は片面印刷基板であり、厚膜印
刷基板１１間は導体接続部６により電気的に接続されて
いる。かがる構成により、複数個の抵抗回路３と大容量
のコンデンサ回路２および４とが積層されて構成された
厚膜回路基板内に含まれている。In particular, the thick-film printed circuit boards 11 are single-sided printed circuit boards, and the thick-film printed circuit boards 11 are electrically connected by the conductor connection portions 6 . With this configuration, a plurality of resistor circuits 3 and large capacitor circuits 2 and 4 are included in a thick film circuit board configured by laminating them.
第２図は本発明の第二の実施例を示す厚膜回路基板の縦
断面図である。FIG. 2 is a longitudinal sectional view of a thick film circuit board showing a second embodiment of the present invention.
第２図に示すように、本実施例も３個の厚膜印刷基板１
１から構成される高密度な回路基板であり、前述した第
一の実施例と比較して異なる点は中間層および最上層の
厚膜印刷基板１１は両面厚膜印刷基板であり、抵抗回路
３および導体２．誘電体４からなるコンデンサ回路がよ
り高密度に実装されている例である０本実施例も厚膜印
刷基板１１間は導体接続部６により電気的に接続されて
いる。かかる構成により、複数個の抵抗回路３および大
容量のコンデンサ回路２および４とが積層されて構成さ
れた厚膜回路基板１１内に含まれている。尚、その他の
絶縁基板１，７．８および導体２あるいはオーバガラス
５とクロスガラス９等は前述した第一の実施例と同一で
あるので説明を省略する。As shown in FIG. 2, this embodiment also uses three thick film printed substrates 1.
This is a high-density circuit board consisting of 1, and the difference from the first embodiment described above is that the middle layer and the top layer thick film printed board 11 are double-sided thick film printed boards, and the resistor circuit 3 and conductor 2. In this embodiment, which is an example in which capacitor circuits made of dielectric material 4 are mounted at a higher density, the thick film printed circuit boards 11 are electrically connected by the conductor connection portions 6. With this configuration, a plurality of resistor circuits 3 and large-capacity capacitor circuits 2 and 4 are included in a thick film circuit board 11 configured by stacking them. Note that the other insulating substrates 1, 7, 8, conductor 2, overglass 5, cross glass 9, etc. are the same as in the first embodiment described above, and therefore their explanation will be omitted.
以上説明したように、本発明の厚膜回路基板は、絶縁体
上に抵抗体、誘電体、導体、オーバガラスおよびクロス
ガラス部等を厚膜にて形成した厚膜印刷基板を複数個積
層し、これら厚膜印刷基板上の接続導体部により電気的
に接続することにより、小形および高密度化できるとい
う効果がある。As explained above, the thick film circuit board of the present invention is made by laminating a plurality of thick film printed circuit boards in which a resistor, a dielectric, a conductor, an overglass, a cross glass, etc. are formed using thick films on an insulator. By electrically connecting through the connecting conductor portions on these thick film printed circuit boards, there is an effect that the device can be made smaller and more dense.
第１図は本発明の第一の実施例を示す厚膜回路基板の縦
断面図、第２図は本発明の第二の実施例を示す厚膜回路
基板の縦断面図、第３図は従来の一例を示す厚膜回路基
板の縦断面図である６１．７．８・・・絶縁基板、２・
・・導体、３・・・抵抗体、４・・・誘電体、５・・・
オーバガラス、６・・・導体接続部、９・・・クロスガ
ラス、１０・・・スルーホール、１１・・・厚膜印刷基
板。FIG. 1 is a vertical cross-sectional view of a thick film circuit board showing a first embodiment of the present invention, FIG. 2 is a vertical cross-sectional view of a thick film circuit board showing a second embodiment of the present invention, and FIG. 61.7.8 Insulating substrate, 2. It is a longitudinal cross-sectional view of a thick film circuit board showing an example of the conventional example.
...Conductor, 3...Resistor, 4...Dielectric, 5...
Over glass, 6... Conductor connection portion, 9... Cross glass, 10... Through hole, 11... Thick film printed circuit board.
Claims (2)
およびクロスガラス等を厚膜形成した複数個の厚膜印刷
基板と、前記複数個の厚膜印刷基板上に形成した接続導
体部とを有し、前記複数個の厚膜印刷基板を積層し且つ
前記接続導体部を介して前記厚膜印刷基板間を電気的に
接続したことを特徴とする厚膜回路基板。1. A plurality of thick-film printed substrates each having a resistor, a dielectric, a conductor, an overglass, a cross glass, etc. formed thereon as thick films on an insulating substrate, and a connecting conductor portion formed on the plurality of thick-film printed substrates. A thick film circuit board, characterized in that the plurality of thick film printed boards are laminated and the thick film printed boards are electrically connected via the connection conductor portion.
デンサおよび抵抗を内層の厚膜印刷基板に形成したこと
を特徴とする厚膜回路基板。2. 2. The thick film circuit board according to claim 1, wherein a large capacity capacitor and a resistor are formed on an inner thick film printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2130923A JPH0426184A (en) | 1990-05-21 | 1990-05-21 | Thick-film circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2130923A JPH0426184A (en) | 1990-05-21 | 1990-05-21 | Thick-film circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426184A true JPH0426184A (en) | 1992-01-29 |
Family
ID=15045897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2130923A Pending JPH0426184A (en) | 1990-05-21 | 1990-05-21 | Thick-film circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426184A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003007379A1 (en) * | 2001-07-12 | 2003-01-23 | Hitachi, Ltd. | Electronic circuit component |
| JP2010537397A (en) * | 2007-08-16 | 2010-12-02 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Electrical circuit device and method of manufacturing electrical circuit device |
-
1990
- 1990-05-21 JP JP2130923A patent/JPH0426184A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003007379A1 (en) * | 2001-07-12 | 2003-01-23 | Hitachi, Ltd. | Electronic circuit component |
| US7586755B2 (en) | 2001-07-12 | 2009-09-08 | Hitachi, Ltd. | Electronic circuit component |
| JP2010537397A (en) * | 2007-08-16 | 2010-12-02 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Electrical circuit device and method of manufacturing electrical circuit device |
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