JPH04249525A - Liquid epoxy resin molding material - Google Patents
Liquid epoxy resin molding materialInfo
- Publication number
- JPH04249525A JPH04249525A JP32491A JP32491A JPH04249525A JP H04249525 A JPH04249525 A JP H04249525A JP 32491 A JP32491 A JP 32491A JP 32491 A JP32491 A JP 32491A JP H04249525 A JPH04249525 A JP H04249525A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding material
- acid anhydride
- resin molding
- liquid epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012778 molding material Substances 0.000 title claims description 13
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 title claims description 11
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- 239000010680 novolac-type phenolic resin Substances 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 abstract description 7
- 239000003822 epoxy resin Substances 0.000 abstract description 6
- 229920000647 polyepoxide Polymers 0.000 abstract description 6
- 229920003986 novolac Polymers 0.000 abstract description 5
- 239000000945 filler Substances 0.000 abstract description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 3
- 125000003700 epoxy group Chemical group 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 4
- 239000000835 fiber Substances 0.000 description 3
- -1 glycidyl ester Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、電気部品、電子部品、
半導体チップ特にセラミック基板を用いたハイブリッド
のＣＯＢ等を封止する液状エポキシ樹脂成形材料に関す
るものである。[Industrial Application Field] The present invention is applicable to electrical parts, electronic parts,
This invention relates to a liquid epoxy resin molding material for sealing semiconductor chips, especially hybrid COBs using ceramic substrates.
【０００２】0002
【従来の技術】近年、電気機器、電子機器の高性能化、
高信頼性、生産性向上のため、プラスチックによる封止
がなされるようになってきた。これらの封止用成形材料
で硬化剤として酸無水物のみを用いると、低粘度化は達
成されるが、ＰＣＴ試験で加水分解し耐湿性の低下を招
き、又接着性も低下する。この為硬化剤として固型ノボ
ラック型フエノール樹脂のみを用いると、耐加水分解性
は向上するが、高粘度となり成形性が低下する。[Background Art] In recent years, the performance of electrical equipment and electronic equipment has improved,
In order to improve reliability and productivity, plastic sealing has come to be used. When only an acid anhydride is used as a curing agent in these molding materials for sealing, a reduction in viscosity is achieved, but the material is hydrolyzed in the PCT test, resulting in a decrease in moisture resistance and also in adhesiveness. For this reason, if only a solid novolak type phenolic resin is used as a curing agent, the hydrolysis resistance will be improved, but the viscosity will be high and the moldability will be reduced.
【０００３】0003
【発明が解決しようとする課題】従来の技術で述べたよ
うに、従来の液状エポキシ樹脂成形材料は、耐湿性、接
着性において−長−短であった。本発明は従来の技術に
おける上述の問題点に鑑みてなされたもので、その目的
とするところは、耐湿性、接着性に優れた液状エポキシ
樹脂成形材料を提供することにある。[Problems to be Solved by the Invention] As described in the prior art section, conventional liquid epoxy resin molding materials have disadvantages in terms of moisture resistance and adhesion. The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a liquid epoxy resin molding material that has excellent moisture resistance and adhesive properties.
【０００４】0004
【課題を解決するための手段】本発明は硬化剤として、
酸無水物とノボラック型フエノール樹脂とを含有したこ
とを特徴とする液状エポキシ樹脂成形材料のため、上記
目的を達成することができたもので、以下本発明を詳細
に説明する。[Means for Solving the Problems] The present invention provides, as a curing agent,
The liquid epoxy resin molding material is characterized in that it contains an acid anhydride and a novolac type phenolic resin, and thus the above object can be achieved.The present invention will be described in detail below.
【０００５】本発明に用いるエポキシ樹脂としては、１
分子中に２個以上のエポキシ基を有する硬化可能なエポ
キシ樹脂であるならば、ビスフエノールＡ型エポキシ樹
脂、ノボラック型エポキシ樹脂、可撓性エポキシ樹脂、
ハロゲン化エポキシ樹脂、グリシジルエステル型エポキ
シ樹脂、高分子型エポキシ樹脂等の何れでもよく、特に
限定するものではない。硬化剤及び又は架橋剤としては
フエノール樹脂、メラミン樹脂、アクリル樹脂、ユリア
樹脂、イソシアネート、脂肪族ポリアミン、ポリアミド
樹脂、芳香族ジアミン等のアミン系硬化剤、酸無水物硬
化剤、ルイス酸錯化合物等が用いられるが、酸無水物と
ノボラック型フエノール樹脂とを含有させることが必要
である。ノボラック型フエノール樹脂としては、平均分
子量４００〜９００、水酸基当量９０〜１５０のものが
好ましく、更に軟化点４５〜９０℃の固型であることが
好ましい。酸無水物としてはメチルヘキサヒドロ無水フ
タル酸等のように、酸無水物当量１４０〜２００で低粘
度のものが好ましい。酸無水物とノボラック型フエノー
ル樹脂との比率は、酸無水物６０〜８０に対して、ノボ
ラック型フエノール樹脂４０〜２０であることがゃのま
しい。硬化促進剤としてはリン系及び又は３級アミン系
硬化促進剤等が用いられ特に限定するものではない。充
填剤としてはタルク、クレー、シリカ、炭酸カルシュウ
ム、水酸化アルミニゥム等の無機質粉末充填剤や、ガラ
ス繊維、アスベスト繊維、パルプ繊維、合成繊維、セラ
ミック繊維等の繊維質充填剤を単独或いは併用するもの
であるが、必要に応じて充填剤表面をカップリング剤で
表面処理することも出来る。更に必要に応じて反応性希
釈剤を添加することができるものである。かくして上記
材料を混合、混練し、更に必要に応じて脱泡して液状エ
ポキシ樹脂成形材料を得るものである。該成形材料の成
形については、注型、注入、デイッピング等で用いられ
る。[0005] As the epoxy resin used in the present invention, 1
Curable epoxy resins having two or more epoxy groups in the molecule include bisphenol A epoxy resins, novolac epoxy resins, flexible epoxy resins,
Any of halogenated epoxy resins, glycidyl ester type epoxy resins, polymer type epoxy resins, etc. may be used, and there are no particular limitations. Examples of curing agents and/or crosslinking agents include phenolic resins, melamine resins, acrylic resins, urea resins, isocyanates, aliphatic polyamines, polyamide resins, amine-based curing agents such as aromatic diamines, acid anhydride curing agents, Lewis acid complex compounds, etc. is used, but it is necessary to contain an acid anhydride and a novolac type phenolic resin. The novolac type phenolic resin preferably has an average molecular weight of 400 to 900 and a hydroxyl equivalent of 90 to 150, and is further preferably solid with a softening point of 45 to 90°C. The acid anhydride preferably has an acid anhydride equivalent of 140 to 200 and a low viscosity, such as methylhexahydrophthalic anhydride. The ratio of the acid anhydride to the novolak type phenolic resin is preferably 60 to 80% for the acid anhydride to 40 to 20% for the novolak type phenolic resin. As the curing accelerator, phosphorus-based and/or tertiary amine-based curing accelerators can be used, and are not particularly limited. Fillers include inorganic powder fillers such as talc, clay, silica, calcium carbonate, and aluminum hydroxide, and fibrous fillers such as glass fiber, asbestos fiber, pulp fiber, synthetic fiber, and ceramic fiber, either alone or in combination. However, if necessary, the surface of the filler can be treated with a coupling agent. Furthermore, a reactive diluent can be added if necessary. In this way, the above materials are mixed, kneaded, and further defoamed if necessary to obtain a liquid epoxy resin molding material. For molding of the molding material, casting, injection, dipping, etc. are used.
【０００６】以下本発明を実施例に基づいて説明する。The present invention will be explained below based on examples.
【０００７】[0007]
【実施例１乃至３と比較例】第１表の配合表に基づいて
材料を配合、混合、混練、脱泡して液状エポキシ樹脂成
形材料を得たが、実施例のフエノール樹脂については、
平均分子量６２０、水酸基当量１２０、軟化点６５℃の
ノボラック型フエノール樹脂を用いた。又シリカについ
ては球状シリカを用い、シリコンオイルについてはエポ
キシ当量６００、粘度１９０ＣＰＳのポリオルガノシロ
キサンを用い、酸無水物については酸無水物当量１６８
、粘度６０ＣＰＳのメチルヘキサヒドロ無水フタル酸を
用い、硬化促進剤についてはイミダゾール系酸無水物を
用いた。次に該液状エポキシ樹脂成形材料で、ベアチッ
プを１６０℃で１２０分間封止成形した。[Examples 1 to 3 and Comparative Example] A liquid epoxy resin molding material was obtained by blending, mixing, kneading, and defoaming the materials based on the recipe shown in Table 1. Regarding the phenolic resin of the example,
A novolac type phenolic resin having an average molecular weight of 620, a hydroxyl equivalent of 120, and a softening point of 65° C. was used. For silica, spherical silica was used, for silicone oil, polyorganosiloxane with an epoxy equivalent of 600 and a viscosity of 190 CPS was used, and for acid anhydride, an acid anhydride equivalent of 168 was used.
, methylhexahydrophthalic anhydride having a viscosity of 60 CPS was used, and an imidazole acid anhydride was used as a curing accelerator. Next, the bare chip was sealed and molded using the liquid epoxy resin molding material at 160° C. for 120 minutes.
【０００８】
実施例１乃至３と比較例の液状エポキシ樹脂成形材
料の性能は、第２表のようである。なお粘度は２５℃で
のものであり、耐湿性は１２１℃、２気圧でのオープン
不良発生迄の時間でみるＰＣＴ試験とＰＣＴ試験後２３
０℃の半田浴に１０秒間浸漬するＰＣＴ半田試験及び−
６５℃で３０分、２５℃で５分、１５０℃で３０分を１
サイクルとし、不良、クラック発生迄の処理サイクル数
でみるヒートサイクル試験でみた。レーザーマーキング
性は成形品表面に、炭酸ガスレーザーでマーキングを施
し、目視にて判定した。剪断力はアルミニゥム板を用い
た引張剪断力Ｋｇ／ｃｍ２ である。[0008] The performances of the liquid epoxy resin molding materials of Examples 1 to 3 and Comparative Example are shown in Table 2. The viscosity is measured at 25°C, and the humidity resistance is measured by the PCT test and the time taken to cause an open failure at 121°C and 2 atm.
PCT solder test by immersing in a solder bath at 0°C for 10 seconds and -
30 minutes at 65℃, 5 minutes at 25℃, 30 minutes at 150℃
A heat cycle test was conducted to determine the number of processing cycles until defects and cracks occurred. Laser marking property was determined by marking the surface of the molded product with a carbon dioxide laser and visually observing the result. The shearing force is a tensile shearing force of Kg/cm2 using an aluminum plate.
【０００９】[0009]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する液状エポキシ樹
脂成形材料においては、耐湿性、接着性性がよく、本発
明の優れていることをを確認した。[Effects of the Invention] The present invention is constructed as described above. The liquid epoxy resin molding material having the structure described in the claims had good moisture resistance and adhesive properties, confirming the superiority of the present invention.
Claims (1)
フエノール樹脂とを含有したことを特徴とする液状エポ
キシ樹脂成形材料。1. A liquid epoxy resin molding material containing an acid anhydride and a novolac type phenolic resin as a curing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32491A JPH04249525A (en) | 1991-01-08 | 1991-01-08 | Liquid epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32491A JPH04249525A (en) | 1991-01-08 | 1991-01-08 | Liquid epoxy resin molding material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04249525A true JPH04249525A (en) | 1992-09-04 |
Family
ID=11470727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32491A Pending JPH04249525A (en) | 1991-01-08 | 1991-01-08 | Liquid epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04249525A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7247683B2 (en) * | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
-
1991
- 1991-01-08 JP JP32491A patent/JPH04249525A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7247683B2 (en) * | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
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