JPH04246594A - Water-repellent and oil-repellent intaglio plate and its manufacture - Google Patents

Water-repellent and oil-repellent intaglio plate and its manufacture

Info

Publication number
JPH04246594A
JPH04246594A JP1188291A JP1188291A JPH04246594A JP H04246594 A JPH04246594 A JP H04246594A JP 1188291 A JP1188291 A JP 1188291A JP 1188291 A JP1188291 A JP 1188291A JP H04246594 A JPH04246594 A JP H04246594A
Authority
JP
Japan
Prior art keywords
intaglio plate
intaglio
group
repellent
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1188291A
Other languages
Japanese (ja)
Other versions
JP3021695B2 (en
Inventor
Keiichi Nakao
恵一 中尾
Mikiya Shimada
幹也 嶋田
Sanemori Soga
眞守 曽我
Norihisa Mino
規央 美濃
Kazufumi Ogawa
一文 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1188291A priority Critical patent/JP3021695B2/en
Publication of JPH04246594A publication Critical patent/JPH04246594A/en
Application granted granted Critical
Publication of JP3021695B2 publication Critical patent/JP3021695B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites

Abstract

PURPOSE:To obtain a water repellent and oil repellent intaglio plate in which precision and yield of intaglio offset printing are improved by decreasing residue of ink on a surface of the intaglio plate after squeegeeing by a method wherein a chemically adsorbed monomolecular film containing fluorine is formed on the surface. CONSTITUTION:After washing an intaglio plate 1 with organic solvent, solution in which non-aqueous solvent mixed with material containing a carbon fluoride group and a chlorosilane group is dissolved is prepared, and the intaglio plate 1 is dipped therein. Then, since a naturally oxidized film has been formed on a film of the intaglio plate 1, many hydroxide groups are contained in the surface of the oxidized film, and a SiCl group of the material containing the carbon fluoride group and the chorosilane group is reacted with the hydroxide group to generate reaction of dechlorination. Therefore, a chemically adsorbed monomolecular film 6 containing fluorine is formed in a state of chemical combination with a surface of the intaglio plate 1 over the whole surface of the intaglio plate 1. Since this carbon fluoride monomolecular film 6 is excellent in water repellence and oil repellence, residue of ink on the surface of the intaglio plate after squeegeeing can be decreased.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は回路基板,液晶表示装置
,サーマルヘッド等のファインパターンの要求される電
子部品において、誘電体(絶縁体,磁性体)や電導体(
配線,抵抗体),カラーフィルター,レジストパターン
の形成を凹版印刷によって行う際に使用する撥水撥油性
凹版およびその製造方法に関するものである。
[Industrial Application Field] The present invention is applicable to electronic components such as circuit boards, liquid crystal display devices, and thermal heads that require fine patterns, such as dielectric materials (insulators, magnetic materials) and conductors (
The present invention relates to a water- and oil-repellent intaglio plate used when forming wiring (wires, resistors), color filters, and resist patterns by intaglio printing, and a method for manufacturing the same.

【0002】0002

【従来の技術】従来より、回路基板,液晶表示装置,サ
ーマルヘッド等の電子部品の製造においては微細な導電
パターンの形成技術が用いられており、近年、従来のフ
ォトレジストを用いた製造方法に比べ、生産性,コスト
,大面積化等の面より、各種印刷方法を用いた微細パタ
ーンの製造方法が提案されている。この中でも特に凹版
オフセット印刷技術が、従来のスクリーン印刷技術に変
わるものとして注目されている[日経エレクトロニクス
別冊「フラットパネル・ディスプレイ’90」(198
9)掲載]。
[Prior Art] Conventionally, technology for forming fine conductive patterns has been used in the manufacture of electronic components such as circuit boards, liquid crystal display devices, and thermal heads.In recent years, manufacturing methods using conventional photoresists have been used. In comparison, methods for manufacturing fine patterns using various printing methods have been proposed from the viewpoints of productivity, cost, large area, etc. Among these, intaglio offset printing technology is particularly attracting attention as an alternative to conventional screen printing technology [Nikkei Electronics special edition "Flat Panel Display '90" (1988).
9) Posted].

【0003】上記凹版オフセット印刷の代表的な従来例
について、以下に図4(A),(B)を用いて説明する
。図4(A)は、凹版を示す斜視図、図4(B)は凹版
にインキを充填する作業を示す断面図である。図4にお
いて、1は凹版、2は凹部パターン、3はインキ、4は
スキージ、5はインキ残りを示すものである。また矢印
はスキージ4の移動する方向を示し、スキージ4の移動
により凹部パターン2にインキ3を充填するものである
A typical conventional example of the above-mentioned intaglio offset printing will be explained below with reference to FIGS. 4(A) and 4(B). FIG. 4(A) is a perspective view showing an intaglio plate, and FIG. 4(B) is a sectional view showing the operation of filling the intaglio plate with ink. In FIG. 4, 1 is an intaglio plate, 2 is a concave pattern, 3 is ink, 4 is a squeegee, and 5 is an ink residue. Further, the arrow indicates the direction in which the squeegee 4 moves, and the movement of the squeegee 4 fills the concave pattern 2 with the ink 3.

【0004】0004

【発明が解決しようとする課題】しかしながら上記従来
の構成で実際に凹版オフセット印刷方法を用いて印刷し
てみると、印刷パターンのピッチ(線幅と線間幅の合計
)が数十μm以下と、ファインパターン化するほど、オ
ープンやショート等の不良発生率が増加し、印刷基板の
歩留まりが悪くなるという課題を有していた。このよう
な課題に対し、オープン不良に対しては重ね刷り印刷を
行うことや、特開昭57−169357号公報に提案さ
れているような、各々異なる位置で受け取ったインキを
同一箇所に転写することで凹版や転写用のブランケット
ゴムの不良に起因するようなオープン不良の発生を低減
させる方法が考案されているが、量産性に乏しいという
問題点があった。
[Problems to be Solved by the Invention] However, when printing is actually performed using the intaglio offset printing method with the above conventional configuration, the pitch of the printing pattern (total of line width and interline width) is several tens of μm or less. However, the finer the pattern, the higher the incidence of defects such as open and short circuits, and the lower the yield of printed circuit boards. To deal with such problems, it is possible to perform overprinting for open defects, or to transfer ink received at different positions to the same place, as proposed in Japanese Patent Application Laid-Open No. 57-169357. Therefore, methods have been devised to reduce the occurrence of open defects such as those caused by defects in intaglio plates and blanket rubber for transfer, but there is a problem in that they are not suitable for mass production.

【0005】一方ショート不良の発生を低減する方法は
、ほとんど提案されておらず、実際に、サーマルヘッド
を凹版オフセット印刷方法を用いて作成した場合には、
ショート不良の原因を分析すると、90%以上が凹版表
面のインキ残りであるというのが実態である。
On the other hand, very few methods have been proposed to reduce the occurrence of short-circuit defects, and in fact, when a thermal head is made using an intaglio offset printing method,
An analysis of the cause of short-circuit defects reveals that over 90% of the causes are ink residue on the surface of the intaglio plate.

【0006】今後、印刷パターンのピッチがファインパ
ターン化するほど、線間幅も短くなり、従来のピッチの
広い場合では問題にならなかったような、凹部パターン
2間の小さなインキ残り5でも、ショート不良になる確
立が増える。また、ピッチが狭くなることは、凹部パタ
ーン2の単位長さ当りの凹溝本数が増加することにつな
がり、結果的に、スキージ4が細かく振動(凹版1の凹
部パターン2に起因する凹凸でスキージ4がカチカチ鳴
ってしまう現象を意味し、場合によっては凹部パターン
2内のインキ3を物理的に飛ばしてしまうことさえある
)してしまい、従来のスキージ条件で問題なくスキージ
できていた条件でも、パターンピッチが狭くなるだけで
、インキ残りが発生しやすくなるという新たな課題も併
せ持っていた。
In the future, as the pitch of the printed pattern becomes finer, the width between the lines will become shorter, and even a small amount of ink remaining 5 between the concave patterns 2 will cause a short circuit, which was not a problem in the case of a conventional wide pitch. The probability of it becoming defective increases. In addition, the narrower pitch leads to an increase in the number of grooves per unit length of the groove pattern 2, and as a result, the squeegee 4 vibrates finely (the unevenness caused by the groove pattern 2 of the intaglio plate 1 causes the squeegee to vibrate). This means that the ink 3 inside the concave pattern 2 may be physically blown away), even if the squeegee could be squeegeeed without any problem under the conventional squeegee conditions. There was also a new problem: simply by narrowing the pattern pitch, ink residue was more likely to occur.

【0007】このような新たな課題である凹版表面のイ
ンキ残りの対策としては、凹版表面の平滑化、スキージ
(材質,硬度,研磨等)の最適条件を見出す研究が行わ
れてきたが、今日現在でこれらを満足する結果はまだ得
られていないのが実情である。
[0007] As a countermeasure for this new problem of ink residue on the intaglio surface, research has been conducted to smooth the intaglio surface and find optimal conditions for the squeegee (material, hardness, polishing, etc.). The reality is that results that satisfy these requirements have not yet been obtained.

【0008】本発明は上記従来例の課題を解決し、撥水
撥油性に優れた凹版を提供することにより、スキージ後
の凹版表面のインキ残りを少なくし凹版オフセット印刷
を精度・歩留まり面で大きく改善した撥水撥油性凹版お
よびその製造方法を提供することを目的とするものであ
る。
The present invention solves the above-mentioned problems of the conventional example, and by providing an intaglio plate with excellent water and oil repellency, the amount of ink remaining on the surface of the intaglio plate after squeegeeing is reduced, and intaglio offset printing is greatly improved in terms of accuracy and yield. The object of the present invention is to provide an improved water- and oil-repellent intaglio plate and a method for producing the same.

【0009】[0009]

【課題を解決するための手段】上記課題を解決するため
に、本発明による撥水撥油性凹版およびその製造方法は
フッ素を含む化学吸着単分子膜を凹版表面に形成したも
のである。一般的に凹版は、ガラス,セラミック,また
は金属製であり、表面に水酸基を含んでおり、一端にク
ロルシラン基(SiClnX3−n基、n=1,2,3
、Xは官能基)を有する直鎖状炭素鎖を含む分子、例え
ばフッ素炭素基およびクロロシラン基を含むクロロシラ
ン系活性剤を混ぜた非水系溶媒に接触させて前記凹版表
面の水酸基と前記クロロシリル基を複数個含む物質のク
ロロシリル基を反応させて前記物質よりなる単分子膜を
前記凹版表面に析出させる、あるいはクロロシリル基を
複数個含む物質を混ぜた非水系溶媒に接触させて前記凹
版の水酸基と前記クロロシリル基を複数個含む物質のク
ロロシリル基を反応させて前記物質を前記凹版表面に析
出させる工程と、非水系有機溶媒を用い前記凹版表面に
残った余分なクロロシリル基を複数個含む物質よりなる
シロキサン系単分子膜を形成する工程と、一端にクロル
シラン基を有する直鎖状炭素鎖を含むシラン系界面活性
剤を凹版上に化学吸着し単分子吸着膜を累積する工程と
により凹版表面にフッ化炭素系化学吸着単分子累積膜を
形成するようにしたものである。
[Means for Solving the Problems] In order to solve the above-mentioned problems, a water- and oil-repellent intaglio plate and a method for producing the same according to the present invention are those in which a chemically adsorbed monomolecular film containing fluorine is formed on the surface of the intaglio plate. Intaglio plates are generally made of glass, ceramic, or metal, and contain hydroxyl groups on the surface, and have a chlorosilane group (SiClnX3-n group, n=1,2,3
, X is a functional group), for example, a fluorine carbon group and a chlorosilane group containing a chlorosilane group. A monomolecular film made of the substance is deposited on the surface of the intaglio plate by reacting the chlorosilyl groups of a substance containing a plurality of chlorosilyl groups, or by contacting with a non-aqueous solvent containing a substance containing a plurality of chlorosilyl groups, the hydroxyl groups of the intaglio plate and the above A step of reacting the chlorosilyl groups of a substance containing a plurality of chlorosilyl groups to precipitate the substance on the surface of the intaglio plate, and using a non-aqueous organic solvent to produce siloxane made of a substance containing a plurality of excess chlorosilyl groups remaining on the surface of the intaglio plate. Fluoride is applied to the surface of the intaglio by forming a monomolecular film, and chemically adsorbing a silane surfactant containing a linear carbon chain with a chlorosilane group at one end onto the intaglio to accumulate a monomolecular adsorption film. A carbon-based chemically adsorbed monomolecular cumulative film is formed.

【0010】0010

【作用】このように構成される撥水撥油性凹版はきわめ
て薄いナノメータレベルの膜厚のフッ化炭素系単分子膜
を凹版表面に形成するため、凹版の精度を損なうことが
ない。また、このフッ化炭素系単分子膜は撥水撥油性に
優れるため、粘着性の非常に高いインキを用いて凹版印
刷する際においても、スキージを行った後の凹版表面の
インキ残りを少なくすることが可能となる。またスキー
ジと凹版との摩擦を少なくすることができ、スキージお
よび凹版の寿命を長くすることができる。従って、印刷
歩留まりの高い凹版を提供することができる。
[Operation] Since the water- and oil-repellent intaglio plate constructed in this way has an extremely thin fluorocarbon monomolecular film with a thickness on the nanometer level formed on the surface of the intaglio plate, the accuracy of the intaglio plate is not impaired. In addition, this fluorocarbon-based monomolecular film has excellent water and oil repellency, so even when intaglio printing is performed using extremely sticky ink, it reduces the amount of ink remaining on the intaglio surface after squeegeeing. becomes possible. Furthermore, the friction between the squeegee and the intaglio can be reduced, and the life of the squeegee and the intaglio can be extended. Therefore, it is possible to provide an intaglio plate with a high printing yield.

【0011】[0011]

【実施例】(実施例1)以下、本発明の一実施例による
撥水撥油性凹版およびその製造方法について図面を用い
て説明する。図1は本発明による凹版1を示す斜視図で
あり、上記凹版1はガラス製の凹版1に半導体の露光に
用いるガラス製クロムマスクをフッ酸系のエッチャント
に浸漬し、部分的にエッチングすることで表面に凹版パ
ターン2を設け、さらに表面に化学吸着単分子膜6を形
成することにより撥水撥油性処理をして構成されたもの
である。
EXAMPLES (Example 1) A water- and oil-repellent intaglio plate according to an example of the present invention and a method for manufacturing the same will be described below with reference to the drawings. FIG. 1 is a perspective view showing an intaglio plate 1 according to the present invention. The intaglio plate 1 is a glass intaglio plate 1 in which a glass chrome mask used for exposing semiconductors is immersed in a hydrofluoric acid-based etchant to partially etch the intaglio plate 1. An intaglio pattern 2 is provided on the surface, and a chemically adsorbed monomolecular film 6 is further formed on the surface to make it water and oil repellent.

【0012】図2は上記撥水撥油性処理を示すための断
面概念図であり、上記凹版1を、有機溶媒で洗浄した後
、フッ化炭素基およびクロロシラン基を含む物質を混ぜ
た非水系の溶媒、例えば、 CF3(CF2)7(CH2)2SiCl3を用い、1
%程度の濃度で溶かした溶液[80%n−ヘキサデカン
(トルエン,キシレン,ジシクロヘキシルでもよい),
10%四塩化炭素,8%クロロホルム]を調整し、前記
凹版1を2時間程度浸漬すると凹版1の膜には自然酸化
膜が形成されているために、この酸化膜表面には水酸基
が多数含まれておりフッ化炭素基およびクロロシラン基
を含む物質のSiCl基と前記水酸基が反応し脱塩素反
応が生じ凹版1全面に亘り、
FIG. 2 is a conceptual cross-sectional diagram showing the water- and oil-repellent treatment, in which the intaglio plate 1 is washed with an organic solvent and then treated with a non-aqueous solution containing a substance containing fluorocarbon groups and chlorosilane groups. Using a solvent, e.g. CF3(CF2)7(CH2)2SiCl3, 1
% solution [80% n-hexadecane (toluene, xylene, dicyclohexyl may also be used),
10% carbon tetrachloride, 8% chloroform] and immersed the intaglio plate 1 for about 2 hours. Since a natural oxide film is formed on the film of the intaglio plate 1, the surface of this oxide film contains many hydroxyl groups. The SiCl group of the substance containing a fluorocarbon group and a chlorosilane group reacts with the hydroxyl group, and a dechlorination reaction occurs over the entire surface of the intaglio 1.

【0013】[0013]

【化1】[Chemical formula 1]

【0014】の結合が生成され、フッ素を含む化学吸着
単分子膜6が凹版1の表面と化学結合した状態でおよそ
15オングストロームの膜厚で形成することができた。 なお、化学吸着単分子膜6はきわめて強固に化学結合し
ているので全く剥離することがなかった。また、凹版1
の材質は、ガラス,セラミック以外の銅,ニッケル,亜
鉛等の金属の場合でも、表面は自然酸化膜でおおわれて
いるので当然水酸基が含まれており上述と同様の化学吸
着単分子膜6を吸着時間を調整するのみで同様の方法を
用いて形成できた。
The following bonds were formed, and a chemically adsorbed monomolecular film 6 containing fluorine could be formed with a film thickness of about 15 angstroms in a state of chemical bonding with the surface of the intaglio plate 1. Note that the chemically adsorbed monomolecular film 6 was not peeled off at all because it had extremely strong chemical bonds. Also, intaglio 1
Even if the material is a metal such as copper, nickel, or zinc other than glass or ceramic, the surface is covered with a natural oxide film, so naturally it contains hydroxyl groups, and the same chemical adsorption monomolecular film 6 as mentioned above is adsorbed. It could be formed using the same method by simply adjusting the time.

【0015】次に、この凹版1を用いて凹版オフセット
印刷を試みた。先ず、従来の凹版として半導体の露光に
用いるガラス製クロムマスクを凹版としただけの何も表
面処理をしていない凹版(以下、未処理凹版と呼ぶ)と
、未処理凹版に上記本発明によるフッ素を含む化学吸着
単分子膜6を表面に形成することで作成した撥水撥油製
凹版1(以下、処理凹版と呼ぶ)を用意した。
Next, intaglio offset printing was attempted using this intaglio plate 1. First, an intaglio plate (hereinafter referred to as an untreated intaglio plate) that is simply a glass chrome mask used for exposure of semiconductors as an intaglio plate without any surface treatment is used as a conventional intaglio plate, and an untreated intaglio plate is coated with fluorine according to the present invention. A water- and oil-repellent intaglio plate 1 (hereinafter referred to as a treated intaglio plate) was prepared by forming a chemically adsorbed monomolecular film 6 containing the following on its surface.

【0016】また、印刷機はコンピュータ制御のサーボ
モータで凹版および被印刷体を載せたステージを高精度
に動かすようになったものを用いた。被印刷体としては
、ファクシミリ用サーマルヘッドとして用いられるグレ
ーズアルミナ基板(60×230mm,厚み0.8mm
)を、印刷用インキとしてはエッチングレジストインキ
および金レジネートインキを用いた。印刷方法として、
まずグレーズアルミナ基板上にスクリーン印刷法を用い
て、ベタのパターンで金レジネートを印刷し、これを焼
成することで金の薄膜を形成したグレーズアルミナ基板
を作成した。次に、金薄膜の形成されたグレーズアルミ
ナ基板上に凹版オフセット印刷機を用いエッチングレジ
ストを印刷した後、金エッチャントを用いてグレーズア
ルミナ基板表面の金をエッチングした。なお、凹版には
未処理凹版と処理凹版を用い比較を行った。最後にエッ
チングレジストを除去し、ピッチ50ミクロンのA4サ
イズ用のサーマルヘッド用の金電極パターンを形成した
(以下、エッチング基板と呼ぶ)。
[0016] The printing machine used was one in which the stage on which the intaglio plate and the printing material were placed was moved with high precision by a computer-controlled servo motor. The printing material was a glazed alumina substrate (60 x 230 mm, thickness 0.8 mm) used as a facsimile thermal head.
), and etching resist ink and gold resinate ink were used as printing inks. As a printing method,
First, a solid pattern of gold resinate was printed on a glazed alumina substrate using a screen printing method, and this was fired to create a glazed alumina substrate on which a thin film of gold was formed. Next, an etching resist was printed on the glazed alumina substrate on which the gold thin film was formed using an intaglio offset printing machine, and then the gold on the surface of the glazed alumina substrate was etched using a gold etchant. A comparison was made using an untreated intaglio and a treated intaglio. Finally, the etching resist was removed, and a gold electrode pattern for an A4 size thermal head with a pitch of 50 microns was formed (hereinafter referred to as an etching substrate).

【0017】また、エッチングレジストインキの代わり
に金レジストインキを用い、凹版オフセット印刷法によ
りアルミナグレーズ基板の上に直接ピッチ50ミクロン
のA4サイズ用のサーマルヘッドの金電極パターンを印
刷した。なお、上記と同様に金属製凹版7には未処理凹
版と処理凹版を用い比較を行った。この金電極パターン
が印刷されたグレーズアルミナ基板を焼成し、前記エッ
チング基板と同様のものを得た(以下、直接印刷基板と
呼ぶ)。
[0017] Also, using gold resist ink instead of etching resist ink, a gold electrode pattern of an A4 size thermal head with a pitch of 50 microns was directly printed on the alumina glaze substrate by an intaglio offset printing method. Incidentally, in the same manner as described above, a comparison was made using an untreated intaglio plate and a treated intaglio plate as the metal intaglio plate 7. The glazed alumina substrate on which this gold electrode pattern was printed was fired to obtain a substrate similar to the etched substrate (hereinafter referred to as a directly printed substrate).

【0018】以下に、エッチング基板および直接印刷基
板における印刷歩留まりを調べた。印刷歩留まりは、サ
ーマルヘッド用の10枚のサンプルの中で、1枚のサン
プル中で約20000ヶ所ある50ミクロンピッチの配
線部分におけるショートおよびオープン不良の発生数で
評価し、この評価結果を以下に示す。
The printing yields of etched substrates and directly printed substrates were investigated below. Printing yield is evaluated by the number of shorts and open defects in the 50 micron pitch wiring parts, which are approximately 20,000 locations in each sample out of 10 samples for thermal heads, and the evaluation results are shown below. show.

【0019】   エッチング基板において       未処理凹版      ショート    
85ヶ所    オープン  25ヶ所      処
理凹版        ショート      8ヶ所 
   オープン    4ヶ所  直接印刷基板におい
て、       未処理凹版      ショート  13
3ヶ所    オープン  38ヶ所      処理
凹版        ショート      5ヶ所  
  オープン    4ヶ所以上の結果より、エッチン
グ基板および直接印刷基板において共通して処理凹版の
方が未処理凹版よりもショートおよびオープンの発生が
少ないことがわかる。未処理凹版を用いて作成したサン
プルのショートした場所を顕微鏡で観察したところ、約
90%が微細パターン部分の線間に残ったインキが原因
であることがわかった。また、各サンプルのオープン原
因を調べたところ、異物(ゴミ)によるものがほとんど
であった。さらに、未処理凹版に比べ処理凹版の方がご
み数が少なかった。これは処理凹版の方が未処理凹版に
比較して異物の付着が少ないためであった。さらに未処
理凹版に比較して、処理凹版では凹版に対するスキージ
のすべりが良く(摩擦が少ない)、従来問題になってい
たようなパターンピッチが小さくなった時のスキージに
よるインキの跳ねも低減できた。このような結果から、
さらに凹版1のパターンをファインパターン化すること
ができる。
[0019] In etched substrate, untreated intaglio short
85 locations Open 25 locations Processed intaglio Short 8 locations
Open 4 places Direct printing board, untreated intaglio short 13
3 locations open 38 locations processed intaglio short 5 locations
Opens From the results of four or more locations, it can be seen that the occurrence of shorts and opens is lower in the treated intaglio than in the untreated intaglio in both etched substrates and direct printed substrates. When we observed the short-circuited areas of a sample made using an untreated intaglio plate under a microscope, we found that about 90% of the short-circuited areas were caused by ink remaining between the lines of the fine pattern. Furthermore, when we investigated the causes of open circuits in each sample, we found that most of them were caused by foreign objects (dust). Furthermore, the number of dust was lower in the treated intaglio than in the untreated intaglio. This was because less foreign matter adhered to the treated intaglio than to the untreated intaglio. Furthermore, compared to untreated intaglio, treated intaglio allows the squeegee to slide better against the intaglio (less friction), and the problem of ink splashing caused by the squeegee when the pattern pitch becomes small, which was a problem in the past, was reduced. . From these results,
Furthermore, the pattern of the intaglio 1 can be made into a fine pattern.

【0020】また、今後凹版オフセット印刷機をスクリ
ーンルームに入れることで、より歩留まりを上げられる
[0020] Furthermore, by installing an intaglio offset printing machine in a screen room in the future, the yield can be further increased.

【0021】また、凹版1全面に形成された化学吸着単
分子膜6のうち、凹版パターン2(溝)内部の化学吸着
単分子膜6は除去してもよい。この場合、水性インキ等
を用いた場合でも、インキ3が凹版パターン2内ではじ
かれる(撥水撥油される)こともなく、安定した印刷が
できる。また、上記所望する部分の化学吸着単分子膜6
を除去するには、残したい部分の化学吸着単分子膜6表
面に粘着性物質(ポリイソブチレン等の樹脂)を付着さ
せた後、酸素プラズマ(フォトレジスト等の除去に用い
る酸素アッシャー)等を用いることで不要部分を除去す
ることができる。
Of the chemisorption monomolecular film 6 formed on the entire surface of the intaglio plate 1, the chemisorption monomolecular film 6 inside the intaglio pattern 2 (groove) may be removed. In this case, even if water-based ink or the like is used, the ink 3 will not be repelled (become water- and oil-repellent) within the intaglio pattern 2, and stable printing can be performed. In addition, the chemically adsorbed monomolecular film 6 of the desired portion
To remove it, attach a sticky substance (resin such as polyisobutylene) to the surface of the chemically adsorbed monomolecular film 6 in the area you want to leave, and then use oxygen plasma (oxygen asher used to remove photoresist, etc.). This allows you to remove unnecessary parts.

【0022】(実施例2)以下、本発明の第2の実施例
について図3を用いて説明する。凹版1の材料として親
水性ではあるが水酸基を含む割合が少ない金属製凹版7
(アルミニウム,ステンレス,銀等の金属)の場合、ト
リクロロシリル基を複数個含む物質[例えば、SiCl
4、またはSiHCl3,SiH2Cl2,Cl−(S
iCl2O)n−SiCl3(nは整数)。特に、Si
Cl4を用いれば、分子が小さく水酸基に対する活性も
大きいので、凹版表面を均一に親水化する効果が大きい
]を混ぜた非水系溶媒、例えばクロロホルム溶媒に1重
量%溶解した溶液に30分程度浸漬すると、図3(A)
で示すように金属製凹版7の表面には親水性のOH基8
が多少とも存在するので表面で脱塩酸反応が生じトリク
ロロシリル基を複数個含む物質のクロロシラン単分子膜
が形成される。
(Embodiment 2) A second embodiment of the present invention will be described below with reference to FIG. A metal intaglio plate 7 that is hydrophilic as a material for the intaglio plate 1 but contains a small proportion of hydroxyl groups
(metals such as aluminum, stainless steel, silver, etc.), substances containing multiple trichlorosilyl groups [e.g., SiCl
4, or SiHCl3, SiH2Cl2, Cl-(S
iCl2O)n-SiCl3 (n is an integer). In particular, Si
If Cl4 is used, it has a small molecule and high activity towards hydroxyl groups, so it has a great effect of uniformly making the intaglio surface hydrophilic.] When immersed for about 30 minutes in a solution of 1% by weight dissolved in a non-aqueous solvent such as chloroform solvent, , Figure 3(A)
As shown in the figure, there are hydrophilic OH groups 8 on the surface of the metal intaglio plate 7.
is present to some extent, a dehydrochlorination reaction occurs on the surface and a chlorosilane monomolecular film of a substance containing a plurality of trichlorosilyl groups is formed.

【0023】例えば、トリクロロシリル基を複数個含む
物質としてSiCl4を用いれば、金属製凹版7の表面
には少量の親水基のOH基8が露出されているので、表
面で脱塩酸反応が生じ、
For example, if SiCl4 is used as a substance containing a plurality of trichlorosilyl groups, a small amount of hydrophilic OH groups 8 are exposed on the surface of the metal intaglio plate 7, so a dehydrochlorination reaction occurs on the surface.

【0024】[0024]

【化2】[Case 2]

【0025】のように分子が−SiO−結合を介して表
面に形成される。その後非水系の溶媒、例えばクロロホ
ルムで洗浄してさらに水で洗浄すると、金属製凹版7と
反応していないSiCl4分子は除去され、表面には
Molecules are formed on the surface via -SiO- bonds. After that, by washing with a non-aqueous solvent such as chloroform and further washing with water, the SiCl4 molecules that have not reacted with the metal intaglio plate 7 are removed, and the surface is


0026】
[
0026

【化3】[Chemical formula 3]

【0027】等のシロキサン単分子膜9が得られる。な
お、このときできたシロキサン単分子膜9は金属製凹版
7とは−SiO−の化学結合を介して完全に結合されて
いるので剥がれることが全く無い。また、得られたシロ
キサン単分子膜9は表面にSiOH結合を数多く持ち、
図3(B)に示すように当初のOH基8のおよそ3倍程
度の数が生成される。
A siloxane monomolecular film 9 such as the following is obtained. Incidentally, the siloxane monomolecular film 9 formed at this time is completely bonded to the metal intaglio plate 7 through the chemical bond of -SiO-, so that it will not peel off at all. Moreover, the obtained siloxane monomolecular film 9 has many SiOH bonds on the surface,
As shown in FIG. 3(B), approximately three times as many OH groups 8 as the original OH groups are generated.

【0028】そこでさらに、フッ化炭素基およびクロロ
シラン基を含む物質を混ぜた非水系の溶媒、例えば、C
F3(CF2)7(CH2)2SiCl3を用い、1%
程度の濃度で溶かした溶液[80%n−ヘキサデカン(
トルエン,キシレン,ジシクロヘキシルでもよい)、1
0%四塩化炭素,8%クロロホルム]を調整し、前記金
属製凹版7にSiOH結合を数多く持つシロキサン単分
子膜9の形成された上記金属製スキージ7を1時間程度
浸漬すると、表面には
Therefore, a non-aqueous solvent containing a substance containing a fluorocarbon group and a chlorosilane group, such as C
Using F3(CF2)7(CH2)2SiCl3, 1%
A solution [80% n-hexadecane (
toluene, xylene, dicyclohexyl), 1
0% carbon tetrachloride, 8% chloroform], and immersed the metal squeegee 7 on which the siloxane monomolecular film 9 having a large number of SiOH bonds was formed on the metal intaglio plate 7 for about an hour.

【0029】[0029]

【化4】[C4]

【0030】の結合が生成され、図3(C)に示すよう
にフッ素を含む化学吸着単分子膜6が金属製凹版7の表
面と化学結合した状態でおよそ15オングストロームの
膜厚で形成することができた。なお、上記フッ素を含む
化学吸着単分子膜6はきわめて強固に化学結合している
ので全く剥離することがなかった。
As shown in FIG. 3(C), a chemically adsorbed monomolecular film 6 containing fluorine is chemically bonded to the surface of the metal intaglio plate 7 to form a film thickness of approximately 15 angstroms. was completed. Note that the chemically adsorbed monomolecular film 6 containing fluorine had extremely strong chemical bonds, so it did not peel off at all.

【0031】さらにまた、上記実施例では、フッ化炭素
系界面活性剤として CF3(CF2)7(CH2)2SiCl3を用いたが
、アルキル鎖部分にC=CやC≡C基を付加したり組み
込んでおけばフッ素を含む化学吸着単分子膜6の形成後
5メガラド程度の電子線放射で架橋できるのでさらにフ
ッ素を含む化学吸着単分子膜6の硬度を向上させること
も可能である。
Furthermore, in the above examples, CF3(CF2)7(CH2)2SiCl3 was used as the fluorocarbon surfactant, but C═C or C≡C groups may be added or incorporated into the alkyl chain portion. If this is done, the hardness of the chemisorbed monomolecular film 6 containing fluorine can be further improved since it can be crosslinked by electron beam radiation of about 5 megarads after the chemisorption monomolecular film 6 containing fluorine is formed.

【0032】なお、フッ化炭素系界面活性剤として上記
のもの以外にも CF3CH2O(CH2)15SiCl3CF3(CH
2)2Si(CH3)2(CH2)15SiCl3F(
CF2)8(CH2)2Si(CH3)2(H2)9S
iCl3 CF3COO(CH2)15SiCl3CF3(CF2
)5(CH2)2SiCl3等が利用できることを確認
した。
In addition to the above-mentioned fluorocarbon surfactants, CF3CH2O(CH2)15SiCl3CF3(CH
2) 2Si(CH3)2(CH2)15SiCl3F(
CF2)8(CH2)2Si(CH3)2(H2)9S
iCl3 CF3COO(CH2)15SiCl3CF3(CF2
)5(CH2)2SiCl3 etc. was confirmed to be usable.

【0033】次に、この金属製凹版7を用い凹版オフセ
ット印刷を試みた。先ず、従来の凹版として何も表面処
理をしていない金属製凹版(以下、未処理金属製凹版と
呼ぶ)と、未処理の金属製凹版に上記本発明によるフッ
素を含む化学吸着単分子膜6を表面に形成することで作
成した撥水撥油性金属製凹版7(以下、処理金属製凹版
と呼ぶ)を用意した。
Next, intaglio offset printing was attempted using this metal intaglio plate 7. First, a metal intaglio plate that has not been subjected to any surface treatment as a conventional intaglio plate (hereinafter referred to as an untreated metal intaglio plate) and a chemically adsorbed monomolecular film 6 containing fluorine according to the present invention are applied to the untreated metal intaglio plate. A water- and oil-repellent metal intaglio plate 7 (hereinafter referred to as treated metal intaglio plate) was prepared by forming on the surface.

【0034】なお、凹版オフセット印刷機,インキ,被
印刷体は、実施例1と同様のものを用い、実施例1と同
様にエッチングレジストインキおよび金レジネートイン
キを用いて同様な印刷実験を行った。ここで金属製凹版
には未処理金属製凹版と処理金属製凹版を用い、比較を
行った(以下、金属凹版エッチング基板と呼ぶ)。
[0034] The same intaglio offset printing machine, ink, and printing material as in Example 1 were used, and similar printing experiments were conducted using etching resist ink and gold resinate ink as in Example 1. . Here, a comparison was made using an untreated metal intaglio and a treated metal intaglio as the metal intaglio (hereinafter referred to as metal intaglio etching substrate).

【0035】また、エッチングレジストインキの代わり
に金レジストインキを用い、凹版オフセット印刷法によ
りアルミナグレーズ基板の上に直接ピッチ50ミクロン
のA4サイズ用のサーマルヘッドの金電極パターンを印
刷した。なお、上記と同様に金属製凹版7には未処理金
属製凹版と処理金属製凹版を用い比較を行った。この金
電極パターンが印刷されたグレーズアルミナ基板を焼成
し、前記エッチング配線基板と同様のものを得た(以下
、金属凹版直接印刷基板と呼ぶ)。
[0035] Also, using gold resist ink instead of etching resist ink, a gold electrode pattern of an A4 size thermal head with a pitch of 50 microns was directly printed on the alumina glaze substrate by an intaglio offset printing method. In the same manner as described above, a comparison was made using an untreated metal intaglio plate and a treated metal intaglio plate as the metal intaglio plate 7. The glazed alumina substrate on which this gold electrode pattern was printed was fired to obtain a substrate similar to the etched wiring substrate (hereinafter referred to as a metal intaglio directly printed substrate).

【0036】以下に、金属凹版エッチング基板および金
属凹版直接印刷基板における印刷歩留まりを調べた。印
刷歩留まりは、サーマルヘッド用の10枚のサンプルの
中で、1枚のサンプル中で約20000ヶ所ある50ミ
クロンピッチの配線部分におけるショートおよびオープ
ン不良の発生数で評価し、この評価結果を以下に示す。
The printing yields of the metal intaglio etched substrate and the metal intaglio directly printed substrate were investigated below. Printing yield is evaluated by the number of shorts and open defects in the 50 micron pitch wiring parts, which are approximately 20,000 locations in each sample out of 10 samples for thermal heads, and the evaluation results are shown below. show.

【0037】   金属凹版エッチング基板において       未処理金属製凹版    ショート   
 85ヶ所    オープン  25ヶ所      
処理金属製凹版      ショート      8ヶ
所    オープン    4ヶ所  金属凹版直接印
刷基板において、       未処理金属製凹版    ショート  1
33ヶ所    オープン  38ヶ所      処
理金属製凹版      ショート      5ヶ所
    オープン    4ヶ所以上の結果より、エッ
チング基板および直接印刷基板において、共通して処理
金属製凹版の方が未処理金属製凹版よりもショートおよ
びオープンの発生が少ないことがわかる。
In metal intaglio etching substrate, untreated metal intaglio short
85 locations Open 25 locations
Treated metal intaglio short 8 places Open 4 places In metal intaglio direct printing board, untreated metal intaglio short 1
33 places open 38 places Treated metal intaglio Short 5 places Open From the results of 4 or more places, shorts and opens occur more often with treated metal intaglio than with untreated metal intaglio on etched substrates and direct printing substrates. It can be seen that there are few

【0038】未処理金属製凹版を用いて作成したサンプ
ルのショートした場所を顕微鏡で観察したところ、約9
0%が微細パターン部分の線間に残ったインキが原因で
あることがわかった。また、各サンプルのオープン原因
を調べたところ、異物(ゴミ)によるものがほとんどで
あった。さらに、未処理金属製凹版に比べ処理金属製凹
版の方が、ごみ数が少なかった。これは第1の実施例と
同様に、処理金属製凹版の方が未処理金属製凹版に比較
して、異物の付着が少ないためであった。
When the short-circuited area of the sample made using an untreated metal intaglio was observed under a microscope, it was found that approximately 9.
It was found that 0% was caused by ink remaining between the lines of the fine pattern portion. Furthermore, when we investigated the causes of open circuits in each sample, we found that most of them were caused by foreign objects (dust). Furthermore, the number of dust was lower in the treated metal intaglio than in the untreated metal intaglio. This is because, as in the first example, less foreign matter adhered to the treated metal intaglio than to the untreated metal intaglio.

【0039】また、凹版1の全面に形成された化学吸着
単分子膜6のうち、凹版パターン2(溝)内部の化学吸
着単分子膜6は除去してもよい。この場合、水性インキ
等を用いた場合でも、インキ3が凹版パターン2内では
じかれる(撥水撥油される)こともなく、安定した印刷
ができる。また、上記所望する部分の化学吸着単分子膜
6を除去するには、残したい部分の化学吸着単分子膜6
表面に粘着性物質(ポリイソブチレン等の樹脂)を付着
させた後、酸素プラズマ(フォトレジスト等の除去に用
いる酸素アッシャー)等を用いることで不要部分を除去
することができる。
Furthermore, of the chemisorption monomolecular film 6 formed on the entire surface of the intaglio plate 1, the chemisorption monomolecular film 6 inside the intaglio pattern 2 (groove) may be removed. In this case, even if water-based ink or the like is used, the ink 3 will not be repelled (become water- and oil-repellent) within the intaglio pattern 2, and stable printing can be performed. In addition, in order to remove the chemisorption monomolecular film 6 of the desired portion, it is necessary to remove the chemisorption monomolecular film 6 of the desired portion.
After attaching a sticky substance (resin such as polyisobutylene) to the surface, unnecessary portions can be removed by using oxygen plasma (oxygen asher used for removing photoresist, etc.).

【0040】[0040]

【発明の効果】以上のように本発明による撥水撥油製凹
版は構成され、きわめて薄いナノメータレベルの膜厚の
フッ化炭素系単分子膜を凹版表面に形成するため、凹版
の精度を損なうことがない。また、このフッ化炭素系単
分子膜は撥水撥油性に優れるため凹版表面のインキ汚れ
が発生しにくいものであり、従って印刷の歩留まりを高
める効果が大きく、工業的価値の大なるものである。
[Effects of the Invention] As described above, the water- and oil-repellent intaglio plate according to the present invention is constructed, and an extremely thin fluorocarbon monomolecular film with a film thickness on the nanometer level is formed on the surface of the intaglio plate, which impairs the accuracy of the intaglio plate. Never. Additionally, this fluorocarbon-based monomolecular film has excellent water and oil repellency, making it difficult for ink stains to occur on the surface of the intaglio plate, thus greatly increasing printing yields and having great industrial value. .

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の一実施例による凹版の構成を示す斜視
FIG. 1 is a perspective view showing the structure of an intaglio plate according to an embodiment of the present invention.

【図2】本発明の凹版の表面を分子レベルまで拡大した
断面概念図
[Figure 2] Conceptual cross-sectional diagram of the surface of the intaglio plate of the present invention enlarged to the molecular level

【図3】(A)〜(C)本発明の第2の実施例を示す凹
版の表面を分子レベルまで拡大した断面工程概念図
[Fig. 3] (A) to (C) A cross-sectional process conceptual diagram showing the second embodiment of the present invention, with the surface of an intaglio plate enlarged to the molecular level.

【図
4】(A)従来例による凹版を示す斜視図(B)従来例
の凹版にインキを充填する作業を示す断面図
[Fig. 4] (A) A perspective view showing a conventional intaglio plate. (B) A sectional view showing the work of filling ink into a conventional intaglio plate.

【符号の説明】[Explanation of symbols]

1  凹版 2  凹版パターン 3  インキ 4  スキージ 5  インキ残り 6  化学吸着単分子膜 7  金属製凹版 8  OH基 9  シロキサン単分子膜 1 Intaglio 2 Intaglio pattern 3 Ink 4 Squeegee 5 Ink remaining 6 Chemisorption monolayer 7 Metal intaglio 8 OH group 9 Siloxane monolayer

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】フッ素を含む化学吸着単分子膜が表面に形
成されていることを特徴とした撥水撥油性凹版。
1. A water- and oil-repellent intaglio plate, characterized in that a chemically adsorbed monomolecular film containing fluorine is formed on the surface.
【請求項2】フッ素を含む化学吸着単分子膜が部分的に
形成されていることを特徴とした撥水撥油性凹版。
2. A water- and oil-repellent intaglio plate, characterized in that a chemically adsorbed monomolecular film containing fluorine is partially formed.
【請求項3】フッ素を含む化学吸着単分子膜が、少なく
ともシロキサン系単分子膜を介して表面に形成されてい
ることを特徴とした撥水撥油性凹版。
3. A water- and oil-repellent intaglio plate, characterized in that a chemically adsorbed monomolecular film containing fluorine is formed on the surface via at least a siloxane monomolecular film.
【請求項4】加工の終了した凹版をよく洗浄した後、一
端にクロルシラン基(SiClnX3−n基、n=1,
2,3、Xは官能基)を有し他の一端にフッ化炭素基を
有するクロロシラン系界面活性剤を溶かした有機溶媒中
に浸漬し、前記クロロシラン系界面活性剤よりなる化学
吸着単分子膜を前記凹版表面に亘り形成する工程を含む
ことを特徴とする撥水撥油性凹版の製造方法。
4. After thoroughly cleaning the processed intaglio plate, one end has a chlorosilane group (SiClnX3-n group, n=1,
2, 3, X is a functional group) and a fluorocarbon group at one end is immersed in an organic solvent in which a chlorosilane surfactant is dissolved, and a chemically adsorbed monomolecular film made of the chlorosilane surfactant is prepared. A method for producing a water- and oil-repellent intaglio plate, comprising the step of forming a water- and oil-repellent intaglio plate over the surface of the intaglio plate.
【請求項5】加工の終わった凹版をよく洗浄した後、ク
ロロシリル基を複数個含む物質を混ぜた非水系溶媒に接
触させて前記凹版の水酸基と前記クロロシリル基を複数
個含む物質のクロロシリル基とを反応させて前記クロロ
シリル基を複数個含む物質を前記凹版表面に析出させる
工程と、非水系有機溶媒を用い前記凹版上に残った余分
なクロロシリル基を複数個含む物質を洗浄除去した後、
水と反応させて前記凹版上にシロール基を複数個含む物
質よりなる単分子膜を形成する工程と、一端にクロルシ
ラン基(SiClnX3−n基、n=1,2,3、Xは
官能基)を有し他の一端に直鎖状フッ化炭素基を含むク
ロロシラン系界面活性剤を凹版上に化学吸着し単分子吸
着膜を累積する工程とを含むことを特徴とする撥水撥油
性凹版の製造方法。
5. After thoroughly washing the processed intaglio plate, it is brought into contact with a non-aqueous solvent containing a substance containing a plurality of chlorosilyl groups to separate the hydroxyl groups of the intaglio plate and the chlorosilyl groups of the substance containing a plurality of chlorosilyl groups. a step of precipitating a substance containing a plurality of chlorosilyl groups on the surface of the intaglio plate, and washing and removing the excess substance containing a plurality of chlorosilyl groups remaining on the intaglio plate using a non-aqueous organic solvent,
A step of forming a monomolecular film made of a substance containing a plurality of silole groups on the intaglio plate by reacting with water, and a chlorosilane group (SiClnX3-n group, n=1,2,3, X is a functional group) at one end. and a step of chemically adsorbing a chlorosilane surfactant containing a linear fluorocarbon group at one end onto the intaglio to form a monomolecularly adsorbed film. Production method.
【請求項6】クロロシリル基を複数個含む物質としてS
iCl4、またはSiHCl3,SiH2Cl2,Cl
−(SiCl2O)n−SiCl3(nは整数)を用い
ることを特徴とした請求項5記載の撥水撥油性凹版の製
造方法。
Claim 6: S as a substance containing a plurality of chlorosilyl groups
iCl4, or SiHCl3, SiH2Cl2, Cl
The method for producing a water- and oil-repellent intaglio plate according to claim 5, characterized in that -(SiCl2O)n-SiCl3 (n is an integer) is used.
【請求項7】一端にクロルシラン基を有し他の一端に直
鎖状フッ化炭素基を含むクロロシラン系界面活性剤とし
てCF3−(CF2)n−R−SiXpCl3−p(n
は0または整数、Rはアルキル基やC=C,C≡Cまた
はシリコンや酸素原子を含む官能基を表わすがなくとも
よい、XはHまたはアルキル基等の置換基、pは0また
は1または2)を用いることを特徴とした請求項5記載
の撥水撥油性凹版の製造方法。
7. CF3-(CF2)n-R-SiXpCl3-p(n
is 0 or an integer, R represents an alkyl group, C═C, C≡C, or a functional group containing a silicon or oxygen atom, but may be omitted; X is H or a substituent such as an alkyl group; p is 0 or 1 or 6. The method for producing a water- and oil-repellent intaglio plate according to claim 5, characterized in that 2) is used.
JP1188291A 1991-02-01 1991-02-01 Water- and oil-repellent intaglio and manufacturing method thereof Expired - Fee Related JP3021695B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1188291A JP3021695B2 (en) 1991-02-01 1991-02-01 Water- and oil-repellent intaglio and manufacturing method thereof

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Application Number Priority Date Filing Date Title
JP1188291A JP3021695B2 (en) 1991-02-01 1991-02-01 Water- and oil-repellent intaglio and manufacturing method thereof

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Publication Number Publication Date
JPH04246594A true JPH04246594A (en) 1992-09-02
JP3021695B2 JP3021695B2 (en) 2000-03-15

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