JPH04241477A - Sub mount for semiconductor device and semiconductor photo device module - Google Patents

Abstract

PURPOSE:To obtain a sub mount for a semiconductor photo device wherein optical axis alignment is not needed, assembly is simple and high speed operation is possible and to obtain a semiconductor photo device module using the sub mount. CONSTITUTION:A light transmitting part 12 is formed on a portion of a transparent heat sink material 11, while a lens 13 and a rear metallized part 17 are formed on the rear face 19 and a chip adhesion part 14, a wire adhesion part 15 and a wire 16 are formed on the upper face 18. The chip adhesion part 14 has the same outer shape as that of a semiconductor photo device chip 20, wherein it is formed so that extension of a center line of the lens 13 aligns with a light emission point of the chip 20 to have the chip 20 adhered to the chip adhesion part 14. Then the chip 20 is soldered to form a sub mount 21 for a semiconductor photo device. In addition, the above sub mount and a package having a recess which has been designed so that the center line of the above lens 13 aligns with the center of a slantly polished surface of a slantly polished fiber are adhered with each other to form a semiconductor photo device module.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor optical device, and more particularly to a submount for a semiconductor optical device and a semiconductor optical device module that combines a semiconductor optical device and an optical fiber.

0002

2. Description of the Related Art FIG. 4 shows an example of a conventional method of assembling a semiconductor light emitting device, a heat sink, and a lens, and a method of coupling a semiconductor light emitting device and a fiber of a module. 2 is a ball lens, 3 is a submount, 4 is a light emitting part of light emitting element 1,
5 is the optical fiber, 6 is the mount or package,
7 is the emitted light.

Next, an assembly method and a method for coupling the semiconductor light emitting device and the fiber will be explained. In the conventional assembly method, after forming the lens 2 of resin, polyimide, etc. on the light emitting portion 4 of the semiconductor light emitting element chip 1,
After soldering the chip 1 onto the submount 3, forming the lens 2 on the light emitting part 4, or forming the lens 2 on the part 4 from which light is emitted,
I was installing it. Furthermore, in the conventional module, the optical axes of the semiconductor light emitting element chip 1, lens 2, and optical fiber 5 are spatially aligned and fixed with a holder.

0004

[Problems to be Solved by the Invention] According to the conventional assembly method, forming the lens 2 on the chip 1 later as shown in FIG. 4 increases the number of steps, and the lens is not formed using a mask on the wafer. However, it was difficult to align the optical axes. In addition, it is also difficult to align the optical axis of the module.
In particular, optical axis alignment is extremely difficult when applied to coupling an array of LDs, LEDs, PDs, etc. and a fiber array.

[0005] This invention was made to solve the above-mentioned problems, and it integrates the heat sink, lens, wiring, etc. to facilitate assembly, shortens the wire length, and enables high-speed operation. The object of the present invention is to obtain a submount for a semiconductor device that allows a possible package to be obtained.

Another object of the present invention is to provide a semiconductor optical device module or a semiconductor optical device array module that is easy to assemble, can operate at high speed, and allows easy alignment of optical axes, similar to the above invention.

[0007]

[Means for Solving the Problems] A submount for a semiconductor optical device according to the present invention has a lens formed on one side of a light transmitting part of an insulating heat sink material using a material with high light transmittance, and a lens around the lens. is the package (or mount,
A metallized part for adhering to the stem), a chip adhesion part with the same external shape as the chip of a semiconductor optical device other than the light transmitting part on the surface opposite to the lens, and a wire adhesion part on the outside of the chip adhesion part. and wiring.

Further, in the semiconductor optical device module and array module according to the present invention, the light emitting or light receiving surface of the semiconductor optical device chip faces the surface opposite to the lens formed on the submount, and the light emitting or light incident point is A semiconductor optical device submount in which the chip is bonded to the chip bonding part of the submount, and an obliquely polished fiber on the surface of the submount that is bonded to the surface on which the lens is formed, so that the chip is in the center of the lens. Package (or mount, stem) with a recess for insertion
The obliquely polished fiber is attached so that the light emitted from or incident on the chip is reflected on the obliquely polished surface of the obliquely polished fiber through the lens formed on the submount and is incident on the fiber. The obliquely polished fiber is inserted into the recess and fixed with resin or the like so that it does not rotate.

[0009]

[Function] The submount for a semiconductor optical device according to the present invention integrates a lens, a wire bonding part, and wiring on an insulating heat sink material using a material with high light transmittance, and further has the same external shape as a chip of a semiconductor optical device. Since the conductive adhesive part is provided, the chip of the semiconductor optical device can be easily bonded while being viewed under a microscope by matching the shape of the adhesive part during assembly.

Further, the semiconductor optical device module and the semiconductor optical device array module of the present invention have a chip bonded to the above-mentioned submount for semiconductor optical device, and a surface to be bonded to the submount that has the same level of obliquely polished fiber. A package having a concave portion of the same size is glued to the package, and the obliquely polished fiber is inserted into the concave portion so that the center of the obliquely polished surface of the obliquely polished fiber is directly below the center of the lens formed on the submount. With this structure, the module can be easily realized without aligning the optical axes in order to couple the chip, lens, and fiber of the semiconductor optical device.

[0011]

[Embodiment] FIG. 1 is a diagram showing a submount for a semiconductor optical device according to an embodiment of the present invention.
1 is a transparent heat sink material, 12 is a light transmitting part, 13 is a lens, 14 is a chip adhesive part, 15 is a wire adhesive part, 1
6 is the wiring, 17 is the back metallized part, 18 is the top surface (the surface to which the chip is bonded), and 19 is the back surface (the surface where the lens 13 is located).
, 20 indicates a chip.

Further, the transparent heat sink material 11 is made of, for example, single crystal sapphire, diamond, etc., and a portion thereof is provided with a light transmitting portion 12.
A lens 13 is formed on the back surface 19 of the heat sink material on one side. Further, a back metallized portion 17 for adhering to a package (mount, stem), not shown, is formed on the back surface 19 over the entire surface except for the light transmitting portion 12 and its periphery. Furthermore, the heat sink material 1
1. A conductive chip having an opening having the same external shape as the chip 20 and the same shape as the light transmitting portion 12 so that the extension of the center line of the lens 13 coincides with the light emitting point of the chip 20. A bonding portion 14 is formed. Further, a conductive wire bonding portion 15 is formed next to the chip bonding portion 14 with a slight gap therebetween to bond the wire attached to the other electrode of the chip 20. Conductive wires 16 are formed from the chip bonding portions 14 to respective lead terminals of a package (not shown) for transmitting signals.

Next, the assembly method will be explained. Using the semiconductor optical device submount 21 and the semiconductor optical device chip 20, the chip 20 is oriented so that its light emitting or light receiving surface is on the chip bonding portion 14 of the submount 21.
The chip 20 is brought into contact with the submount so that its outer shape matches the outer shape of the chip bonding part 14. Then, these are fixed by soldering. Further, one end of the wire is bonded to the electrode on the upper surface of the chip 20, and the other end of the wire is bonded to the wire bonding portion 15.

As described above, in this embodiment, a high-precision submount can be completed by simple assembly without optical axis alignment, and the wire length can be shortened, so that high-speed operation is possible.

FIG. 2 is a diagram showing a surface emitting LD array module according to a second embodiment of the present invention.
1 is a submount for the semiconductor device, 22 is a surface emitting LD array chip, 23 is an electrode of the chip, 24 is a wire, 25 is an obliquely polished fiber array, 26 is a package (or mount, fiber array holder), 2
7 is a surface of the package 26 to which the semiconductor device submount 21 is adhered, 28 is a recess into which a fiber is inserted, and 29 is a resin or the like.

Next, the assembly method will be explained. Figure 2 (a
), (b), the surface emitting LD array module is made by bonding the surface emitting LD array chip 22,
The wire-bonded semiconductor device submount 21 is used. First, the surface 27 of the package 26 that is bonded to the semiconductor device submount 21
A recess 28 for inserting the obliquely polished fiber is formed parallel to this surface. The recess 28 into which the obliquely polished fibers are inserted has the same height and width as the obliquely polished fiber array 25, and the obliquely polished fibers are placed on an extension of the center line of the lens 13 formed on the semiconductor device submount 21. The fiber array 25 is formed so that the centers of the oblique polished surfaces have a matching depth. And the above surface emitting LD
bonding the semiconductor device submount 21 to which the array chip 22 is bonded and the package 26;
The obliquely polished fiber array 25 is inserted into the recess 28 formed between these, and the obliquely polished fibers are fixed with resin or the like 29 so as not to rotate.

In the second embodiment of the present invention, the LD array module, ie, the semiconductor optical device array, can be assembled without aligning the optical axis by simply inserting the fiber into the recess 28 formed by aligning the fibers in advance. It has the effect of realizing modules.

In the above embodiment, a submount for a semiconductor optical device with a lens was shown, but as shown in FIG. It may be a portion 31 with a light guide region formed to have a refractive index distribution with a low refractive index portion 32 on the outside, or it may have both a lens and a light guide region.

Further, in the above embodiment, a surface emitting LD array module was explained, but it may be a surface emitting LD (single) module, or a module of a single LED or PD or an array. The same effects as in the above embodiment are achieved.

Furthermore, although the recess formed in the package has been described as a rectangular parallelepiped recess, it may also be a recess having the same shape as the fiber (array) and slightly larger than the rectangular parallelepiped recess.

[0021]

[Effects of the Invention] As described above, according to the present invention, a heat sink material with high light transmittance is used in a submount for a semiconductor optical device, and the lens, chip bonding part, wire bonding part, wiring, etc. are integrated. Therefore, chips of semiconductor optical devices can be bonded easily and with high precision, the wire length can be shortened, and high-speed operation can be achieved.

Furthermore, according to the semiconductor optical device module of the present invention, the above-mentioned semiconductor optical device submount is used, a recessed portion designed to enable pre-alignment is formed, and the fiber is simply inserted. , it is possible to obtain a package that can be easily assembled with high precision, shortened the wire length, and can operate at high speed, and is suitable for semiconductor optical device chips and submounts for semiconductor optical devices.
Furthermore, the package and the fiber can be coupled by a simple method that does not require alignment of optical axes, and there is an effect that semiconductor optical device array modules can be obtained with good mass productivity.

[Brief explanation of the drawing]

FIG. 1 is a top view, a back view, and a sectional view showing a submount for a semiconductor optical device according to an embodiment of the present invention.

FIG. 2 is a perspective view and a sectional view showing a mounting method of a surface emitting LD array module according to a second embodiment of the present invention.

FIG. 3 is a cross-sectional view of a submount for a semiconductor optical device showing another embodiment of the present invention, and a diagram showing a refractive index distribution of a light transmitting portion.

FIG. 4 is a perspective view showing a conventional method for mounting a surface emitting LED.

[Explanation of symbols]

1 Surface emitting LED chip 2 Ball lens 3 Submount 4 Light emitting part 5 Optical fiber 6 Mount 7 Emitted light 11 Transparent heat sink material 12 Light transmitting part 13 Lens 14 Chip adhesive part 15 Wire adhesive part 16 Wiring 17 Back metallized part 18 Top surface 19 Back surface 20 Chip 21 Submount according to the present invention 22 Surface-emitting LD array chip 23 Chip electrode 24 Wire 25 Obliquely polished fiber array 26 Package (or mount) 27 Surface to which the submount is bonded 28 Recessed portion for inserting the fiber 29 Resin, etc.

Claims (4)

[Claims] 1. A submount for a semiconductor optical device made of an insulating heat sink material with high light transmittance, the submount having a light transmitting part, a lens formed on one side of the light transmitting part, A metallized part is provided around the lens on one side of the lens for adhering the submount to the package on which it is to be mounted, and a semiconductor optical device chip and a semiconductor optical device chip are provided on the opposite side of the lens in addition to the above-mentioned light transmitting part. A submount for a semiconductor optical device, characterized in that a chip adhesion part having the same external shape is provided, and wiring and wire adhesion parts are provided outside the chip adhesion part. 2. The semiconductor according to claim 1, wherein the refractive index of the light transmitting portion has a refractive index distribution that is lower on the outer side than on the center portion in a concentric cylindrical shape centered on the center portion of the lens. Submount for devices. 3. A semiconductor optical device module comprising the submount for a semiconductor optical device according to claim 1, to which a semiconductor optical device chip is adhered, and a package into which a fiber whose tip is obliquely polished is inserted, the semiconductor optical device module comprising: is set so that the light emission or incidence point is at the center of the lens formed on the above-mentioned semiconductor optical device submount.
The light-emitting or light-receiving surface is bonded so as to face the chip bonding part of the submount for semiconductor optical device, and the surface of the submount for semiconductor optical device with the lens has a recess into which the obliquely polished fiber of the package is inserted. The obliquely polished fiber is bonded so that light emitted or incident through the lens of the semiconductor optical device submount is reflected on the obliquely polished surface of the obliquely polished fiber and is incident on the fiber. A semiconductor optical device module, wherein the semiconductor optical device module is inserted into the recess and is fixedly held so as not to rotate. 4. Claim 3, wherein the chip, the light transmitting portion of the submount, the wiring, and the optical fiber are arranged in an array.
The semiconductor optical device module described.