JPH04219618A - Manufacture of magnetic head supporting structure - Google Patents

Abstract

PURPOSE:To efficiently and easily obtain a floating magnetic head supporting structure of a small type and a light weight without affected by the rigidity of the recording and regenerating signal wiring on the floating operation of the head slider provided with the magnetic head. CONSTITUTION:On the insulated face of a thin plate form of base plate 11, a thin film conductive wiring 15 having a first connecting pad 16 for head connection at one end and a second connecting pad 17 for lead line drawing at the other end are formed and the head slider 19 is adhered and fixed to the first connecting pad 16 at a rear side, then the base plate 11 is segmented in the form of a load supporting beam. Or the base plate 11 forming the thin conductive wiring 15 having the first and second connecting pads 16, 17 is segmented in the prescribed supporting beam form, then the head slider 19 is adhered and fixed to the first connecting pad 16 at the rear side to construct the structure.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a magnetic head support mechanism used in a magnetic disk drive, and more particularly to a method of manufacturing a magnetic head support mechanism suitable for downsizing a head slider and lowering the flying height relative to a magnetic disk. It is something. In recent years, in magnetic disk drives, the flying height of the magnetic head slider relative to the magnetic disk has become smaller and smaller as the recording density has increased, and the probability of the magnetic head slider coming into contact with or colliding with the magnetic disk has also increased. Head crashes are more likely to occur. In order to avoid such troubles, it is effective to downsize the magnetic head slider and reduce the load associated with its flying force.

However, as the magnetic head slider becomes smaller and the head load becomes lower, the magnetic head slider is disposed along the load support beam and the access arm from the magnetic head element.
In addition, the rigidity of the signal wiring connected to the recording/reproduction control circuit has a greater influence on the flying operation of the magnetic head slider, impairing the flying stability. Therefore, there is a need for a support mechanism that can easily stabilize a small magnetic head slider at a low flying height by eliminating the influence of the rigidity of the signal wiring.

0003

2. Description of the Related Art A conventional magnetic head support mechanism is a head with a thin-film magnetic head 2 attached thereto, as shown in the side view of FIG. 4 and the back view of FIG. 5, which shows the gimbal 3 of FIG. Slider 1 has an opposing magnetic disk (not shown)
The folded tip 3a of the gimbal 3 made of stainless steel or the like, which flexibly stabilizes the floating posture of the slider 1, is adhesively fixed to the approximately central part of the back surface of the slider 1 with an adhesive such as epoxy resin, and the other end of the gimbal 3 is The portion 3b is in a state where the pivot 5 at the tip is in contact with the back surface of the head slider 1 on the lower surface side of the load support beam 4 for balancing the levitation force generated in the head slider 1 and obtaining the required flying height. It is joined and fixed by spot welding method etc.

The other end of the load support beam 4 is fixedly supported by an access arm (not shown), and is connected to a terminal of a thin film magnetic head 2 attached to the head slider 1 for recording/reproducing signals. A lead wire 6 is routed along the load support beam 4 and an access arm (not shown), and is connected to a recording/reproduction control circuit.

[0005]

[Problems to be Solved by the Invention] However, in a magnetic disk device using the above-mentioned magnetic head support mechanism,
As the recording density of magnetic disks increases, the flying height of the head slider 1 with respect to the magnetic disk is increasingly reduced, and the probability that the head slider 1 will come into contact with the magnetic disk increases accordingly, making head crashes more likely.

In order to reduce the impact energy when the head slider 1 contacts or collides with the magnetic disk, and to improve flying stability and durability, it is essential to downsize the head slider 1 and reduce the head load. It is. However, the downsizing of the head slider 1 and the reduction of the head load inevitably result in a decrease in the rigidity of the gimbal 3 due to its configuration. On the contrary, the rigidity of the lead wire 6 for recording/reproducing signals increases relatively, and the influence of the rigidity impairs the flying stability of the head slider 1, resulting in decreased durability and reliability. there were.

[0007] Reducing the rigidity of the lead wire 6 can be simply solved by using a lead wire with a small diameter, but the lead wire with a small diameter is easy to break, making it difficult to assemble such a structure. Yield decreases due to cutting in the process. Furthermore, if the gimbal, load support beam, etc. are also made smaller as the head slider becomes smaller, handling during assembly becomes difficult, and problems arise in that it becomes difficult to obtain alignment accuracy.

In view of the above-mentioned problems of the conventional art, the present invention provides a novel magnetic head support mechanism that is small and lightweight, which does not have the influence of the rigidity of signal wiring on the flying motion of the magnetic head slider, and which is easy to assemble with high precision. The purpose is to provide a manufacturing method.

[0009]

[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention provides a method for manufacturing a support mechanism for supporting a head slider with a magnetic head attached thereto by a load support beam, in which a conductive thin film is applied to an insulating surface of a substrate. The conductor thin film is deposited and patterned to form a thin film conductor wiring having connection parts at both ends, one connection part of the thin film conductor wiring is used as a first connection pad for head connection, and the other connection part is used as a lead wire. A step of forming a second connection pad for a drawer, and adhesively fixing a connection terminal of a magnetic head provided on the back surface of the head slider to the first connection pad for connecting the head, and then a substrate to which the head slider is fixed. and cutting out the shape of the load support beam.

[0010] Furthermore, after cutting out the substrate on which the thin film conductor wiring having the first and second connection pads is formed into the shape of the load support beam, the head connection portion on the support beam-shaped substrate is cut out. A step of adhesively fixing a connection terminal of a magnetic head provided on the back surface of the head slider to the first connection pad of the head slider is configured. Further, the substrate may be a thin metal plate whose at least one side is coated with an insulating film, a silicon substrate coated with an insulating film, a resin substrate, or a ceramic substrate.

[0011]

[Function] In the manufacturing method of the present invention, as shown in FIG. Instead of lead wires for recording and reproducing signals that were arranged along 15 is formed by a thin film forming method, a photolithography process, etc., and a connection terminal of a thin film magnetic head 18 previously formed on the back surface of a head slider 19 to which a thin film magnetic head 18 is attached is fixed to the first connection pad 16 by solder bonding. After that, the head slider 19
The substrate 11 with the support beams fixed thereon is cut into a predetermined support beam shape by laser processing or the like.

Alternatively, a first connection pad 16 for connecting the head and a second connection pad 17 for drawing out the lead wire are provided at both ends.
After cutting out the substrate 11 on which the thin film conductor wiring 15 having the shape of a support beam is formed, the connection terminal of the magnetic head 18 provided on the back surface of the head slider 19 is glued to the first connection pad 16 for connecting the head. By fixing
It is possible to efficiently and easily manufacture a small and lightweight magnetic head support mechanism that is free from the influence of the rigidity of lead wires and the risk of breakage as in the conventional case in the support beam portion 20 which also functions as a gimbal.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described in detail below with reference to the drawings. 2(a), 2(b), and 3 are perspective views sequentially showing one embodiment of a method for manufacturing a magnetic head support mechanism according to the present invention. First, as shown in FIG. 2(a), for example, an insulating film 13 made of polyimide resin material is coated with a thickness of 1 μm on a thin metal plate 12 made of stainless steel with a thickness of 0.1 mm.
3 to 3 by a thin film forming method such as sputtering, vapor deposition, or plating on the surface of the substrate 11 coated with a film thickness of
A conductor thin film 14 made of copper (Cu) or the like with a film thickness of 10 μm
After depositing the conductor thin film 14, the conductor thin film 14 is patterned by a photolithography process to form a pair of thin film conductor wirings 15 having connecting portions 15a and 15b at both ends, as shown in FIG. 2(b).

[0014] Note that the thin metal plate 12 made of stainless steel
Instead of covering the insulating film 13 made of polyimide resin material, it may be covered with an insulating film made of SiO2, and as the conductive thin film, in addition to a copper (Cu) thin film,
A conductive thin film such as Au or Al can also be applied. Next, the connecting portions 15a at both ends of the pair of thin film conductor wirings 15
and 15b, one connection part 15a is connected to the first connection pad 16 for head connection, and the other connection part 15 is connected to the first connection pad 16 for connecting the head.
b are formed on the second connection pads 17 for leading out the lead wires as shown in FIG.
A head slider 19 having a thin film magnetic head 18 attached to the connection pad 16 is fixed to the back surface of the head slider 19 by solder heat bonding to a connection terminal (not shown) coated with solder of the thin film magnetic head 18 formed in advance.

The first connection pad 1 for connecting the head
6 and the connection terminal on the back of the head slider 19, the first connection pad 16 and the head slider 1
Even if there is a slight deviation in the corresponding position with respect to the connection terminal on the side 9, the first connection pad 16 and the head slider 1
Since the connection terminal on the 9th side has a solder bonding area covered with solder, it has the advantage that the surface tension of the solder during heat welding of the solder automatically draws them together in a fixed position and allows them to be bonded with high precision. .

Thereafter, the substrate 11 with the head slider 19 fixed thereon is cut into a predetermined support beam shape by laser processing, mechanical cutting, etching, etc., as shown by the dashed line, as shown in FIG. As shown in the figure, there is no fear of the rigidity of the lead wire or breakage as in the conventional case at the support beam section 20, which also functions as a gimbal.
Moreover, it becomes possible to efficiently and easily obtain a small and lightweight floating magnetic head support mechanism.

In the above embodiment, the substrate 11 is
Although an example has been described in which a substrate made of a thin stainless steel plate coated with an insulating film made of polyimide resin material or SiO2 is used, the present invention is not limited to such a substrate. Si
Other non-magnetic metal thin plates coated with an insulating film made of O2 etc.
Further, a thin Si substrate, a ceramic substrate, a resin substrate made of epoxy resin, polyimide resin, or the like can also be used.

[0018] Furthermore, the polyimide resin material or SiO
When using a substrate made of a SiO2 thin plate covered with an insulating film made of 2 etc., the substrate is cut into a support beam shape in the final process by forming thin film conductor wiring in consideration of the crystal plane of the SiO2 thin plate. In this case, it becomes possible to apply anisotropic etching, and it is possible to cut out the support beam shape with high precision. When using the ceramic substrate, resin substrate, etc., there is no need to cover these substrates with an insulating film, and the process can be simplified.

Further, in the above embodiment, the head connection in the pair of thin film conductor wirings 15 formed on the substrate 11 includes the first connection pad 16 for head connection and the second connection pad 17 for leading out the lead wire. After soldering the first connection pad 16 and the connection terminal on the back of the head slider 19,
The substrate 11 is cut into a predetermined support beam shape, and if necessary, for example, a pair of thin film conductors having a first connection pad 16 for connecting the head and a second connection pad 17 for drawing out the lead wire may be formed on the substrate 11. After forming the wiring 15,
The substrate 11 is cut into a predetermined support beam shape, and then the first connection pad 16 for head connection in the pair of thin film conductor wirings 15 on the cut out support beam and the connection terminal on the back surface of the head slider 19 are bonded by soldering. You can do it like this.

[0020]

Effects of the Invention As is clear from the above description, the method of manufacturing a magnetic head support mechanism according to the present invention eliminates the influence of the rigidity of the lead wires and the risk of breakage, and the function of the gimbal can be improved. It has the excellent advantage of being able to efficiently and easily obtain a small and lightweight magnetic head support mechanism that also functions as a small and lightweight magnetic head support mechanism. This makes it possible to improve durability and reliability.

[0021] Furthermore, this manufacturing method enables efficient manufacturing of a large number of magnetic head support mechanisms at once, etc.
This is extremely advantageous in practice.

[Brief explanation of the drawing]

FIG. 1 is a perspective view for explaining a method of manufacturing a magnetic head support mechanism of the present invention.

FIG. 2 is a perspective view for sequentially explaining one embodiment of a method for manufacturing a magnetic head support mechanism of the present invention.

FIG. 3 is a perspective view for explaining an embodiment following FIG. 2 of the method for manufacturing a magnetic head support mechanism of the present invention.

FIG. 4 is a side view of a main part for explaining an example of a conventional magnetic head support mechanism.

FIG. 5 is a rear view for explaining a gimbal in a conventional magnetic head support mechanism.

[Explanation of symbols]

11 Board
12 Metal thin plate 13
Insulating film
14 Conductor thin film 15 Thin film conductor wiring
16 1st
Connection pad 17 Second connection pad
18 Thin film magnetic head 19 Head slider
20 Support beam part

Claims (4)

[Claims] 1. In a method for manufacturing a support mechanism for supporting a head slider (19) attached with a magnetic head (18) by a load support beam, an insulating surface of a substrate (11) is provided with:
A conductor thin film (14) is deposited and the conductor thin film (14) is patterned to form a thin film conductor wiring (15) having connection parts at both ends.
), one connection part of the thin film conductor wiring (15) is connected to a first connection pad (16) for connecting the head, and the other connection part is connected to a second connection pad (17) for drawing out a lead wire.
a step of adhesively fixing connection terminals of a magnetic head (18) provided on the back surface of the head slider (19) to the first connection pad (16) for connecting the head; 19) Cutting out a substrate (11) to which is fixed a substrate (11) into the shape of the load support beam. 2. In a method of manufacturing a support mechanism for supporting a head slider (19) attached with a magnetic head (18) by a load support beam, the insulating surface of the substrate (11) is provided with:
A conductor thin film (14) is deposited and the conductor thin film (14) is patterned to form a thin film conductor wiring (15) having connection parts at both ends.
), one connection part of the thin film conductor wiring (15) is connected to a first connection pad (16) for connecting the head, and the other connection part is connected to a second connection pad (17) for drawing out a lead wire.
forming the first and second connection pads (16
, 17) on which a thin film conductor wiring (15) is formed is cut into the shape of the load support beam, and a first connection pad for head connection on the support beam shape substrate. (16), the head slider (
19) A method for manufacturing a magnetic head support mechanism, comprising the step of adhesively fixing connection terminals of a magnetic head (18) provided on the back surface of the magnetic head (18). 3. The magnetic head support mechanism according to claim 1, wherein the substrate (11) is made of a thin metal plate or a thin silicon plate whose at least one side is covered with an insulating film (13). manufacturing method. 4. The method of manufacturing a magnetic head support mechanism according to claim 1, wherein the substrate (11) is made of a thin plate-like resin substrate or a ceramic substrate.