JPH04171326A - Damping sheet spring - Google Patents
Damping sheet springInfo
- Publication number
- JPH04171326A JPH04171326A JP29390990A JP29390990A JPH04171326A JP H04171326 A JPH04171326 A JP H04171326A JP 29390990 A JP29390990 A JP 29390990A JP 29390990 A JP29390990 A JP 29390990A JP H04171326 A JPH04171326 A JP H04171326A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- damping
- spring
- plate
- viscoelastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000013016 damping Methods 0.000 title claims abstract description 48
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 230000000452 restraining effect Effects 0.000 claims description 12
- 239000003190 viscoelastic substance Substances 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 230000007423 decrease Effects 0.000 abstract description 5
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 abstract description 2
- 229920000515 polycarbonate Polymers 0.000 abstract description 2
- 239000004417 polycarbonate Substances 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、情報機器等に用いられる板ばね装置を構成す
る制振板ばねに関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a damping leaf spring constituting a leaf spring device used in information equipment and the like.
（従来の技術）
情報機器等には、種々の部材を支持又は案内するために
、各種の板ばね装置が取り付けられている。これらの板
ばね装置は、機器の駆動動作の影響を受けて共振しない
ような構造が採用されている。(Prior Art) Various leaf spring devices are attached to information devices and the like in order to support or guide various members. These leaf spring devices have a structure that does not resonate under the influence of the driving operation of the device.
特に、光情報再生装置では、対物レンズの動作を高精度
に制御することが要求される。この対物レンズ駆動装置
においては、１乃至２ｋＨｚ付近の共振を十分に抑制す
る必要があるため、これに通常タイプの板ばねを用いる
ことはできない。In particular, optical information reproducing devices require highly accurate control of the operation of the objective lens. In this objective lens driving device, it is necessary to sufficiently suppress resonance in the vicinity of 1 to 2 kHz, so a normal type leaf spring cannot be used for this purpose.
このため、第５図に示すように、従来の板ばね装置に−
は、粘弾性物質３を１対の金属板２の間に挿入し、粘弾
性物質３で振動を吸収することにより、制振特性を高め
た制振板ばね１が用いられている。For this reason, as shown in FIG.
In this example, a vibration damping plate spring 1 is used in which a viscoelastic material 3 is inserted between a pair of metal plates 2 and the vibrations are absorbed by the viscoelastic material 3, thereby improving vibration damping characteristics.
（発明が解決しようとする課題）
しかしながら、従来の制振板ばねにおいては、常温の使
用条件で設計されているために、環境温度が変化した場
合に、例えば、低温域では十分な制振効果が発揮されな
い。これは、粘弾性物質の減衰定数が温度依存性を有す
るため、低温域では粘弾性物質の振動吸収性能が低下す
ることに起因する。(Problem to be solved by the invention) However, since conventional vibration damping leaf springs are designed for use at room temperature, when the environmental temperature changes, for example, the damping effect is insufficient in low temperature ranges. is not demonstrated. This is because the damping constant of the viscoelastic material has temperature dependence, so the vibration absorption performance of the viscoelastic material decreases in a low temperature range.
本発明は、かかる事情に鑑みてなされたものであって、
使用環境の温度変化に伴う制振効果の変動が少ない制振
板ばねを提供することを目的とする。The present invention has been made in view of such circumstances, and
It is an object of the present invention to provide a damping leaf spring whose damping effect is less likely to fluctuate due to temperature changes in the environment in which it is used.
［発明の構成］
（課題を解決するための手段）
本発明に係る制振板ばねは、金属製の弾性板部祠と、樹
脂製の拘束板部口と、前記弾性板部祠および前記拘束板
部材の間に挿入された粘弾性部材と、を有することを特
徴とする。[Structure of the Invention] (Means for Solving the Problems) A damping plate spring according to the present invention includes a metal elastic plate portion, a resin restraining plate opening, the elastic plate portion and the restraining plate portion. A viscoelastic member inserted between the plate members.
（作用）
本発明に係る１、１１振板ばねにおいては、低温域では
粘弾性部材の減衰定数が低下するが、樹脂製の拘束板部
材の減衰定数が逆に向上し、粘弾性部材の減衰定数の低
下が補償されるので、低温域を常温域と比較した場合に
、ばね全体の減衰定数は実質的に変動しなくなる。(Function) In the 1, 11 diaphragm spring according to the present invention, the damping constant of the viscoelastic member decreases in the low temperature range, but the damping constant of the resin restraining plate member increases, and the damping of the viscoelastic member Since the decrease in constant is compensated for, the damping constant of the entire spring does not substantially change when comparing the low temperature range with the normal temperature range.
（実施例）
以下、添付の図面を参照しながら、本発明の実施例につ
いて具体的に説明する。(Example) Hereinafter, examples of the present invention will be specifically described with reference to the accompanying drawings.
第１図は本発明の第１実施例に係る制振板ばねを示す横
断面図、第２図はその斜視図である。制振板ばね１１は
、粘弾性部材１３が弾性板１２および拘束板１４の間に
挿入・接着された１−層構造をなしている。弾性板１２
には、厚さ数百ミクロンのステンレス鋼板又はベリリウ
ム銅板で形成された金属板ばねを用いる。粘弾性部材１
３には、厚さ数百ミクロンのシリコーン系のゴム、ブチ
ル系のゴム、又はアクリル系の粘弾性物質を用いる。FIG. 1 is a cross-sectional view showing a damping leaf spring according to a first embodiment of the present invention, and FIG. 2 is a perspective view thereof. The damping plate spring 11 has a one-layer structure in which a viscoelastic member 13 is inserted and bonded between an elastic plate 12 and a restraining plate 14. Elastic plate 12
A metal plate spring made of a stainless steel plate or a beryllium copper plate with a thickness of several hundred microns is used for this purpose. Viscoelastic member 1
For No. 3, silicone rubber, butyl rubber, or acrylic viscoelastic material with a thickness of several hundred microns is used.
拘束板１４には、１νさ数百ミクロンのポリカーボネー
ト、ポリアミド、又はポリイミド等の樹脂を用いる。The restraining plate 14 is made of a resin such as polycarbonate, polyamide, or polyimide with a diameter of 1v and several hundred microns.
このような制振板ばね１１は、振動が伝達されると、粘
弾性部材１３の振動吸収ｆ′］用により、常温において
は従来の制振板ばねと同様に十分な制振効果を得ること
ができる。一方、低温域においては、粘弾性部材１３の
減衰定数が低下するが、これとは逆に拘束板１４の減衰
定数が上昇するので、ばね全体としての減衰定数は実質
的にほとんど変動しない。すなわち、低温になると、樹
脂は硬度を増すため、拘束板〕４の曲げ剛性がトガし、
拘束力を増す。このため、粘弾性部材１３の歪みが大き
くなり、粘弾性部材１３内におけるエネルギ吸収の割合
を増加させることができる。このように、粘弾性部材１
３の欠点である低温状態における制振効果の低下を、拘
束板１４の硬度変化によりエネルギ散逸量の終息を維持
するので、制振板ばねとしての温度変化による減衰定数
の変化率を低減することができる。When vibration is transmitted, such a vibration damping leaf spring 11 can obtain sufficient vibration damping effect at room temperature like a conventional vibration damping leaf spring by absorbing the vibration f' of the viscoelastic member 13. I can do it. On the other hand, in a low temperature range, the damping constant of the viscoelastic member 13 decreases, but on the contrary, the damping constant of the restraining plate 14 increases, so that the damping constant of the spring as a whole does not substantially change. In other words, when the temperature becomes low, the hardness of the resin increases, so the bending rigidity of the restraint plate 4 increases,
Increase restraint. Therefore, the distortion of the viscoelastic member 13 becomes large, and the rate of energy absorption within the viscoelastic member 13 can be increased. In this way, the viscoelastic member 1
3, the reduction in the damping effect in low temperature conditions can be avoided by maintaining the end of the amount of energy dissipation by changing the hardness of the restraining plate 14, thereby reducing the rate of change in the damping constant due to temperature changes as a damping plate spring. I can do it.
次に、第３図を参照しながら、第２の実施例について説
明する。なお、この第２の実施例が上記第１の実施例と
共通する部分の説明は省略する。Next, a second embodiment will be described with reference to FIG. Note that a description of the parts that this second embodiment has in common with the first embodiment will be omitted.
第２の実施例の制振板ばね２１は、弾性板２２の片面側
に二層の粘弾性部材２３を設けている。The damping plate spring 21 of the second embodiment has a two-layer viscoelastic member 23 on one side of an elastic plate 22.
すなわち、第１層の粘弾性部材２３は金属製弾性板２２
と第１の樹脂製拘束板２４との間に挿入・接着され、第
２層の粘弾性部材２３は第１の樹脂製拘束板２４と第２
の樹脂製拘束板２４との間に挿入・接着されている。That is, the first layer of viscoelastic member 23 is made of metal elastic plate 22.
and the first resin restraint plate 24 and the second layer viscoelastic member 23 is inserted between the first resin restraint plate 24 and the second resin restraint plate 24.
It is inserted and bonded between the resin restraining plate 24 and the resin restraining plate 24 .
このような制振板ばね２１によれば、粘弾性部材２１つ
及び拘束板２４からなる複数のラミネート層を設けるこ
とにより、ばね全体の減衰定数を大きくすることができ
る。According to such a damping plate spring 21, by providing a plurality of laminate layers each consisting of the viscoelastic member 21 and the restraint plate 24, the damping constant of the entire spring can be increased.
次に、第４図を参照しながら、第３の実施例について説
明する。なお、この第３の実施例が上記第１の実施例と
共通する部分の説明は省略する。Next, a third embodiment will be described with reference to FIG. Note that a description of the parts that this third embodiment has in common with the first embodiment will be omitted.
第３の実施例の制振板ばね３１は、弾性板３２の両面に
それぞれ粘弾性部材３３を設けている。In the damping plate spring 31 of the third embodiment, viscoelastic members 33 are provided on both sides of an elastic plate 32, respectively.
すなわち、各粘弾性部材３３は、金属製弾性板３２と樹
脂製拘束板３４との間にそれぞれ挿入・接着されている
。That is, each viscoelastic member 33 is inserted and bonded between the metal elastic plate 32 and the resin restraint plate 34, respectively.
このような１．す振板ばね３１は、」−２第２実施例の
制振板ばね２１と同様に、ばね全体の減衰定数を大きく
することができる。1 like this. The damping plate spring 31 can increase the damping constant of the entire spring, similarly to the damping plate spring 21 of the second embodiment.
また、制振板ばね３１は表裏面対称の構造であるため、
剪断打ち抜き加Ｊをいずれの面の側からも行うことがで
き、打ち抜き面の間違い１１故を無くすことができるの
で、歩留まり向上を図ることができる。In addition, since the damping plate spring 31 has a symmetrical structure on the front and back,
Shearing punching can be performed from either side, and errors in punching surfaces can be eliminated, so yields can be improved.
［発明の効果］
本発明によれば、拘束板部口を樹脂製とすることにより
粘弾性物質の減衰定数の低−トが補償されるので、使用
環境の温度変化に伴う減衰定数の変動が少ない制振板ば
ねを提供することができる。[Effects of the Invention] According to the present invention, the low damping constant of the viscoelastic material is compensated for by making the restraining plate opening made of resin, so that fluctuations in the damping constant due to temperature changes in the usage environment can be avoided. It is possible to provide fewer damping leaf springs.
第１図は本発明の第１実施例に係る制振板ばねを示す横
断面図、第２図は第１実施例の制振板ばねの斜視図、第
３図は第２実施例の制振板ばねの横断面図、第４図は第
３実施例の制振板ばねの横断面図、第５図は従来の制振
板ばねの横断面図である。
１．１．２１．３１・・・制振板ばね、１２．２２．３
２・・・弾性板、１３，２３．３３・・・粘弾性部材、
１４．２４．３４・・・拘束板
出願人代理人 弁理−士 鈴江武彦
第２図FIG. 1 is a cross-sectional view showing a damping leaf spring according to a first embodiment of the present invention, FIG. 2 is a perspective view of the damping leaf spring of the first embodiment, and FIG. 3 is a damping leaf spring of the second embodiment. FIG. 4 is a cross-sectional view of a vibration-damping leaf spring of the third embodiment, and FIG. 5 is a cross-sectional view of a conventional vibration-damping leaf spring. 1.1.21.31... Damping plate spring, 12.22.3
2...Elastic plate, 13,23.33...Viscoelastic member,
14.24.34...Restriction board Applicant's agent Patent attorney Takehiko Suzue Figure 2
Claims (1)
前記弾性板部材および前記拘束板部材の間に挿入された
粘弾性部材と、を有することを特徴とする制振板ばね。(1) A metal elastic plate member, a resin restraining plate member,
A damping plate spring comprising: a viscoelastic member inserted between the elastic plate member and the restraining plate member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29390990A JPH04171326A (en) | 1990-10-31 | 1990-10-31 | Damping sheet spring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29390990A JPH04171326A (en) | 1990-10-31 | 1990-10-31 | Damping sheet spring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04171326A true JPH04171326A (en) | 1992-06-18 |
Family
ID=17800725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29390990A Pending JPH04171326A (en) | 1990-10-31 | 1990-10-31 | Damping sheet spring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04171326A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6209842B1 (en) | 1998-05-27 | 2001-04-03 | International Business Machines Corporation | Laminated damping device for a carrier |
| US7054150B2 (en) | 2001-08-29 | 2006-05-30 | Xyratex Technology Limited | Mounting for disk drive unit and method of handling |
| US7088541B2 (en) | 2001-08-29 | 2006-08-08 | Xyratex Technology Limited | Mounting for disk drive unit and method of handling |
| JP2008064316A (en) * | 1998-04-01 | 2008-03-21 | Bell Helicopter Textron Inc | Support assembly for rotating shaft |
-
1990
- 1990-10-31 JP JP29390990A patent/JPH04171326A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008064316A (en) * | 1998-04-01 | 2008-03-21 | Bell Helicopter Textron Inc | Support assembly for rotating shaft |
| US6209842B1 (en) | 1998-05-27 | 2001-04-03 | International Business Machines Corporation | Laminated damping device for a carrier |
| US6371433B2 (en) | 1998-05-27 | 2002-04-16 | International Business Machines Corporation | Laminated damping device for a carrier and a method for making the same |
| US7054150B2 (en) | 2001-08-29 | 2006-05-30 | Xyratex Technology Limited | Mounting for disk drive unit and method of handling |
| US7088541B2 (en) | 2001-08-29 | 2006-08-08 | Xyratex Technology Limited | Mounting for disk drive unit and method of handling |
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