JPH04144266A - Manufacture of hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To execute a screening and a function check easily and reliably without a high-cost and complicated exclusive jig by a method wherein a hybrid integrated circuit of the specification of a leadless type organic substrate is temporarily provided with additional areas, each including a clip terminal mounting part. CONSTITUTION:A hybrid integrated circuit board has an IC mounting part substrate 1, on which an IC chip 9 is mounted and clip terminals 3 and IC input/output pads 5 near upper side V-cuts 4 are electrically connected to each other via wiring layers 6 for lead-out use, and terminal part substrates 2a and 2b for measurement use separable by the V-cuts 4 in one surface of the upper side of the substrate 1 and V-cuts 4 in one surface of the lower side of the substrate 1. In the substrates 2a and 2b, pads for screening and function inspection use are led out as pads of a dual-in-line package in addition to the pads 5 of a hybrid integrated circuit device and the reference clip terminals 3 are mounted there by soldering. A screening and a function inspection are conducted using for IC use, the substrate of an non-defective only among IC mounting part substrates is bent using the V-cuts as starting points and the substrates 2a and 2b are cut off to obtain finally the IC mounting part substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a hybrid integrated circuit, and particularly to a hybrid integrated circuit using a leadless type organic substrate.

[Conventional technology]

Hybrid integrated circuits using conventional adhesive-type organic substrates require dedicated probes or sockets for screening and functional testing processes.

Particularly for products using circular or polygonal boards, as shown in Figure 3, it is necessary to simultaneously contact the multiple probe pins 7 of the probe head 8 with extremely narrow pitches to the input/output pads 5 on the front and back sides of the board. However, since organic substrates are more prone to warping and twisting than ordinary ceramic substrates, it is difficult to bring all the probes into contact with the patterns on the substrate, as this may cause poor contact or short circuits between the probes and the input/output pads.

In addition, recent hybrid integrated circuits using organic substrates often use high-performance microcontrollers and memories, so if they are used as bare chips, they must be screened as hybrid integrated circuits.

Furthermore, conventionally, when mounting a ROM bare chip, it is difficult to write data in a post-process, so writing after mounting is rarely performed in a leadless type hybrid integrated circuit using an organic substrate.

[Problem to be solved by the invention]

When manufacturing a hybrid integrated circuit using this conventional leadless type organic substrate, it is often determined that the probe or socket is inoperable due to incomplete contact with the substrate surface during screening and functional testing. In the worst case scenario, it takes time to adjust the position of the probe or socket and the strength of the crimp, and most of the time required for screening and possible inspections is spent on these adjustments.

Furthermore, since it is difficult to reliably write the final data to a ROM bare chip, it has been difficult to realize products that are the same but differ only in ROM data.

[Means to solve the problem]

The method for manufacturing a hybrid integrated circuit of the present invention electrically connects a plurality of electrodes of a semiconductor chip mounting portion on an IC mounting portion substrate and a plurality of lead-out wiring layer ends of a measurement terminal portion substrate provided in the periphery. The mounting portion of the insulating substrate has a lead-out wiring layer to be connected, and a separating processing portion that can be separated into the IC mounting part board and the measurement terminal part board between both ends of the lead-out wiring layer. After mounting the semiconductor chip and testing the semiconductor chip by connecting a test terminal of a test device from the outside to the end of the lead-out wiring layer of the measurement terminal board, the measurement is performed from the separation processing part. The method includes a step of separating a terminal part board for obtaining an IC mounting part board.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) and 1(b) are a top view and a side view of a hybrid integrated circuit board during a manufacturing process, shown for explaining a first embodiment of the present invention.

The hybrid integrated circuit board includes an IC mounting board 1 on which an IC chip 9 is mounted and electrically connected to an IC input/output pad 5 near a V-cut 4 on the upper side through a lead-out wiring layer 6; Measurement terminal board 2a that can be separated by cutting 4 on one side;
2b.

The measurement terminal substrates 2a and 2b are W of the hybrid integrated circuit device.
In addition to the book input/output pads 5, 12 pads for screening and function testing, 21 pads in total, were pulled out as a dual-in package with a pitch of 2.54 mm, and standard clip terminals 3 were attached thereto by soldering.

Then, screening and functional tests are performed using commercially available 2.54 mm IC sockets, and only the good ones are bent down the board using the V-cut 4 as a fulcrum, and the measurement terminal boards 2a and 2b are separated for final inspection. Good product I
A C mounting part substrate 1 is obtained.

As a result, instead of the conventional dedicated probes or sockets that cost more than 5,000 to 6,000 yen per piece, commercially available IC sockets that cost about 5 to 6,000 yen per piece can now be used, and are dedicated for screening or functional testing. Equipment investment cost reduced to 1/10
It is possible to get away with it to a certain degree.

In addition, in this case, it is equivalent to inserting a normal DIP type IC into an IC socket, and the connection between the screening or functional test circuit and the hybrid integrated circuit device is made using the probe pin attached to the probe head 8 as shown in Figure 3. Unlike crimping in Step 7, a secure connection can be achieved with the simple operation of inserting an IC socket in an extremely short time, which greatly reduces the number of man-hours required.

FIG. 2 is a top view of a hybrid integrated circuit board during a step to explain a second embodiment of the present invention. In this embodiment, a ROM is used as the element 9.

As in the first embodiment, the IC mounting part substrate 1a and the measurement terminal part 2c are integrated with the cut 4 in between.

After the assembly is completed, a write signal is applied from the clip terminal 3 to write data into the element 9.

Then, as soon as this is completed, it is separated from the 4 V-cut portions to form the final product.

This has made it possible to easily and reliably write and check data after mounting a bare chip on a ROM terminal, which was difficult in the past.

〔Effect of the invention〕

As explained above, the present invention eliminates the need for expensive and complicated screening, function checking, and ROM data writing by temporarily providing an additional area including a clip terminal intermediary area in a leadless type hybrid integrated circuit using an organic substrate. It has the effect of being easily and reliably carried out without a special jig.

Furthermore, since data can be written easily and reliably after mounting a pair of ROM chips, it is possible to produce a wide variety of products in small quantities with the same configuration but different ROM data.

[Brief explanation of the drawing]

FIGS. 1(a) and 1(b) are top and side views of a hybrid integrated circuit board during the manufacturing process for explaining a first embodiment of the present invention, and FIG. 2 is a second embodiment of the present invention. FIG. 3 is a top view of a substrate for explaining an example of a conventional hybrid integrated circuit manufacturing method. 1.1a...IC mounting part board, 2a-2c...terminal part board for measurement, 3...clip terminal, 4...■cut line, 5...IC input/output pad, 6... - Leading wiring layer, 7... probe pin, 8... probe head, 9... IC chip.

Claims (1)

[Claims] It has a lead-out wiring layer that electrically connects the plurality of electrodes of the semiconductor chip mounting part on the IC-mounting part board and the ends of the plurality of lead-out wiring layers of the measurement terminal part board provided in the periphery, and After mounting the semiconductor chip on the mounting portion of the insulating substrate, which has a separating processing portion that can be separated into the IC mounting portion substrate and the measurement terminal portion substrate between both ends of the lead-out wiring layer, the measurement terminal is mounted on the mounting portion of the insulating substrate. After testing the semiconductor chip by connecting a test terminal of a test device from the outside to the end of the lead-out wiring layer of the component board, the measurement terminal part board is separated from the separation processing part to form an IC mounting part. A method for manufacturing a hybrid integrated circuit, comprising the step of obtaining a substrate.