JPH04116853A - Electronic parts packaging method - Google Patents

Abstract

PURPOSE:To prevent the occurrence of pinholes in a bonding agent by putting a package enclosing electronic parts elements in a closed vessel after caps of the elements are put on their bases, with a bonding agent applied to the adhesive surface of the caps, and heating the package so as to stick the bases and caps to each other. CONSTITUTION:Electronic parts elements l are airtightly enclosed in the cavity 8 of a package 6 in such a state where the cap 3 of each element l is put on the base 2 mounted with electronic parts 14, with a thermosetting adhesive 4 being applied to the adhesive surface of each cap 3. After a plurality of such packages is housed in the housing space 9 of a vessel main body 10 and a lid body 11 is put on the main body 10, the lid body 11 is fixed to the main body 10 with screws 13 so that the vessel 5 can be airtightly sealed. Then the sealed vessel 5 housing the packaged electronic parts 14 is put in a thermosetting tank where the elements l are maintained at the thermosetting temperature of the adhesive 4. Therefore, the occurrence of pinholes in the adhesive can be prevented, because a pressure balance can be maintained between the outside and inside of the package at the time of heating the adhesive.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for hermetically sealing an electronic component within a package constructed by bonding a cap and a base.

"Background Art" When an electronic component element is hermetically sealed in a package having a cavity inside, packaging is conventionally carried out as follows.

First, at room temperature, a cap coated with a thermosetting adhesive such as epoxy resin is placed over a base on which an electronic component element is mounted. Thereafter, the package containing the electronic component element is moved and placed in a thermosetting tank, where the adhesive is heated and cured at a temperature of, for example, 150°C to 200°C, and is placed inside the package consisting of the cap and the base. Sealing electronic component elements.

However, in the step of heating and curing the thermosetting adhesive in a thermosetting tank, the thermosetting adhesive is once softened before hardening, and the air sealed inside the package is thermally expanded. Therefore, as shown in FIG. 2, the pressure inside the package 8 made up of the cap 3 and the base 2 is higher than the outside (in the figure, the magnitude of the pressure is roughly represented by the length of the arrow). ), the air inside tries to escape to the outside, causing pinholes in the adhesive 4, or the cap 3 lifting and tilting due to the internal pressure, causing the thickness of the adhesive 4 to become uneven, causing the adhesive 4 to leak in some parts. There was a problem in that the reliability of manufactured electronic components decreased as the thickness of the electronic components became thinner. Furthermore, misalignment between the cap 3 and the base 2 was likely to occur. These problems are particularly noticeable in packages with large internal cavities, such as LSI packages.

In order to eliminate this drawback, in the past, a holding jig 21 such as a clip was used to attach the cap 3 and base 2 to each electronic component.
The electronic component was placed in a thermosetting bath with the adhesive 4 sandwiched between the electronic parts and a load W applied to the adhesive 4.

[Problems to be Solved by the Invention] However, the conventional method of holding electronic components one by one between holding jigs such as clips and placing them in a thermosetting bath requires a large number of holding jigs. This requires complicated work to attach and remove the presser jig to each package, which requires a large amount of labor and makes it difficult to achieve cost reductions.

The present invention has been made in view of the drawbacks of the conventional examples described above, and its purpose is to prevent pinholes from forming at the adhesive part and lifting of the cap during the heating process of the adhesive by a simple operation. The aim is to prevent this and reduce work effort.

[Means for Solving the Problems] The electronic component packaging method of the present invention includes attaching a cap to a base on which an electronic component element is mounted with an adhesive interposed, and placing the electronic component element inside a package consisting of the base and the cap. After being sealed, the package is delivered into an airtight container that can maintain internal pressure when the temperature rises, the airtight container is hermetically sealed, and the package is heated together with the airtight container to bond the base and cap. It is characterized by allowing

[Operations] In the present invention, after the cap is attached to the base using an adhesive, the package containing the electronic component is placed in a sealed container and heated to adhere the base and the cap. . Therefore, when the sealed container and the package stored inside are heated, the pressure inside the package and the pressure outside (the internal pressure of the sealed container) increase in the same way, and the balance between the pressure inside and outside the package is maintained. This prevents pinholes from forming in the adhesive due to air attempting to escape from the package. Furthermore, the cap does not float or tilt due to internal pressure, and the thickness of the adhesive can be made uniform.

For deer, as the package is simply placed in an airtight container and heated, there is no need for holding jigs such as clips, which greatly reduces work effort compared to methods that use holding jigs. Packaging can be done at low cost.

[Example] Hereinafter, embodiments of the present invention will be described in detail based on FIG.

The package 6 includes a base 2 made of fired ceramic or the like and a cap 3. The base 2 is provided with a surface electrode (not shown), and the upper surface of the base 2 is provided with a surface electrode (not shown).
An electronic component element 1 such as an SI is mounted, and the electronic component element 1 and the surface electrode are bonded with a wire 7. A cap 3 coated with a thermosetting adhesive 4 such as a thermosetting resin is placed on the base 2 on which the electronic component 1 is mounted. An electronic component element 1 is hermetically sealed inside.

As shown in FIG. 1, the airtight container 5 is composed of a container body 10 in which a housing space 9 is formed and a lid 11 for closing the top opening of the container body 10. An airtight material 12 such as an O-ring for airtightly sealing between the container body 10 and the lid 11 is provided around the periphery. The lid 11 is attached to the container body 10 by screws 13.
It is removably fixed to. This airtight container 5 has enough rigidity and heat resistance to isolate the internal pressure PC from the external pressure (atmospheric pressure) and maintain the internal pressure Pc when the temperature rises, and is made of, for example, a ceramic material. It can be made of metal material.

Therefore, in the heat curing process of the thermosetting adhesive 4, the cap 3 is attached to the base 2 via the thermosetting adhesive 4.
A plurality of packages 6 attached to the container body 10
The lid 11 is placed on the container body 10, and the lid 11 is fixed to the container body 10 by tightening the screws 13, thereby airtightly sealing the inside of the airtight container 5. In this way, the sealed container 5 containing the packaged electronic components 14 is placed inside a thermosetting tank (not shown), where the adhesive 4 is heated to a curing temperature (e.g.
50-200°C). In the package 6, the cap 3 and the base 2 are bonded to each other by heat curing of the adhesive 4, and the electronic component element 1 is hermetically sealed within the cavity 8.

In this heating process of the adhesive 4, the internal pressure P2 and the external pressure (internal pressure of the sealed container 5) Po of the package 6 increase in the same way as the temperature inside the thermosetting tank increases, and therefore the inside and outside of the package 6 There is no pressure difference.

Therefore, it is possible to prevent pinholes from forming in the adhesive 4 due to pressure differences between the inside and outside of the package 6, and highly reliable sealing can be achieved. Also, cap 3 of package θ
It is also prevented from floating up.

Further, the closed container 5 may be provided with a closable valve 15, as shown in FIG. Due to the uneven temperature distribution in the thermosetting tank immediately after the start of heating, the internal pressure P partially changes to the external pressure P. If the size is larger and there is a risk of pinholes etc. occurring in the adhesive 4, first inject, for example, N2 gas into the closed container 5 from the valve 15,
External pressure P. By setting the pressure slightly higher than the atmospheric pressure, the occurrence of pinholes etc. in such a case can be easily avoided.

Note that the material and shape of the package are not limited to those shown in the above embodiments; for example, a lid-like cap may be glued onto a container-like base to seal the electronic component inside the package. But that's fine. In addition, as an adhesive,
In addition to the thermosetting resin, a highly airtight substance such as glass paste may be used.

[Effects of the Invention] According to the present invention, when the package is placed in a thermosetting bath and the adhesive is heated, the balance between the pressure inside and outside the package can be maintained. This prevents pinholes from forming in the adhesive due to the air inside the package trying to escape to the outside, and also prevents the cap from floating and tilting due to internal pressure, resulting in uneven thickness of the adhesive. be able to.

Therefore, the reliability of the packaged electronic component can be improved, and lifting of the cap and misalignment between the cap and the base can be prevented, and the yield rate during manufacturing can be improved.

Moreover, since the adhesive is simply heated while the electronic components are housed in a sealed container, it is possible to prevent the occurrence of pinholes etc. with a simple operation. This method eliminates the need for tools, reduces manufacturing costs for electronic components, and significantly reduces work capacity compared to conventional methods that use clips or the like.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing one embodiment of the present invention, FIG. 2 is an explanatory view illustrating drawbacks of the conventional packaging method, and FIG. 3 is a sectional view illustrating another conventional example. 1...Electronic component element 2...Base 3...Cap 4...Adhesive 5...Sealed container Patent applicant Murata Manufacturing Co., Ltd. Representative Patent attorney Masafusa Nakano

Claims (1)

[Claims] (1) After attaching a cap to the base on which the electronic component element is mounted using an adhesive, and enclosing the electronic component element in a package consisting of the base and cap, the electronic component element is placed inside a sealed container that can maintain internal pressure when the temperature rises. A method of packaging electronic components, comprising: delivering the package to a container, airtightly sealing the container, and heating the package together with the container to bond the base and the cap.