JPH0399457A - Lsi cooling device - Google Patents
Lsi cooling deviceInfo
- Publication number
- JPH0399457A JPH0399457A JP23676289A JP23676289A JPH0399457A JP H0399457 A JPH0399457 A JP H0399457A JP 23676289 A JP23676289 A JP 23676289A JP 23676289 A JP23676289 A JP 23676289A JP H0399457 A JPH0399457 A JP H0399457A
- Authority
- JP
- Japan
- Prior art keywords
- air
- exhaust
- lsi
- cover
- vent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 17
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子回路基盤上のＬＳＩ を冷却する冷却装置
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling device for cooling an LSI on an electronic circuit board.
従来、電子回路基盤を集積した、例えばパーソナル・コ
ンピュータのようなシステムにおいて、電子回路基盤上
のＬＳＩを冷却するには、パーソナル・コンピュータの
側面、前面、後面、上板、底板のいずれかにシステム内
部の空気を排気する電動ファンを１個ないし複数固有し
、電動ファンによりコンピュータ内の排気を行い、電動
ファン設置以外の面より外気を取り入れてシステム全体
の冷却を行うようになっていた。Conventionally, in a system such as a personal computer in which an electronic circuit board is integrated, in order to cool the LSI on the electronic circuit board, a system is installed on the side, front, rear, top, or bottom board of the personal computer. One or more electric fans are installed to exhaust the air inside the computer, and the electric fan exhausts the air inside the computer, and the entire system is cooled by drawing in outside air from a surface other than the one where the electric fan is installed.
【５！明が解決しようとする課題〕
しかしながら、高密度な電子回路やシステム全体の小型
、高性能化により電動ファンによる排気では回路基盤の
配置や基盤上のＬＳＩの配置場所によってシステム内に
おける冷却用空気の流れを均一にすることが容易でなく
、冷却にむらが生じるという欠点がある。そのため、Ｌ
ＳＩより発生した熱がその付近に滞留し、ＬＳＩが高熱
にさらされ、そのためＬＳＩの誤動作・破壊によるシス
テムの信頼性を低下させる可能性があった。[5! However, due to high-density electronic circuits and the miniaturization and performance of the entire system, when exhausting with an electric fan, the amount of cooling air within the system depends on the layout of the circuit board and the location of the LSI on the board. There is a drawback that it is difficult to make the flow uniform, resulting in uneven cooling. Therefore, L
The heat generated by the SI stays in the vicinity, exposing the LSI to high heat, which may reduce the reliability of the system due to malfunction or destruction of the LSI.
本発明の目的はこのような従来のシステム全体の冷却に
よる問題点を解決し、ＬＳＩの熱障害によって起こるシ
ステムの信頼性の低下を防ぐＬＳＩ冷却装置を提供する
ことにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an LSI cooling device that solves the problems caused by the conventional cooling of the entire system and prevents a decrease in system reliability caused by thermal failure of the LSI.
前記目的を達成するため、本発明に係るＬＳＩ冷却装置
においては、基盤上に配置された個々のＬＳ■の上面を
被い、且つ１個又は複数個の吸気口及び１個の排気口を
備えたカバーと、前記カバー内を排気口より排気するシ
ステム排気口とを有するものである。In order to achieve the above object, the LSI cooling device according to the present invention covers the upper surface of each LS placed on the board and is provided with one or more intake ports and one exhaust port. and a system exhaust port for evacuating the inside of the cover from the exhaust port.
以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す斜視図、第２図は主要
部を示す拡大図である。FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is an enlarged view showing the main parts.
図において、基盤上の冷却すべきＬＳＩの上面を吸気口
２ａ及び排気口２ｂを備えた冷却用カバー２により個々
に覆い各カバー２の吸気口２ａを吸気用パイプ３ａによ
りエア集配コネクタ４ａにそれぞれ接続する。エア集配
コネクタ４ａはパイプ５ａにより、冷却媒体としての外
気を採り入れるシステム吸気口６に接続しである。In the figure, the upper surface of an LSI on a board to be cooled is individually covered with a cooling cover 2 having an intake port 2a and an exhaust port 2b, and the intake port 2a of each cover 2 is connected to an air collection/distribution connector 4a through an intake pipe 3a. Connecting. The air distribution connector 4a is connected by a pipe 5a to a system intake port 6 that takes in outside air as a cooling medium.
一方、各カバー２の排気口２ｂは排気用パイプ３ｂによ
りエア集配コネクタ４ｂに接続しである。エア集配コネ
クタ４ｂはパイプ５ｂにより、熱をもった媒体を排気す
るシステム排気ロアに接続してあり、システム排気ロア
には排気用電動ファン８が取付けである。On the other hand, the exhaust port 2b of each cover 2 is connected to an air distribution connector 4b through an exhaust pipe 3b. The air distribution connector 4b is connected by a pipe 5b to a system exhaust lower for exhausting hot media, and an electric exhaust fan 8 is attached to the system exhaust lower.
実施例において、冷却用の外気はシステム吸気口６より
流入し、吸気用パイプ５ａを通ってエア集配コネクタ４
ａに入る。エア集配コネクタ４ａから各々のＬＳＩ
１ヘパイブ３ａを通って空気が分流し、ＬＳＩ １を被
う冷却用カバー２内に吸気口２ａを通って入る。発熱し
たＬＳＩ ｌの上面に沿って空気が流れ、それに伴っ
て熱の伝達が起こり、ＬＳＩ １の熱が奪われその結
果、ＬＳＩ １が冷却される。熱せられた空気はカバ
ー２の排気口２ｂにつながれたパイプ３ｂを通って排気
用のエア集配コネクタ４ｂに入る。同様にして各々のＬ
ＳＩ １を冷却した空気はエア集配コネクタ４ｂでま
とめられ、排気用パイプ５ｂを通りシステム排気ロアよ
り排気用電動ファン８によって外部に排出される。In the embodiment, outside air for cooling flows in from the system intake port 6 and passes through the intake pipe 5a to the air distribution connector 4.
Enter a. Each LSI from the air collection/distribution connector 4a
Air flows through the pipe 3a to the LSI 1 and enters the cooling cover 2 that covers the LSI 1 through the intake port 2a. Air flows along the top surface of the LSI 1 which generates heat, and heat transfer occurs accordingly, heat is removed from the LSI 1, and as a result, the LSI 1 is cooled. The heated air passes through a pipe 3b connected to an exhaust port 2b of the cover 2 and enters an air distribution connector 4b for exhaust. Similarly, each L
The air that has cooled the SI 1 is collected by the air distribution connector 4b, passes through the exhaust pipe 5b, and is exhausted to the outside by the exhaust electric fan 8 from the system exhaust lower.
尚、実施例では外部の空気を利用して冷却する例につい
て説明したが、第３図に示すように冷却用カバー２に複
数の吸気口２ａ、 ２ａ・・・を設け、複数の吸気口２
ａ、 ２ａ・・・よりＬＳＩ １の周辺の空気を吸込
んで冷却を行うようにしてもよい。また、第１図のシス
テム排気ロアに排気用電動ファン８を直結してもよい。Incidentally, in the embodiment, an example in which cooling is performed using external air has been described, but as shown in FIG.
Air around the LSI 1 may be sucked in from a, 2a, . . . for cooling. Further, the exhaust electric fan 8 may be directly connected to the system exhaust lower shown in FIG.
以上説明したように本発明によれば、ＬＳＩに発生する
熱を個別に冷却を行い、システムとは別に独立した冷却
を行うことができる。従って、システム内の基盤上に集
中した滞熱箇所は生じなくなり、ＬＳＩの熱障害による
システムの信頼性の低下を防ぐ効果がある。As explained above, according to the present invention, the heat generated in the LSI can be individually cooled, and cooling can be performed independently from the system. Therefore, there will be no concentrated heat accumulation areas on the board within the system, which has the effect of preventing a decrease in system reliability due to thermal failure of the LSI.
第１図は本発明の一実施例を説明する斜視図、第２図は
第１図におけるＬＳＩ部分の拡大側面図、第３図は本発
明の他の実施例におけるＬＳＩ部分の拡大側面図である
。
ｌ・・・ＬＳＩ ２・・・冷却カバー
３ａ、３ｂ・・・吸・排気用パイプ
４ａ、 ４ｂ・・・吸・排気用エア集配コネクタ５ａ、
５ｂ・・・パイプ ６・・・システム吸気ロ
ア・・・システム排気口 ８・・・排気用電動ファ
ンｌ：ムＳｒFIG. 1 is a perspective view illustrating one embodiment of the present invention, FIG. 2 is an enlarged side view of the LSI portion in FIG. 1, and FIG. 3 is an enlarged side view of the LSI portion in another embodiment of the present invention. be. l...LSI 2...Cooling cover 3a, 3b...Suction/exhaust pipes 4a, 4b...Suction/exhaust air collection/distribution connector 5a,
5b... Pipe 6... System intake lower... System exhaust port 8... Exhaust electric fan l: Mu Sr
Claims (1)
且つ１個又は複数個の吸気口及び１個の排気口を備えた
カバーと、前記カバー内を排気口より排気するシステム
排気口とを有することを特徴とするＬＳＩ冷却装置。(1) Covering the top surface of each LSI placed on the board,
An LSI cooling device characterized by having a cover having one or more intake ports and one exhaust port, and a system exhaust port for exhausting the inside of the cover from the exhaust port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23676289A JPH0399457A (en) | 1989-09-12 | 1989-09-12 | Lsi cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23676289A JPH0399457A (en) | 1989-09-12 | 1989-09-12 | Lsi cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0399457A true JPH0399457A (en) | 1991-04-24 |
Family
ID=17005418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23676289A Pending JPH0399457A (en) | 1989-09-12 | 1989-09-12 | Lsi cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0399457A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995025255A1 (en) * | 1992-09-28 | 1995-09-21 | Aavid Engineering, Inc. | Apparatus and method for cooling heat generating electronic components in a cabinet |
-
1989
- 1989-09-12 JP JP23676289A patent/JPH0399457A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995025255A1 (en) * | 1992-09-28 | 1995-09-21 | Aavid Engineering, Inc. | Apparatus and method for cooling heat generating electronic components in a cabinet |
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