JPH0393782U - - Google Patents

Info

Publication number
JPH0393782U
JPH0393782U JP151490U JP151490U JPH0393782U JP H0393782 U JPH0393782 U JP H0393782U JP 151490 U JP151490 U JP 151490U JP 151490 U JP151490 U JP 151490U JP H0393782 U JPH0393782 U JP H0393782U
Authority
JP
Japan
Prior art keywords
power supply
board
supply units
cooling fan
air vertically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP151490U
Other languages
Japanese (ja)
Other versions
JPH082627Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP151490U priority Critical patent/JPH082627Y2/en
Publication of JPH0393782U publication Critical patent/JPH0393782U/ja
Application granted granted Critical
Publication of JPH082627Y2 publication Critical patent/JPH082627Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の実施例を簡略に示す斜視図
、第2図はその電源ユニツト14の構造例を示す
斜視図、第3図は従来の冷却構造を簡略に示す斜
視図である。
FIG. 1 is a perspective view that simply shows an embodiment of this invention, FIG. 2 is a perspective view that shows an example of the structure of the power supply unit 14, and FIG. 3 is a perspective view that simply shows a conventional cooling structure.

Claims (1)

【実用新案登録請求の範囲】 装置筐体内において、電源以外の回路が搭載さ
れたボードが上下に分けられ、それぞれ板面をほ
ぼ垂直として順次対向して並べられ、 これら上下のボード群の間に垂直方向に空気を
送るボード冷却フアンが配され、 複数の電源ユニツトが上下に分けられて配され
、 これら各電源ユニツトは、それぞれ上下が開放
とされたケース内に、板面がほぼ垂直な回路基板
が収容されて構成され、 これら上下の電源ユニツト群の間に垂直方向に
空気を送る電源冷却フアンが配されている半導体
試験装置の冷却構造。
[Claim for Utility Model Registration] Inside the device housing, boards on which circuits other than the power supply are mounted are divided into upper and lower parts, and are arranged facing each other in sequence with the board surfaces almost perpendicular, and between these upper and lower board groups. A board cooling fan that blows air vertically is arranged, and multiple power supply units are arranged in upper and lower sections. Each of these power supply units has a circuit whose board surface is almost vertical, inside a case that is open at the top and bottom. A cooling structure for semiconductor test equipment that houses a board and includes a power supply cooling fan that sends air vertically between upper and lower power supply units.
JP151490U 1990-01-10 1990-01-10 Cooling structure of semiconductor test equipment Expired - Lifetime JPH082627Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP151490U JPH082627Y2 (en) 1990-01-10 1990-01-10 Cooling structure of semiconductor test equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP151490U JPH082627Y2 (en) 1990-01-10 1990-01-10 Cooling structure of semiconductor test equipment

Publications (2)

Publication Number Publication Date
JPH0393782U true JPH0393782U (en) 1991-09-25
JPH082627Y2 JPH082627Y2 (en) 1996-01-29

Family

ID=31505418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP151490U Expired - Lifetime JPH082627Y2 (en) 1990-01-10 1990-01-10 Cooling structure of semiconductor test equipment

Country Status (1)

Country Link
JP (1) JPH082627Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7262961B2 (en) 2005-05-31 2007-08-28 Hironori Motoe Information processing apparatus and method for controlling the same
US7293124B2 (en) 2004-05-31 2007-11-06 Kabushiki Kaisha Toshiba Storage device with parallel interface connector
JP2014048201A (en) * 2012-08-31 2014-03-17 Advantest Corp Electronic component tester
JP2014048202A (en) * 2012-08-31 2014-03-17 Advantest Corp Electronic component tester

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7293124B2 (en) 2004-05-31 2007-11-06 Kabushiki Kaisha Toshiba Storage device with parallel interface connector
US7262961B2 (en) 2005-05-31 2007-08-28 Hironori Motoe Information processing apparatus and method for controlling the same
JP2014048201A (en) * 2012-08-31 2014-03-17 Advantest Corp Electronic component tester
JP2014048202A (en) * 2012-08-31 2014-03-17 Advantest Corp Electronic component tester

Also Published As

Publication number Publication date
JPH082627Y2 (en) 1996-01-29

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term