JPH0393782U - - Google Patents
Info
- Publication number
- JPH0393782U JPH0393782U JP151490U JP151490U JPH0393782U JP H0393782 U JPH0393782 U JP H0393782U JP 151490 U JP151490 U JP 151490U JP 151490 U JP151490 U JP 151490U JP H0393782 U JPH0393782 U JP H0393782U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- board
- supply units
- cooling fan
- air vertically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 1
Description
第1図はこの考案の実施例を簡略に示す斜視図
、第2図はその電源ユニツト14の構造例を示す
斜視図、第3図は従来の冷却構造を簡略に示す斜
視図である。
FIG. 1 is a perspective view that simply shows an embodiment of this invention, FIG. 2 is a perspective view that shows an example of the structure of the power supply unit 14, and FIG. 3 is a perspective view that simply shows a conventional cooling structure.
Claims (1)
れたボードが上下に分けられ、それぞれ板面をほ
ぼ垂直として順次対向して並べられ、 これら上下のボード群の間に垂直方向に空気を
送るボード冷却フアンが配され、 複数の電源ユニツトが上下に分けられて配され
、 これら各電源ユニツトは、それぞれ上下が開放
とされたケース内に、板面がほぼ垂直な回路基板
が収容されて構成され、 これら上下の電源ユニツト群の間に垂直方向に
空気を送る電源冷却フアンが配されている半導体
試験装置の冷却構造。[Claim for Utility Model Registration] Inside the device housing, boards on which circuits other than the power supply are mounted are divided into upper and lower parts, and are arranged facing each other in sequence with the board surfaces almost perpendicular, and between these upper and lower board groups. A board cooling fan that blows air vertically is arranged, and multiple power supply units are arranged in upper and lower sections. Each of these power supply units has a circuit whose board surface is almost vertical, inside a case that is open at the top and bottom. A cooling structure for semiconductor test equipment that houses a board and includes a power supply cooling fan that sends air vertically between upper and lower power supply units.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP151490U JPH082627Y2 (en) | 1990-01-10 | 1990-01-10 | Cooling structure of semiconductor test equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP151490U JPH082627Y2 (en) | 1990-01-10 | 1990-01-10 | Cooling structure of semiconductor test equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0393782U true JPH0393782U (en) | 1991-09-25 |
JPH082627Y2 JPH082627Y2 (en) | 1996-01-29 |
Family
ID=31505418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP151490U Expired - Lifetime JPH082627Y2 (en) | 1990-01-10 | 1990-01-10 | Cooling structure of semiconductor test equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH082627Y2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7262961B2 (en) | 2005-05-31 | 2007-08-28 | Hironori Motoe | Information processing apparatus and method for controlling the same |
US7293124B2 (en) | 2004-05-31 | 2007-11-06 | Kabushiki Kaisha Toshiba | Storage device with parallel interface connector |
JP2014048201A (en) * | 2012-08-31 | 2014-03-17 | Advantest Corp | Electronic component tester |
JP2014048202A (en) * | 2012-08-31 | 2014-03-17 | Advantest Corp | Electronic component tester |
-
1990
- 1990-01-10 JP JP151490U patent/JPH082627Y2/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7293124B2 (en) | 2004-05-31 | 2007-11-06 | Kabushiki Kaisha Toshiba | Storage device with parallel interface connector |
US7262961B2 (en) | 2005-05-31 | 2007-08-28 | Hironori Motoe | Information processing apparatus and method for controlling the same |
JP2014048201A (en) * | 2012-08-31 | 2014-03-17 | Advantest Corp | Electronic component tester |
JP2014048202A (en) * | 2012-08-31 | 2014-03-17 | Advantest Corp | Electronic component tester |
Also Published As
Publication number | Publication date |
---|---|
JPH082627Y2 (en) | 1996-01-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |