JPH0361393U - - Google Patents
Info
- Publication number
- JPH0361393U JPH0361393U JP12214989U JP12214989U JPH0361393U JP H0361393 U JPH0361393 U JP H0361393U JP 12214989 U JP12214989 U JP 12214989U JP 12214989 U JP12214989 U JP 12214989U JP H0361393 U JPH0361393 U JP H0361393U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- electronic component
- shield conductor
- mounting structure
- shielded space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は回路基板の展開図、第３図は箱状に折曲した
回路基板の斜視図、第４図は接続部分の断面図で
ある。第５図は本考案の他の実施例を示す断面図
である。第６図は従来例を示す断面図である。
図面中、４，６，２１……回路基板、５，７，
２２……シールド導体、８……シールド空間、９
……電子部品、１０……切欠部、１２……回路基
板６の舌片部、１５……孔、２４，２５……回路
基板２１を構成する基板、２８……シールド導体
２２のスリツト、２９……コネクタ、３０……シ
ールド導体２２の舌片部である。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a developed view of the circuit board, FIG. 3 is a perspective view of the circuit board bent into a box shape, and FIG. 4 is a sectional view of the connecting portion. FIG. 5 is a sectional view showing another embodiment of the present invention. FIG. 6 is a sectional view showing a conventional example. In the drawings, 4, 6, 21... circuit board, 5, 7,
22... Shield conductor, 8... Shield space, 9
. . . Electronic component, 10 . . . . Connector, 30 . . . A tongue piece portion of the shield conductor 22.
Claims (1)
第１の回路基板上にシールドされた空間部分を形
成する如く接続された第２の回路基板と、いずれ
か一方の回路基板の前記シールドされた空間部分
に臨む面に実装された電子部品と、他方の回路基
板の少なくとも片面に実装された電子部品とから
なる電子部品の実装構造。 (2) 請求項１記載の電子部品の実装構造におい
て、第１の回路基板がシールド導体を有すること
を特徴とする電子部品の実装構造。[Claims for utility model registration] (1) Having a first circuit board and a shield conductor,
a second circuit board connected to the first circuit board to form a shielded space, and an electronic component mounted on a surface of one of the circuit boards facing the shielded space; An electronic component mounting structure comprising an electronic component mounted on at least one side of the other circuit board. (2) The electronic component mounting structure according to claim 1, wherein the first circuit board has a shield conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12214989U JPH0361393U (en) | 1989-10-20 | 1989-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12214989U JPH0361393U (en) | 1989-10-20 | 1989-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361393U true JPH0361393U (en) | 1991-06-17 |
Family
ID=31670163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12214989U Pending JPH0361393U (en) | 1989-10-20 | 1989-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361393U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001225879A (en) * | 2000-02-17 | 2001-08-21 | Crecia Corp | Wet tissue packaging container with improved sealability |
| JP2011077218A (en) * | 2009-09-30 | 2011-04-14 | Nec Corp | Electromagnetic shield, and electronic apparatus |
| JP2014122855A (en) * | 2012-12-21 | 2014-07-03 | Mitsubishi Heavy Ind Ltd | Battery state monitoring device and battery module including the same |
| JP2016514368A (en) * | 2013-03-11 | 2016-05-19 | クアルコム，インコーポレイテッド | Electromagnetic interference enclosure for radio frequency multichip integrated circuit packages |
-
1989
- 1989-10-20 JP JP12214989U patent/JPH0361393U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001225879A (en) * | 2000-02-17 | 2001-08-21 | Crecia Corp | Wet tissue packaging container with improved sealability |
| JP2011077218A (en) * | 2009-09-30 | 2011-04-14 | Nec Corp | Electromagnetic shield, and electronic apparatus |
| JP2014122855A (en) * | 2012-12-21 | 2014-07-03 | Mitsubishi Heavy Ind Ltd | Battery state monitoring device and battery module including the same |
| US9337518B2 (en) | 2012-12-21 | 2016-05-10 | Mitsubishi Heavy Industries, Ltd. | Battery state monitoring device and battery module having the same |
| JP2016514368A (en) * | 2013-03-11 | 2016-05-19 | クアルコム，インコーポレイテッド | Electromagnetic interference enclosure for radio frequency multichip integrated circuit packages |