JPH03289194A - Manufacture of multilayer circuit board - Google Patents
Manufacture of multilayer circuit boardInfo
- Publication number
- JPH03289194A JPH03289194A JP9042290A JP9042290A JPH03289194A JP H03289194 A JPH03289194 A JP H03289194A JP 9042290 A JP9042290 A JP 9042290A JP 9042290 A JP9042290 A JP 9042290A JP H03289194 A JPH03289194 A JP H03289194A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- board
- holes
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 37
- 239000000853 adhesive Substances 0.000 claims abstract description 26
- 230000001070 adhesive effect Effects 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 abstract description 3
- 230000008018 melting Effects 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 16
- 239000011888 foil Substances 0.000 description 10
- 238000007747 plating Methods 0.000 description 7
- 238000007772 electroless plating Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業−にの利用分野〕 この発１１は多層配線基板の製造方法に関する。[Detailed description of the invention] [Industrial field of use] This issue 11 relates to a method for manufacturing a multilayer wiring board.
［従来の技術］
従来、４層構造の多層配線基板は、以下のようにして製
造されている。まず、両面配線載板を形成する。すなわ
ち、絶縁性フィルムの上下面に銅等の金属箔を！１１肝
して、所定箇所に上下に貫通するスルーホールを形成す
る。このスルーホールの内面および金属箔の上下面に無
電解ノー２キを施して上下に４辿する金Ｊｉ！肘を形成
する。そして、金底層をフォトリングラフィ技術により
エツチングして、絶縁性フィルムの上下面に配線リード
を形成することにより、両面配線基板を形成する。次に
、この両面配線基板を用いて４層構造の多層配線基板を
形成する。この場合には、まず、両面配線基板の上下面
にプリプレグ（半硬化状態の絶縁シート）を設け、この
上下の各プリプレグの表面に再び銅等の金属箔を積層し
た上、その所定箇所にプレス加工やドリル加工等により
上下に貫通する貫通孔を形成する。しかる後、無電解メ
ツキを施して貫通孔の内面に導電層を形成した上、上下
の金属箔をエツチングして外部の配線リードを形成する
。これにより、内部の配線リードと外部の配線リードが
所定箇所で接続された４層構造の多層配線基板が形成さ
れる。[Prior Art] Conventionally, a multilayer wiring board with a four-layer structure has been manufactured as follows. First, a double-sided wiring board is formed. In other words, put metal foil such as copper on the top and bottom of the insulating film! Step 11: Form through-holes that penetrate vertically at predetermined locations. Apply electroless nozzle to the inner surface of this through hole and the top and bottom surfaces of the metal foil, and trace the top and bottom four times. Form the elbow. Then, the gold bottom layer is etched using photolithography technology to form wiring leads on the upper and lower surfaces of the insulating film, thereby forming a double-sided wiring board. Next, a multilayer wiring board having a four-layer structure is formed using this double-sided wiring board. In this case, first, prepreg (semi-hardened insulating sheets) is provided on the top and bottom surfaces of the double-sided wiring board, and metal foil such as copper is laminated again on the surface of each of the top and bottom prepregs, and then pressed at the specified locations. Through machining, drilling, etc., form a through hole that penetrates vertically. Thereafter, electroless plating is applied to form a conductive layer on the inner surface of the through hole, and the upper and lower metal foils are etched to form external wiring leads. As a result, a multilayer wiring board having a four-layer structure in which internal wiring leads and external wiring leads are connected at predetermined locations is formed.
［発明が解決しようとする課題１
しかしながら、上述した多層配線基板の製造方法では、
絶縁性フィルムの上下面に配線リードが形成された１枚
の両面配線基板の上下面にプリプレグを設け、この上下
の各プリプレグの表面に金属箔を枯治しなければならず
、しかもその後、所定箇所にプレス加工やドリル加工等
で貫通孔を形成した」二、金属箔をエツチングして外部
の配線リードを形成しなければならないため、製造工程
数が多く、製造作業が煩雑で、製造能率が極めて悪く、
製造コストも高くなるという問題がある。[Problem to be Solved by the Invention 1] However, in the method for manufacturing a multilayer wiring board described above,
Prepreg is provided on the upper and lower surfaces of a single double-sided wiring board with wiring leads formed on the upper and lower surfaces of an insulating film, and the metal foil must be dried off on the surface of each of the upper and lower prepregs, and after that, the metal foil must be removed at specified locations. 2. The metal foil must be etched to form the external wiring leads, which requires a large number of manufacturing steps, is complicated, and has extremely low manufacturing efficiency. Bad,
There is also a problem in that the manufacturing cost increases.
４＋ｊに、両面配線基板の上下面にプリプレグを設けた
」ニ、この上下の各プリプレグの表面に金属箔を形成し
ているので、その所定箇所に形成される貫通孔が深くな
るため、無電解メツキによる導電層を貫通孔の内面に確
実に形成することができないという問題もある。4+j, prepregs are provided on the upper and lower surfaces of the double-sided wiring board. 2. Metal foil is formed on the surface of each of the upper and lower prepregs, so the through holes formed at predetermined locations become deep, so electroless There is also the problem that a conductive layer cannot be reliably formed on the inner surface of the through hole by plating.
この発明の目的は、製造工程の簡素化を図り、製造能率
が良く、安価に製造でき、かり導通信頼性の高い多層配
線基板の製造方法を提供することである。An object of the present invention is to provide a method for manufacturing a multilayer wiring board that simplifies the manufacturing process, has good manufacturing efficiency, can be manufactured at low cost, and has high conductivity reliability.
［課題を解決するための手段］
この発明は上述した目的を達成するために、基板ニスル
ーホールを形成し、このスルーホールの内面および前記
基板の表裏面に金属屑を形成しスルーホールな内面を除
いて前記基板の表裏面を部分的に除去してなる配線リー
トを有する第１の配線基板を形成するとともに、この第
１の配線基板のスルーホールと対応する箇所に金属層よ
りなる端子部もしくは内面に金属層が形成されたスルー
ホールを有する第２の配線基板を形成し、第１の配線基
板のスルーホールと対応する箇所に貫通孔が形成された
絶縁性接着シートを第１および第２の配線基板の間に挟
み、かつ前記貫通孔を介して第１の配線ス（板のスルー
ホールと第２の配線基板の金属層もしくはスルーホール
とを対応させて、第１および第２の各配線基板を積層し
、しかる後、前記絶縁性接着シートの貫通孔と対応する
第１の配線基板のスルーホール内および前記貫通孔内に
導電ペーストを充填して、積層された第１および第２の
配線基板を電気的に接続することである。[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention forms a varnished through hole in a substrate, and forms metal scraps on the inner surface of the through hole and on the front and back surfaces of the substrate to form the inner surface of the through hole. A first wiring board having a wiring lead formed by partially removing the front and back surfaces of the board except for Alternatively, a second wiring board having through holes with a metal layer formed on the inner surface is formed, and an insulating adhesive sheet with through holes formed in locations corresponding to the through holes of the first wiring board is attached to the first and second wiring boards. The first wiring board is sandwiched between the two wiring boards, and the first wiring board is inserted through the through hole so that the through hole of the board corresponds to the metal layer or through hole of the second wiring board. Each wiring board is laminated, and then a conductive paste is filled in the through-hole of the first wiring board corresponding to the through-hole of the insulating adhesive sheet and in the through-hole, and the laminated first and This is to electrically connect the two wiring boards.
［作用］ この発ＩＪ＋の作用は次の通りである。[Effect] The action of this IJ+ is as follows.
第１の配線ノ大板と第２の配線基板の間に絶縁性接着シ
ートを挟むとともに、第１の配線基板のスルーホール、
絶縁性接着シートの貫通孔、および第２の配線基板の端
子部もしくはスルーホールを対応させて、第１の配線基
板のスルーホール内およびこれと対応する絶縁性接着シ
ートの貫通孔内に４゛１にペーストを充填するだけで、
精屑された第１および第２の配線２（板を電気的に接続
することができる。したがって、従来のように１枚の両
面配線載板の上下面にプリプレグを設けて金属箔をＭＨ
したり、この後貫通孔を形成してその内面に無電解メツ
キを施したりする必要がないので、製造工程の簡素化を
図ることができ、製造能率が良く、安価に製造でき、し
かも積層された配線基板は絶縁性接着シートの貫通孔内
に充填された導電ペーストにより接続されるので、導通
信頼性が極めて高い。An insulating adhesive sheet is sandwiched between the first large wiring board and the second wiring board, and a through hole in the first wiring board;
The through hole of the insulating adhesive sheet corresponds to the terminal part or through hole of the second wiring board, and a 4. Just fill 1 with paste,
The scraped first and second wiring 2 (boards can be electrically connected. Therefore, as in the past, prepreg is provided on the upper and lower surfaces of one double-sided wiring board and the metal foil is MH
Since there is no need to form through-holes or apply electroless plating to the inner surface of the holes, the manufacturing process can be simplified, the manufacturing efficiency is high, and the manufacturing process can be done at low cost. Since the printed circuit boards are connected by the conductive paste filled in the through holes of the insulating adhesive sheet, the reliability of conduction is extremely high.
［実施例］
以下、第１図および第２図を参照して、この発明の一実
施例を説明する。[Embodiment] An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.
予め、第２図（Ａ）〜（Ｇ）に示すようにして両面配線
基板を製造する。この場合には、まず、第２図（Ａ）に
示すように、絶縁性フィルムｌを用意する。この絶縁性
フィルム１はポリイミド、ポリエステル、ガラスエポキ
シ等の合成樹脂よりなり、シート状に形成されている。In advance, a double-sided wiring board is manufactured as shown in FIGS. 2(A) to 2(G). In this case, first, as shown in FIG. 2(A), an insulating film 1 is prepared. This insulating film 1 is made of synthetic resin such as polyimide, polyester, glass epoxy, etc., and is formed into a sheet shape.
そして、第２図（Ｂ）に示すように、絶縁性フィルムｌ
の所定箇所に上下に貫通するスルーホール２を形成する
。このスルーホール２は、打ち抜き加工、ドリル加工等
によって形成されるほか、金属製の針を突き刺すことに
より形成してもよい０次に、第２図（Ｃ）に示すように
、絶縁性フィルム１の上下面およびスルーホール２の内
面に真空蒸着、スパッタリング、あるいは無電解メツキ
等により金属薄膜３を被着する。この金属薄１１１！！
３は、銅、アルミニウム等の金属よりなり、その厚さは
数百大〜数千五程度に形成される。この後、第２図（Ｄ
）に示すように、金属薄膜３の全表面に電解メツキを施
してメツキ層４を形成する。このメツキ層４は金属薄膜
３と同じ材料が望ましいが、これに限られない、また、
その厚さは数ｇｍ〜数十ｇｍ程度に形成される。これに
より、メツキ層４および金ｙ、薄膜３により２層構造の
金属層５が形成される。この金属屑５はスルーホール２
を通して絶縁性フィルムｌの上下に導通している。次に
、第２図（Ｅ）に示すように、絶縁性フィルム１の上下
面における金属層５の表面にスクリーン印刷またはフォ
トパターニング等の方法によりレジスト層６を形成する
。このレジスト層６はスルーホール２の箇所で互いに対
応して設けられ、後述する配線リード７と同じ位置で同
じ形状に形成される。なお、レジスト層６をスクリーン
印刷により形成する場合には、金属屑５上にスクリーン
を介してレジストを印刷することにより形成する。また
、フォトパターニング法によりレジスト層６を形成する
場合には、金属層５の全表面にフォトレジストを塗布し
、このフォトレジストをフォトマスクを介して露光し現
像することにより形成する。この後、第２図（Ｆ）に示
すように、レジスト層６をマスクとして金属屑５をエツ
チングし、不要な部分を除去する。すなわち、レジスト
層６が形成された絶縁性フィルムｌを、まず、メツキ用
のエツチング液に漬けて、メツキ層４の不要な部分つま
りレジスト層６が形成されていない部分のメツキ層４を
除去し、次いで、金Ｊｉ！膜用のエツチング液に漬けて
、メツキ層４が除去された部分の金属薄膜３を除去する
。最後に、第２図（Ｇ）に示すように、レジスト層６を
除去すると、絶縁性フィルムｌの上下面に金ｒｉ５層５
よりなる配線リード７がパターン形成されるとともに、
スルーホール２と対応する箇所のし下縁には金属層５よ
りなるランド８が形成される。この上下のランド８はス
ルーホール２の内面に設けられた金属Ｗ５５により相互
に導通している。なお、上下の配線リード７は第２図（
Ｇ）においては上下のランド８により相互に接続されて
いるが、必ずしも接続されている必要はない、これによ
り、両面配線基板が形成される。Then, as shown in FIG. 2(B), the insulating film l
A through hole 2 that penetrates vertically is formed at a predetermined location. The through hole 2 may be formed by punching, drilling, etc., or may be formed by piercing the insulating film 1 with a metal needle, as shown in FIG. A thin metal film 3 is deposited on the upper and lower surfaces of the through hole 2 and the inner surface of the through hole 2 by vacuum deposition, sputtering, electroless plating, or the like. This metal thin 111! !
3 is made of metal such as copper or aluminum, and has a thickness of about several hundred to several thousand or so. After this, Figure 2 (D
), the entire surface of the metal thin film 3 is electrolytically plated to form a plating layer 4. This plating layer 4 is preferably made of the same material as the metal thin film 3, but is not limited to this, and
The thickness thereof is approximately several gm to several tens of gm. As a result, a metal layer 5 having a two-layer structure is formed by the plating layer 4, the gold y, and the thin film 3. This metal scrap 5 is the through hole 2
Conductivity is provided between the top and bottom of the insulating film l through the insulating film l. Next, as shown in FIG. 2(E), a resist layer 6 is formed on the surface of the metal layer 5 on the upper and lower surfaces of the insulating film 1 by a method such as screen printing or photo patterning. The resist layers 6 are provided corresponding to each other at the locations of the through holes 2, and are formed in the same shape and at the same positions as wiring leads 7, which will be described later. In addition, when forming the resist layer 6 by screen printing, it is formed by printing a resist on the metal scrap 5 through a screen. When the resist layer 6 is formed by a photopatterning method, a photoresist is applied to the entire surface of the metal layer 5, and the photoresist is exposed to light through a photomask and developed. Thereafter, as shown in FIG. 2(F), the metal chips 5 are etched using the resist layer 6 as a mask to remove unnecessary portions. That is, the insulating film l on which the resist layer 6 is formed is first immersed in an etching solution for plating to remove unnecessary parts of the plating layer 4, that is, the parts where the resist layer 6 is not formed. , then Kim Ji! The metal thin film 3 is removed from the portion where the plating layer 4 has been removed by immersing it in a film etching solution. Finally, as shown in FIG. 2(G), when the resist layer 6 is removed, a gold RI layer 5 is formed on the upper and lower surfaces of the insulating film l.
The wiring leads 7 are patterned, and
A land 8 made of a metal layer 5 is formed at the lower edge of a portion corresponding to the through hole 2. The upper and lower lands 8 are electrically connected to each other by a metal W55 provided on the inner surface of the through hole 2. The upper and lower wiring leads 7 are shown in Figure 2 (
Although they are connected to each other by the upper and lower lands 8 in G), they do not necessarily need to be connected, thereby forming a double-sided wiring board.
次に、第ｘｌＮ（Ａ）〜（Ｆ）に示すようにして多対配
線基板を形成する。まず、第１図（Ａ）に示すように、
第１の両面配線基板９を用意する。Next, a multi-pair wiring board is formed as shown in xlN(A) to xlN(F). First, as shown in Figure 1 (A),
A first double-sided wiring board 9 is prepared.
この両面配線基板９は、絶縁性フィルム１の上下面に配
線リード７が形成されているとともに、所定箇所にスル
ーホール２が形成され、このスルーホール２の」−下縁
にラント８が相互に導通して設けられている０次に、ｍ
１Ｍ（Ｂ）に示すように、絶縁性接肴シーｈｌｏを用意
する。この絶縁性接置シート１０は低温溶融材料であり
、例えば熱可塑性樹脂よりなる熱溶融型に属するホット
メルト型のものが望ましく、そのＪゾさは５０μｍ程度
に形成されている。また、絶縁性接着シート１０には第
１の両面配線基板９のスルーホール２と対応する箇所に
１′ｊ通孔１１が形成されている。この貫通孔１１の径
はスルーホール２の内面に形成された金属屑５の内径と
同じか、それよりも若干太きく形成されている。なお、
貫通孔１１は後述する熱圧着工程でのつぶれる分を考慮
して、大きく形成しておくことが望ましい。In this double-sided wiring board 9, wiring leads 7 are formed on the upper and lower surfaces of an insulating film 1, and through holes 2 are formed at predetermined locations, and runts 8 are formed at the lower edges of the through holes 2. The 0th order which is provided in conduction, m
As shown in 1M(B), prepare an insulating dressing sheet hlo. The insulating adhesive sheet 10 is made of a low-temperature melting material, preferably a hot-melt type made of thermoplastic resin, and has a J width of about 50 μm. Furthermore, through holes 1'j are formed in the insulating adhesive sheet 10 at locations corresponding to the through holes 2 of the first double-sided wiring board 9. The diameter of the through hole 11 is the same as or slightly larger than the inner diameter of the metal scrap 5 formed on the inner surface of the through hole 2. In addition,
It is desirable to form the through hole 11 large in consideration of the amount of collapse during the thermocompression bonding process described later.
次に、第１図（Ｃ）に示すように、第２の配線基板１２
を用意する。この第２の両面配線基板１２ば第１の両面
配線基板９のスルーホール２と対応する箇所に金属Ｒ５
からなる端子部１３が形成され、第１の両面配線基板９
のスルーホール２と異なる位置にスルーホール１４が形
成され、第１の両面配線基板９と異なる配線に形成され
ている。そして、第１の両面配線基板９の下方に第２の
両面配線基板１２を配置し、この上下の両面配線基板９
．１２の間に絶縁性接着シー）１０を配置する。この場
合には、第１の両面配線基板９のスルーホール２と第２
の両面配線基板１２の端子部１３とを対向させ、かつそ
の対向間に絶縁性接着シートＩＯの貫通孔１１が位置す
るように絶縁性接着シート１０を配置する。Next, as shown in FIG. 1(C), the second wiring board 12
Prepare. This second double-sided wiring board 12 has a metal R5 at a location corresponding to the through hole 2 of the first double-sided wiring board 9.
A terminal portion 13 consisting of the first double-sided wiring board 9 is formed.
A through hole 14 is formed at a different position from the through hole 2, and is formed in a different wiring from the first double-sided wiring board 9. Then, a second double-sided wiring board 12 is arranged below the first double-sided wiring board 9, and the upper and lower double-sided wiring boards 9
．． An insulating adhesive sheet (10) is placed between the two. In this case, the through hole 2 of the first double-sided wiring board 9 and the second
The insulating adhesive sheet 10 is arranged so that the terminal portions 13 of the double-sided wiring board 12 face each other, and the through holes 11 of the insulating adhesive sheet IO are located between the opposing sides.
この後、第１図（Ｄ）に示すように、絶縁性接着シート
１０を介在させて上下の両面配線基板９．１２を熱圧着
する。すると、上下の両面配線基板９．１２は絶縁性接
着シー）１０により相互に接着される。また、：５１の
両面配線基板９のスルーホール２と第２の両面配線基板
１２の端子部１３とは絶縁性接着シートｌｏの貫通孔１
１により連通状態となる。Thereafter, as shown in FIG. 1(D), the upper and lower double-sided wiring boards 9 and 12 are thermocompression bonded with the insulating adhesive sheet 10 interposed therebetween. Then, the upper and lower double-sided wiring boards 9 and 12 are bonded to each other by the insulating adhesive sheet 10. Also, the through holes 2 of the double-sided wiring board 9 of :51 and the terminal portions 13 of the second double-sided wiring board 12 are the through holes 1 of the insulating adhesive sheet lo.
1, it becomes a communication state.
そして、第１図（Ｅ）に示すように、第１の両面配線基
板９のスルーホール２内に導電ペースト１５を充填する
。すると、導電ベース）１５は第１の両面配線基板９の
スルーホール２から絶縁性接着シートｌＯの貫通孔ｌｌ
内にも充填されるので、この貫通孔１１の下に位置する
第２の両面配線基板１２の端子部１３にも被着されるこ
ととなる。これにより、第１の両面配線基板９と第２の
両面配線基板１２とは導電ペースト１５により電気的に
接続される。この場合、導電ペースト１５としては、カ
ーボンインクあるいは半田ペースト等であり、半田ペー
ストを用いた場合には充填した後にリフロー処理を行な
えばよい。最後に、第１図（Ｆ）に示すように、上下の
両面配線基板９．１２の外面にスクリーン印刷等により
ソルダーレジスト１６を設ける。この場合、ソルダーレ
ジスト１６は上下の両面配線基板９．１２のスルーホー
ル２．２の箇所を除いて設ければ、露出した導電ペース
ト１５の部分および露出したランド８を外部接続端子と
して用いることができる。Then, as shown in FIG. 1E, the through holes 2 of the first double-sided wiring board 9 are filled with conductive paste 15. Then, the conductive base 15 connects the through hole 2 of the first double-sided wiring board 9 to the through hole ll of the insulating adhesive sheet lO.
Since it is also filled inside the through hole 11, the terminal portion 13 of the second double-sided wiring board 12 located below the through hole 11 is also covered. Thereby, the first double-sided wiring board 9 and the second double-sided wiring board 12 are electrically connected by the conductive paste 15. In this case, the conductive paste 15 is carbon ink, solder paste, or the like, and if solder paste is used, reflow processing may be performed after filling. Finally, as shown in FIG. 1(F), a solder resist 16 is provided on the outer surface of the upper and lower double-sided wiring boards 9.12 by screen printing or the like. In this case, if the solder resist 16 is provided except for the through holes 2.2 of the upper and lower double-sided wiring boards 9.12, the exposed portions of the conductive paste 15 and the exposed lands 8 can be used as external connection terminals. can.
これにより、４層構造の多層配線基板が形成される。As a result, a multilayer wiring board having a four-layer structure is formed.
このように、上述した多層配線基板の製造方法では、従
来のように１枚の両面配線基板の上下面にプリプレグを
それぞれ設けて金属箔を積層したり、この後貫通孔を形
成してその内面に無電解メツキを施したりする必要がな
く、１枚の絶縁性接着シー）１０を挟んで２つの両面配
ｍ基板９゜１２を積層し、かつ第１の両面配線基板９の
スルーホール２から絶縁性接着シートｌＯの貫通孔１１
内に導電ペースト１５を充填するだけで良いので、製造
工程の簡素化を図ることができ、製造能率が良く、安価
に製造でき、しかも２つの両面配線基板９．１２は導電
ペース）１５によりスルーホール２のランド８と端子部
１３が電気的に接続されるので、導通信頼性が極めて高
いものとなる。In this way, in the method for manufacturing the multilayer wiring board described above, prepregs are provided on the upper and lower surfaces of a single double-sided wiring board and metal foil is laminated thereon as in the conventional method, or through-holes are then formed and the inner surface of the prepreg is laminated. There is no need to electroless plating the two double-sided printed circuit boards 9゜12 with one insulating adhesive sheet 10 in between, and from the through hole 2 of the first double-sided printed circuit board 9. Through hole 11 of insulating adhesive sheet IO
Since it is only necessary to fill the conductive paste 15 inside the inside, the manufacturing process can be simplified, manufacturing efficiency is high, and manufacturing can be done at low cost.Moreover, the two double-sided wiring boards 9 and 12 are connected to each other by the conductive paste 15. Since the land 8 of the hole 2 and the terminal portion 13 are electrically connected, the continuity reliability is extremely high.
なお、この９．１ＪＩは上述した実施例に限定されるも
のではない０例えば、絶縁性接着シートｌｏを挟んで２
つの両面に線基板９．１２を積層する際には、必ずしも
熱圧着により積層する必要はなく、加正するだけで２つ
の両面配線基板８．１２を接着するようにしてもよい。Note that this 9.1JI is not limited to the above-mentioned example. For example, 2
When laminating the wire substrates 9.12 on both sides of the two, it is not necessarily necessary to laminate them by thermocompression bonding, and the two double-sided wiring substrates 8.12 may be bonded together simply by conditioning.
また、両面配線基板８，１２は２つとも全く同じもので
あってもよい。この場合には、絶縁性接着シー）１０の
貫通４１１１を介してスルーホール２，１４同士を対向
させればよい。さらに、両面配線基板８，１２の配線リ
ード７をパターン形成する場合には、エツチング液に情
けるウェットエツチングに限らずドライエツチングによ
りパターン形成してもよい、また、多層配線基板は４屑
構造である必要はなく、３居構造でもよく、また５層構
造以上でもよい。また、絶縁性接置シート１０に設ける
ｒｔ通孔１１はスルーホール２よりも大きく形成しても
よい。Furthermore, the two double-sided wiring boards 8 and 12 may be completely the same. In this case, the through holes 2 and 14 may be opposed to each other via the penetration 4111 of the insulating adhesive sheet 10. Furthermore, when patterning the wiring leads 7 of the double-sided wiring boards 8 and 12, the pattern can be formed not only by wet etching, which is compatible with etching liquid, but also by dry etching. It is not necessary to have a three-layer structure, or a five-layer structure or more. Furthermore, the rt through holes 11 provided in the insulating adhesive sheet 10 may be formed larger than the through holes 2.
［発明の効果］
以上詳細に説明したように、この発明によれｔｆ、第１
の配線基板と第２の配線基板の間に絶縁性接着シートを
挟むとともに、第１の配線基板のスルーホール、絶縁性
接着シートの貫通孔、および第２の配線基板の端子部も
しくはスルーホールを対応させて、第１の配線基板のス
ルーホール内およびこれと対応する絶縁性接着シートの
貫通孔内に導電ペーストを充填するだけで、積層された
第１および第２の配線基板を電気的に接続することがで
きるので、製造工程の簡素化を図ることができ、製造能
率が良く、安価に製造できるとともに、導通信頼性の高
いものを得ることができる。[Effect of the invention] As explained in detail above, according to the present invention, tf, the first
An insulating adhesive sheet is sandwiched between the wiring board and the second wiring board, and the through holes of the first wiring board, the through holes of the insulating adhesive sheet, and the terminals or through holes of the second wiring board are By simply filling the through holes of the first wiring board and the corresponding through holes of the insulating adhesive sheet with conductive paste, the laminated first and second wiring boards can be electrically connected. Since it can be connected, the manufacturing process can be simplified, manufacturing efficiency can be improved, manufacturing can be done at low cost, and a product with high conductivity reliability can be obtained.
の製造工程を示す安部の各断面図である。FIG. 3 is a cross-sectional view of the Abe showing the manufacturing process.
ｌ・・・・・・絶縁性フィルム、２．１４・・・・・・
スルーホール、５・・・・・・金属層、７・・・・・・
配線リード、９・・・・・・第１の両面配線基板、１０
・・・・・・絶縁性接着シート、１１・・・・・・貫通
孔、１２・・・・・・第２の両面配線基板、１３・・・
・・・端子部、１５・・・・・・導電ペースト。l...Insulating film, 2.14...
Through hole, 5...Metal layer, 7...
Wiring lead, 9...First double-sided wiring board, 10
... Insulating adhesive sheet, 11 ... Through hole, 12 ... Second double-sided wiring board, 13 ...
...Terminal part, 15... Conductive paste.
Claims (1)
面および前記基板の表裏面に金属層を形成し、スルーホ
ールの内面を除いて前記基板の表裏面を部分的に除去し
てなる配線リードを有する第１の配線基板を形成する工
程と、 前記第１の配線基板のスルーホールに対応する箇所に金
属層よりなる端子部もしくは内面に金属層が形成された
スルーホールを有する第２の配線基板を形成する工程と
， 前記第１の配線基板のスルーホールと対応する箇所に貫
通孔が形成された絶縁性接着シートを前記第１および第
２の配線基板の間に挟み、かつ前記貫通孔を介して第１
の配線基板のスルーホールと第２の配線基板の金属層も
しくはスルーホールとを対応させて、前記第１および第
２の配線基板を積層する工程と、 前記第１の配線基板のスルーホール内および前記絶縁性
接着シートの貫通孔内に導電ペーストを充填して、積層
された第１および第２の配線基板を電気的に接続する工
程と， からなる多層配線基板の製造方法。[Claims] A through hole is formed in a substrate, a metal layer is formed on the inner surface of the through hole and the front and back surfaces of the substrate, and the front and back surfaces of the substrate are partially removed except for the inner surface of the through hole. forming a first wiring board having a wiring lead made of a metal layer; and having a terminal portion made of a metal layer or a through hole with a metal layer formed on the inner surface at a location corresponding to the through hole of the first wiring board. forming a second wiring board; sandwiching an insulating adhesive sheet with through holes formed in locations corresponding to the through holes of the first wiring board between the first and second wiring boards; and the first through the through hole.
a step of stacking the first and second wiring boards by matching the through holes of the wiring board with the metal layer or the through holes of the second wiring board; A method for manufacturing a multilayer wiring board, comprising the steps of: filling the through holes of the insulating adhesive sheet with a conductive paste to electrically connect the stacked first and second wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9042290A JPH03289194A (en) | 1990-04-06 | 1990-04-06 | Manufacture of multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9042290A JPH03289194A (en) | 1990-04-06 | 1990-04-06 | Manufacture of multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03289194A true JPH03289194A (en) | 1991-12-19 |
Family
ID=13998167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9042290A Pending JPH03289194A (en) | 1990-04-06 | 1990-04-06 | Manufacture of multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03289194A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003023248A (en) * | 2001-07-05 | 2003-01-24 | Nitto Denko Corp | Multilayered flexible wiring circuit board and its manufacturing method |
-
1990
- 1990-04-06 JP JP9042290A patent/JPH03289194A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003023248A (en) * | 2001-07-05 | 2003-01-24 | Nitto Denko Corp | Multilayered flexible wiring circuit board and its manufacturing method |
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