JPH03251416A - Vacuum mold and its molding process - Google Patents

Vacuum mold and its molding process

Info

Publication number
JPH03251416A
JPH03251416A JP4729090A JP4729090A JPH03251416A JP H03251416 A JPH03251416 A JP H03251416A JP 4729090 A JP4729090 A JP 4729090A JP 4729090 A JP4729090 A JP 4729090A JP H03251416 A JPH03251416 A JP H03251416A
Authority
JP
Japan
Prior art keywords
mold
cavity
vacuum
hole
state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4729090A
Other languages
Japanese (ja)
Inventor
Shinji Yamamoto
伸治 山本
Yuji Kihara
木原 勇二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Steel Works Ltd
Original Assignee
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Steel Works Ltd filed Critical Japan Steel Works Ltd
Priority to JP4729090A priority Critical patent/JPH03251416A/en
Publication of JPH03251416A publication Critical patent/JPH03251416A/en
Pending legal-status Critical Current

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  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To obtain the molded object which has high quality and no void, while the evacuated state in mold clamping is perfectly held by achieving the evacuation by way of the through hole formed on a top force. CONSTITUTION:When a bottom force is temporally stopped at the position before the completion of mold clamping, a first transverse sealing part 15 is connected to a first vertical surface 7 of a top force 1. Then, a through hole 9 is positioned inside of the first transverse sealing part 15, and communicates with the cavity 20 formed by each recessed part 6, 10 of each mold 1, 11. The evacuation of the inner part of the cavity 20 is carried out by operating the vacuum pump connected to the through hole 9, and mold clamping is finished by moving the bottom force 11. Since the through hole 9 is positioned between each transverse sealing parts 15 and 16 and is closed, the deaerated state of the cavity 20 and the sprue 2 near vacuum is held, and injection molding is carried out by feeding resin into the cavity from a nozzle 5.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、真空金型及びその成形方法に関し、特に、射
出成形や反応射出成形において、止金型の貫通孔から脱
気することにより、粘度の低い気泡の発生しやすい樹脂
の成形を良好に行うための新規な改良に関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a vacuum mold and a molding method thereof, and in particular, in injection molding and reaction injection molding, by degassing from the through hole of the stopper mold, This invention relates to novel improvements for better molding of resins with low viscosity that tend to generate bubbles.

〔従来の技術〕[Conventional technology]

従来、用いられていたこの種の真空金型及びその成形方
法としては種々あるが、その中で代表的なものについて
述べると、一般に、金型内のエジェクタービンの部分を
利用して脱気し、キャビテイ部内を真空に近い状態とし
ていた。
There are various vacuum molds and molding methods of this type that have been used in the past, but the most typical ones are generally those that utilize the ejector turbine part of the mold to degas. The inside of the cavity was kept in a near-vacuum state.

〔発明が解決しようとする課題] 従東の真空金型及びその成形方法は、以上のように構成
されていたため、次のような課題が存在していた。
[Problems to be Solved by the Invention] Since the Juto vacuum mold and its molding method were configured as described above, the following problems existed.

すなわち、成形時の樹脂材料の粘度か低い場合、金型と
エジェクタービン間に樹脂が流れ込み、この状態で樹脂
材料が同化するために、エジェクタービンと金型のクリ
アランスが殆どなくなり、その結果、キャビティ部内の
真空引きの効果か著しく低下していた。
In other words, if the viscosity of the resin material during molding is low, the resin will flow between the mold and the ejector turbine, and in this state the resin material will be assimilated, resulting in almost no clearance between the ejector turbine and the mold, and as a result, the cavity The effectiveness of the vacuum inside the room had decreased significantly.

従って、特に、粘度の低い樹脂材料の場合には、成形品
の中に気泡が残るボイドが発生ずることになり、歩留ま
りが著しく低くなっていた。
Therefore, especially in the case of a resin material with low viscosity, voids in which air bubbles remain are generated in the molded product, resulting in a significantly low yield.

本発明は、以上のような課題を解決するためになされた
ものて、特に、射出成形や反応射出成形において、上金
型の貫通孔から空気を除去することにより、粘度の低い
気泡の発生しやすい樹脂の成形を良好に行うようにした
真空金型及びその成形方法を提供することを目的とする
The present invention has been made to solve the above-mentioned problems, and in particular, in injection molding and reaction injection molding, by removing air from the through holes of the upper mold, the generation of low-viscosity air bubbles can be prevented. It is an object of the present invention to provide a vacuum mold and a molding method thereof that can easily mold resin.

〔課題を解決するための手段〕[Means to solve the problem]

本発明による真空金型は、上金型と下金型とにより形成
されるキャビデイ部内を真空状態にして、樹脂を前記キ
ャビティ部内に供給するようにした真空金型において、
前記上金型に形成された貫通孔と、前記下金型に形成さ
れたシール部とを備え、前記各金型接り時に形成される
前記キャビティ部を、前記貫通孔を介して真空状態とす
るようにした構成である。
A vacuum mold according to the present invention is a vacuum mold in which a cavity formed by an upper mold and a lower mold is kept in a vacuum state, and resin is supplied into the cavity.
It includes a through hole formed in the upper mold and a seal part formed in the lower mold, and the cavity part formed when each of the molds is joined is brought into a vacuum state through the through hole. This is a configuration designed to do this.

さらに詳細には、前記上金型のノズルタッチ部に設けら
れたシール部を有する構成である。
More specifically, the structure includes a seal portion provided at the nozzle touch portion of the upper mold.

さらに、他の発明である真空金型成形方法は、止金型と
下金型とにより形成されるキャビティ部内を真空状態に
して、樹脂を前記キャビティ部内に供給するようにした
真空金型成形方法において、前記各金型の型締を一時停
止し、この一時停止状態で、前記第1金型に形成された
貫通孔を介して前記キャビティ部内の脱気を行う第1工
程と、前記第1工程終了後、前記各金型を閉じて前記キ
ャビティ部内に樹脂を供給する第2工程とからなる方法
である。
Furthermore, a vacuum mold forming method according to another invention is such that a cavity formed by a stopper mold and a lower mold is evacuated, and resin is supplied into the cavity. a first step of temporarily stopping mold clamping of each of the molds, and deaerating the inside of the cavity through a through hole formed in the first mold in this temporarily stopped state; After the process is completed, the method includes a second process of closing each of the molds and supplying resin into the cavity.

〔作 用〕[For production]

本発明による真空金型及びその成形方法においては、上
金型に貫通孔が形成され、下金型にシール部が形成され
ると共に、上金型のノズルタッチ部にシール部が設けら
れているため、ノズルをノズルタッチ部に接合すること
により、ノズルと上金型とが密6し、この状態、て、型
締を行い、型締め完了の少し手前(数ミリ位)の位置で
一時停止する。
In the vacuum mold and the molding method thereof according to the present invention, a through hole is formed in the upper mold, a seal part is formed in the lower mold, and a seal part is provided in the nozzle touch part of the upper mold. Therefore, by joining the nozzle to the nozzle touch part, the nozzle and the upper mold are tightly connected, and in this state, the mold is clamped, and the mold is temporarily stopped at a position slightly (several millimeters) before mold clamping is completed. do.

各金型間に形成されたキャビティ部内の空気を」1金型
の貫通孔を介して除去(脱気)することによりキャビテ
ィ部内は真空状態となり、脱気完了後、型締めを行う。
The air in the cavity formed between each mold is removed (degassed) through the through hole of one mold, thereby creating a vacuum state in the cavity, and after the degassing is completed, the molds are clamped.

この型締完了の状態で、貫通孔は下金型の各シール部の
間に位置しているため、キャビティ部内の真空状態が保
持され、ノズルからキャビティ部内への樹脂の供給が行
われる。
In this state where the mold clamping is completed, the through holes are located between the seal parts of the lower mold, so the vacuum state within the cavity is maintained, and resin is supplied from the nozzle into the cavity.

その後、保圧、冷却(又は加熱〉の後、各金型を開くこ
とにより、成形品を取り出すことがてきる。
Thereafter, after holding pressure and cooling (or heating), each mold is opened to take out the molded product.

〔実施例〕〔Example〕

以下、図面と共に本発明による真空金型及びその成形方
法の好適な実施例について詳細に説明する。
Hereinafter, preferred embodiments of the vacuum mold and molding method thereof according to the present invention will be described in detail with reference to the drawings.

第1図から第3国連は、本発明による真空金型を示すも
ので、第1図は開状態を示す断面図、第2図は型締一時
停止状態を示す断面図、第3図は型締完了状態を示す断
面図である。
Figures 1 to 3 show the vacuum mold according to the present invention; Figure 1 is a sectional view showing the open state, Figure 2 is a sectional view showing the mold clamping is temporarily stopped, and Figure 3 is the mold. It is a sectional view showing a state in which the tightening is completed.

図において符号1で示されるものは上金型であり、この
上金型1のスプル一部2に連通ずるノズルタッチ部3に
は、シール部4が形成され、このノズルタッチ部3には
、成形機(図示せず)のノズル5が接なして配設されて
いる。
What is indicated by the reference numeral 1 in the figure is an upper mold, and a seal portion 4 is formed in a nozzle touch portion 3 that communicates with the sprue portion 2 of this upper mold 1. A nozzle 5 of a molding machine (not shown) is disposed in contact therewith.

前記上金型]の内部には、前記スプル一部2に連通ずる
第1四部6か形成され、この第1凹部6の壁部6εtに
は、第1垂直面7を有する第1パーティング面8が形成
され、この垂直面7には、水平方向に形成された貫通孔
9が形成されている。
A first fourth part 6 communicating with the sprue part 2 is formed inside the upper mold, and a wall part 6εt of the first recess 6 has a first parting surface having a first vertical surface 7. 8 is formed, and a through hole 9 formed in the horizontal direction is formed in this vertical surface 7.

前記上金型1の下方位置には、前記第1四部6と対応す
る第2四部10を有する下金型11か移動自在に配設さ
れており、この第2四部10と連続して、Jシール部1
2を有する第2パーティング面]3か形成されている。
A lower mold 11 having a second fourth part 10 corresponding to the first four part 6 is movably disposed below the upper mold 1. Seal part 1
A second parting surface having 2] 3 is formed.

前記第2パーディング面13に連続して形成された第2
垂直面14には、互いに垂直方向に離間し、て設けられ
た第1横シール部15及び第2横シール部16が配設さ
れている。
A second padding surface continuously formed on the second padding surface 13.
A first horizontal seal portion 15 and a second horizontal seal portion 16 are provided on the vertical surface 14 and are spaced apart from each other in the vertical direction.

本発明による真空金型は、前述したように構成されてお
り、以下に、その真空成形方法について説明する。
The vacuum mold according to the present invention is constructed as described above, and the vacuum molding method thereof will be explained below.

まず、成形前においては、第1図に示すように、上金型
1と下金型11とは分離されており、ノズル5はノズル
タッチ部3にシール部4を介して密合している。
First, before molding, as shown in FIG. 1, the upper mold 1 and the lower mold 11 are separated, and the nozzle 5 is tightly fitted to the nozzle touch part 3 via the seal part 4. .

次に、第2図に示されるように、型締を行い、型締完了
手前の位置(約数ミリ)て、下金型11を一時停止する
と、第1横シール部15か上金型1の第1垂直面7と接
会し、この時、前記貫通孔9はこの第1横シール部15
よりも内側に位置し、且つ、各金型1,11の各凹部6
.]0によって形成されたキャビティ部20に連通して
いる。
Next, as shown in FIG. 2, when the mold is clamped and the lower mold 11 is temporarily stopped at a position (approximately several millimeters) before the mold clamping is completed, the first horizontal seal portion 15 or the upper mold 1 At this time, the through hole 9 is in contact with the first vertical surface 7 of the first horizontal seal portion 15.
, and each recess 6 of each mold 1, 11
.. ]0 is in communication with the cavity portion 20 formed by.

前述の状態で、貫通孔9に接続した真空ポンプく図示せ
ず)を作動させ、キャヒティ部20内の脱気ずなわち真
空引きを行い、所定時間の脱気が完了した後に、第3図
のように、下金型]1を移動することにより、型締が完
了する。
In the above-mentioned state, the vacuum pump (not shown) connected to the through hole 9 is operated to evacuate the cavity 20, that is, to evacuate it, and after completing the degassing for a predetermined time, the vacuum pump (not shown) connected to the through hole 9 is operated. Mold clamping is completed by moving the lower mold] 1 as shown in FIG.

この型締が完了した状態ては、前記貫通孔9は、前記各
横シール部15,1.6間に位置して閉状態となるため
、キャビティ部20及びスプル一部2の真空に近い脱気
状態が維持され、このキャビティ部20内にノズル5か
ら樹脂を供給することにより、射出成形か行われる。
When this mold clamping is completed, the through hole 9 is located between the horizontal seal portions 15 and 1.6 and is in a closed state, so that the cavity portion 20 and the sprue portion 2 are evacuated to a near vacuum state. Injection molding is performed by supplying resin from the nozzle 5 into the cavity 20 while maintaining the air condition.

その後、周知の保圧、冷却(又は加熱)の後、各金型1
,11を開くことにより、第1図の状態に戻り、成形品
を取り出すことができる。
After that, after well-known pressure holding and cooling (or heating), each mold 1
, 11 to return to the state shown in FIG. 1, and the molded product can be taken out.

次に、本出願人が社内て行った前述の真空成形方法の実
施例について述へる。
Next, an example of the above-mentioned vacuum forming method carried out in-house by the present applicant will be described.

実験例1 型締力800 tonの射出成形機を用いてPΔ66の
成形を行った。成形品は40 cmX 40 clnX
 O,2cI^の平板である。射出圧力600 KH/
c+n2、射出時間4秒、樹脂温度290℃の成形条件
で、第2図に示す型締め手前の距離を5+n+nとして
真空引きを10秒とした。
Experimental Example 1 Molding with PΔ66 was performed using an injection molding machine with a mold clamping force of 800 tons. Molded product is 40 cmX 40 clnX
It is a flat plate of O,2cI^. Injection pressure 600KH/
Under the molding conditions of c+n2, injection time of 4 seconds, and resin temperature of 290° C., the distance before the mold clamping shown in FIG. 2 was set to 5+n+n, and the vacuum was drawn for 10 seconds.

この成形において真空引きの有無の場合の成形品につい
て調査した。真空引き有の場合の成形品は、樹脂の回り
込みもよく、ボイド(空隙部)の発生は全くみられなか
ったが、真空引き無しの通常成形においては、樹脂の回
り込みが不良で特にコーナ一部がガサガザとなった。
In this molding process, molded products with and without vacuum evacuation were investigated. In the case of molded products with vacuum evacuation, the resin wrapped around well and no voids were observed at all, but in normal molding without vacuum evacuation, the resin wrapped around poorly, especially in some corners. became rusty.

実験例2 反応射出成形(RIM)において、エポキシの成形を行
った。成形品は、60 c+nX 60 CIIIX 
0.3cmのものて、この中にガラス繊維の強化材くガ
ラスマット)を4Qu+t%入れたものである。エポキ
シ注入量を180 g / secとし、液温を50〜
70℃、注入圧力を30〜50 Kg7cm2とした。
Experimental Example 2 Epoxy was molded using reaction injection molding (RIM). The molded product is 60 c+nX 60 CIIIX
It is 0.3 cm thick and contains 4 Qu+t% of glass fiber reinforcement (glass mat). The epoxy injection amount was 180 g/sec, and the liquid temperature was 50~
The temperature was 70°C, and the injection pressure was 30-50 Kg7cm2.

又、型締力は40 tonである。第2図に示す真空引
きの時間は15秒とした。
Moreover, the mold clamping force is 40 tons. The evacuation time shown in FIG. 2 was 15 seconds.

真空引きの有無の場合についてRIM成形を行い、その
成形品の調査を行った。真空引き有の場合の成形品断面
、及び表面には、はとんどボイドの発生はみられなかっ
たが、真空引き無しの渇きには、成形品の表面や断面の
一部にボイドの発生がみられた。
RIM molding was performed with and without vacuuming, and the molded products were investigated. When vacuuming was applied, no voids were observed on the cross section or surface of the molded product, but when vacuuming was not performed, voids were observed on the surface or part of the cross section of the molded product. was seen.

〔発明の効果〕〔Effect of the invention〕

本発明による真空金型及びその成形方法は、以上のよう
に構成されているため、次のような効果を得ることがで
きる。
Since the vacuum mold and the molding method thereof according to the present invention are configured as described above, the following effects can be obtained.

すなわち、上金型に形成された貫通孔を介して真空引き
を行うことができるため、型締時における真空引き状態
が完全に確保され、ボイドのない高品質の成形品を得る
ことができた。
In other words, since vacuum can be drawn through the through holes formed in the upper mold, a vacuum state is completely ensured during mold clamping, and a high-quality molded product with no voids can be obtained. .

また、射出成形に限らず、RIM成形のうちの強化材を
入れる5RIN(i造用反応射出成形)においても、ボ
イドの発生を防ぎ、歩留まりのよい成形を行うことがて
きる。
Moreover, not only injection molding but also 5RIN (reaction injection molding for i-building) in which reinforcing materials are added in RIM molding can prevent the generation of voids and can perform molding with a high yield.

【図面の簡単な説明】[Brief explanation of drawings]

第1図から第3国連は、本発明による真空金型を示すも
ので、第1図は開状態を示す断面図、第2図は型締一時
停止状態を示す断面図、第3図は型締完了状態を示す断
面図である。 1は上金型、3はノズルタッチ部、4はシール部、8は
パーティング面、9は貫通孔、11は下金型、15はシ
ール部、20はキャビティ部である。
Figures 1 to 3 show the vacuum mold according to the present invention; Figure 1 is a sectional view showing the open state, Figure 2 is a sectional view showing the mold clamping is temporarily stopped, and Figure 3 is the mold. It is a sectional view showing a state in which the tightening is completed. 1 is an upper mold, 3 is a nozzle touch part, 4 is a seal part, 8 is a parting surface, 9 is a through hole, 11 is a lower mold, 15 is a seal part, and 20 is a cavity part.

Claims (3)

【特許請求の範囲】[Claims] (1)上金型(1)と下金型(11)とにより形成され
るキャビティ部(20)内を真空状態にして、樹脂を前
記キャビティ部(20)内に供給するようにした真空金
型において、 前記上金型(1)に形成された貫通孔(9)と、前記下
金型(11)に形成されたシール部(15)とを備え、
前記各金型(1、11)接合時に形成される前記キャビ
ティ部(20)を、前記貫通孔(9)を介して真空状態
とするように構成したことを特徴とする真空金型。
(1) A vacuum mold in which the inside of the cavity part (20) formed by the upper mold (1) and the lower mold (11) is brought into a vacuum state, and resin is supplied into the cavity part (20). The mold includes a through hole (9) formed in the upper mold (1) and a seal part (15) formed in the lower mold (11),
A vacuum mold characterized in that the cavity portion (20) formed when the molds (1, 11) are joined is brought into a vacuum state through the through hole (9).
(2)前記上金型(1)のノズルタッチ部(3)に設け
られたシール部(4)を有することを特徴とする請求項
1記載の真空金型。
(2) The vacuum mold according to claim 1, further comprising a sealing part (4) provided at the nozzle touch part (3) of the upper mold (1).
(3)上金型(1)と下金型(11)とにより形成され
るキャビティ部(20)内を真空状態にして、樹脂を前
記キャビティ部(20)内に供給するようにした真空金
型成形方法において、 前記各金型(1、11)の型締を一時停止し、この一時
停止状態で、前記第1金型(1)に形成された貫通孔(
9)を介して前記キャビティ部(20)内の脱気を行う
第1工程と、 前記第1工程終了後、前記各金型(1、11)を閉じて
前記キャビティ部(20)内に樹脂を供給する第2工程
とからなることを特徴とする真空金型成形方法。
(3) A vacuum mold which is configured to make the inside of the cavity part (20) formed by the upper mold (1) and the lower mold (11) into a vacuum state and supply resin into the cavity part (20). In the mold forming method, the mold clamping of each of the molds (1, 11) is temporarily stopped, and in this suspended state, the through hole (
a first step of deaerating the inside of the cavity (20) through a step 9), and after the first step, closing each of the molds (1, 11) to fill the cavity (20) with resin. A vacuum mold forming method characterized by comprising a second step of supplying.
JP4729090A 1990-03-01 1990-03-01 Vacuum mold and its molding process Pending JPH03251416A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4729090A JPH03251416A (en) 1990-03-01 1990-03-01 Vacuum mold and its molding process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4729090A JPH03251416A (en) 1990-03-01 1990-03-01 Vacuum mold and its molding process

Publications (1)

Publication Number Publication Date
JPH03251416A true JPH03251416A (en) 1991-11-08

Family

ID=12771155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4729090A Pending JPH03251416A (en) 1990-03-01 1990-03-01 Vacuum mold and its molding process

Country Status (1)

Country Link
JP (1) JPH03251416A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5991041A (en) * 1982-11-16 1984-05-25 Mitsubishi Metal Corp Mold for injection molding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5991041A (en) * 1982-11-16 1984-05-25 Mitsubishi Metal Corp Mold for injection molding

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