JPH0322517A - Semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To prevent occurrence of distortion due to the adhesion of a foreign substance on the rear of a wafer by a method wherein the contact surface of a wafer is finely divided, and each of the divided parts is made tomove independently in vertical direction against the reference surface when necessary. CONSTITUTION:Grooves 2 for vacuum attraction, a wafer 3, split contact surfaces 5, movable point-like contact surfaces 7, the split contact surfaces 5 as an exposure area 8, and movable point-like contact surfaces 7 are formed in a vertically movable state against the reference surface. When a foreign substance 4 is adhered to the wafer 3, the focal distance in h exposure area 8 is measured by the device, and the position of the foreign substance 4 is confirmed by the difference obtained by the above-mentioned measurement. Then, the split contact surface 5, where the foreign substance is located, is pulled down, and the generation of distortion caused by the foreign substance 4 van be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a transfer technology for semiconductor manufacturing processes.

[Conventional technology]

FIGS. 4 and 5 are front views showing an example of a conventional chuck, respectively. Figure ◆ shows concentric grooves for vacuum suction formed on the flat suction surface, and Figure 5 shows dotted contact surfaces to minimize the contact surface with the wafer. In the figure, 12) indicates the contact surface of the square, 12} indicates the groove for vacuum suction, and 61 indicates the dotted contact surface.

Figure 6 shows a state where the wafer is distorted due to foreign matter adhering between the wafer and the suction surface +11.
11 of the chuck in Figure 5 showing the case where there is a bulge
1! It is a partial sectional view of the first plane. In the figure, Il + Pakueha contact surface! 31 (Ij wafer 14) is a foreign object, 16}C is a dotted contact surface, and +81fl is an exposure area.

The next K operation will be explained. The wafer 131 carried by the handler is attracted to the chuck shown in FIG. 4 or 5, and exposed in the groove 1 at the exposure position.

[Problem to be solved by the invention]

Since the conventional device is configured as described above, if a foreign object adheres to the back side of the wafer as shown in Figure 6, the wafer will rub around the wafer, and defocus and reduction fluctuations will cause the image to become unreliable. Rolling is not done. Alternatively, if the surface of the wafer is partially raised as shown in Fig. 7, the vacuum suction cannot be completed and the wafer is exposed as a raised smear, resulting in problems such as inaccurate transfer. there were.

This invention was made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a device that can eliminate the influence of foreign matter even if it adheres, and can also correct the rising of wafers that are not vacuumed. With the goal.

[Means to solve the problem]

In the chuck according to the present invention, the contact surface with the wafer is divided into fine parts, and each of the divided parts can move up and down with respect to the reference surface independently by the required lc5.

[Effect]

The feature of this invention is that when a foreign substance adheres to the surface of the kueha, the contact surface of that part is lowered to prevent the kueha from rising. The flatness of the exposed area is improved by raising the area.

[Implementation row]

Hereinafter, a gold map as an embodiment of the present invention will be described. 1st
FIG. 3 is a front view of the chuck in which the contact surface with the wafer is divided. FIG. 2 is a partial cross-sectional view of a chuck with a movable point contact surface according to another embodiment of the present invention. In the figure, 12) is a groove for vacuum suction, 131r/'i square, +
61ij divided contact surface, 17} is a movable point contact surface, t81
This is a 1dg optical area.

The divided contact surface (6) and the movable point contact surface 17) can be moved up and down with respect to the reference point.

Next, the operation will be explained. As shown in FIG. 8, if a foreign object (41) adheres to the Kueha 131, the device measures the focal length within the exposure area (8), and from the difference, the foreign object 14
1's place [tr check. Next, pull the divided contact surface +61 t-downward of the part where the foreign object {4} is placed, and remove the foreign object +41V.
Prevent attempts by C from occurring.

In Fig. 2, a movable dot-like contact surface 17) will be explained in case of a chuck used.

In this case, although there are few occurrences of foreign matter adhering to the back surface of the wafer (31), due to the heat treatment, some parts of the wafer (1)
3} was distorted, and it could not be vacuum-adsorbed and rose 1
It may be 1. In that case, there will be parts with different focal lengths within the exposure area (8). At this time, too, based on the measurement results of the focal length of the device, a certain movable dot-like contact surface (7) can be raised to cover the entire exposure area (8). flatness can be increased.

The above-mentioned divided contact surface i51 and movable dotted contact surface 17 are placed on the chuck base, and a material that can control expansion and contraction, such as a piezoelectric element, is placed in the lower part, and can be either upper or lower depending on the judgment from the device. move in the direction.

〔Effect of the invention〕

As described above, according to the present invention, the contact surface of the chuck with the wafer can be divided and each part can be operated independently. This prevents distortion caused by foreign matter adhering to the back surface of the wafer. Distortion can also be processed without causing defocussion.

[Brief explanation of drawings]

FIG. 1 is a front view of a chuck according to an embodiment of a semiconductor manufacturing apparatus according to the present invention, and FIG. 8 is a partial cross-sectional view of a chuck according to another embodiment of the present invention.
Fig. 8 is a partial cross-sectional view of the surface of the chuck shown in Fig. 1, showing the case where a foreign object exists between the wafer and the split contact surface, and Fig. 4 and Fig. 5 show the entire structure of the conventional chuck. 6 is a side partial sectional view of the chuck shown in FIG. 4 where there is a foreign object between the wafer and the wafer contact surface, and FIG. 7 is a partial sectional view of the chuck VC shown in FIG. FIG. 3 is a side partial cross-sectional view of the chuck showing a case where the quefer has a partial bulge. In the figure, +21 is the groove for vacuum suction, (31 is Kueha,
141 is a foreign object, {6} is a divided contact surface, (7) is a movable point contact surface, and (8) is an exposure area. In the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] In semiconductor manufacturing equipment used to transfer circuits onto wafers using a stepper, the part of the chuck that vacuum-chucks the wafer that comes into contact with the wafer is divided into small parts, and each part moves up and down independently. Features of semiconductor manufacturing equipment.