JPH03221449A - Metal foil with ultraviolet cured water base resin, and metal coated laminate sheet with ultraviolet cured water base resin, and manufacture thereof and removing method of cured film thereof - Google Patents
Metal foil with ultraviolet cured water base resin, and metal coated laminate sheet with ultraviolet cured water base resin, and manufacture thereof and removing method of cured film thereofInfo
- Publication number
- JPH03221449A JPH03221449A JP1608190A JP1608190A JPH03221449A JP H03221449 A JPH03221449 A JP H03221449A JP 1608190 A JP1608190 A JP 1608190A JP 1608190 A JP1608190 A JP 1608190A JP H03221449 A JPH03221449 A JP H03221449A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- ultraviolet
- metal foil
- water
- cured film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 60
- 239000002184 metal Substances 0.000 title claims abstract description 60
- 239000011888 foil Substances 0.000 title claims abstract description 59
- 229920005989 resin Polymers 0.000 title claims abstract description 46
- 239000011347 resin Substances 0.000 title claims abstract description 46
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000011248 coating agent Substances 0.000 claims abstract description 20
- 238000000576 coating method Methods 0.000 claims abstract description 20
- 239000011889 copper foil Substances 0.000 claims abstract description 17
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000004952 Polyamide Substances 0.000 claims abstract description 7
- 229920002647 polyamide Polymers 0.000 claims abstract description 7
- 239000007864 aqueous solution Substances 0.000 claims description 8
- 239000000243 solution Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 239000012670 alkaline solution Substances 0.000 claims 1
- 239000011260 aqueous acid Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 239000011521 glass Substances 0.000 abstract description 4
- 238000003848 UV Light-Curing Methods 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 238000002845 discoloration Methods 0.000 abstract description 3
- 239000004744 fabric Substances 0.000 abstract description 3
- 239000003999 initiator Substances 0.000 abstract description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052753 mercury Inorganic materials 0.000 abstract description 2
- 239000002585 base Substances 0.000 abstract 2
- 239000003513 alkali Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 abstract 1
- 239000002932 luster Substances 0.000 abstract 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000001723 curing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はプリント回路基板として用いられる金属張積層
板、この金属張積層板に用いられる金属箔及びそれらの
製造法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a metal-clad laminate used as a printed circuit board, a metal foil used in the metal-clad laminate, and a method for manufacturing them.
本発明はまた、これらの金属箔又は金属張積層板の使用
方法に関する。The invention also relates to methods of using these metal foils or metal clad laminates.
［従来の技術］
従来、一般に使用されているプリント配線板用の金属張
積層板の金属箔表面やこれに用いられる金属箔の表面は
、金属箔をエツチングして回路を形成するなどの各工程
において、特に表面を保護するようなことは行われてい
なかった。このため、このような金属箔や金属張積層板
は、金属箔を金属張積層板に加工する際や、金属張積層
板を回路加工する際に、金属箔表面への異物の付着等に
より傷を生じ易いという欠点、変色に起因する不良か発
生するという欠点、また特に薄い金属箔を取扱うときに
箔自体がしわになりやすく折れて不良になるという欠点
を有していた。[Prior Art] Conventionally, the surface of the metal foil of a metal-clad laminate for a commonly used printed wiring board and the surface of the metal foil used therein have been processed through various processes such as etching the metal foil to form a circuit. No special measures were taken to protect the surface. For this reason, such metal foils and metal-clad laminates are susceptible to damage due to foreign matter adhering to the surface of the metal foil when processing metal foil into metal-clad laminates or processing circuits on metal-clad laminates. The metal foil itself has the drawbacks of easily wrinkled and folded, resulting in defects, especially when handling thin metal foils.
従来、金属箔の上にポリプロピレンフィルムを重ねて傷
を防止しようとする試みはなされていたが手間を要する
ばかりで作業性の低下が避けられないという欠点を有し
ていた。Conventionally, attempts have been made to prevent scratches by overlaying a polypropylene film on metal foil, but this has the disadvantage that it is time consuming and inevitably reduces workability.
［発明が解決しようとする課題］
本発明は、金属箔表面の傷、異物付着、変色等を防止で
き、しかも水等により容易に除去することができる樹脂
硬化被膜を有する金属箔及び金属張積層板を提供するこ
とを目的とする。[Problems to be Solved by the Invention] The present invention provides a metal foil and a metal clad laminate having a resin cured coating that can prevent scratches, foreign matter adhesion, discoloration, etc. on the surface of the metal foil, and can be easily removed with water or the like. The purpose is to provide a board.
本発明はまた、上記金属箔及び金属張積層板を容易に製
造することができる製造法を提供することを目的とする
。Another object of the present invention is to provide a manufacturing method that can easily manufacture the metal foil and metal-clad laminate described above.
さらに、本発明は上記硬化被膜を有する金属箔及び金属
張積層板の硬化被膜を容易に除去する方法を提供するこ
とを目的とする。A further object of the present invention is to provide a method for easily removing the cured coating from metal foils and metal-clad laminates having the above-mentioned cured coating.
［課題を解決するための手段］
本発明者らは前記目的を達成するために鋭意研究を行っ
た結果、金属箔の表面に紫外線硬化水性樹脂の硬化被膜
を設けることにより前記目的が達成されることを見出し
、この知見に基づいて本発明を完成するに至った。[Means for Solving the Problems] As a result of intensive research conducted by the present inventors in order to achieve the above object, the above object is achieved by providing a cured film of an ultraviolet curable water-based resin on the surface of metal foil. Based on this finding, we have completed the present invention.
すなわち、本発明は金属箔の表面に紫外線硬化水性樹脂
の硬化被膜を設けてなる紫外線硬化水性樹脂付金属箔を
提供するものである。That is, the present invention provides a metal foil coated with an ultraviolet curable aqueous resin, which is formed by providing a cured film of an ultraviolet curable aqueous resin on the surface of the metal foil.
本発明において用いられる金属箔としては、好ましくは
電解銅箔、圧延銅箔等の銅箔が挙げられる。この他にア
ルミｉ、亜鉛箔、錫箔などの金属箔、銅−亜鉛、銅−錫
などの合金箔、あるいは銅箔面に銅メツキ層、亜鉛メツ
キ層、銀メツキ層、金メツキ層、ニッケルメッキ層、ク
ロムメツキ層又はこれらの合金メツキ層などを数μｍ被
着させた複合箔等も用いることができる。The metal foil used in the present invention preferably includes copper foil such as electrolytic copper foil and rolled copper foil. In addition, metal foil such as aluminum i, zinc foil, tin foil, alloy foil such as copper-zinc, copper-tin, or copper plating layer, zinc plating layer, silver plating layer, gold plating layer, nickel plating on the copper foil surface. It is also possible to use a composite foil on which a layer, a chrome plating layer, or an alloy plating layer of these layers is deposited to a thickness of several micrometers.
これらの金属箔の厚みは、特に限定するものではないが
、取扱い上及び経済的見地から１〜１００μｍの厚みを
有しているものが好ましい。The thickness of these metal foils is not particularly limited, but from the viewpoint of handling and economics, it is preferable to have a thickness of 1 to 100 μm.
本発明の金属箔は紫外線硬化水性樹脂の硬化被膜か設け
られているので、金属箔表面の傷等を防止することがで
きる。また薄い金属箔ではこの硬化被膜によりしわが防
止されハンドリング性が良好となる。この硬化被膜は水
、酸水溶液、アルカリ水溶液により数分以内に容易に膨
潤脱離又は溶解して除去することができる。そして硬化
被膜除去後は塗膜を形成する前と同じ新鮮な金属面を再
現することができる。Since the metal foil of the present invention is provided with a cured coating of an ultraviolet-curable water-based resin, scratches on the surface of the metal foil can be prevented. In addition, in the case of thin metal foils, this hardened film prevents wrinkles and improves handling properties. This cured film can be easily removed by swelling or dissolving within several minutes with water, an acid aqueous solution, or an alkaline aqueous solution. After removing the cured film, it is possible to reproduce the same fresh metal surface as before the coating was applied.
硬化被膜の形成に用いられる紫外線硬化水性樹脂は水と
非常によく溶解し、塗膜の形成が容易で硬化速度が速い
ものが用いられる。このようなものとして不飽和ポリア
ミドエーテル、不飽和ポリアミドエステル、不飽和ポリ
アミドアルコールなどが好適に用いられ、特に不飽和ポ
リアミドエーテルか好適に用いられる。具体的にはＭＯ
ＮＯＣＵＲＥ ＰＴＹ、ＬＴＤ、 （豪）から市販
されているＵＶ硬化開始剤を含んだベースレジンＭ５８
０が好適に用いられる。このものは水といかなる比率に
も溶解し、適当な粘度になるように希釈されて使用され
る。この塗膜に紫外線を照射すると形成する塗膜の厚さ
によって異なるが、０．５〜５秒という短時間で硬化し
、傷、異物付着、変色の防止等に有効な保護膜が形成さ
れる。この被膜は水により使用時容易に剥離することが
できる。The ultraviolet curable aqueous resin used to form the cured film is one that dissolves very well in water, allows easy formation of a coating, and has a fast curing speed. As such, unsaturated polyamide ether, unsaturated polyamide ester, unsaturated polyamide alcohol, etc. are preferably used, and unsaturated polyamide ether is particularly preferably used. Specifically, M.O.
Base resin M58 containing UV curing initiator commercially available from NOCURE PTY, LTD. (Australia)
0 is preferably used. This product can be dissolved in any proportion with water and used after being diluted to an appropriate viscosity. When this paint film is irradiated with ultraviolet rays, it hardens in a short time of 0.5 to 5 seconds, depending on the thickness of the film formed, and forms a protective film that is effective in preventing scratches, foreign matter adhesion, and discoloration. . This coating can be easily peeled off with water during use.
この硬化被膜の厚さは０． １〜２００μｍとすること
か好ましい。特に好ましくは５〜３０μｍである。The thickness of this cured film is 0. It is preferable to set it as 1-200 micrometers. Particularly preferably, it is 5 to 30 μm.
また本発明の金属箔は被膜の形成により上記したように
変色が防止されることから長期の保存が可能となり、ま
た、金属箔を巻取って保存する場合、箔の粗面側の模様
が光沢面側に転写されるのを防止することもできる。In addition, the metal foil of the present invention can be stored for a long time because it is prevented from discoloring as mentioned above due to the formation of a film.Furthermore, when the metal foil is rolled up and stored, the pattern on the rough side of the foil becomes glossy. It is also possible to prevent the image from being transferred to the surface side.
本発明の金属箔を製造する方法としては、金属箔の表面
に紫外線硬化水性樹脂の溶液を塗布して塗膜を形成し、
次いでこれに紫外線を照射して硬化被膜を形成する方法
が好適に用いられる。また、必要に応じて水を揮散させ
る熱乾燥手段を採用してもよい。塗布はスプレー、ロー
ルコータ−１浸漬等を用いて行われる。□膜の厚さは樹
脂溶液の濃度を適宜変化させることにより調整すること
もできる。紫外線硬化水性樹脂はそのまま又は重量比で
５倍程度までの水により希釈して塗布することが好まし
い。The method for manufacturing the metal foil of the present invention includes coating the surface of the metal foil with a solution of an ultraviolet curing water-based resin to form a coating film;
Next, a method of forming a cured film by irradiating this with ultraviolet rays is preferably used. Further, a thermal drying means for volatilizing water may be employed as necessary. Coating is carried out using spraying, roll coater 1 dipping, or the like. □The thickness of the film can also be adjusted by appropriately changing the concentration of the resin solution. It is preferable to apply the ultraviolet curable aqueous resin as it is or after diluting it with water up to about 5 times the weight ratio.
本発明はまた、金属張積層板の金属箔の表面に紫外線硬
化水性樹脂の硬化被膜を設けてなる紫外線硬化水性樹脂
付金属張積層板を提供するものである。The present invention also provides a metal-clad laminate with an ultraviolet-curable water-based resin, which is formed by providing a cured coating of an ultraviolet-curable water-based resin on the surface of the metal foil of the metal-clad laminate.
本発明の金属張積層板はプリント回路板を作製する各工
程中において金属箔、例えば銅箔表面の傷か防止される
とともに、ドリル（穴明け）時、当て板が不要となりプ
リント回路板作製時の作業性が向上するという利点を有
している。またこの硬化被膜は水、酸水溶液又はアルカ
リ水溶液により容易に除去することができる。The metal-clad laminate of the present invention prevents scratches on the surface of metal foil, such as copper foil, during each process of manufacturing printed circuit boards, and eliminates the need for a patch plate during drilling (drilling). This has the advantage of improving workability. Moreover, this hardened film can be easily removed with water, an acid aqueous solution, or an alkaline aqueous solution.
金属張積層板に用いられる金属箔、紫外線硬化水性樹脂
の硬化被膜等については前記の金属箔に用いられるもの
と同様のものが用いられる。The metal foil, the cured coating of ultraviolet curable water-based resin, etc. used in the metal-clad laminate are the same as those used for the metal foil described above.
本発明の金属張積層板は例えば前記紫外線硬化水性樹脂
付金属箔と熱硬化性樹脂含浸基材とを積層成形すること
により製造することができる。積層成形は通常加熱加圧
して行われる。この場合成形時に金属箔と熱板の間に挿
入される剥離紙を必ずしも必要としないという利点を有
している。The metal-clad laminate of the present invention can be produced, for example, by laminating and molding the metal foil coated with an ultraviolet-curable water-based resin and a base material impregnated with a thermosetting resin. Laminate molding is usually performed by heating and pressurizing. This case has the advantage that a release paper inserted between the metal foil and the hot plate during molding is not necessarily required.
熱硬化性樹脂含浸基材としては、紙、ガラス布、ガラス
不織布等の基材にフェノール樹脂、エポキシ樹脂、不飽
和ポリエステル樹脂、ポリイミド樹脂等の熱硬化性樹脂
を含浸させたものが好適に用いられる。As the thermosetting resin-impregnated base material, a base material such as paper, glass cloth, or glass nonwoven fabric impregnated with a thermosetting resin such as phenol resin, epoxy resin, unsaturated polyester resin, or polyimide resin is preferably used. It will be done.
本発明の金属張積層板はまた、従来の硬化被膜をもたな
い金属張積層板の金属箔の表面に紫外線硬化水性樹脂の
溶液を塗布して塗膜を形威し、次いでこれに紫外線を照
射して硬化被膜を形成することにより製造することもで
きる。硬化被膜の形成は金属箔の場合と同様に行われる
。The metal-clad laminate of the present invention can also be produced by applying a solution of an ultraviolet-curable aqueous resin to the surface of the metal foil of a conventional metal-clad laminate that does not have a cured film to form a coating film, and then applying ultraviolet rays to the surface of the metal foil. It can also be manufactured by irradiating to form a cured film. Formation of the cured film is performed in the same manner as in the case of metal foil.
［実施例］
以下、本発明を実施例に基づいて詳細に説明するが、本
発明はこれに限定されるものではない。[Examples] Hereinafter, the present invention will be described in detail based on Examples, but the present invention is not limited thereto.
実施例１
厚さ３５μｍの電解銅箔の光沢面側にＭ−５８０（ＭＯ
ＮＯＣＵＲＥ ＰＴＹ、ＬＴＤ、 （豪）社、ＵＶ
硬化開始剤を含む紫外線硬化水性樹脂）１００重量部を
水４０重量部に溶解した溶液をロールコータ−法にて塗
工量が１０ｇ／ｍ２になるように塗布して塗膜を形成し
、次いで高圧水銀ランプを備えた紫外線照射装置を用い
て、８０Ｗ１１灯、５秒間の条件で照射して厚さ１０μ
ｍの硬化被膜を有する銅箔を得た。Example 1 M-580 (MO
NOCURE PTY, LTD. (Australia) Ltd., UV
A solution prepared by dissolving 100 parts by weight of an ultraviolet curable aqueous resin (containing a curing initiator) in 40 parts by weight of water was applied using a roll coater method at a coating weight of 10 g/m2 to form a coating film. Using an ultraviolet irradiation device equipped with a high-pressure mercury lamp, irradiation was performed using 11 80W lamps for 5 seconds to create a thickness of 10 μm.
A copper foil with a cured film of m was obtained.
得られた銅箔を水洗したところ３０秒後に硬化被膜は膨
潤し容易に剥離し除去できた。When the obtained copper foil was washed with water, the cured film swelled after 30 seconds and could be easily peeled off and removed.
また、この銅箔は常温雰囲気下で６０日間経過後も変色
せず、保存安定性に優れていた。Further, this copper foil did not change color even after 60 days in an atmosphere at room temperature, and had excellent storage stability.
実施例２
市販の紙基材フェノール樹脂銅張積層板の銅箔面に実施
例１と同様にして紫外線硬化水性樹脂の硬化被膜を形成
した。Example 2 A cured film of an ultraviolet curable water-based resin was formed on the copper foil surface of a commercially available paper-based phenolic resin copper-clad laminate in the same manner as in Example 1.
このようにして得られた硬化被膜付銅張積層板は当て板
なしで穴明けすることができた。The copper-clad laminate with a cured film thus obtained could be drilled without a patch plate.
実施例３
実施例１で得られた硬化被膜付銅箔とエポキシキシ樹脂
をガラス布の含浸させたプリプレグを積層して、銅箔と
熱板との間に剥離紙を設けず、１６８°Ｃ，１００ｋｇ
／ｃｍ２で積層成形し、エポキシ樹脂銅張積層板を得た
。Example 3 The cured copper foil obtained in Example 1 and the prepreg made of glass cloth impregnated with epoxy resin were laminated and heated at 168°C without a release paper between the copper foil and the hot plate. 100kg
/cm2 to obtain an epoxy resin copper-clad laminate.
この銅張積層板の銅箔表面の硬化被膜は熱板側に付着し
ておらず、剥離紙を用いないで積層成形することが可能
であった。The cured film on the copper foil surface of this copper-clad laminate did not adhere to the hot plate side, and it was possible to perform lamination molding without using release paper.
また、この銅張積層板を実施例１と同様に水洗したとこ
ろ硬化被膜は容易に剥離除去できた。Furthermore, when this copper-clad laminate was washed with water in the same manner as in Example 1, the cured film could be easily peeled off and removed.
［発明の効果コ
本発明の紫外線硬化水性樹脂付金属箔及び紫外線硬化水
性樹脂付金属張積層板は表面に硬化樹脂被膜を有してい
るので金属表面の傷を防止できるとともに、高密度回路
形成において微細な異物の付着等に起因する不良を防止
することができる。[Effects of the invention] The metal foil coated with an ultraviolet-curable water-based resin and the metal-clad laminate coated with an ultraviolet-curable water-based resin of the present invention have a cured resin coating on the surface, which prevents scratches on the metal surface and facilitates high-density circuit formation. It is possible to prevent defects caused by the adhesion of minute foreign matter.
この硬化樹脂被膜は水、酸水溶液、アルカリ水溶液によ
り容易に除去することができ、回路加工工程においてな
んら妨げにならない。また、本発明の金属張積層板は当
て板なしに穴明は加工ができるという利点や金属張積層
板を製造する際の加熱加圧時に剥離紙が不要であるとい
う利点も有している。This cured resin film can be easily removed with water, an acid aqueous solution, or an alkaline aqueous solution, and does not interfere with the circuit processing process. The metal-clad laminate of the present invention also has the advantage that holes can be punched without a backing plate, and that no release paper is required during heating and pressing when manufacturing the metal-clad laminate.
さらに、本発明の製造法により上記の優れた特長を有す
る金属箔、金属張積層板を容易に提供することが可能と
なった。Furthermore, the manufacturing method of the present invention makes it possible to easily provide metal foils and metal-clad laminates having the above-mentioned excellent features.
Claims (1)
けてなる紫外線硬化水性樹脂付金属箔。 ２、金属箔が銅箔である請求項１記載の紫外線硬化水性
樹脂付金属箔。 ３、硬化被膜の厚さが０．１〜２００μｍである請求項
１又は２記載の紫外線硬化水性樹脂付金属箔。 ４、紫外線硬化水性樹脂が不飽和ポリアミドエーテルで
ある請求項１、２、又は３記載の紫外線硬化水性樹脂付
金属箔。 ５、金属箔の表面に紫外線硬化水性樹脂の溶液を塗布し
て塗膜を形成し、次いでこれに紫外線を照射して硬化被
膜を形成する紫外線硬化水性樹脂付金属箔の製造法。 ６、請求項１、２、３又は４記載の紫外線硬化水性樹脂
付金属箔の硬化被膜を水、酸水溶液又はアルカリ水溶液
を用いて除去する硬化被膜の除去法。 ７、金属張積層板の金属箔の表面に紫外線硬化水性樹脂
の硬化被膜を設けてなる紫外線硬化水性樹脂付金属張積
層板。 ８、金属箔が銅箔である請求項７記載の紫外線硬化水性
樹脂付金属張積層板。 ９、硬化被膜の厚さが０．１〜２００μｍである請求項
７又は８記載の紫外線硬化水性樹脂付金属張積層板。 １０、紫外線硬化水性樹脂が不飽和ポリアミドエーテル
である請求項７、８又は９記載の紫外線硬化水性樹脂付
金属張積層板。 １１、請求項１記載の紫外線硬化水性樹脂付金属箔と熱
硬化性樹脂含浸基材とを積層成形する紫外線硬化水性樹
脂付金属張積層板の製造法。 １２、金属張積層板の金属箔の表面に紫外線硬化水性樹
脂の溶液を塗布して塗膜を形成し、次いでこれに紫外線
を照射して硬化被膜を形成する紫外線硬化水性樹脂付金
属張積層板の製造法。 １３、請求項７、８、９又は１０記載の紫外線硬化水性
樹脂付金属張積層板の硬化被膜を水、酸水溶液又はアル
カリ水溶液を用いて除去する硬化被膜の除去法。[Claims] 1. A metal foil coated with an ultraviolet curable water-based resin, which is formed by providing a cured coating of an ultraviolet ray-curable water-based resin on the surface of the metal foil. 2. The metal foil coated with an ultraviolet curable water-based resin according to claim 1, wherein the metal foil is a copper foil. 3. The metal foil coated with an ultraviolet curable water-based resin according to claim 1 or 2, wherein the thickness of the cured film is 0.1 to 200 μm. 4. The metal foil coated with an ultraviolet curable aqueous resin according to claim 1, 2 or 3, wherein the ultraviolet curable aqueous resin is an unsaturated polyamide ether. 5. A method for producing a metal foil coated with an ultraviolet-curing water-based resin, which comprises applying a solution of an ultraviolet-curing water-based resin onto the surface of the metal foil to form a coating film, and then irradiating the film with ultraviolet rays to form a cured film. 6. A method for removing a cured film of the metal foil coated with an ultraviolet curable water-based resin according to claim 1, 2, 3 or 4, which comprises removing the cured film using water, an acid aqueous solution or an alkaline aqueous solution. 7. A metal-clad laminate with an ultraviolet-curable water-based resin, which is formed by providing a cured film of an ultraviolet-curable water-based resin on the surface of the metal foil of the metal-clad laminate. 8. The metal-clad laminate with ultraviolet curable water-based resin according to claim 7, wherein the metal foil is copper foil. 9. The metal-clad laminate with ultraviolet curable water-based resin according to claim 7 or 8, wherein the thickness of the cured film is 0.1 to 200 μm. 10. The metal-clad laminate with an ultraviolet curable aqueous resin according to claim 7, 8 or 9, wherein the ultraviolet curable aqueous resin is an unsaturated polyamide ether. 11. A method for producing a metal-clad laminate with an ultraviolet curable water-based resin, which comprises laminating and molding the ultraviolet-curable water-based resin-covered metal foil according to claim 1 and a thermosetting resin-impregnated base material. 12. A metal-clad laminate with an ultraviolet-curable water-based resin, in which a solution of an ultraviolet-curable water-based resin is applied to the surface of the metal foil of the metal-clad laminate to form a coating film, and then a cured film is formed by irradiating this with ultraviolet rays. manufacturing method. 13. A method for removing a cured film of the metal-clad laminate with an ultraviolet curable aqueous resin according to claim 7, 8, 9 or 10, which comprises removing the cured film using water, an aqueous acid solution or an aqueous alkaline solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016081A JP2551490B2 (en) | 1990-01-29 | 1990-01-29 | UV-curable aqueous resin-coated copper foil, UV-curable aqueous resin-coated copper clad laminate, their manufacturing method and their cured coating removal method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016081A JP2551490B2 (en) | 1990-01-29 | 1990-01-29 | UV-curable aqueous resin-coated copper foil, UV-curable aqueous resin-coated copper clad laminate, their manufacturing method and their cured coating removal method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03221449A true JPH03221449A (en) | 1991-09-30 |
| JP2551490B2 JP2551490B2 (en) | 1996-11-06 |
Family
ID=11906602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016081A Expired - Fee Related JP2551490B2 (en) | 1990-01-29 | 1990-01-29 | UV-curable aqueous resin-coated copper foil, UV-curable aqueous resin-coated copper clad laminate, their manufacturing method and their cured coating removal method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2551490B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05129776A (en) * | 1991-11-05 | 1993-05-25 | Hitachi Chem Co Ltd | Manufacture of copper foil provided with protective film |
| JP2002127285A (en) * | 2000-10-26 | 2002-05-08 | Matsushita Electric Works Ltd | Composite body and method for producing multi-layer printed-wiring board |
| JP2005335361A (en) * | 2004-05-28 | 2005-12-08 | Lg Cable Ltd | Soft metallic thin film-laminated film and its manufacturing method |
| JP4582436B2 (en) * | 2001-08-27 | 2010-11-17 | Ｊｘ日鉱日石金属株式会社 | Copper foil with water-soluble resin carrier and printed circuit board using the copper foil |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5011416A (en) * | 1973-06-01 | 1975-02-05 | ||
| JPS5260891A (en) * | 1975-11-12 | 1977-05-19 | Dow Chemical Co | Unsaturated polyamide ester and derivatives crossslinked thereof |
| JPS55152573A (en) * | 1979-05-17 | 1980-11-27 | Toyo Kohan Co Ltd | Formation of metal protective layer |
| JPS62136274A (en) * | 1985-12-09 | 1987-06-19 | Nisshin Steel Co Ltd | Method of applying radiation curable resin |
-
1990
- 1990-01-29 JP JP2016081A patent/JP2551490B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5011416A (en) * | 1973-06-01 | 1975-02-05 | ||
| JPS5260891A (en) * | 1975-11-12 | 1977-05-19 | Dow Chemical Co | Unsaturated polyamide ester and derivatives crossslinked thereof |
| JPS55152573A (en) * | 1979-05-17 | 1980-11-27 | Toyo Kohan Co Ltd | Formation of metal protective layer |
| JPS62136274A (en) * | 1985-12-09 | 1987-06-19 | Nisshin Steel Co Ltd | Method of applying radiation curable resin |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05129776A (en) * | 1991-11-05 | 1993-05-25 | Hitachi Chem Co Ltd | Manufacture of copper foil provided with protective film |
| JP2002127285A (en) * | 2000-10-26 | 2002-05-08 | Matsushita Electric Works Ltd | Composite body and method for producing multi-layer printed-wiring board |
| JP4582436B2 (en) * | 2001-08-27 | 2010-11-17 | Ｊｘ日鉱日石金属株式会社 | Copper foil with water-soluble resin carrier and printed circuit board using the copper foil |
| JP2005335361A (en) * | 2004-05-28 | 2005-12-08 | Lg Cable Ltd | Soft metallic thin film-laminated film and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2551490B2 (en) | 1996-11-06 |
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