JPH03153029A - Chemical-liquid treatment tank for semiconductor wafer and automatic cleaning treatment apparatus - Google Patents

Abstract

PURPOSE:To enhance the yield, to stabilize the quality and to stably position a conveyance operation by a method wherein, for a wet cleaning operation used to treat a semiconductor wafer with a chemical liquid or pure water, a drainboard inside a treatment tank is tilted. CONSTITUTION:A drainboard 2 inside a chemical-liquid treatment tank 1 is tilted at 3 to 5 deg. in such a way that the surface side of a wafer 4 falls down toward the rear side in a cassette guide groove 7. In the drainboard 2, a guide groove is cut in a wafer pushing-up protrusion 6 in such a way that the wafer 4 is situated in the center with reference to the cassette guide groove 7; the wafer comes into minimum contact with the wafer guide groove 7. A cassette 3 can be positioned in a fixed position by using a cassette guide 5. The cassette guide 5 is tapered in such a way that it can be set stably to a fixed position with reference to the cassette 3.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a chemical treatment tank and a water washing treatment tank for wet processing and cleaning of semiconductor wafers with chemicals. [Prior Art] Conventionally, as shown in FIGS. 2(a) and 2(b), the drainboard 2 in the processing tank 1 is installed in a horizontal state, and the wafer storage container 3 ( A conventional method was to place a cassette (hereinafter referred to as a cassette) horizontally on a drainboard 2 and perform chemical treatment for a specified period of time. [Problems to be Solved by the Invention] However, in the conventional method, the wafer guide groove 7 shown in FIG.
In order to make it easier to push in and take out the wafer 4, there is a child box (backlash) approximately three times the thickness of the wafer 4, and this child box allows the wafer 4 to tilt in the wafer guide groove 7. . The cassette 3 and the wafer 4 are electrostatically charged, and the wafer 4 is pulled toward the wafer guide groove 7. Also, since the cassette 3 is used many times, the wafer is held at the bottom of the wafer guide groove 7. The wafer 4 may be damaged due to wear or impact scratches on the wafer guide groove 7.
A situation arises in which the object comes into contact with the side of the object. If the cassette 3 is immersed in the chemical treatment tank l in this state and the wafer 4 is immersed in the cassette 3 for processing, if the surface of the wafer 4 comes into contact with the wafer guide groove 7, there will be residual resist and etching. This resulted in a decrease in yield by one point. Therefore, in order to solve these conventional problems, the present invention tilts the drainboard 2 in the chemical liquid processing tank l and provides a wafer push-up protrusion 6 and a cassette guide 5, so that the chemical liquid does not leave processing residue. The purpose is to provide treatment tanks. [Means for Solving the Problems 1 In order to solve the above problems, the chemical treatment tank of the present invention includes:
In chemical solution or pure water treatment of semiconductor wafers, the drainboard inside the treatment tank is tilted. The drainboard is characterized in that a wafer push-up protrusion and a wafer storage container positioning guide are provided on the drainboard. [Embodiment 1] An embodiment of the present invention will be described below based on the drawings. FIGS. 1(a) and 1(b) show the structure of a chemical treatment tank. It shows the function. In the drainboard 2 in the chemical treatment tank 1, the surface side of the wafer 4 is located in the cassette guide shown in FIG. At jI7, it is tilted by 3° to 5° so as to fall down to the back side. Further, in the drainboard 2, a projection 6 for pushing up the wafer 4 is attached to the center of the cassette 3. To explain the wafer push-up protrusion 6 in more detail in FIG.
A guide V groove is cut in the wafer push-up protrusion 6 so as to be located in the center, so that contact with the wafer guide groove 7 can be minimized. Further, the cassette 3 can be positioned at a fixed position by a cassette guide 5. As shown in FIG. 4, the cassette guide 5 is tapered so that the cassette 3 can be stably set in a fixed position. With these simple structures and configurations, the wafers 4 in the cassette 3 can be drawn to the sides of the wafer guide groove 7 by static electricity, and the wafer guide groove 7 can be used many times. Therefore, even if the wafer 4 is deformed or scratched and cannot be tipped over to the back side simply by tilting the drainboard 2, the surface contact between the wafer surface and the wafer guide groove 7 may be lost due to the wafer push-up protrusion 6. As a result, the wafers 4 all fall to the back side and their positions are determined stably.The cassette guide 5 makes it possible to use the chemical processing tank shown in Fig. 1 in an automatic cleaning processing device without requiring severe positioning accuracy of the transfer robot. [Effects of the Invention] The present invention has a simple structure as in the embodiments described above, and the back side of the wafer 4 falls into the cassette guide groove 7, so that cleaning and This has the effect of eliminating processing residues such as copying and etching, making it possible to perform processing without variation, and improving yield.Also, when used in automatic cleaning processing equipment, stable quality and stable positioning of conveyance can be achieved. effective.

[Brief explanation of the drawing]

FIGS. 1(a) and (b) are a front view (a) and a right side view (b) of a chemical treatment tank of the present invention, and FIGS. 2(a) and (b) are
Front view (a) and right side view (b) of a conventional chemical treatment tank
, FIG. 3 is a plan view of the cassette and wafer storage, and FIG. 4 is a detailed view of the cassette guide and wafer push-up section. Chemical treatment tank Slatted wafer storage container (cassette) Wafer cassette Kite wafer push-up protrusion Wafer guide groove Figure 2 (a) Akira 逼21 (b) X3 diagram

Claims (3)

[Claims] (1) A semiconductor wafer chemical liquid processing tank characterized in that a drain board in the processing tank is tilted during wet cleaning for treating semiconductor wafers with a chemical liquid or pure water. (2) A semiconductor wafer chemical processing tank, characterized in that the drainboard in the chemical processing tank according to claim 1 is provided with a wafer push-up protrusion and a positioning guide for a wafer storage container. (3) An automatic cleaning treatment device comprising the chemical treatment tank according to claim 1 or 2.