JPH03142305A - Surface roughness measuring instrument - Google Patents
Surface roughness measuring instrumentInfo
- Publication number
- JPH03142305A JPH03142305A JP27988389A JP27988389A JPH03142305A JP H03142305 A JPH03142305 A JP H03142305A JP 27988389 A JP27988389 A JP 27988389A JP 27988389 A JP27988389 A JP 27988389A JP H03142305 A JPH03142305 A JP H03142305A
- Authority
- JP
- Japan
- Prior art keywords
- optical elements
- measured
- light
- transmitter
- reflected light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003746 surface roughness Effects 0.000 title claims abstract description 6
- 230000003287 optical effect Effects 0.000 claims abstract description 7
- 230000004907 flux Effects 0.000 abstract 1
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010960 cold rolled steel Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Abstract
PURPOSE:To measure the roughness with a high precision by constituting a measuring instrument of a light throwing device, a photodetector where plural optical elements are arranged two-dimensionally, an amplifier, a transmitter, an arithmetic unit, and an output device. CONSTITUTION:A light throwing device 1 throws a luminous flux 2 at an angle thetato a surface 3 to be measured. Reflected light 4 received by optical elements 5a of a photodetector 5 are converted to electric signals proportional to respective intensities and are amplified with a certain power by an amplifier 6. Signals of optical elements 5a are fetched as measured values into a sample and holds circuit by a transmitter 7 and are successively selectively scanned by a multiplexer to momently measure the reflected light 4 reflected on the surface 3 to be measured. An arithmetic unit 8 reads in signals from optical elements 5a through the transmitter 7 and calculates the surface roughness of the surface 3 based on intensity distribution 4a of the reflected light 4, and the result is outputted to an output device 9. Since optical elements 5a are two-dimensionally arranged, the reflection light distribution having the peak value, namely, the maximum value as the center is accurately measured whichever direction the peak of the reflected light 4 is deviated in.
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、物体の表面ｔｎ度を光学的に非接触で測定す
る装置に係り、特に、測定対象物体の位置が振動などに
より微妙に変化する場合でも１ｎ度よく粗度測定が行え
る装置に関する。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a device for optically and non-contactly measuring the surface tn degree of an object. The present invention relates to a device that can measure roughness with an accuracy of 1n degrees even when the roughness is measured.
〈従来の技術〉
一般に、各種物体の表面粗度は、触針式の表面粗度計を
用いてその表面プロフィルを解析する方法が用いられる
が、この方法は被測定物が静止した状態を前提としてお
り、移動、振動を伴う物体を測定することは極めて困難
である。一方、光学的手法を用いた表面粗度計が近年盛
んに開発されており、非接触で測定できる点を利用して
移動物体に対しても適用が試みられている。<Prior art> Generally, the surface roughness of various objects is measured by analyzing the surface profile using a stylus-type surface roughness meter, but this method assumes that the object to be measured is stationary. Therefore, it is extremely difficult to measure objects that move or vibrate. On the other hand, surface roughness meters using optical methods have been actively developed in recent years, and attempts are being made to apply them to moving objects by taking advantage of non-contact measurement points.
ところで、例えば冷延鋼板の製造工程のように、被測定
面が高速で走行するような状況下では、振動による位置
や角度のずれが生じるために、精度のよい測定を行うこ
とができない。By the way, in a situation where the surface to be measured runs at high speed, such as in the manufacturing process of cold-rolled steel sheets, accurate measurements cannot be performed because positional and angular deviations occur due to vibrations.
Claims (1)
した反射光を受光する複数個の光素子を二次元状に配し
た光検出器と、この光検出器の信号を増幅する増幅器と
、この増幅器からの信号を送信する伝送器と、この伝送
器からの信号を受信し、これらの反射光強度から被測定
面の粗度を算出する演算装置と、この演算装置における
演算結果を出力する出力装置とからなることを特徴とす
る表面粗度測定装置。A light projector that projects a light beam onto the surface to be measured, a photodetector that has multiple optical elements arranged in a two-dimensional manner to receive the light reflected from the surface to be measured, and an amplifier that amplifies the signal of this photodetector. , a transmitter that transmits the signal from this amplifier, a calculation device that receives the signal from this transmitter and calculates the roughness of the surface to be measured from the intensity of the reflected light, and a calculation result of this calculation device. A surface roughness measuring device comprising: an output device for outputting an output.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27988389A JPH03142305A (en) | 1989-10-30 | 1989-10-30 | Surface roughness measuring instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27988389A JPH03142305A (en) | 1989-10-30 | 1989-10-30 | Surface roughness measuring instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03142305A true JPH03142305A (en) | 1991-06-18 |
Family
ID=17617265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27988389A Pending JPH03142305A (en) | 1989-10-30 | 1989-10-30 | Surface roughness measuring instrument |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03142305A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5352038A (en) * | 1991-05-06 | 1994-10-04 | Hoechst Aktiengesellschaft | Method of and measuring arrangement for contactless on-line measurement |
| JPH07218225A (en) * | 1994-02-03 | 1995-08-18 | Kansei Kogyo Kk | Deformed state surveying apparatus for conduit |
| US5474381A (en) * | 1993-11-30 | 1995-12-12 | Texas Instruments Incorporated | Method for real-time semiconductor wafer temperature measurement based on a surface roughness characteristic of the wafer |
| WO1998003305A1 (en) * | 1996-07-18 | 1998-01-29 | Speedfam Corporation | Methods and apparatus for the in-process detection of workpieces |
| EP0823309A1 (en) * | 1996-08-09 | 1998-02-11 | MEMC Electronic Materials, Inc. | Method and apparatus for controlling flatness of polished semiconductor wafers |
-
1989
- 1989-10-30 JP JP27988389A patent/JPH03142305A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5352038A (en) * | 1991-05-06 | 1994-10-04 | Hoechst Aktiengesellschaft | Method of and measuring arrangement for contactless on-line measurement |
| US5474381A (en) * | 1993-11-30 | 1995-12-12 | Texas Instruments Incorporated | Method for real-time semiconductor wafer temperature measurement based on a surface roughness characteristic of the wafer |
| US5741070A (en) * | 1993-11-30 | 1998-04-21 | Texas Instruments Incorporated | Apparatus for real-time semiconductor wafer temperature measurement based on a surface roughness characteristic of the wafer |
| JPH07218225A (en) * | 1994-02-03 | 1995-08-18 | Kansei Kogyo Kk | Deformed state surveying apparatus for conduit |
| WO1998003305A1 (en) * | 1996-07-18 | 1998-01-29 | Speedfam Corporation | Methods and apparatus for the in-process detection of workpieces |
| GB2330200A (en) * | 1996-07-18 | 1999-04-14 | Speedfam Corp | Methods and apparatus for the in-process detection of workpieces |
| GB2330200B (en) * | 1996-07-18 | 2000-09-27 | Speedfam Corp | Methods and apparatus for the in-process detection of workpieces |
| EP0823309A1 (en) * | 1996-08-09 | 1998-02-11 | MEMC Electronic Materials, Inc. | Method and apparatus for controlling flatness of polished semiconductor wafers |
| EP1060835A2 (en) * | 1996-08-09 | 2000-12-20 | MEMC Electronic Materials, Inc. | Method and apparatus for controlling flatness of polished semiconductor wafers |
| EP1060835A3 (en) * | 1996-08-09 | 2001-12-19 | MEMC Electronic Materials, Inc. | Method and apparatus for controlling flatness of polished semiconductor wafers |
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